BTA310-800C [NXP]
4 QUADRANT LOGIC LEVEL TRIAC;
| 型号： | BTA310-800C |
| 厂家： | 
NXP |
| 描述： | 4 QUADRANT LOGIC LEVEL TRIAC 三端双向交流开关 |
| 文件： | 总14页 (文件大小：654K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BTA310-800C
O-220AB
T
3Q Hi-Com Triac
Rev. 1 — 23 April 2012
Product data sheet
1. Product profile
1.1 General description
Planar passivated high commutation three quadrant triac in a SOT78 (TO-220AB) plastic
package intended for use in circuits where high static and dynamic dV/dt and high dI/dt
can occur. This "series C" triac will commutate the full RMS current at the maximum rated
junction temperature without the aid of a snubber.
1.2 Features and benefits
3Q technology for improved noise
Less sensitive gate for high noise
immunity
immunity
High commutation capability with
Planar passivated for voltage
maximum false trigger immunity
ruggedness and reliability
High immunity to false turn-on by dV/dt
High voltage capability
Triggering in three quadrants only
1.3 Applications
Electronic thermostats (heating and
Rectifier-fed DC inductive loads e.g.
cooling)
DC motors and solenoids
Motor controls e.g. washing machines
and vacuum cleaners
1.4 Quick reference data
Table 1.
Symbol
VDRM
Quick reference data
Parameter
Conditions
Min
Typ
Max
800
85
Unit
V
repetitive peak off-state voltage
-
-
-
-
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C;
tp = 20 ms; see Figure 4; see Figure 5
A
Tj
junction temperature
RMS on-state current
-
-
-
-
125
10
°C
A
IT(RMS)
full sine wave; Tmb ≤ 106 °C;
see Figure 1; see Figure 2;
see Figure 3
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
Table 1.
Symbol
Quick reference data …continued
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; see Figure 7
2
2
2
-
-
-
35
35
35
mA
mA
mA
VD = 12 V; IT = 0.1 A; T2+ G-;
Tj = 25 °C; see Figure 7
VD = 12 V; IT = 0.1 A; T2- G-;
Tj = 25 °C; see Figure 7
Dynamic Characteristics
dVD/dt
rate of rise of off-state voltage
VDM = 536 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
500
20
-
-
-
-
V/µs
dIcom/dt
rate of change of commutating
current
VD = 400 V; Tj = 125 °C;
A/ms
IT(RMS) = 10 A; dVcom/dt = 20 V/µs;
(snubberless condition); gate open
circuit
2. Pinning information
Table 2.
Pinning information
Symbol Description
Pin
1
Simplified outline
Graphic symbol
T1
T2
G
main terminal 1
main terminal 2
gate
mb
T2
T1
G
2
3
sym051
mb
T2
mounting base; main terminal 2
1
2 3
SOT78 (TO-220AB)
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BTA310-800C
TO-220AB
plastic single-ended package; heatsink mounted; 1 mounting
hole; 3-lead TO-220AB
SOT78
BTA310-800C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
2 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDRM
Parameter
Conditions
Min
Max
800
10
Unit
V
repetitive peak off-state voltage
RMS on-state current
-
-
IT(RMS)
full sine wave; Tmb ≤ 106 °C; see Figure 1;
A
see Figure 2; see Figure 3
ITSM
non-repetitive peak on-state
current
full sine wave; Tj(init) = 25 °C; tp = 20 ms;
see Figure 4; see Figure 5
-
85
A
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms
tp = 10 ms; sine-wave pulse
-
93
A
I2t
I2t for fusing
-
36.1
100
2
A2s
A/µs
A
dIT/dt
IGM
rate of rise of on-state current
peak gate current
IT = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/µs
-
-
PGM
PG(AV)
Tstg
Tj
peak gate power
-
5
W
average gate power
storage temperature
junction temperature
over any 20 ms period
-
0.5
150
125
W
-40
-
°C
°C
003aaj686
003aaj688
12
50
I
T(RMS)
(A)
106 °C
I
T(RMS)
(A)
40
30
20
10
8
4
0
0
-2
-1
10
-50
0
50
100
150
10
1
10
T
mb
(°C)
surge duration (s)
Fig 1. RMS on-state current as a function of mounting
base temperature; maximum values
Fig 2. RMS on-state current as a function of surge
duration; maximum values
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
3 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
003aaj690
102.5
15
conduction form
T
P
mb(max)
tot
(W)
12
angle
factor
a
(°C)
107
°
(degrees)
α = 180
30
60
4
°
120
2.8
2.2
1.9
1.57
α
90
°
90
60
120
180
9
6
3
0
111.5
116
°
°
30
120.5
125
0
2.5
5
7.5
10
12.5
I
(A)
T(RMS)
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
003aaj692
120
TSM
I
(A)
100
80
60
40
20
0
I
I
TSM
T
t
1/f
= 25 °C max
T
j(init)
2
3
1
10
10
10
number of cycles (n)
Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
4 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
003aaj693
3
10
I
TSM
(A)
(1)
2
10
I
I
T
TSM
t
t
p
T
j(init)
= 25 °C max
10
-5
-4
-3
-2
-1
10
10
10
10
10
t (s)
p
Fig 5. Non-repetitive peak on-state current as a function of pulse width; maximum values
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
5 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
1.5
2
Unit
K/W
K/W
K/W
thermal resistance from junction to mounting full cycle; see Figure 6
base
-
-
-
-
half cycle; see Figure 6
-
Rth(j-a)
thermal resistance from junction to ambient
in free air
60
-
003aaj343
10
Z
th(j-mb)
(K/W)
1
(1)
(2)
-1
-2
-3
10
10
10
P
D
t
t
p
-5
-4
-3
-2
-1
10
10
10
10
10
1
10
t
p
(s)
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse duration
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
6 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
6. Characteristics
