BUJ303AX_11 [NXP]
NPN power transistor Very high voltage capability Isolated package; NPN功率晶体管非常高的电压隔离能力包型号: | BUJ303AX_11 |
厂家: | NXP |
描述: | NPN power transistor Very high voltage capability Isolated package |
文件: | 总14页 (文件大小:586K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUJ303AX
220F
-
TO
NPN power transistor
Rev. 05 — 3 May 2011
Product data sheet
1. Product profile
1.1 General description
High voltage, high speed, planar passivated NPN power switching transistor in a
SOT186A (TO220F) "full pack" plastic package.
1.2 Features and benefits
Fast switching
Very high voltage capability
Isolated package
Very low switching and conduction
losses
1.3 Applications
DC-to-DC converters
Inverters
High frequency electronic lighting
Motor control systems
ballasts
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
IC
collector current
see Figure 1; see Figure 2;
see Figure 4
-
-
5
A
Ptot
total power dissipation
Th ≤ 25 °C; see Figure 3
-
-
-
-
32
W
VCESM
collector-emitter peak
voltage
VBE = 0 V
1000 V
Static characteristics
hFE
DC current gain
IC = 5 mA; VCE = 5 V;
Th = 25 °C; see Figure 11
10
14
22
25
35
35
IC = 500 mA; VCE = 5 V;
Th = 25 °C; see Figure 11
Dynamic characteristics
tf
fall time
IC = 2.5 A; IBon = 0.5 A;
see Figure 14; see Figure 15;
VBB = -5 V; LB = 1 µH;
Th = 25 °C
-
145 160 ns
BUJ303AX
NXP Semiconductors
NPN power transistor
2. Pinning information
Table 2.
Pinning information
Symbol Description
Pin
1
Simplified outline
Graphic symbol
B
base
mb
C
2
C
collector
3
E
emitter
B
mb
n.c.
mounting base; isolated
E
sym123
1
2 3
SOT186A (TO-220F)
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
SOT186A
BUJ303AX
TO-220F
plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 "full pack"
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCESM
VCEO
IC
Parameter
Conditions
Min
Max
1000
500
5
Unit
collector-emitter peak voltage
collector-emitter voltage
collector current
VBE = 0 V
-
V
IB = 0 A
-
V
see Figure 1; see Figure 2; see Figure 4
-
A
ICM
peak collector current
base current
-
10
A
IB
DC
-
2
A
IBM
peak base current
total power dissipation
storage temperature
junction temperature
-
4
A
Ptot
Th ≤ 25 °C; see Figure 3
-
32
W
°C
°C
Tstg
Tj
-65
-
150
150
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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BUJ303AX
NXP Semiconductors
NPN power transistor
003aag028
V
C
CC
12
L
V
I
CL(CE)
C
probe point
(A)
L
B
I
Bon
8
4
0
DUT
V
BB
001aab999
0
400
800
1200
(V)
V
CEclamp
Fig 1. Test circuit for reverse bias safe operating area Fig 2. Reverse bias safe operating area
03aa13
120
Pder
(%)
80
40
0
0
50
100
150
200
T
h
(°C)
Fig 3. Normalized total power dissipation as a function of heatsink temperature
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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BUJ303AX
NXP Semiconductors
NPN power transistor
003aag029
2
10
I
C
(A)
duty cycle = 0.01
10
I
CMmax
t
p
= 10 μs
II
(3)
I
Cmax
(1)
100 μs
1 ms
1
(2)
I
(3)
-1
10 ms
DC
10
III
(3)
-2
10
2
3
1
10
10
10
V
(V)
CEclamp
(1) Ptot maximum and Ptot peak maximum lines.
(2) Second breakdown limits.
(3) I = Region of permissible DC operation.
II = Extension for repetitive pulse operation.
III = Extension during turn-on in single transistor converters provided that RBE ≤ 100 Ω and tp ≤ 0.6 μs.
Fig 4. Forward bias safe operating area for Tmb ≤ 25 °C
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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NPN power transistor
5. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from junction to
heatsink
with heatsink compound ;
see Figure 5
-
-
3.95
K/W
Rth(j-a)
thermal resistance from junction to
ambient
in free air
-
55
-
K/W
003aag067
10
Z
th(j-h)
δ = 0.5
(K/W)
0.2
1
0.1
0.05
0.02
0
-1
-2
-3
10
10
10
t
p
P
δ =
tot
T
t
t
p
T
-6
-5
-4
-3
-2
-1
2
10
10
10
10
10
10
1
10
10
t
p
(s)
Fig 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
6. Isolation characteristics
Table 6.
