BUT18 [NXP]

Silicon diffused power transistors; 扩散硅功率晶体管
BUT18
型号: BUT18
厂家: NXP    NXP
描述:

Silicon diffused power transistors
扩散硅功率晶体管

晶体 晶体管
文件: 总12页 (文件大小:72K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BUT18; BUT18A  
Silicon diffused power transistors  
1999 Jun 11  
Product specification  
Supersedes data of 1997 Aug 13  
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
DESCRIPTION  
High-voltage, high-speed,  
glass-passivated NPN power  
transistor in a TO-220AB package.  
dbook, halfpage  
APPLICATIONS  
2
Converters  
Inverters  
1
Switching regulators  
Motor control systems.  
3
MBB008  
MBK106  
1
2 3  
PINNING  
PIN  
DESCRIPTION  
base  
1
2
collector; connected to  
mounting base  
Fig.1 Simplified outline (TO-220AB) and symbol.  
3
emitter  
QUICK REFERENCE DATA  
SYMBOL  
PARAMETER  
CONDITIONS  
MAX.  
UNIT  
VCESM  
collector-emitter peak voltage  
BUT18  
VBE = 0  
850  
V
V
BUT18A  
1000  
VCEO  
collector-emitter voltage  
BUT18  
open base  
see Fig.7  
400  
450  
1.5  
4
V
BUT18A  
V
VCEsat  
ICsat  
IC  
collector-emitter saturation voltage  
collector saturation current  
collector current (DC)  
collector current (peak value)  
total power dissipation  
fall time  
V
A
see Fig.2  
see Fig.2  
6
A
ICM  
Ptot  
tf  
12  
110  
A
Tmb 25 °C; see Fig.4  
W
µs  
resistive load; see Figs 10 and 11 0.8  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-mb  
thermal resistance from junction to mounting base  
1.15  
K/W  
1999 Jun 11  
2
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VCESM  
collector-emitter peak voltage  
BUT18  
VBE = 0  
850  
V
V
BUT18A  
1000  
VCEO  
collector-emitter voltage  
BUT18  
open base  
400  
450  
4
V
V
A
A
A
A
A
BUT18A  
ICsat  
IC  
ICM  
IB  
collector saturation current  
collector current (DC)  
collector current (peak value)  
base current (DC)  
base current (peak value)  
total power dissipation  
storage temperature  
junction temperature  
see Fig.2  
see Fig.2  
6
12  
3
IBM  
Ptot  
Tstg  
Tj  
6
Tmb 25 °C; see Fig.4  
110  
+150  
150  
W
65  
°C  
°C  
CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VCEOsust  
collector-emitter sustaining  
voltage  
IC = 0.1 A; IBoff = 0; L = 25 mH; see  
Figs 5 and 6  
BUT18  
400  
450  
V
BUT18A  
V
VCEsat  
VBEsat  
ICES  
collector-emitter saturation voltage IC = 4 A; IB = 0.8 A; see Fig.7  
1.5  
1.3  
1
V
base-emitter saturation voltage  
collector-emitter cut-off current  
IC = 4 A; IB = 0.8 A; see Fig.8  
V
VCE = VCESMmax; VBE = 0; note 1  
mA  
mA  
VCE = VCESMmax; VBE = 0;  
2
Tj = 125 °C; note 1  
IEBO  
hFE  
emitter-base cut-off current  
DC current gain  
VEB = 9 V; IC = 0  
10  
35  
35  
mA  
VCE = 5 V; IC = 10 mA; see Fig.9  
10  
10  
18  
20  
VCE = 5 V; IC = 1 A; see Fig.9  
Switching times resistive load (see Figs 10 and 11)  
ton  
ts  
turn-on time  
storage time  
fall time  
ICon = 4 A; IBon = IBoff = 800 mA  
ICon = 4 A; IBon = IBoff = 800 mA  
ICon = 4 A; IBon = IBoff = 800 mA  
1
µs  
µs  
µs  
4
tf  
0.8  
Switching times inductive load (see Figs 10 and 13)  
ts  
tf  
storage time  
fall time  
ICon = 4 A; IBon = 800 mA; VCL = 250 V −  
ICon = 4 A; IBon = 800 mA; VCL = 250 V −  
1.6  
2.5  
µs  
150  
400  
ns  
Note  
1. Measured with a half-sinewave voltage (curve tracer).  
1999 Jun 11  
3
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
MGB921  
2
10  
I
C
(A)  
I
CM max  
10  
I
C max  
II  
1
I
1  
10  
DC  
2  
10  
BUT18  
BUT18A  
3  
10  
4  
10  
2
3
4
1
10  
10  
10  
10  
V
(V)  
CE  
Tmb = 25 °C.  
I - Region of permissible DC operation.  
II - Permissible extension for repetitive pulse operation.  
Fig.2 Forward bias SOAR.  
4
1999 Jun 11  
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
MGB862  
10  
Z
th jmb  
(K/W)  
δ = 1  
0.75  
1
0.50  
0.33  
0.20  
0.10  
1  
10  
0.05  
0.02  
0.01  
0
2  
10  
3  
2  
1  
2
3
10  
10  
10  
1
10  
10  
10  
t
(ms)  
p
Fig.3 Transient thermal impedance.  
