BGA2717 [NXP]

MMIC wideband amplifier; MMIC宽带放大器器
BGA2717
型号: BGA2717
厂家: NXP    NXP
描述:

MMIC wideband amplifier
MMIC宽带放大器器

放大器
文件: 总14页 (文件大小:85K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BGA2717  
MMIC wideband amplifier  
Rev. 02 — 24 September 2004  
Product data sheet  
1. Product profile  
1.1 General description  
Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal  
matching circuit in a 6-pin SOT363 SMD plastic package.  
CAUTION  
This device is sensitive to electrostatic discharge (ESD). Therefore care should be taken  
during transport and handling.  
MSC895  
1.2 Features  
Internally matched to 50  
Wide frequency range (3.2 GHz at 3 dB bandwidth)  
Flat 24 dB gain (±1 dB up to 2.8 GHz)  
2.5 dBm output power at 1 dB compression point  
Good linearity for low current (IP3out = 10 dBm)  
Low second harmonic; 38 dBc at PD = 40 dBm  
Low noise figure; 2.3 dB at 1 GHz  
Unconditionally stable (K 2).  
1.3 Applications  
LNB IF amplifiers  
Cable systems  
ISM  
General purpose.  
1.4 Quick reference data  
Table 1:  
Symbol  
VS  
Quick reference data  
Parameter  
Conditions  
Min  
Typ  
5
Max  
Unit  
V
DC supply voltage  
supply current  
-
-
-
-
-
6
-
IS  
8
mA  
dB  
2
s21  
insertion power gain  
noise figure  
f = 1 GHz  
f = 1 GHz  
f = 1 GHz  
24  
2.3  
1
-
NF  
-
dB  
PL(sat)  
saturated load power  
-
dBm  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
2. Pinning information  
Table 2:  
Pinning  
Pin  
1
Description  
VS  
Simplified outline  
Symbol  
1
6
5
4
2, 5  
3
GND2  
RF_OUT  
GND1  
6
3
4
4
2, 5  
6
RF_IN  
sym052  
1
2
3
SOT363  
3. Ordering information  
Table 3:  
Ordering information  
Type number Package  
Name  
Description  
Version  
BGA2717  
-
plastic surface mounted package; 6 leads  
SOT363  
4. Marking  
Table 4:  
Marking  
Type number  
Marking code  
BGA2717  
1B-  
5. Limiting values  
Table 5:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VS  
DC supply voltage  
RF input AC  
coupled  
-
6
V
IS  
supply current  
-
15  
mA  
mW  
°C  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
maximum drive power  
Tsp 90 °C  
-
200  
+150  
150  
10  
65  
-
-
°C  
PD  
dBm  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
2 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
6. Thermal characteristics  
Table 6:  
Symbol  
Rth(j-sp)  
Thermal characteristics  
Parameter  
thermal resistance from junction Ptot = 200 mW;  
Conditions  
Typ  
Unit  
300  
K/W  
to solder point  
Tsp 90 °C  
7. Characteristics  
Table 7:  
Characteristics  
VS = 5 V; IS = 8 mA; Tj = 25 °C; measured on demo board; unless otherwise specified.  
Symbol Parameter  
IS supply current  
s21  
Conditions  
Min  
6
Typ  
8
Max  
10  
20  
25  
27  
27  
26  
24  
-
Unit  
mA  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
GHz  
2
insertion power f = 100 MHz  
18  
23  
24  
24  
22  
20  
15  
8
18.6  
23.9  
25  
gain  
f = 1 GHz  
f = 1.8 GHz  
f = 2.2 GHz  
f = 2.6 GHz  
f = 3 GHz  
25.1  
24  
22.1  
19  
2
2
2
s11  
s22  
s12  
input return  
losses  
f = 1 GHz  
f = 2.2 GHz  
f = 1 GHz  
9.4  
10  
-
output return  
losses  
8
-
f = 2.2 GHz  
f = 1.6 GHz  
f = 2.2 GHz  
f = 1 GHz  
5
6.8  
55  
-
isolation  
54  
38  
-
-
39  
-
NF  
noise figure  
2.3  
2.9  
3.2  
2.5  
3.1  
-
f = 2.2 GHz  
at s21 2 3 dB below flat  
gain at 1 GHz  
-
B
K
bandwidth  
3
stability factor  
f = 1 GHz  
-
13  
-
-
-
-
-
f = 2.2 GHz  
-
1.7  
PL(sat)  
saturated load f = 1 GHz  
0
1.4  
dBm  
dBm  
dBm  
power  
f = 2.2 GHz  
1  
4  
+0.1  
2.6  
PL(1dB)  
load power  
at 1 dB gain compression;  
f = 1 GHz  
at 1 dB gain compression;  
f = 2.2 GHz  
5  
3.1  
-
-
dBm  
dBc  
IM2  
second order  
at PD = 40 dBm;  
36  
38  
intermodulation f0 = 1 GHz  
product  
IP3in  
IP3out  
input, third  
order intercept  
point  
f = 1 GHz  
15  
20  
13.9  
18.8  
-
-
dBm  
dBm  
f = 2.2 GHz  
output, third  
order intercept  
point  
f = 1 GHz  
9
4
10  
-
-
dBm  
dBm  
f = 2.2 GHz  
6.3  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
3 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
8. Application information  
Figure 1 shows a typical application circuit for the BGA2717 MMIC. The device is  
internally matched to 50 , and therefore does not need any external matching. The value  
of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF  
for applications above 100 MHz. However, when the device is operated below 100 MHz,  
the capacitor value should be increased.  
