BZA900AVL [NXP]
Quadruple low capacitance ESD suppressor; 四低电容ESD抑制器
| 型号： | BZA900AVL |
| 厂家： | 
NXP |
| 描述： | Quadruple low capacitance ESD suppressor |
| 文件： | 总11页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BZA900AVL series
Quadruple low capacitance ESD
suppressor
Product specification
2003 Oct 20
Supersedes data of 2003 Apr 15
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
FEATURES
PINNING
PIN
• Low diode capacitance
DESCRIPTION
• Low leakage current
1
2
3
4
5
cathode 1
• SOT665 surface mount package
• Common anode configuration.
common anode
cathode 2
cathode 3
APPLICATIONS
cathode 4
• Communication systems
• Computers and peripherals
• Audio and video equipment.
5
4
handbook, halfpage
DESCRIPTION
1
3
4
5
Monolithic transient voltage suppressor diode in a five lead
SOT665 package for 4-bit wide ESD transient
suppression.
2
1
2
3
MGW315
MARKING
TYPE NUMBER
BZA956AVL
MARKING CODE
V3
V2
V1
BZA962AVL
BZA968AVL
Fig.1 Simplified outline (SOT665) and symbol.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
BZA956AVL
BZA962AVL
BZA968AVL
−
−
−
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
SOT665
SOT665
SOT665
2003 Oct 20
2
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
IZ
working current
Tamb = 25 °C
−
−
−
−
−
note 1
200
3.5
mA
IF
continuous forward current
non-repetitive peak forward current
total power dissipation
Tamb = 25 °C
mA
A
IFSM
Ptot
PZSM
tp = 1 ms; square pulse
Tamb = 25 °C; note 2; see Fig.5
square pulse; tp = 1 ms
335
6
mW
W
non repetitive peak reverse power
dissipation
Tstg
Tj
storage temperature
junction temperature
electrostatic discharge
−65
+150
150
−
°C
°C
kV
kV
−
ESD
IEC 61000-4-2 (contact discharge) 15
HBM MIL-Std 883
10
−
Notes
1. DC working current limited by Ptot(max)
.
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
STANDARD
IEC 61000-4-2, level 4 (ESD)
HBM MIL-Std 883, class 3
CONDITIONS
>15 kV (air); >8 kV (contact discharge)
>4 kV
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to
ambient
all diodes loaded
370
K/W
Rth j-s
thermal resistance from junction to
solder point; note 1
one diode loaded
all diodes loaded
135
125
K/W
K/W
Note
1. Solder point of common anode (pin 2).
2003 Oct 20
3
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
IF = 200 mA
MIN.
TYP.
MAX.
1.2
UNIT
VF
IR
−
−
V
reverse current
BZA956AVL
VR = 3 V
VR = 4 V
VR = 4.3 V
IZ = 1 mA
−
−
−
−
−
−
200
100
20
nA
nA
nA
BZA962AVL
BZA968AVL
VZ
rdif
SZ
Cd
working voltage
BZA956AVL
5.32
5.89
6.46
5.6
6.2
6.8
5.88
6.51
7.14
V
V
V
BZA962AVL
BZA968AVL
differential resistance
BZA956AVL
IZ = 1 mA
−
−
−
−
−
−
200
150
100
Ω
Ω
Ω
BZA962AVL
BZA968AVL
temperature coefficient
BZA956AVL
IZ = 1 mA
−
−
−
1.3
2.4
2.9
−
−
−
mV/K
mV/K
mV/K
BZA962AVL
BZA968AVL
diode capacitance
BZA956AVL
f = 1 MHz; VR = 0
f = 1 MHz; VR = 5 V
tp = 1 ms; Tamb = 25 °C
−
−
−
22
18
16
28
22
19
pF
pF
pF
BZA962AVL
BZA968AVL
diode capacitance
BZA956AVL
−
−
−
12
9
17
12
11
pF
pF
pF
BZA962AVL
BZA968AVL
8
IZSM
non-repetitive peak reverse current
BZA956AVL
−
−
−
−
−
−
0.90
0.85
0.80
A
A
A
BZA962AVL
BZA968AVL
2003 Oct 20
4
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
MLE001
MLE003
2
10
10
handbook, halfpage
handbook, halfpage
I
P
ZSM
ZSM
(A)
(W)
BZA956AVL
BZA956AVL
BZA962AVL
1
10
BZA968AVL
BZA962AVL/BZA968AVL
−1
10
1
10
−2
−1
−2
−1
10
10
1
10
10
1
10
t
(ms)
t (ms)
p
p
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
MGT586
MLE002
26
400
handbook, halfpage
handbook, halfpage
C
d
P
tot
(mW)
(pF)
22
300
18
200
100
0
BZA956AVL
14
BZA962AVL
10
BZA968AVL
6
0
1
2
3
4
5
0
50
100
150
V
(V)
T
(°C)
R
amb
Tj = 25 °C; f = 1 MHz.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
Fig.5 Power derating curve.
2003 Oct 20
5
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
ESD TESTER
RG 223/U
DIGITIZING
50 Ω coax
OSCILLOSCOPE
R
Z
450 Ω
10×
ATTENUATOR
50 Ω
C
Z
note 1
1/4 BZA900AVL
IEC 1000-4-2 network
= 150 pF; R = 330 Ω
Note 1: attenuator is only used for open
socket high voltage measurements
C
Z
Z
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
BZA968AVL
GND3
BZA962AVL
BZA956AVL
GND2
GND1
GND
unclamped +1 kV ESD voltage waveform
clamped +1 kV ESD voltage waveform
(IEC 1000-4-2 network)
(IEC 1000-4-2 network)
GND
GND
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
unclamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network)
MLE005
Fig.6 ESD clamping test set-up and waveforms.
6
2003 Oct 20
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
APPLICATION INFORMATION
Typical common anode application
A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one
package. Two simplified examples are shown in Figs.7 and 8.
A
B
C
D
keyboard,
terminal,
printer,
etc.
I/O
FUNCTIONAL
DECODER
BZA900AVL
GND
MLE008
Fig.7 Computer interface protection.
V
V
DD
GG
address bus
RAM
ROM
data bus
I/O
CPU
CLOCK
control bus
BZA900AVL
GND
MLE009
Fig.8 Microprocessor protection.
7
2003 Oct 20
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA900AVL is determined by the peak transient current
and the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
terminals or connectors
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
unprotected conductors
4. Minimize all printed-circuit board loop areas including
power and ground loops
5. Minimize the length of the transient return path to
ground
6. Avoid using shared transient return paths to a common
ground point.
2003 Oct 20
8
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
PACKAGE OUTLINE
Plastic surface mounted package; 5 leads
SOT665
D
A
E
X
Y
S
S
H
E
5
4
A
c
1
2
3
e
1
b
p
w M
A
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
c
D
E
e
e
H
L
w
y
A
p
p
1
E
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.7
1.5
0.3
0.1
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
01-01-04
01-08-27
SOT665
2003 Oct 20
9
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 20
10
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/03/pp11
Date of release: 2003 Oct 20
Document order number: 9397 750 11935
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