CBTU02043HEJ_技术文档

CBTU02043

High speed differential 1-to-2 switch chip

Rev. 1.1 — 31 May 2017

Product data sheet

1. General description

The CBTU02043 is a high-speed differential 1-to-2 switch chip optimized to interface with

type C connector for mobile and PC applications. This high performance switch chip can

be used for 1 port USB3.1, PCIe-Gen3 high speed serial interface applications. It can also

support DP1.3 or 4 single-ended DDR channels. The CBTU02043 chip can also provide

2-to-1 MUX function by selecting 1 (Port A) out of two differential ports (Port B or C) for

other applications.

The device's pinouts are optimized for USB3.1 type C DeMUX application and achieve

very low crosstalk to meet the stringent type C crosstalk spec. The small package and

pinning is ideal for smartphone type C application.

CBTU02043 is available in 1.6 mm x 2.4 mm x 0.5 mm HUQFN16 package with 0.4 mm

pitch.

2. Features and benefits

 Optimized for type C connector PCB routing for signal integrity

 Minimize crosstalk to meet stringent type C requirement

 Minimize via with friendly type C PCB layout

 One port (two bidirectional differential channels) 1-to-2 switch

 Low insertion loss: 1.4 dB at 5 GHz; 0.9 dB at 2.5 GHz; 0.5 dB at 100 MHz

 Low off-state isolation: 20 dB at 5 GHz; 40 dB at 100 MHz

 Low return loss: 16 dB at 2.5 GHz; 12 dB @ 5 GHz

 Low ON-state resistance: 10  (typ)

 Bandwidth: 12 GHz (typ)

 Very low DDNEXT crosstalk: < 37 dB at 5 GHz

 VIC common mode input voltage VIC: 0 V to 2 V

 Differential input voltage VID: <1.6 V

 Intra-pair skew: <6 ps

 VDD Power Supply voltage range: 1.62 V to 3.63 V

 Low current consumption:

 200 A (typ) for active mode

 3 A (typ) for power-saving

 CMOS SEL and XSD pins

 Back current protection on all I/O pins of these switches

 Patent pending high performance analog pass-gate technology

 All channels support rail-to-rail input voltage (up to 2.4 V)

 HUQFN16 1.6 mm  2.4 mm  0.5 mm package with 0.4 mm pitch

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

 ESD: 2000 V HBM; 1000 V CDM

 Operating temperature range: 10 C to 85 C

3. Application diagram

Type-C

cable

system

Type-C

receptacle

D+

D-

USB 2.0

PHY

CBTU02043

TX1P

TX1N

SSTX1

USB 3.0

PHY

RX1P

RX1N

TX2P

TX2N

APPLICATION

PROCESSOR

RX2P

RX2N

SEL

orientation

VCONN

power

I2C

GPIO

2.7V_OUT

OTG

CC1

CC2

CC

PIN 11

PTN5150A

VCONN

PMIC

VBUS (4 traces)

5V_OUT_OTG

5V_CHARGE

VBUS_DET

aaa-022004

Fig 1. Application diagram

4. Ordering information

Table 1.

Ordering information

Type number

Topside

marking

Package

Name

Description

Version

CBTU02043HE 43

HUQFN16

Plastic, super thin quad flat package; no leads; 16

SOT1832-1

terminals; body 1.6 mm x 2.4 mm x 0.5 mm; 0.4 mm pitch

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

2 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

4.1 Ordering options

Table 2.

Ordering options

Type number

Orderable

part number

Package

Packing method

Minimum

order quantity

Temperature

T_amb= 40 C to +85 C

CBTU02043HE^[1]

CBTU02043HEJ HUQFN16

REEL 13" Q1/T1

*STANDARD MARK

SMD

10000

[1] In development. Contact your NXP sales office for availability.

5. Block diagram

A0_P

A0_N

A1_P

A1_N

B0_P

B0_N

B1_P

B1_N

C0_P

C0_N

C1_P

C1_N

SEL

XSD

aaa-021443

Fig 2. Block diagram

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

6. Pinning information

6.1 Pinning

CBTU02043

9

A0N

6

5

4

3

2

1

C0N

C0P

A0P 10

GND 11

SEL 12

A1P 13

VDD

XSD

B1P

B1N

NC

terminal 1

index area

A1N

14

aaa-021627

Fig 3. Pin configuration for HUQFN16 (transparent top view)

Refer to Section 12 “Package outline” for package related information.

6.2 Pin description

Table 3.