Symbol
Visol(RMS)
Isolation characteristics
Parameter
Conditions
Min
Typ
Max
Unit
RMS isolation voltage
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Th = 25 °C;
from all terminals to external heatsink; clean
and dust free
-
-
2500
V
Cisol
isolation capacitance
from collector to external heatsink ;
f = 1 MHz; Th = 25 °C
-
10
-
pF
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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NXP Semiconductors
NPN power transistor
7. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
[1]
[1]
[1]
[1]
ICES
collector-emitter cut-off
current
VBE = 0 V; VCE = 1000 V; Th = 25 °C
VBE = 0 V; VCE = 1000 V; Tj = 125 °C
-
-
-
-
-
-
-
-
1
mA
mA
mA
mA
2
ICBO
ICEO
collector-base cut-off current VCB = 1000 V; IE = 0 A; Th = 25 °C
1
collector-emitter cut-off
current
VCE = 500 V; IB = 0 A; Th = 25 °C
0.1
IEBO
emitter-base cut-off current VEB = 9 V; IC = 0 A; Th = 25 °C
collector-emitter sustaining IB = 0 A; IC = 10 mA; LC = 25 mH;
-
-
-
0.1
-
mA
V
VCEOsus
500
voltage
Th = 25 °C; see Figure 6; see Figure 7
VCEsat
VBEsat
hFE
collector-emitter saturation
voltage
IC = 3 A; IB = 0.6 A; Th = 25 °C;
see Figure 8; see Figure 9
-
0.25
0.97
22
1.5
1.3
35
35
17
-
V
V
base-emitter saturation
voltage
IC = 3 A; IB = 0.6 A; Th = 25 °C;
see Figure 10
-
DC current gain
IC = 5 mA; VCE = 5 V; Th = 25 °C;
see Figure 11
10
14
10
-
IC = 500 mA; VCE = 5 V; Th = 25 °C;
see Figure 11
25
hFEsat
DC saturation current gain
IC = 2.5 A; VCE = 5 V; Th = 25 °C;
see Figure 11
13.5
12
IC = 3 A; VCE = 5 V; Th = 25 °C;
see Figure 11
Dynamic characteristics
ton
ts
turn-on time
storage time
IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A;
RL = 75 Ω; VBB = -4 V; Th = 25 °C;
resistive load; see Figure 12;
see Figure 13
-
-
0.5
3.3
0.7
4
µs
µs
IC = 2.5 A; IBon = 0.5 A; VBB = -5 V;
LB = 1 µH; Th = 25 °C; inductive load;
see Figure 14; see Figure 15
-
-
-
1.4
1.6
µs
µs
µs
IC = 2.5 A; IBon = 0.5 A; VBB = -5 V;
LB = 1 µH; Tj = 100 °C; inductive load;
see Figure 14; see Figure 15
1.7
1.9
tf
fall time
IC = 2.5 A; IBon = 0.5 A; IBoff = -0.5 A;
RL = 75 Ω; VBB = -4 V; Th = 25 °C;
resistive load; see Figure 12;
see Figure 13
0.33
0.45
IC = 2.5 A; IBon = 0.5 A; VBB = -5 V;
LB = 1 µH; Th = 25 °C; see Figure 14;
see Figure 15
-
-
145
160
160
200
ns
ns
IC = 2.5 A; IBon = 0.5 A; VBB = -5 V;
LB = 1 µH; Tj = 100 °C; inductive load;
see Figure 14; see Figure 15
[1] Measured with half-sine wave voltage (curve tracer).
