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HEF4555BT,652 [NXP]

HEF4555B - 1-of-4 decoder/demultiplexer SOP 16-Pin;
HEF4555BT,652
型号： HEF4555BT,652
厂家： NXP    NXP
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HEF4555B - 1-of-4 decoder/demultiplexer SOP 16-Pin
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HEF4555B  
1-of-4 decoder/demultiplexer  
Rev. 5 — 18 November 2011  
Product data sheet  
1. General description  
The HEF4555B contains two 1-of-4 decoders/demultiplexers. Each has two address  
inputs (nA0 and nA1, an active LOW enable input (nE) and four mutually exclusive  
outputs which are active HIGH (nY0 to nY3). When used as a decoder, nE when HIGH,  
forces nY0 to nY3 LOW. When used as a demultiplexer, the appropriate output is selected  
by the information on nA0 and nA1 with nE as data input. All unselected outputs are LOW.  
It operates over a recommended VDD power supply range of 3 V to 15 V referenced to VSS  
(usually ground). Unused inputs must be connected to VDD, VSS, or another input.  
2. Features and benefits  
Fully static operation  
5 V, 10 V, and 15 V parametric ratings  
Standardized symmetrical output characteristics  
Specified from 40 C to +85 C  
Complies with JEDEC standard JESD 13-B  
3. Applications  
Code conversion  
Address decoding  
Demultiplexing: when using the enable input as data input  
4. Ordering information  
Table 1.  
Ordering information  
All types operate from 40 C to +85 C.  
Type number  
Package  
Name  
Description  
Version  
HEF4555BP  
HEF4555BT  
DIP16  
SO16  
plastic dual in-line package; 16 leads (300 mil)  
plastic small outline package; 16 leads; body width 3.9 mm  
SOT38-4  
SOT109-1  
 
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
5. Functional diagram  
1Y0  
1Y1  
1Y2  
1Y3  
4
5
6
7
nY0  
2
1A0  
nA0  
nA1  
nE  
DECODER  
3
1
1A1  
1E  
nY1  
nY2  
2Y0 12  
2Y1 11  
2Y2 10  
14 2A0  
DECODER  
13 2A1  
15 2E  
2Y3  
9
nY3  
001aae753  
001aae751  
Fig 1. Functional diagram  
Fig 2. Logic diagram for one decoder/multiplexer  
6. Pinning information  
6.1 Pinning  
HEF4555B  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
1E  
1A0  
1A1  
1Y0  
1Y1  
1Y2  
1Y3  
V
DD  
2E  
2A0  
2A1  
2Y0  
2Y1  
2Y2  
2Y3  
V
SS  
001aae752  
Fig 3. Pin configuration  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
2 of 13  
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
6.2 Pin description  
Table 2.  
Symbol  
Pin description  
Pin  
Description  
1A0, 1A1, 2A0, 2A1  
2, 3, 14, 13  
address input  
1E, 2E  
1, 15  
enable input (active LOW  
output (active HIGH)  
supply voltage  
1Y0, 1Y1, 1Y2, 1Y3, 2Y0, 2Y1, 2Y2, 2Y3  
4, 5, 6, 7, 12, 11, 10, 9  
VDD  
VSS  
16  
8
ground (GND)  
7. Functional description  
Table 3.  
Function selection[1]  
Inputs  
Outputs  
nE  
L
nA0  
L
nA1  
L
nY0  
H
nY1  
L
nY2  
L
nY3  
L
L
H
L
L
H
L
L
L
L
H
L
L
H
L
L
H
H
L
L
L
H
H
X
X
L
L
L
L
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.  
8. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDD  
IIK  
Parameter  
Conditions  
Min  
Max  
+18  
10  
Unit  
V
supply voltage  
0.5  
input clamping current  
input voltage  
VI < 0.5 V or VI > VDD + 0.5 V  
VO < 0.5 V or VO > VDD + 0.5 V  
-
mA  
V
VI  
0.5  
VDD + 0.5  
10  
IOK  
output clamping current  
input/output current  
supply current  
-
mA  
mA  
mA  
C  
II/O  
-
10  
IDD  
-
50  
Tstg  
Tamb  
Ptot  
storage temperature  
ambient temperature  
total power dissipation  
65  
+150  
+85  
40  
C  
[1]  
[2]  
DIP16 package  
SO16 package  
per output  
-
-
-
750  
mW  
mW  
mW  
500  
P
power dissipation  
100  
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.  
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
3 of 13  
 
