HEF4051BT,013 [NXP]
HEF4051B - 8-channel analog multiplexer/demultiplexer SOP 16-Pin;型号: | HEF4051BT,013 |
厂家: | NXP |
描述: | HEF4051B - 8-channel analog multiplexer/demultiplexer SOP 16-Pin PC 光电二极管 |
文件: | 总23页 (文件大小:174K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HEF4051B
8-channel analog multiplexer/demultiplexer
Rev. 10 — 17 November 2011
Product data sheet
1. General description
The HEF4051B is an 8-channel analog multiplexer/demultiplexer with three address
inputs (S1 to S3), an active LOW enable input (E), eight independent inputs/outputs
(Y0 to Y7) and a common input/output (Z). The device contains eight bidirectional analog
switches, each with one side connected to an independent input/output (Y0 to Y7) and the
other side connected to a common input/output (Z). With E LOW, one of the eight
switches is selected (low-impedance ON-state) by S1 to S3. With E HIGH, all switches
are in the high-impedance OFF-state, independent of S1 to S3. If break before make is
needed, then it is necessary to use the enable input.
VDD and VSS are the supply voltage connections for the digital control inputs (S1 to S3,
and E). The VDD to VSS range is 3 V to 15 V. The analog inputs/outputs (Y0 to Y7, and Z)
can swing between VDD as a positive limit and VEE as a negative limit. VDD VEE may not
exceed 15 V. Unused inputs must be connected to VDD, VSS, or another input. For
operation as a digital multiplexer/demultiplexer, VEE is connected to VSS (typically
ground). VEE and VSS are the supply voltage connections for the switches.
2. Features and benefits
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C and 40 C to +125 C
Complies with JEDEC standard JESD 13-B
3. Applications
Analog multiplexing and demultiplexing
Digital multiplexing and demultiplexing
Signal gating
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
4. Ordering information
Table 1.
Ordering information
All types operate from 40 C to +125 C.
Type number
Package
Name
Description
Version
HEF4051BP
HEF4051BT
HEF4051BTS
HEF4051BTT
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
SO16
plastic small outline package; 16 leads; body width 3.9 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT109-1
SOT338-1
SOT403-1
SSOP16
TSSOP16
5. Functional diagram
V
DD
16
13 Y0
14 Y1
15 Y2
12 Y3
S1 11
S2 10
LOGIC
LEVEL
CONVERSION
1
5
2
4
3
Y4
Y5
Y6
Y7
Z
1 − OF − 8
DECODER
S3
9
6
E
8
7
V
SS
V
001aac277
EE
Fig 1. Functional diagram
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
2 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
Yn
V
DD
V
DD
Z
V
EE
001aac281
Fig 2. Schematic diagram (one switch)
11
10
9
1
0
7
X
3
Y0
13
6
EN
S1
S2
S3
Y1
Y2
Y3
Y4
Y5
Y6
Y7
11
10
9
14
15
12
1
MUX/DMUX
13
14
15
12
1
0
1
2
3
4
5
6
5
3
2
E
6
4
5
3
Z
2
001aac278
4
7
001aac279
Fig 3. Logic symbol
Fig 4. IEC logic symbol
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
3 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
LEVEL
CONVERTER
S1
LEVEL
CONVERTER
S2
S3
E
LEVEL
CONVERTER
LEVEL
CONVERTER
Z
001aac280
Fig 5. Logic diagram
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
4 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
6. Pinning information
6.1 Pinning
HEF4051B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Y4
Y6
Z
V
DD
Y2
Y1
Y0
Y3
S1
S2
S3
HEF4051B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Y4
Y6
Z
V
DD
Y7
Y5
E
Y2
Y1
Y0
Y3
S1
S2
S3
Y7
Y5
E
V
EE
SS
V
EE
SS
V
V
001aak508
001aac282
Fig 6. Pin configuration SOT38-4 and SOT109-1
Fig 7. Pin configuration SOT338-1 and SOT403-1
6.2 Pin description
Table 2.