The 22 nF supply decoupling capacitor C1 should be located as close as possible to the  
MMIC.  
The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as  
close as possible to the MMIC, and ideally directly beneath it. When using via holes, use  
multiple via holes, located as close as possible to the MMIC.  
V
S
C1  
1
V
S
C2  
C3  
6
RF_IN  
RF_OUT 3  
RF input  
RF output  
mgu435  
GND1  
GND2  
2, 5  
4
Fig 1. Typical application circuit.  
Figure 2 shows the PCB layout, used for the standard demonstration board.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
4 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
30 mm  
PHILIPS  
PH  
30 mm  
IN  
OUT  
V+  
PHILIPS  
PH  
DUT  
C1  
C3  
C2  
IN  
OUT  
V+  
001aab255  
Material = FR4; thickness = 0.6 mm, εr = 4.6.  
Fig 2. PCB layout and demonstration board showing components.  
8.1 Grounding and output impedance  
If the grounding is not optimal, the gain becomes less flat and the 50 output matching  
becomes worse. If a better output matching to 50 is required, a 12 resistor (R1) can  
be placed in series with C3 (see Figure 3). This will significantly improve the output  
impedance, at the cost of 1 dB gain and 1 dB output power.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
5 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
V
S
C1  
C2  
V
S
C3  
R1  
RF_OUT  
RF_IN  
RF input  
RF output  
GND1  
GND2  
001aab346  
Fig 3. Application circuit for better output impedance into 50 .  
8.2 Application examples  
The MMIC is very suitable as IF amplifier in e.g. LNBs. The excellent wideband  
characteristics make it an ideal building block (see Figure 4). As second amplifier after an  
LNA, the MMIC offers an easy matching, low noise solution (see Figure 5).  
mixer  
to IF circuit  
from  
or demodulator  
RF circuit  
wideband  
amplifier  
oscillator  
mgu438  
Fig 4. Application as IF amplifier.  
mixer  
to IF circuit  
or demodulator  
antenna  
LNA  
wideband  
amplifier  
oscillator  
mgu439  
Fig 5. Application as RF amplifier.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
6 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
90°  
+1  
1.0  
0.8  
135°  
+0.2  
45°  
+0.5  
+2  
0.6  
0.4  
4 GHz  
+5  
0.2  
100 MHz  
0
0.2  
0.5  
2
5
10  
0°  
0
180°  
5  
0.2  
2  
0.5  
135°  
45°  
1  
1.0  
001aab265  
90°  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 6. Input reflection coefficient (s11); typical values.  
90°  
+1  
1.0  
0.8  
0.6  
0.4  
0.2  
0
135°  
+0.5  
45°  
+2  
100 MHz  
+0.2  
+5  
0
0.2  
0.5  
1
2
5
10  
0°  
180°  
4 GHz  
5  
0.2  
2  
0.5  
135°  
45°  
1  
1.0  
001aab266  
90°  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
Fig 7. Output reflection coefficient (s22); typical values.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
7 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
001aab267  
001aab268  
0
2
30  
2
|s  
21  
|
|s  
|
12  
(dB)  
(dB)  
(2)  
(1)  
20  
20  
(3)  
40  
60  
10  
0
0
1000  
2000  
3000  
4000  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
IS = 8 mA; VS = 5 V; PD = 35 dBm; Zo = 50 .  
PD = 35 dBm; Zo = 50 .  
(1) IS = 8.9 mA; VS = 5.5 V.  
(2) IS = 8 mA; VS = 5 V.  
(3) IS = 7.2 mA; VS = 4.5 V.  
Fig 8. Isolation ( s12 2) as a function of frequency;  
typical values.  
Fig 9. Insertion gain ( s21 2) as a function of  
frequency; typical values.  
001aab269  
001aab270  
10  
10  
P
P
L
L
(dBm)  
(dBm)  
(1)  
(3)  
(1)  
(3)  
(2)  
(2)  
0
0
10  
20  
30  
10  
20  
30  
50  
40  
30  
20  
10  
(dBm)  
50  
40  
30  
20  
10  
P (dBm)  
D
P
D
f = 1 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
f = 2.2 GHz; Zo = 50 .  
(1) VS = 5.5 V.  
(2) VS = 5 V.  
(2) VS = 5 V.  
(3) VS = 4.5 V.  
(3) VS = 4.5 V.  
Fig 10. Load power as a function of drive power at  
1 GHz; typical values.  
Fig 11. Load power as a function of drive power at  
2.2 GHz; typical values.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
8 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
001aab271  
001aab272  
4
25  
K
NF  
(dB)  
20  
15  
10  
5
3
(3)  
(2)  
(1)  
2
1
0
0
0
500  
1000  
1500  
2000  
2500  
0
1000  
2000  
3000  
4000  
f (MHz)  
f (MHz)  
Zo = 50 .  