Symbol

Pin description

Type

Description

Data path signals

A0N

A0P

B0P

B0N

C0N

C0P

A1P

A1N

B1P

B1N

C1N

C1P

9

differential I/O USB3.1 differential TX signals for A port

differential I/O

10

8

differential I/O USB3.1 differential TX signals for B port

differential I/O

7

6

differential I/O USB3.1 differential TX signals for C port

differential I/O

5

13

14

2

differential I/O USB3.1 differential RX signals for A port

differential I/O

differential I/O USB3.1 differential RX signals for B port

differential I/O

1

16

15

differential I/O USB3.1 differential RX signals for C port

differential I/O

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

Table 3.

Symbol

Control signal

Pin description …continued

Type

Description

SEL

12

GPIO input

Input signal driven by GPIO

When SEL = LOW, Port A and Port B are mutually

connected

When SEL = HIGH, port A and port C are mutually

connected

XSD

3

CMOS input

Shutdown pin; should be driven LOW for normal

operation. When HIGH, all paths are switched off (high

impedance state). And supply current consumption is

minimized.

Power supply

VDD

Ground connection

4

power

Power supply range between 1.62 V and 3.63 V

GND

NC

11

ground

0 V; must connect to PCB ground

center pad

not connected Center pad is not connected to the device ground pin

inside the package. Recommend to connect center

pad to PCB ground

7. Functional description

Refer to Figure 2 “Block diagram” of CBTU02043.

The CBTU02043 provides a shutdown function to minimize power consumption when the

application is not active, but power to the CBTU02043 is provided. The XSD pin (power

down HIGH) places all channels in high -impedance state while reducing current

consumption to near-zero. When XSD pin is LOW, the device operates normally.

Table 4.

XSD

ON/OFF control table

SEL

Function

HIGH

LOW

X

A, B and C ports are high-Z

A to B ports and vice versa

A to C ports and vice versa

LOW

HIGH

LOW

8. Application examples

USB3_TX1

USB3_RX1

USB

C0N/P

C1N/P

USB3_TX

USB3_RX

A0N/P

A1P/N

APPLICATION

PROCESSOR

CBTU02043

TYPE-C

USB3_TX2

B0P/N

B1P/N

USB3_RX2

SEL

aaa-022005

Fig 4. Type C smartphone application

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

5 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

9. Limiting values

Table 5.

Limiting values ^[1]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_DD

Parameter

Conditions

Min

0.3

Max

+4.4

+2.6

Unit

V

[2]

supply voltage

V_I

input voltage of control pins

V

V_IO

voltage of I/O pins of

switches

V

T_stg

storage temperature

65

+150

2000

1000

C

V

[3]

[4]

V_ESD

electrostatic discharge

voltage

HBM

CDM

-

V

[1] Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the

device. These are stress ratings only and functional operation of the device at these or any conditions

beyond those indicated under recommended operating conditions is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

[2] All voltage values, except differential voltages, are with respect to network ground terminal.

[3] Human Body Model: ANSI/EOS/ESD-S5.1-1994, standard for ESD sensitivity testing, Human Body Model -

Component level; Electrostatic Discharge Association, Rome, NY, USA.

[4] Charged Device Model: ANSI/EOS/ESD-S5.3-1-1999, standard for ESD sensitivity testing, Charged Device

Model - Component level; Electrostatic Discharge Association, Rome, NY, USA.

10. Recommended operating conditions

Table 6.

Operating conditions

Over operating free-air temperature range (unless otherwise noted)

Symbol

VDD

V_I

Parameter

Conditions

Min

1.62

0.3

10

Typ

Max

3.63

VDD

+2.4

+85

Unit

V

supply voltage

input voltage

3.3 V supply option

CMOS inputs

-

V

switch I/O pins

operating in free air

V

T_amb

ambient operating

temperature

C

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

11. Characteristics

11.1 Device general characteristics

Table 7.

Symbol

I_DD

General characteristics

Parameter

Conditions

Min

Typ^[1]

Max

Unit

supply current

XSD = HIGH (disable)

-

3

10

A

XSD = LOW (enable)

-

250

-

450

30

A

s

t_startup

start-up time

supply voltage

ramping up to valid

with XSD = LOW to

channel specified

operating

characteristics

t_en

enable time

XSD going LOW to

channel specified

operating

characteristics

SEL state changes^[2]

-

90

18

220

30

s

t_rcfg

reconfiguration time

ns

[1] Typical values are at VDD = 1.8 V; T_amb= 25 C, and maximum loading

[2] Smooth transition without glitch

XSD

VDD

1.63 V

valid signal at the output channel

aaa-022007

t

enable

Enable time is when valid VDD is available and t = 0 starts when XSD makes transition from HIGH

to LOW

Fig 5. Enable time definition

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

11.2 Switch channel characteristics

Table 8.