Symbol
E
Pin description
Pin
Description
6
enable input (active LOW)
supply voltage
VEE
7
VSS
8
ground supply voltage
select input
S1, S2, S3
11, 10, 9
Y0, Y1, Y2, Y3, Y4, Y5, Y6, Y7 13, 14, 15, 12, 1, 5, 2, 4 independent input or output
Z
3
common output or input
supply voltage
VDD
16
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
5 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
7. Functional description
7.1 Function table
Table 3.
Function table[1]
Input
Channel ON
E
L
L
L
L
L
L
L
L
H
S3
L
S2
L
S1
L
Y0 to Z
Y1 to Z
Y2 to Z
Y3 to Z
Y4 to Z
Y5 to Z
Y6 to Z
Y7 to Z
switches off
L
L
H
L
L
H
H
L
L
H
L
H
H
H
H
X
L
H
L
H
H
X
H
X
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol
VDD
Parameter
Conditions
Min
0.5
18
-
Max
+18
+0.5
10
Unit
V
supply voltage
supply voltage
input clamping current
[1]
VEE
referenced to VDD
V
IIK
pins Sn and E;
mA
VI < 0.5 V or VI > VDD + 0.5 V
VI
input voltage
0.5
-
VDD + 0.5
10
V
II/O
input/output current
supply current
mA
mA
C
C
IDD
Tstg
Tamb
Ptot
-
50
storage temperature
ambient temperature
total power dissipation
65
40
+150
+125
[2]
Tamb = 40 C to +125 C
DIP16 package
-
-
-
-
-
750
500
500
500
100
mW
mW
mW
mW
mW
SO16 package
SSOP16 package
TSSOP16 package
per output
P
power dissipation
[1] To avoid drawing VDD current out of terminal Z, when switch current flows into terminals Y, the voltage drop across the bidirectional
switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VDD current will flow out of terminals Y, and in this case there
is no limit for the voltage drop across the switch, but the voltages at Y and Z may not exceed VDD or VEE
.
[2] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
6 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
For SSOP16 and TSSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5.
Symbol
VDD
Recommended operating conditions
Parameter
Conditions
Min
Typ
Max
15
Unit
V
supply voltage
input voltage
see Figure 8
3
-
-
-
-
-
-
VI
0
VDD
+125
3.75
0.5
V
Tamb
ambient temperature
in free air
40
C
t/V
input transition rise and fall VDD = 5 V
-
-
-
s/V
s/V
s/V
rate
VDD = 10 V
VDD = 15 V
0.08
001aac285
15
V
DD
− V
SS
(V)
10
operating area
5
0
0
5
10
15
V
− V (V)
EE
DD
Fig 8. Operating area as a function of the supply voltages
10. Static characteristics
Table 6.
Static characteristics
VSS = VEE = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter
Conditions
VDD
Tamb = 40 C Tamb = 25 C Tamb = 85 C Tamb = 125 C Unit
Min
Max
-
Min
Max
-
Min
Max
-
Min
Max
-
VIH
HIGH-level
input voltage
IO < 1 A
5 V
10 V
15 V
5 V
3.5
3.5
3.5
3.5
V
V
V
V
V
V
7.0
-
7.0
-
7.0
-
7.0
-
11.0
-
11.0
-
11.0
-
11.0
-
VIL
LOW-level
input voltage
IO < 1 A
-
-
-
-
1.5
3.0
4.0
0.1
-
-
-
-
1.5
3.0
4.0
0.1
-
-
-
-
1.5
3.0
4.0
1.0
-
-
-
-
1.5
3.0
4.0
10 V
15 V
15 V
II
input leakage
current
1.0 A
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
7 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
Table 6.
Static characteristics …continued
VSS = VEE = 0 V; VI = VSS or VDD unless otherwise specified.