IS = 8 mA; VS = 5 V; Zo = 50 .  
(1) IS = 8.9 mA; VS = 5.5 V.  
(2) IS = 8 mA; VS = 5 V.  
(3) IS = 7.2 mA; VS = 4.5 V.  
Fig 12. Noise figure as a function of frequency; typical  
values.  
Fig 13. Stability factor as a function of frequency;  
typical values.  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
9 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
Table 8:  
Scattering parameters  
VS = 5 V; IS = 8 mA; PD = 35 dBm; Zo = 50 ; Tamb = 25 °C.  
f (MHz) s11  
Magnitude Angle  
s21  
s12  
s22  
Magnitude Angle  
K-factor  
Magnitude Angle  
Magnitude Angle  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
(ratio)  
(deg)  
100  
0.074378  
0.076338  
0.123748  
0.145511  
0.134956  
0.114063  
0.101959  
0.125656  
0.16736  
13.78537  
13.70153  
8.465495  
9.420359  
22.90763  
7.358555  
0.003859  
0.003112  
66.39435 0.450496  
122.2687 0.354179  
79.88713  
40.70919  
0.3804  
12.2  
14.9  
19.1  
200  
400  
1.402521 11.56481  
31.32646 13.31271  
67.10955 14.56872  
111.2495 15.61733  
168.8557 16.45625  
14.92222 0.002011  
37.77988 0.001659  
61.08808 0.00169  
84.67015 0.002146  
107.9167 0.002901  
40.5142  
156.393  
0.312568  
0.3038  
600  
25.36808 20.2  
46.7704 18.1  
800  
164.4454 0.30873  
174.8593 0.319208  
1000  
1200  
1400  
1600  
1800  
2000  
2200  
2400  
2600  
2800  
3000  
3200  
3400  
3600  
3800  
4000  
68.71787 13.2  
91.58398 9.2  
116.5485 6.2  
140.7537 4.3  
167.9683 2.9  
139.8136  
123.527  
0.335623  
0.353582  
0.366893  
0.404064  
0.42512  
129.9717  
85.791  
17.05668  
17.49643  
17.90167  
17.86635  
131.63  
0.004053  
155.2301 0.005545  
179.6656 0.007498  
107.0763  
105.9423  
90.10168  
75.19814  
53.10814  
21.70136  
4.656224  
0.234721  
0.285944  
0.339673  
0.393746  
0.384353  
0.376183  
0.358586  
0.345562  
0.33312  
51.43065  
16.46701  
155.5993  
130.5601  
103.3297  
77.84766  
52.77053  
30.51455  
10.04765  
0.009779  
0.011736  
0.013927  
0.015937  
0.016795  
0.01786  
163.3173  
135.039  
2.2  
1.7  
1.5  
1.5  
1.7  
1.9  
2.0  
11.74152 17.96498  
47.58817 17.32414  
81.55786 15.87927  
0.459194  
0.459988  
0.428158  
0.393701  
103.1106  
75.83004  
50.16202  
26.66791  
6.504047  
112.353  
14.44081  
142.5801 12.67831  
171.7261 11.27597  
19.19006 0.3497  
32.22469 0.30875  
49.16136 0.279672  
59.65434 0.248479  
78.78085 0.21362  
94.87525 0.168643  
0.019217  
160.2254  
133.8644  
108.48  
10.43483  
9.743293  
9.072149  
8.513716  
9.842264 0.020551  
30.36495 0.020908  
12.63121 2.1  
33.64811 2.2  
56.42401 2.3  
80.24833 2.4  
0.331268  
0.337502  
0.344645  
50.7401  
0.022136  
84.75183  
71.86536 0.022792  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
10 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
9. Package outline  
Plastic surface mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT363  
SC-88  
Fig 14. Package outline; SOT363 (SC-88).  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
11 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
10. Revision history  
Table 9:  
Revision history  
Release date Data sheet status  
20040924 Product data sheet  
Document ID  
BGA2717_2  
Modifications:  
Change notice Doc. number  
Supersedes  
-
9397 750 13293 BGA2717_N_1  
The format of this data sheet has been redesigned to comply with the new presentation and  
information standard of Philips Semiconductors  
BGA2717_N_1  
20040202  
Preliminary data sheet  
-
9397 750 12828  
-
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
12 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
11. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
12. Definitions  
13. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
14. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 13293  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 24 September 2004  
13 of 14  
BGA2717  
Philips Semiconductors  
MMIC wideband amplifier  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
2
3
4
5
6
7
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
8
8.1  
8.2  
Application information. . . . . . . . . . . . . . . . . . . 4  
Grounding and output impedance . . . . . . . . . . 5  
Application examples . . . . . . . . . . . . . . . . . . . . 6  
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Contact information . . . . . . . . . . . . . . . . . . . . 13  
10  
11  
12  
13  
14  
© Koninklijke Philips Electronics N.V. 2004  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 24 September 2004  
Document number: 9397 750 13293  
Published in The Netherlands  

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