Symbol

DDIL

Dynamic and static characteristics

Parameter

Conditions

Min

Typ

Max

Unit

differential insertion loss

Channel is off

f = 5 GHz

-

20

40

-

dB

f = 100 MHz

Channel is on

f = 5 GHz

-

1.4

0.9

0.7

-

dB

f = 2.5 GHz

f = 100 MHz

B_-3dB

Bandwidth

-

12

-

GHz

dB

DDRL

Differential Return Loss

f = 5 GHz

12

16

f = 2.5 GHz

dB

DDNEXT

DDFEXT

High Speed Differential

near-end crosstalk

A0 to A1 or B0 to B1 or C0 to C1 ports

f = 5 GHz

A to B or A to C ports (or vice versa)

-

37

dB

High Speed far-end crosstalk

f = 5 GHz

-

20

2.4

2.0

1.6

1.5

1.2

-

dB

V

V_I

Input voltage

Switch I/O pins

for all switch ports

0.3

-

V_IC

V_{ID_PP}

I_IH

Common-mode input voltage

Differential input voltage

0

-

V

1.2

-

V

HIGH-level input leakage

current

High–speed switch I/O; A,

B and C ports; V_I= 2.0 V

A

V

I_IL

LOW-level input leakage

current

V_I= GND

-

V_IK

t_PD

t_sk

Input negative clamping

voltage

Voltage on high-speed

channel pins; II = 18 mA

-

Propagation Delay

From A port to B or C port

or vice versa

80

6

ps

Intra-pair Skew

Skew between P and N for

all the ports

-

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

Table 8.

Symbol

R_onse

Dynamic and static characteristics …continued

Parameter Conditions

Min

Typ

Max

Unit

Single-end ON-state resistance Switch ON resistance with

source current is 18 mA

-

10

14



Z_input

C_in

DC CM input impedance

XSD = High and V_I> 0 V

-

3000^[1]

622^[1]

-

K

Input capacitance at 2.5 GHz

VDD = 1.8 V; V_I= 1.4 V or

floating

fF

[1] Guaranteed by design

11.3 Control signals characteristics

Table 9.

SEL input buffer characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

V_IH

V_IL

I_IH

HIGH-level input

voltage

1.4

-

V

LOW-level input

voltage

0.3

-

0.4

1.5

V

HIGH-level input

leakage current

Measured with input at

V_I= VDD

-

A

I_IL

LOW-level input

leakage current

Measured with input at

V_I= 0 V

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

Table 10. XSD input buffer characteristics

Symbol Parameter

Conditions

Min

Typ Max

Unit

V_IH

V_IL

I_IH

HIGH-level input

voltage

0.75 %

VDD

-

V

LOW-level input

voltage

0.3

0.25 %

VDD

V

HIGH-level input

leakage current

Measured with input at

V_I= VDD

-

1.5

A

I_IL

LOW-level input

leakage current

Measured with input at

V_I= 0 V

1.5

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

12. Package outline

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Fig 6. Package outline SOT1832-1 (HUQFN16)

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

13. Packing information

13.1 SOT1832-1 (HUQFN16); Reel pack, SMD, 13" Q1/T1 standard product

orientation; Orderable part number ending ,118 or J; Ordering code

(12NC) ending 118

13.1.1 Packing method

Printed plano box

Barcode label

Reel

QA seal

Tape

Space for additional

label

Preprinted ESD

Circular sprocket holes opposite the

warning

label side of reel

Barcode label

Cover tape

Carrier tape

Printed plano box

aaa-021436

Fig 7. Reel dry pack for SMD: Light weight reel

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

Table 11. Dimensions and quantities

Reel dimensions

d  w (mm) ^[1]

SPQ/PQ

(pcs) ^[2]

Reels

per box

Outer box dimensions

l  w  h (mm)

330  8

10000

1

342  338  27

[1] d = reel diameter; w = tape width.

[2] Packing quantity dependent on specific product type.

View ordering and availability details at NXP order portal, or contact your local NXP representative.

13.1.2 Product orientation

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Tape pocket quadrants

Pin 1 is in quadrant Q1/T1

Fig 8. Product orientation in carrier tape

13.1.3 Carrier tape dimensions

4 mm

A

0

K

0

W

B

0

P

1

T

direction of feed

001aao148

Not drawn to scale.

Fig 9. Carrier tape dimensions

Table 12. Carrier tape dimensions

In accordance with IEC 60286-3.

A₀(mm)

B₀(mm)

K₀(mm)

T (mm)

P₁(mm)

W (mm)

8.0  0.3/-0.1

1.79  0.05

2.50  0.05

0.65  0.05

0.23  0.02

4.0  0.5

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

13.1.4 Reel dimensions

A

Z

W2

B

Ø C

Ø D

detail Z

001aao149

Fig 10. Schematic view of reel

Table 13. Reel dimensions

In accordance with IEC 60286-3.