Symbol Parameter
Conditions
VDD
Tamb = 40 C Tamb = 25 C Tamb = 85 C Tamb = 125 C Unit
Min
Max
Min
Max
Min
Max
Min
Max
IS(OFF)
OFF-state
leakage
current
Z port;
all channels OFF;
see Figure 9
15 V
-
-
-
1000
-
-
-
-
nA
nA
Y port;
15 V
-
-
-
200
-
-
-
-
per channel;
see Figure 10
IDD
supply current IO = 0 A
5 V
10 V
15 V
-
-
-
-
-
5
10
20
-
-
-
-
-
5
-
-
-
-
150
300
600
-
-
-
-
-
150 A
300 A
600 A
10
20
7.5
CI
input
Sn, E inputs
-
pF
capacitance
10.1 Test circuits
V
DD
S1 to S3
V
or V
SS
DD
Z
E
Yn
I
S
V
= V
EE
SS
V
DD
V
V
O
I
001aak513
Fig 9. Test circuit for measuring OFF-state leakage current Z port
V
DD
S1 to S3
Y0
Yn
1
2
V
or V
DD
SS
switch
I
S
Z
E
V
SS
= V
EE
V
SS
V
V
I
O
001aak514
Fig 10. Test circuit for measuring OFF-state leakage current Yn port
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
8 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
10.2 ON resistance
Table 7.
ON resistance
Tamb = 25 C; ISW = 200 A; VSS = VEE = 0 V.
Symbol Parameter
Conditions
VI = 0 V to VDD VEE
see Figure 11 and Figure 12
VDD VEE Typ
Max
2500
245
175
340
160
115
365
200
155
-
Unit
RON(peak) ON resistance (peak)
;
5 V
350
80
60
115
50
40
120
65
50
25
10
5
10 V
15 V
RON(rail)
ON resistance (rail)
VI = 0 V; see Figure 11 and Figure 12 5 V
10 V
15 V
5 V
VI = VDD VEE
;
see Figure 11 and Figure 12
10 V
15 V
5 V
RON
ON resistance mismatch
between channels
VI = 0 V to VDD VEE; see Figure 11
10 V
15 V
-
-
10.2.1 ON resistance waveform and test circuit
V
V
V
SW
DD
S1 to S3
V
or V
DD
SS
Z
E
Yn
V
= V
EE
SS
V
SS
I
V
SW
I
001aak512
RON = VSW / ISW
.
Fig 11. Test circuit for measuring RON
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
9 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
001aae648
400
R
ON
(Ω)
V
= 5 V
DD
300
200
100
0
10 V
15 V
0
5
10
15
V (V)
I
Fig 12. Typical RON as a function of input voltage
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Tamb = 25 C; VSS = VEE = 0 V; for test circuit see Figure 16.
Symbol Parameter Conditions
tPHL
VDD
5 V
Typ
15
5
Max
30
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
HIGH to LOW propagation delay Yn, Z to Z, Yn; see Figure 13
Sn to Yn, Z; see Figure 14
10 V
15 V
5 V
10
5
10
150
60
45
15
5
300
120
90
10 V
15 V
5 V
tPLH
LOW to HIGH propagation delay Yn, Z to Z, Yn; see Figure 13
Sn to Yn, Z; see Figure 14
30
10 V
15 V
5 V
10
5
10
150
65
45
120
90
85
140
55
40
145
120
115
300
130
90
10 V
15 V
5 V
tPHZ
tPZH
tPLZ
HIGH to OFF-state
propagation delay
E to Yn, Z; see Figure 15
E to Yn, Z; see Figure 15
E to Yn, Z; see Figure 15
240
180
170
280
110
80
10 V
15 V
5 V
OFF-state to HIGH
propagation delay
10 V
15 V
5 V
LOW to OFF-state
propagation delay
290
240
230
10 V
15 V
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
10 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
Table 8.
Dynamic characteristics …continued
Tamb = 25 C; VSS = VEE = 0 V; for test circuit see Figure 16.
