IP4286CZ6-TBF,115 [NXP]
IP4286CZ6-TBF; IP4286CZ6-TTY - Integrated 4-channel ESD protection SON 6-Pin;
| 型号： | IP4286CZ6-TBF,115 |
| 厂家： | 
NXP |
| 描述： | IP4286CZ6-TBF; IP4286CZ6-TTY - Integrated 4-channel ESD protection SON 6-Pin 二极管 |
| 文件： | 总13页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4286CZ6-TBF; IP4286CZ6-TTY
Integrated 4-channel ESD protection
Rev. 2 — 1 September 2010
Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect the capacitive loads of Input/Output (I/O) ports
(such as USB 2.0, Ethernet, Digital Visual Interface (DVI), etc.) from being damaged by
ElectroStatic Discharge (ESD).
To provide ESD protection to downstream signal and supply components, the devices
incorporate four pairs of ultra low capacitance rail-to-rail diodes plus two Zener diodes.
This provides protection against contact discharge voltages as high as ±8 kV in
accordance with IEC 61000-4-2, level 4.
The ESD protection is independent of the supply voltage due to the rail-to-rail diodes
being connected to a Zener diode.
The devices are fabricated using monolithic silicon technology and integrate four ultra low
capacitance rail-to-rail ESD protection diodes plus two Zener diodes.
1.2 Features and benefits
Pb-free and Restriction of Hazardous Substances (RoHS) compliant
IEC 61000-4-2, level 4, ±8 kV contact discharge compliant ESD protection
Four input ESD rail-to-rail protection diodes with ultra low input capacitance of 0.6 pF
maximum
Low-voltage clamping due to integrated Zener diodes
1.3 Applications
General-purpose downstream ESD protection high-frequency analog signals and
high-speed serial data transmission for ports inside:
PC/Notebook USB 2.0/IEEE 1394 ports
Cellular phone and Personal Communication System (PCS) mobile handsets
Digital Visual Interface (DVI)
High-Definition Multimedia Interfaces (HDMI)
Cordless telephones
Wireless data (WAN/LAN) systems
MID (Mobile Internet Device) and PMP (Portable Media Player)
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
2. Pinning information
Table 1.
Pinning
Description
Pin
Simplified outline
Graphic symbol
IP4286CZ6-TBF (SOT886)
1
2
3
4
5
6
ESD protection for I/O signals
6
5
4
1
2
3
ground
ESD protection for I/O signals
ESD protection for I/O signals
ground
6
5
4
ESD protection for I/O signals
bottom view
1
6
2
3
018aaa046
XSON6
IP4286CZ6-TTY (SOT363)
1
2
3
4
5
6
ESD protection for I/O signals
5
4
6
5
4
ground
ESD protection for I/O signals
ESD protection for I/O signals
ground
1
2
3
SC-88
ESD protection for I/O signals
1
2
3
018aaa046
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4286CZ6-TBF
IP4286CZ6-TTY
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 × 1.45 × 0.5 mm
SC-88
plastic surface-mounted package; 6 leads
SOT363
IP4286CZ6-TBF_TTY
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
2 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VESD
electrostatic discharge
voltage
IEC 61000-4-2, level 4,
contact discharge
-
±8
kV
Tstg
VI
storage temperature
input voltage
−55
+125
+5.5
°C
−0.5
V
5. Characteristics
Table 4.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
C(I/O-GND) input/output to
ground capacitance
reverse leakage current VI = 3.0 V
Parameter
Conditions
Min
Typ
Max Unit
[1][2][3]
VI = 3.3 V; f = 1 MHz
-
0.6
-
pF
[4]
[1]
ILR
-
-
-
100
-
nA
pF
C(zd-GND)
Zener diode to
20
ground capacitance
[1]
VBRzd
VF
Zener diode
breakdown voltage
Itest = 1 mA
6
-
-
9
-
V
V
forward voltage
0.7
[1] Guaranteed by design.
[2] Route differential pairs to pins 1 and 6, and to pins 3 and 4 for optimal parasitic symmetry.
[3] Pins 1 and 6, and pins 3 and 4 to ground.
[4] Pins 1, 3, 4 and 6 to ground.
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
3 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
6. Application information
6.1 Typical application
The devices are capable of protecting both USB data lines of a USB 2.0 port from ESD,
and are optimized to protect two USB 2.0 ports simultaneously.
A typical application is shown in Figure 1.
V
BUS
D−
D+
GND
IP4286CZ6
V
BUS
D−
D+
GND
018aaa047
All protection pins (1, 3, 4 and 6) can be swapped to protect any signal line.
Fig 1. Application diagram for protection of two USB ports
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
4 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
7. Package outline
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L
1
e
6
5
4
e
1
e
1
6×
A
(2)
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
L
L
1
1
max max
0.25
0.17
1.5
1.4
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
04-07-15
04-07-22
SOT886
MO-252
Fig 2. Package outline SOT886 (XSON6/MO-252)
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
5 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 3. Package outline SOT363 (SC-88)
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
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IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
8. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
8.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
8.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
8.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
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IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
8.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 4) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 5 and 6
Table 5.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 6.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 4.
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
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IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 4. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
9 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
9. Revision history
Table 7.
Document ID
IP4286CZ6-TBF_TTY v.2 20100901
Revision history
Release date
Data sheet status
Change notice
Supersedes
Product data sheet
-
IP4286CZ6_1
Modifications:
• Type number IP4286CZ6-TTD deleted.
• Table 1 “Pinning”: amended.
• Table 3 “Limiting values”: amended.
• Table 4 “Characteristics”: amended.
• Figure 1: updated.
• Section 10 “Legal information”: updated.
IP4286CZ6_1
20090420
Objective data sheet
-
-
IP4286CZ6-TBF_TTY
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 2 — 1 September 2010
10 of 13
IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
10.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
10.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
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Product data sheet
Rev. 2 — 1 September 2010
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IP4286CZ6-TBF; IP4286CZ6-TTY
NXP Semiconductors
Integrated 4-channel ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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Product data sheet
Rev. 2 — 1 September 2010
12 of 13
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NXP Semiconductors
Integrated 4-channel ESD protection
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 4
Typical application . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
4
5
6
6.1
7
8
Soldering of SMD packages . . . . . . . . . . . . . . . 7
Introduction to soldering . . . . . . . . . . . . . . . . . . 7
Wave and reflow soldering . . . . . . . . . . . . . . . . 7
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . . 7
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . . 8
8.1
8.2
8.3
8.4
9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 September 2010
Document identifier: IP4286CZ6-TBF_TTY
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