 
 
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
9. Recommended operating conditions  
Table 5.  
Symbol  
VDD  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
15  
Unit  
V
supply voltage  
3
-
-
-
-
-
-
VI  
input voltage  
0
VDD  
+85  
3.75  
0.5  
V
Tamb  
ambient temperature  
input transition rise and fall rate  
in free air  
40  
C  
t/V  
VDD = 5 V  
VDD = 10 V  
VDD = 15 V  
-
-
-
s/V  
s/V  
s/V  
0.08  
10. Static characteristics  
Table 6.  
Static characteristics  
VSS = 0 V; VI = VSS or VDD unless otherwise specified.  
Symbol Parameter Conditions  
VDD  
Tamb = 40 C Tamb = 25 C Tamb = 85 C Unit  
Min  
Max  
-
Min  
Max  
-
Min  
Max  
VIH  
HIGH-level input voltage IO< 1 A  
5 V  
10 V  
15 V  
5 V  
3.5  
3.5  
3.5  
-
-
V
V
V
V
V
V
V
V
V
V
V
V
7.0  
-
7.0  
-
7.0  
11.0  
-
11.0  
-
11.0  
-
VIL  
LOW-level input voltage  
IO< 1 A  
-
1.5  
3.0  
4.0  
-
-
1.5  
3.0  
4.0  
-
-
1.5  
3.0  
4.0  
-
10 V  
15 V  
5 V  
-
-
-
-
-
-
VOH  
VOL  
IOH  
HIGH-level output voltage IO< 1 A;  
VI = VSS or VDD  
4.95  
4.95  
4.95  
10 V  
15 V  
5 V  
9.95  
-
9.95  
-
9.95  
-
14.95  
-
14.95  
-
14.95  
-
LOW-level output voltage IO< 1 A;  
VI = VSS or VDD  
-
0.05  
0.05  
0.05  
1.7  
0.52  
1.3  
3.6  
-
-
0.05  
0.05  
0.05  
1.4  
0.44  
1.1  
3.0  
-
-
0.05  
0.05  
0.05  
10 V  
15 V  
5 V  
-
-
-
-
-
-
HIGH-level output current VO = 2.5 V  
-
-
-
1.1 mA  
0.36 mA  
0.9 mA  
2.4 mA  
VO = 4.6 V  
VO = 9.5 V  
5 V  
-
-
-
10 V  
15 V  
5 V  
-
-
-
VO = 13.5 V  
-
-
-
IOL  
LOW-level output current VO = 0.4 V  
VO = 0.5 V  
0.52  
0.44  
0.36  
-
-
-
mA  
mA  
mA  
10 V  
15 V  
15 V  
5 V  
1.3  
-
1.1  
-
0.9  
VO = 1.5 V  
3.6  
-
3.0  
-
2.4  
II  
input leakage current  
supply current  
VDD = 15 V  
-
-
-
-
-
0.3  
20  
40  
80  
-
-
-
-
-
-
0.3  
20  
40  
80  
7.5  
-
-
-
-
-
1.0 A  
150 A  
300 A  
600 A  
IDD  
IO = 0 A;  
VI = VSS or VDD  
10 V  
15 V  
-
CI  
input capacitance  
-
pF  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
4 of 13  
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
11. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
VSS = 0 V; Tamb = 25 C; for test circuit see Figure 5; unless otherwise specified.  
Symbol Parameter  
tPHL HIGH to LOW  
Conditions  
nAn nYn;  
VDD  
5 V  
Extrapolation formula  
88 ns + (0.55 ns/pF)CL  
34 ns + (0.23 ns/pF)CL  
22 ns + (0.16 ns/pF)CL  
98 ns + (0.55 ns/pF)CL  
39 ns + (0.23 ns/pF)CL  
22 ns + (0.16 ns/pF CL  
113 ns + (0.55 ns/pF)CL  
44 ns + (0.23 ns/pF)CL  
32 ns + (0.16 ns/pF)CL  
123 ns + (0.55 ns/pF)CL  
44 ns + (0.23 ns/pF)CL  
32 ns + (0.16 ns/pF)CL  
10 ns + (1.00 ns/pF)CL  
9 ns + (0.42 ns/pF)CL  
6 ns + (0.28 ns/pF)CL  
Min  
Typ  
115  
45  
Max  
230  
90  
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
[1]  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
propagation delay see Figure 4  
10 V  
15 V  
5 V  
30  
65  
nE nYn  
125  
50  
250  
95  
10 V  
15 V  
5 V  
30  
65  
[1]  
tPLH  
LOW to HIGH  
nAn nYn  
nE nYn  
on nYn  
140  
55  
280  
105  
75  
propagation delay  
10 V  
15 V  
5 V  
40  
150  
55  
295  
110  
75  
10 V  
15 V  
5 V  
40  
[1][2]  
tt  
transition time  
60  
120  
60  
10 V  
15 V  
30  
20  
40  
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).  
[2] Transition time tt is the same as the HIGH to LOW and LOW to HIGH transition times tTHL and tTLH  
.
Table 8.  
Dynamic power dissipation PD  
PD can be calculated from the formulas shown. VSS = 0 V; tr = tf 20 ns; Tamb = 25 C.  
Symbol  
Parameter  
VDD  
5 V  