Symbol Parameter
tPZL OFF-state to LOW
propagation delay
Conditions
VDD
5 V
Typ
140
55
Max
280
110
80
Unit
ns
E to Yn, Z; see Figure 15
10 V
15 V
ns
40
ns
11.1 Waveforms and test circuit
V
DD
Yn or Z
input
V
V
M
DD
Sn input
V
M
V
V
EE
V
V
SS
t
t
PLH
PHL
t
t
PHL
PLH
V
V
O
O
90 %
Yn or Z
output
Z or Yn
output
V
M
10 %
switch ON
EE
switch OFF
switch OFF
EE
001aak509
001aak510
Measurement points are given in Table 9.
Measurement points are given in Table 9.
Fig 13. Yn, Z to Z, Yn propagation delays
Fig 14. Sn to Yn, Z propagation delays
V
DD
E input
V
M
V
V
V
SS
t
t
PLZ
PZL
V
O
90 %
Yn or Z output
LOW-to-OFF
OFF-to-LOW
10 %
EE
t
t
PHZ
PZH
V
O
90 %
Yn or Z output
HIGH-to-OFF
OFF-to-HIGH
10 %
switch ON
001aak511
EE
switch ON
switch OFF
Measurement points are given in Table 9.
Fig 15. Enable and disable times
Table 9. Measurement points
Supply voltage
VDD
Input
VM
Output
VM
5 V to 15 V
0.5VDD
0.5VDD
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
11 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
M
positive
pulse
V
M
10 %
0 V
t
W
V
V
DD
V
V
I
DD
V
I
S1
O
R
L
PULSE
GENERATOR
open
DUT
R
T
C
L
V
V
SS
EE
001aaj903
Test data is given in Table 10.
Definitions:
DUT = Device Under Test.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including test jig and probe.
RL = Load resistance.
Fig 16. Test circuit for measuring switching times
Table 10. Test data
Input
Yn, Z
Load
CL
S1 position
[1]
Sn and E tr, tf
VM
RL
tPHL
tPLH
tPZH, tPHZ tPZL, tPLZ other
VEE VDD VEE
VDD or VEE VDD or VSS 20 ns
0.5VDD
50 pF
10 k
VDD or VEE VEE
[1] For Yn to Z or Z to Yn propagation delays use VEE. For Sn to Yn or Z propagation delays use VDD
.
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
12 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
11.2 Additional dynamic parameters
Table 11. Additional dynamic characteristics
VSS = VEE = 0 V; Tamb = 25 C.
Symbol
Parameter
Conditions
VDD
Typ
0.25
0.04
0.04
13
Max
Unit
%
[1]
[1]
[1]
[1]
[1]
[1]
[1]
THD
total harmonic distortion
see Figure 17; RL = 10 k; CL = 15 pF; 5 V
channel ON; VI = 0.5VDD (p-p);
fi = 1 kHz
-
-
-
-
-
-
-
10 V
%
15 V
5 V
%
f(3dB)
3 dB frequency response see Figure 18; RL = 1 k; CL = 5 pF;
MHz
MHz
MHz
dB
channel ON; VI = 0.5VDD (p-p)
10 V
15 V
10 V
40
70
iso
isolation (OFF-state)
crosstalk voltage
crosstalk
see Figure 19; fi = 1 MHz; RL = 1 k;
CL = 5 pF; channel OFF;
VI = 0.5VDD (p-p)
50
Vct
digital inputs to switch; see Figure 20; 10 V
RL = 10 k; CL = 15 pF;
E or Sn = VDD (square-wave)
50
-
mV
dB
[1]
Xtalk
between switches; see Figure 21;
fi = 1 MHz; RL = 1 k;
10 V
50
-
VI = 0.5VDD (p-p)
[1] fi is biased at 0.5 VDD; VI = 0.5VDD (p-p).
Table 12. Dynamic power dissipation PD
PD can be calculated from the formulas shown; VEE = VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.