A [nom]

(mm)

W2 [max]

(mm)

B [min]

(mm)

C [min]

(mm)

D [min]

(mm)

330

14.4

1.5

12.8

20.2

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

13.1.5 Barcode label

Fixed text

Country of origin

i.e. "Made in....." or

"Diffused in EU [+]

Assembled in......

NXP SEMICONDUCTORS

MADE IN >COUNTRY<

Optional product information*

Re-approval date code*

Origin code

Product Manufacturing Code

MSL at the Peak Body solder

temperature with tin/lead*

MSL at the higher lead-free

Peak Body Temperature*

2D matrix with all data

[PRODUCT INFO]

Packing unit (PQ) identification

nd

(33T) PUID: B.0987654321

(30T) LOT2

(31D) REDATE

2

traceability lot number*

(youngest) date code*

Quantity*

(30D) DATE2 (32T) ORIG

nd

(30Q) QTY2

(31T) PMC

(31P) MSL/PBT

(1T) LOT

(9D) DATE

Traceability lot number

Date code

With linear barcode

Quantity

With linear barcode

Type number

MSL/PBT

(including the data identifiers)

(Q) QTY

Additional info if halogen

free product

Additional info on RoHS

HALOGEN FREE

RoHS compliant

(30P) TYPE

(1P) CODENO

NXP 12NC

With linear barcode

Lead-free symbol

001aak714

Fig 11. Example of typical box and reel information barcode label

Table 14. Barcode label dimensions

Box barcode label

Reel barcode label

l  w (mm)

100  75

36  75

CBTU02043

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Product data sheet

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

16 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 12) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 15 and 16

Table 15. SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

235

 350

220

< 2.5

 2.5

220

Table 16. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 12.

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 12. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

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15. Soldering: PCB footprint

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Fig 13. PCB footprint for SOT1832-1 (HUQFN16); reflow soldering

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

19 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

16. Abbreviations

Table 17. Abbreviations

Acronym

CDM

Description

Charged Device Model

Gigabits per second

Human Body Model

Gbps

HBM

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

17. Revision history

Table 18. Revision history

Document ID

Release date

20170531

Data sheet status

Change notice

Supersedes

CBTU02043 v.1.1

Modifications:

Product data sheet

-

CBTU02043 v.1

• Removed “Company Confidential” watermark, released to public

20161102 Product data sheet

CBTU02043 v.1

-

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

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CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

18. Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

18.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

18.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

22 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

18.4 Trademarks

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

CBTU02043

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Product data sheet

Rev. 1.1 — 31 May 2017

23 of 24

CBTU02043

NXP Semiconductors

High speed differential 1-to-2 switch chip

20. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Application diagram . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

Functional description . . . . . . . . . . . . . . . . . . . 5

Application examples . . . . . . . . . . . . . . . . . . . . 5

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

Recommended operating conditions. . . . . . . . 6

8

9

10

11

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device general characteristics . . . . . . . . . . . . . 7

Switch channel characteristics . . . . . . . . . . . . . 8

Control signals characteristics . . . . . . . . . . . . . 9

11.1

11.2

11.3

12

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11

13

13.1

Packing information . . . . . . . . . . . . . . . . . . . 12

SOT1832-1 (HUQFN16); Reel pack, SMD, 13"

Q1/T1 standard product orientation; Orderable

part number ending ,118 or J; Ordering code

(12NC) ending 118 . . . . . . . . . . . . . . . . . . . . . 12

Packing method . . . . . . . . . . . . . . . . . . . . . . . 12

Product orientation . . . . . . . . . . . . . . . . . . . . . 13

Carrier tape dimensions . . . . . . . . . . . . . . . . . 13

Reel dimensions. . . . . . . . . . . . . . . . . . . . . . . 14

Barcode label . . . . . . . . . . . . . . . . . . . . . . . . . 15

13.1.1

13.1.2

13.1.3

13.1.4

13.1.5

14

Soldering of SMD packages . . . . . . . . . . . . . . 16

Introduction to soldering . . . . . . . . . . . . . . . . . 16

Wave and reflow soldering . . . . . . . . . . . . . . . 16

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17

14.1

14.2

14.3

14.4

15

16

17

Soldering: PCB footprint. . . . . . . . . . . . . . . . . 19

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 20

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21

18

Legal information. . . . . . . . . . . . . . . . . . . . . . . 22

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23

18.1

18.2

18.3

18.4

19

20

Contact information. . . . . . . . . . . . . . . . . . . . . 23

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 31 May 2017

Document identifier: CBTU02043


型号：	CBTU02043HEJ
厂家：	NXP
描述：	CBTU02043 - High speed differential 1-to-2 switch chip
文件：	总24页 (文件大小：692K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CBTU02043HEJ [NXP]

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