MGD283  
120  
handbook, halfpage  
P
tot max  
handbook, halfpage  
(%)  
+ 50 V  
100 to 200 Ω  
80  
L
horizontal  
oscilloscope  
vertical  
40  
300 Ω  
1 Ω  
6 V  
30 to 60 Hz  
MGE252  
0
0
50  
100  
150  
o
T
( C)  
mb  
Fig.5 Test circuit for collector-emitter  
sustaining voltage.  
Fig.4 Power derating curve.  
1999 Jun 11  
5
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
MGB884  
2
handbook, halfpage  
(1)  
(2)  
(3)  
V
CEsat  
(V)  
MGE239  
I
handbook, halfpage  
C
(mA)  
250  
1
200  
100  
0
0
10  
V
(V)  
2  
1  
CE  
10  
1
10  
min  
I
(A)  
B
V
CEOsust  
Tj = 25 °C.  
(1) IC = 1 A.  
(2)  
IC = 2 A.  
(3) IC = 4 A.  
Fig.6 Oscilloscope display for collector-emitter  
sustaining voltage.  
Fig.7 Collector-emitter saturation voltage as a  
function of base current.  
MGB880  
MBC097  
2
10  
1.5  
handbook, halfpage  
handbook, halfpage  
V
BEsat  
(V)  
h
FE  
V
= 5 V  
1V  
CE  
(1)  
(2)  
1
10  
(3)  
1
10  
0.5  
10  
2  
1  
2
2  
1  
10  
1
10  
10  
10  
1
10  
I
(A)  
I
(A)  
C
B
Tj = 25 °C.  
(1) C = 4 A.  
I
(2) IC = 2 A.  
(3) IC = 1 A.  
VCE = 5 V; Tj = 25 °C.  
Fig.8 Base-emitter saturation voltage as a  
function of base current.  
Fig.9 DC current gain; typical values.  
1999 Jun 11  
6
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
MBB731  
handbook, halfpage  
90%  
t 30 ns  
r
I
B on  
I
B
10%  
V
handbook, halfpage  
CC  
t
I
B off  
R
L
V
R
IM  
0
B
I
C on  
D.U.T.  
90%  
t
p
I
MGE244  
C
T
10%  
t
t
f
t
on  
t
s
VCC = 250 V; tp = 20 µs; VIM = 6 to +8 V; tp/T = 0.01.  
tr 30 ns.  
The values of RB and RL are selected in accordance with ICon and  
IBon requirements.  
Fig.11 Switching time waveforms with  
resistive load.  
Fig.10 Test circuit resistive load.  
handbook, halfpage  
t
r
I
90%  
10%  
B on  
I
B
V
C
handbook, halfpage  
CC  
t
L
I  
B off  
V
+I  
CL  
B
L
B
I
C on  
D.U.T.  
90%  
10%  
V  
BE  
MGE246  
I
C
t
t
f
t
s
t
VCL = up to 1000 V; VCC = 30 V; VBE = 5 V; LB = 1 µH (0 for reverse  
bias SOAR); LC = 200 µH.  
MGE238  
off  
Fig.12 Test circuit inductive load and reverse  
bias SOAR.  
Fig.13 Switching times waveforms with  
inductive load.  
1999 Jun 11  
7
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
PACKAGE OUTLINE  
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB  
SOT78  
E
P
A
A
1
q
D
1
D
(1)  
L
L
1
2
Q
b
1
L
1
2
3
b
c
e
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
b
(1)  
L
e
2
A
b
D
E
L
D
L
1
A
c
UNIT  
P
q
Q
1
1
1
max.  
4.5  
4.1  
1.39  
1.27  
0.9  
0.7  
1.3  
1.0  
0.7  
0.4  
15.8  
15.2  
6.4  
5.9  
10.3  
9.7  
15.0  
13.5  
3.30  
2.79  
3.8  
3.6  
3.0  
2.7  
2.6  
2.2  
mm  
3.0  
2.54  
Note  
1. Terminals in this zone are not tinned.  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
97-06-11  
SOT78  
TO-220AB  
1999 Jun 11  
8
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jun 11  
9
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
NOTES  
1999 Jun 11  
10  
Philips Semiconductors  
Product specification  
Silicon diffused power transistors  
BUT18; BUT18A  
NOTES  
1999 Jun 11  
11  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Slovakia: see Austria  
Slovenia: see Italy  
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Hungary: see Austria  
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Tel. +91 22 493 8541, Fax. +91 22 493 0966  
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Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
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Uruguay: see South America  
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Middle East: see Italy  
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For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA66  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
135002/02/pp12  
Date of release: 1999 Jun 11  
Document order number: 9397 750 06092  

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