Symbol
Parameter
VDD
5 V
Typical formula for PD (W)
PD = 1000 fi + (fo CL) VDD
PD = 5500 fi + (fo CL) VDD
where:
2
2
PD
dynamic power
dissipation
fi = input frequency in MHz;
fo = output frequency in MHz;
10 V
15 V
2
CL = output load capacitance in pF;
DD = supply voltage in V;
(CL fo) = sum of the outputs.
PD = 15000 fi + (fo CL) VDD
V
11.2.1 Test circuits
V
V
DD
DD
S1 to S3
S1 to S3
V
or V
V
or V
DD
DD
SS
SS
Z
E
Yn
Z
E
Yn
V
= V
V
= V
SS EE
SS
EE
V
V
SS
SS
R
L
C
L
R
L
C
L
D
dB
f
f
i
i
001aak516
001aak517
Fig 17. Test circuit for measuring total harmonic
distortion
Fig 18. Test circuit for measuring frequency response
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
13 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
V
DD
S1 to S3
Y0
Yn
1
2
V
or V
DD
SS
switch
Z
E
V
SS
= V
EE
V
SS
R
L
C
L
dB
f
i
001aak518
Fig 19. Test circuit for measuring isolation (OFF-state)
0.5V
V
DD
DD
R
L
S1 to S3
Y0
Yn
1
switch
Z
E
2
G
V
SS
= V
EE
R
L
C
L
V
O
V
V
or V
SS
DD
001aak519
a. Test circuit
logic
input (Sn, E)
off
on
off
V
V
ct
O
001aaj908
b. Input and output pulse definitions
Fig 20. Test circuit for measuring crosstalk voltage between digital inputs and switch
HEF4051B
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 10 — 17 November 2011
14 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
V
DD
V
DD
S1 to S3
Y0
Yn
S1 to S3
Y0
Yn
V
DD
or V
SS
SS
V
or V
DD
SS
Z
E
Z
E
V
= V
EE
SS
V
= V
EE
SS
V
V
R
L
I
V
SS
R
L
V
R
L
O
R
L
V
O
V
I
001aak520
001aak521
a. Switch closed condition
Fig 21. Test circuit for measuring crosstalk between switches
b. Switch open condition
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
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NXP Semiconductors
8-channel analog multiplexer/demultiplexer
12. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 22. Package outline SOT38-4 (DIP16)
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
16 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 23. Package outline SOT109-1 (SO16)
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
17 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 24. Package outline SOT338-1 (SSOP16)
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
18 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 25. Package outline SOT403-1 (TSSOP16)
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
19 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
13. Revision history
Table 13. Revision history
Document ID
HEF4051B v.10
Modifications:
Release date
20111117
Data sheet status
Change notice
Supersedes
Product data sheet
-
HEF4051B v.9
• Legal pages updated.
• Changes in “General description”, “Features and benefits” and “Applications”.
HEF4051B v.9
20100325
20100301
20091127
20090924
20090826
20050112
19950101
19950101
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product data sheet
Product specification
Product specification
-
-
-
-
-
-
-
-
HEF4051B v.8
HEF4051B v.7
HEF4051B v.6
HEF4051B v.5
HEF4051B v.4
HEF4051B_CNV v.3
HEF4051B_CNV v.2
-
HEF4051B v.8
HEF4051B v.7
HEF4051B v.6
HEF4051B v.5
HEF4051B v.4
HEF4051B_CNV v.3
HEF4051B_CNV v.2
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
20 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
14.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
21 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
HEF4051B
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Product data sheet
Rev. 10 — 17 November 2011
22 of 23
HEF4051B
NXP Semiconductors
8-channel analog multiplexer/demultiplexer
16. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
7.1
8
Functional description . . . . . . . . . . . . . . . . . . . 6
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
9
10
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 9
ON resistance waveform and test circuit . . . . . 9
10.1
10.2
10.2.1
11
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Waveforms and test circuit . . . . . . . . . . . . . . . 11
Additional dynamic parameters . . . . . . . . . . . 13
Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11.1
11.2
11.2.1
12
13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2011
Document identifier: HEF4051B
相关型号:
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