BZA962A [PHILIPS]

Transient Suppressor,;
BZA962A
型号: BZA962A
厂家: PHILIPS SEMICONDUCTORS    PHILIPS SEMICONDUCTORS
描述:

Transient Suppressor,

文件: 总12页 (文件大小:77K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BZA900A-series  
Quadruple ESD transient voltage  
suppressor  
Product specification  
2001 Sep 03  
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
FEATURES  
PINNING  
PIN  
ESD rating >8 kV, according to IEC61000-4-2  
SOT665 surface mount package  
DESCRIPTION  
1
2
3
4
5
cathode 1  
Common anode configuration.  
common anode  
cathode 2  
APPLICATIONS  
cathode 3  
cathode 4  
Computers and peripherals  
Audio and video equipment  
Communication systems  
DESCRIPTION  
5
4
handbook, halfpage  
Monolithic transient voltage suppressor diode in a five lead  
SOT665 package for 4-bit wide ESD transient  
suppression.  
1
3
4
5
2
MARKING  
1
2
3
MGW315  
TYPE NUMBER  
BZA956A  
MARKING CODE  
Z1  
Z2  
Z3  
BZA962A  
BZA968A  
Fig.1 Simplified outline (SOT665) and symbol.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
SYMBOL  
Per diode  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
IZ  
working current  
continuous forward current  
non-repetitive peak forward current tp = 1 ms; square pulse  
Tamb = 25 °C  
note 1  
200  
4
mA  
IF  
Tamb = 25 °C  
mA  
A
IFSM  
Ptot  
PZSM  
total power dissipation  
Tamb = 25 °C; note 2; see Fig.5  
335  
mW  
non repetitive peak reverse power square pulse; tp = 1 ms; see Fig.3  
dissipation:  
BZA956A  
16  
W
W
W
°C  
°C  
BZA962A  
15  
BZA968A  
14  
Tstg  
Tj  
storage temperature  
junction temperature  
65  
+150  
150  
Notes  
1. DC working current limited by Ptot(max)  
.
2. Device mounted on standard printed-circuit board.  
2001 Sep 03  
2
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
VALUE  
UNIT  
Rth j-a  
Rth j-s  
thermal resistance from junction to ambient all diodes loaded  
370  
135  
125  
K/W  
K/W  
K/W  
thermal resistance from junction to solder  
point; note 1  
one diode loaded  
all diodes loaded  
Note  
1. Solder point of common anode (pin 2).  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MAX.  
UNIT  
VF  
IR  
IF = 200 mA  
1.3  
V
reverse current  
BZA956A  
VR = 3 V  
VR = 4 V  
VR = 4.3 V  
1000  
500  
nA  
nA  
nA  
BZA962A  
BZA968A  
100  
Table 1 Per type; BZ956A to BZA968A  
Tj = 25 °C unless otherwise specified.  
TYPE  
WORKING VOLTAGE  
VZ (V)  
DIFFERENTIAL  
RESISTANCE  
TEMP.  
COEFF.  
SZ (mV/K) at at f = 1 MHz;  
DIODE CAP.  
Cd (pF)  
NON-REPETITIVE  
PEAK REVERSE  
CURRENT  
at IZ = 1 mA  
rdif ()  
at IZ = 1 mA  
IZ = 1 mA  
VR = 0  
I
ZSM (A) at tp = 1 ms;  
Tamb = 25 °C  
MIN.  
TYP.  
MAX.  
MAX.  
TYP.  
MAX.  
MAX.  
BZA956A  
BZA962A  
BZA968A  
5.32  
5.89  
6.46  
5.6  
6.2  
6.8  
5.88  
6.51  
7.14  
400  
300  
200  
0.3  
1.6  
2.2  
125  
105  
90  
2.2  
2.1  
2.0  
2001 Sep 03  
3
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
GRAPHICAL DATA  
MGW318  
MGW319  
2
10  
10  
handbook, halfpage  
handbook, halfpage  
I
P
ZSM  
ZSM  
(A)  
(W)  
BZA956A  
BZA956A  
BZA962A  
BZA968A  
1
10  
BZA962A  
BZA968A  
1  
10  
1
10  
2  
1  
2  
1  
10  
10  
1
10  
10  
1
10  
t
(ms)  
t
(ms)  
p
p
PZSM = VZSM × IZSM  
.
VZSM is the non-repetitive peak reverse voltage at IZSM  
.
Fig.3 Maximum non-repetitive peak reverse  
power dissipation as a function of pulse  
duration (square pulse).  
Fig.2 Maximum non-repetitive peak reverse  
current as a function of pulse time.  
MGW320  
MGT586  
120  
400  
handbook, halfpage  
handbook, halfpage  
P
tot  
C
d
(pF)  
(mW)  
300  
80  
200  
100  
0
BZA956A  
BZA962A  
BZA968A  
40  
0
0
2
4
6
8
0
50  
100  
150  
V
(V)  
R
T
(°C)  
amb  
Tj = 25 °C; f = 1 MHz.  
Fig.4 Diode capacitance as a function of reverse  
voltage; typical values.  
Fig.5 Power derating curve.  
2001 Sep 03  
4
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
ESD TESTER  
RG 223/U  
DIGITIZING  