Typical formula for PD (W)  
Where:  
2
PD  
dynamic power  
dissipation  
PD = 4500 fi + (fo CL) VDD  
fi = input frequency in MHz,  
fo = output frequency in MHz,  
2
2
10 V  
15 V  
PD = 18800 fi + (fo CL) VDD  
PD = 45700 fi + (fo CL) VDD  
CL = output load capacitance in pF,  
DD = supply voltage in V,  
(fo CL) = sum of the outputs.  
V
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
5 of 13  
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
12. Waveforms  
V
DD  
0.5V  
nAn, nE input  
nYn output  
M
GND  
t
t
PHL  
PLH  
V
OH  
0.5V  
M
V
OL  
t
t
THL  
TLH  
001aal114  
Measurement points are given in Table 9.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 4. Inputs nAn and nE to output nYn propagation delays  
Table 9.  
Measurement points  
Supply voltage  
VDD  
Input  
VM  
Output  
VM  
5 V to 15 V  
0.5VDD  
0.5VDD  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
6 of 13  
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
EXT  
V
DD  
V
V
O
I
G
DUT  
R
T
C
L
001aal115  
Test data is given in Table 10.  
Definitions for test circuit:  
Device Under Test (DUT);  
RL = Load resistance;  
CL = Load capacitance including jig and probe capacitance;  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator;  
VEXT = External voltage for measuring switching times.  
Fig 5. Load circuitry for switching times  
Table 10. Test data  
Supply voltage  
Input  
VI  
Load  
CL  
VEXT  
tr = tf  
tPLH, tPHL  
open  
tTHL, tTLH  
5 V to 15 V  
VDD  
20 ns  
50 pF  
VDD  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
7 of 13  
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
13. Package outline  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
b
2
16  
9
M
H
pin 1 index  
E
1
8
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
w
UNIT  
mm  
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
1.25  
0.85  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
0.76  
0.068 0.021 0.049 0.014  
0.051 0.015 0.033 0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
95-01-14  
03-02-13  
SOT38-4  
Fig 6. Package outline SOT38-4 (DIP16)  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
8 of 13  
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
c
y
H
v
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 7. Package outline SOT109-1 (SO16)  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
9 of 13  
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20111118  
Data sheet status  
Change notice  
Supersedes  
HEF4555B v.5  
Product data sheet  
-
HEF4555B v.4  
Modifications:  
• Table 6: IOH minimum values changed to maximum  
HEF4555B v.4  
20100106  
19950101  
19950101  
Product data sheet  
Product specification  
Product specification  
-
-
-
HEF4555B_CNV v.3  
HEF4555B_CNV v.3  
HEF4555B_CNV v.2  
HEF4555B_CNV v.2  
-
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
10 of 13  
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
15.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
15.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
11 of 13  
 
 
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
HEF4555B  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 5 — 18 November 2011  
12 of 13  
 
 
HEF4555B  
NXP Semiconductors  
1-of-4 decoder/demultiplexer  
17. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10  
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 12  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 18 November 2011  
Document identifier: HEF4555B  
 

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