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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NXP Semiconductors
NPN power transistor
I
C
50 V
100 Ω to 200 Ω
(mA)
horizontal
oscilloscope
vertical
250
6 V
300 Ω
1 Ω
100
30 Hz to 60 Hz
001aab987
10
0
min
V
CE
(V)
V
CEOsus
001aab988
Fig 6. Test circuit for collector-emitter sustaining
voltage
Fig 7. Oscilloscope display for collector-emitter
sustaining voltage test waveform
003aag031
003aag032
2.0
V
CEsat
(V)
0.5
CEsat
V
I
= 1 A
2 A 3 A
4 A
C
1.6
1.2
0.8
0.4
0
(V)
0.4
0.3
0.2
0.1
0
-2
-1
-1
10
10
1
10
10
1
10
I
B
(A)
I (A)
C
Fig 8. Collector-emitter saturation voltage as a
function of base current; typical values
Fig 9. Collector-emitter saturation voltage as a
function of collector current; typical values
BUJ303AX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 05 — 3 May 2011
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BUJ303AX
NXP Semiconductors
NPN power transistor
003aag033
003aag034
2
1.4
10
V
BEsat
(V)
1.2
h
FE
V
= 5 V
CE
1.0
0.8
0.6
0.4
0.2
0
10
1 V
(A)
1
-1
-2
-1
10
1
10
10
10
1
10
I
C
(A)
I
C
Fig 10. Base-emitter saturation voltage as a function of
collector current; typical values
Fig 11. DC current gain as a function of collector
current; typical values
V
CC
I
C
I
Con
90 %
90 %
R
L
V
t
IM
0
R
B
DUT
10 %
p
t
t
f
T
001aab989
t
s
I
B
t
on
t
off
I
Bon
10 %
t
t ≤ 30 ns
r
−I
Boff
001aab990
Fig 12. Test circuit for resistive load switching
Fig 13. Switching times waveforms for resistive load
BUJ303AX
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Product data sheet
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BUJ303AX
NXP Semiconductors
NPN power transistor
V
C
I
C
CC
I
Con
90 %
L
L
B
I
Bon
DUT
V
BB
001aab991
10 %
t
t
f
t
s
t
off
I
B
I
Bon
t
−I
Boff
001aab992
Fig 14. Test circuit for inductive load switching
Fig 15. Switching times waveforms for inductive load
BUJ303AX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 05 — 3 May 2011
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BUJ303AX
NXP Semiconductors
NPN power transistor
8. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3-lead TO-220 'full pack'
SOT186A
E
P
A
A
1
q
D
1
mounting
base
T
D
j
L
L
2
1
K
Q
b
b
1
2
L
1
2
3
b
c
w
M
e
e
1
0
5
scale
10 mm
DIMENSIONS (mm are the original dimensions)
(1)
(2)
L
A
A
b
c
D
D
1
E
e
e
1
j
K
L
L
P
Q
q
T
w
b
b
UNIT
mm
2
1
1
1
2
max.
1.1
0.9
1.4
1.0
2.7
1.7
0.6 14.4 3.30
0.4 13.5 2.79
2.6
2.3
4.6 2.9
4.0 2.5
0.9
0.7
3.0
2.6
0.7 15.8 6.5 10.3
0.4 15.2 6.3 9.7
3.2
3.0
3
5.08
2.54
2.5
0.4
Notes
1. Terminal dimensions within this zone are uncontrolled.
2. Both recesses are ∅ 2.5 × 0.8 max. depth
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-04-09
06-02-14
SOT186A
3-lead TO-220F
Fig 16. Package outline SOT186A (TO-220F)
BUJ303AX
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Product data sheet
Rev. 05 — 3 May 2011
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NPN power transistor
9. Revision history
Table 8.
Revision history
Document ID
BUJ303AX v.5
Modifications:
BUJ303AX v.4
Release date
Data sheet status
Change notice
Supersedes
20110503
Product data sheet
-
BUJ303AX v.4
• Various changes to content.
20110415 Product data sheet
-
BUJ303AX v.3
BUJ303AX
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 05 — 3 May 2011
11 of 14
BUJ303AX
NXP Semiconductors
NPN power transistor
10. Legal information
10.1 Data sheet status
Document status [1] [2]
Product status [3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
Right to make changes — NXP Semiconductors reserves the right to make
10.2 Definitions
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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applications and products.
10.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
BUJ303AX
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Product data sheet
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12 of 14
BUJ303AX
NXP Semiconductors
NPN power transistor
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
Non-automotive qualified products — Unless this data sheet expressly
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the product is not suitable for automotive use. It is neither qualified nor tested
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Semiconductors accepts no liability for inclusion and/or use of
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
non-automotive qualified products in automotive equipment or applications.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BUJ303AX
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Product data sheet
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BUJ303AX
NXP Semiconductors
NPN power transistor
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits. . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
Ordering information. . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Isolation characteristics . . . . . . . . . . . . . . . . . . .5
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
10.1
10.2
10.3
10.4
11
Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 May 2011
Document identifier: BUJ303AX
相关型号:
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