Table 6.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IGT gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C;
see Figure 7
2
2
2
-
-
-
-
-
-
-
35
35
35
50
60
50
mA
mA
mA
mA
mA
mA
VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 7
VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 7
IL
latching current
VD = 12 V; IG = 0.1 A; T2+ G+; Tj = 25 °C;
see Figure 8
VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C;
see Figure 8
-
VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C;
see Figure 8
-
IH
holding current
VD = 12 V; Tj = 25 °C; see Figure 9
IT = 12 A; Tj = 25 °C; see Figure 10
-
-
-
-
35
mA
V
VT
VGT
on-state voltage
gate trigger voltage
1.25
0.8
1.5
1.5
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
see Figure 11
V
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
see Figure 11
0.25
-
0.4
0.1
-
V
ID
off-state current
VD = 800 V; Tj = 125 °C
0.5
mA
Dynamic Characteristics
dVD/dt
rate of rise of off-state
voltage
VDM = 536 V; Tj = 125 °C; (VDM = 67% of
VDRM); exponential waveform; gate open
circuit
500
20
-
-
-
-
V/µs
dIcom/dt
rate of change of
commutating current
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 20 V/µs; (snubberless condition);
gate open circuit
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 10 V/µs; gate open circuit
28
40
-
-
-
-
A/ms
A/ms
VD = 400 V; Tj = 125 °C; IT(RMS) = 10 A;
dVcom/dt = 1 V/µs; gate open circuit
BTA310-800C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
7 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
003aaj695
003aaj694
3
3
(1)
I
I
GT
L
I
I
L(25°C)
GT(25°C)
(2)
2
2
(3)
1
1
0
0
-50
0
50
100
150
-50
0
50
100
150
T (°C)
j
T (°C)
j
(1) T2- G-
(2) T2+ G+
(3) T2+ G-
Fig 7. Normalized gate trigger current as a function of
junction temperature
Fig 8. Normalized latching current as a function of
junction temperature
003aaj697
003aaj696
3
40
I
T
I
H
(A)
I
H(25°C)
30
2
20
10
0
1
0
(1)
1
(2)
(3)
-50
0
50
100
150
0
2
3
T (°C)
j
V
(V)
T
Vo = 1.103 V; Rs = 0.030 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. Normalized holding current as a function of
junction temperature
Fig 10. On-state current as a function of on-state
voltage
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
8 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
003aaj698
1.6
V
GT
V
GT(25°C)
1.2
0.8
0.4
-50
0
50
100
150
T (°C)
j
Fig 11. Normalized gate trigger voltage as a function of junction temperature
BTA310-800C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
9 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
7. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB
SOT78
E
p
A
A
1
q
mounting
D
1
base
D
(1)
(1)
L
1
L
2
Q
(2)
b
1
L
(3×)
(2)
b
2
(2×)
1
2
3
b(3×)
c
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
2
(2)
(2)
(1)
1
UNIT
mm
A
A
b
b
b
c
D
D
1
E
e
L
L
p
q
Q
1
1
2
max.
4.7
4.1
1.40
1.25
0.9
0.6
1.6
1.0
1.3
1.0
0.7
0.4
16.0
15.2
6.6
5.9
10.3
9.7
15.0 3.30
12.8 2.79
3.8
3.5
3.0
2.7
2.6
2.2
2.54
3.0
Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
08-04-23
08-06-13
SOT78
SC-46
3-lead TO-220AB
Fig 12. Package outline SOT78 (TO-220AB)
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
10 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
8. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BTA310-800C v.1
20120423
Product data sheet
-
-
BTA310-800C
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
11 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
9. Legal information
9.1 Data sheet status
Document status[1] [2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URLhttp://www.nxp.com.
Right to make changes — NXP Semiconductors reserves the right to make
9.2 Definitions
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with theTerms and conditions of commercial sale of NXP Semiconductors.
BTA310-800C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
12 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published athttp://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Adelante,Bitport,Bitsound,CoolFlux,CoReUse,DESFire,EZ-HV,FabKey,G
reenChip,HiPerSmart,HITAG,I²C-bus
logo,ICODE,I-CODE,ITEC,Labelution,MIFARE,MIFARE Plus,MIFARE
Ultralight,MoReUse,QLPAK,Silicon
Tuner,SiliconMAX,SmartXA,STARplug,TOPFET,TrenchMOS,TriMedia
andUCODE — are trademarks of NXP B.V.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
HD Radio andHD Radio logo — are trademarks of iBiquity Digital
Corporation.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
10. Contact information
For more information, please visit:http://www.nxp.com
For sales office addresses, please send an email to:salesaddresses@nxp.com
BTA310-800C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 April 2012
13 of 14
BTA310-800C
NXP Semiconductors
3Q Hi-Com Triac
11. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits. . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
Ordering information. . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
Thermal characteristics . . . . . . . . . . . . . . . . . . .6
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
9.1
9.2
9.3
9.4
10
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 April 2012
Document identifier: BTA310-800C
相关型号：
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