50 coax  
OSCILLOSCOPE  
R
Z
450 Ω  
10×  
ATTENUATOR  
50 Ω  
C
Z
note 1  
1/4 BZA900A  
IEC 61000-4-2 network  
= 150 pF; R = 330 Ω  
Note 1: attenuator is only used for open  
socket high voltage measurements  
C
Z
Z
vertical scale = 5 V/div  
horizontal scale = 50 ns/div  
vertical scale = 100 V/div  
horizontal scale = 50 ns/div  
BZA968A  
BZA962A  
BZA956A  
GND  
GND  
unclamped +1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
clamped +1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
GND  
vertical scale = 100 V/div  
horizontal scale = 50 ns/div  
vertical scale = 5 V/div  
horizontal scale = 50 ns/div  
unclamped 1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
clamped 1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
MGW321  
Fig.6 ESD clamping test set-up and waveforms.  
5
2001 Sep 03  
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
APPLICATION INFORMATION  
Typical common anode application  
A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one  
package. A simplified example is shown in Fig.7.  
A
B
C
D
keyboard,  
terminal,  
printer,  
etc.  
I/O  
FUNCTIONAL  
DECODER  
BZA900A  
GND  
MGW316  
Fig.7 Computer interface protection.  
Device placement and printed-circuit board layout  
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA900A is  
determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further  
add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a  
minimum. This includes the lead length of the suppression element.  
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended:  
1. Place the suppression element close to the input terminals or connectors  
2. Keep parallel signal paths to a minimum  
3. Avoid running protection conductors in parallel with unprotected conductors  
4. Minimize all printed-circuit board loop areas including power and ground loops  
5. Minimize the length of the transient return path to ground  
6. Avoid using shared transient return paths to a common ground point.  
2001 Sep 03  
6
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
PACKAGE OUTLINE  
Plastic surface mounted package; 5 leads  
SOT665  
D
A
E
X
Y
S
S
H
E
5
4
A
c
1
2
3
e
1
b
w M  
A
p
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
b
c
D
E
e
e
H
L
w
y
A
p
p
1
E
0.6  
0.5  
0.27  
0.17  
0.18  
0.08  
1.7  
1.5  
1.3  
1.1  
1.7  
1.5  
0.3  
0.1  
mm  
1.0  
0.5  
0.1  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
01-01-04  
01-08-27  
SOT665  
2001 Sep 03  
7
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
DATA SHEET STATUS  
PRODUCT  
DATA SHEET STATUS(1)  
STATUS(2)  
DEFINITIONS  
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Changes will be  
communicated according to the Customer Product/Process Change  
Notification (CPCN) procedure SNW-SQ-650A.  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes, without notice, in the  
products, including circuits, standard cells, and/or  
software, described or contained herein in order to  
improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for  
the use of any of these products, conveys no licence or title  
under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that  
these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified.  
Application information  
Applications that are  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2001 Sep 03  
8
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
NOTES  
2001 Sep 03  
9
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
NOTES  
2001 Sep 03  
10  
Philips Semiconductors  
Product specification  
Quadruple ESD transient voltage suppressor  
BZA900A-series  
NOTES  
2001 Sep 03  
11  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2001  
SCA73  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613514/1000/01/pp12  
Date of release: 2001 Sep 03  
Document order number: 9397 750 08542  

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