IP4352CX24/LF [NXP]
9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4; 带ESD保护的9通道的SD存储卡接口过滤器，符合IEC 61000-4-2第4级
| 型号： | IP4352CX24/LF |
| 厂家： | 
NXP |
| 描述： | 9-channel SD memory card interface filter with ESD protection to IEC 61000-4-2 level 4 |
| 文件： | 总13页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4352CX24
9-channel SD memory card interface filter with ESD protection
to IEC 61000-4-2 level 4
Rev. 02 — 3 May 2010
Product data sheet
1. Product profile
1.1 General description
The IP4352CX24 is a diode array designed to provide protection to downstream
components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.
The IP4352CX24 integrates 9 pairs of rail-to-rail diodes, 15 resistors and 12 Zener diodes
in a single Wafer-Level Chip-Scale Package (WLCSP) using monolithic silicon
semiconductor technology.
These features make the IP4352CX24 ideal for applications requiring miniaturized
components, such as mobile phone handsets, cordless telephones and personal digital
devices.
1.2 Features and benefits
Pb-free, RoHS compliant, free of halogen and antimony (Dark Green compliant)
All SD memory card channels have integrated ESD protection EMI and RF filters
ESD protection up to 15 kV at output terminals on 9 channels
Integrated EMI and RF filters with pull-up resistors on 5 channels
Integrated EMI and RF filters on 4 channels
SD card power supply protection
WLCSP with 0.4 mm pitch
Write protection with integrated card detect biasing resistor
Supports electrical card detection
Also available with different filter behavior and the same footprint as IP4350CX24
1.3 Applications
SD memory card interfaces in cellular and PCS mobile handsets
DECT handsets
Digital still and video cameras
Media players
Card readers
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
2. Pinning information
2.1 Pinning
bump A1
index area
1
2
3
4
5
A
B
C
D
E
001aaj785
transparent top view,
solder balls facing down
Fig 1. Pin configuration IP4352CX24
Table 1.
Pin
A1
Pinning
Description
DATA2: data line 2
A2
DATA3: data line 3
A3
GND_H: ground 1
A4
SDDATA2: secure digital data 2
SDDATA3: secure digital data 3
CD: card detect
A5
B1
B2
CMD: command
B3
not connected
B4
SDCD: secure digital card detect
SDCMD: secure digital command
DAT3_PD: data 3 pull-down
WP: write protect
B5
C1
C2
C3
C4
C5
D1
D2
D3
D4
D5
E1
DAT3_PU: data 3 pull-up
SDWP: secure digital write protect
VSD: supply voltage
WP+CD: write protect and card detect
CLK: clock
GND_C: ground 2
SDWP+CD: secure digital write protect and card detect
SDCLK: secure digital clock
DATA1: data line 1
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
2 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
Table 1.
Pinning …continued
Pin
E2
E3
E4
E5
Description
DATA0: data line 0
GND_C: ground 3
SDDATA1: secure digital data 1
SDDATA0: secure digital data 0
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4352CX24/LF
WLCSP24 wafer level chip-size package; 24 bumps (5 × 5 - B3)
IP4352CX24
4. Functional diagram
VSD
DAT3_PU
R11
R12 R13 R14 R15
R1
R2
R3
R4
R5
R6
R7
R8
R9
CLK
SDCLK
CMD
SDCMD
DATA0
DATA1
DATA2
DATA3
CD
SDDATA0
SDDATA1
SDDATA2
SDDATA3
SDCD
WP
SDWP
WP+CD
SDWP+CD
R21
DAT3_PD
GND_H
GND_C
001aaj750
Fig 2. Schematic diagram IP4352CX24
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
3 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
5. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
Max Unit
input voltage
−0.5 +5.0
V
VESD
electrostatic discharge voltage
IEC 61000-4-2 level 4; output pins A4, A5, B4,
B5, C4, C5, D4, D5, E4, E5; pins A3, D3 and E3
connected to ground
[1]
contact discharge
air discharge
−8
+8
kV
kV
−15
+15
IEC 61000-4-2 level 1; all other pins; pins A3, D3
and E3 connected to ground
contact discharge
−2
−2
-
+2
kV
air discharge
+2
kV
Pch
Ptot
Tstg
channel power dissipation
total power dissipation
storage temperature
continuous power; Tamb = 70 °C
continuous power; Tamb = 70 °C
25
mW
mW
-
100
−55
-
+150 °C
Treflow(peak) peak reflow temperature
Tamb ambient temperature
10 s maximum
260
+85
°C
°C
−30
[1] Device is qualified with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the
specified level 4 (8 kV contact discharge).
6. Characteristics
Table 4.
Channel characteristics
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter Conditions
Min
32
Typ
40
Max Unit
Rs(ch)
channel series
resistance
R1 to R9 ± 20 %
R11 to R14 ± 30 %
R15 ± 30 %
48
65
Ω
35
50
kΩ
10.5 15
19.5 kΩ
R21 ± 30 %
329
470
611
kΩ
Cch
channel capacitance
Vbias(DC) = 0 V; f = 1 MHz; pin DAT3_PU = 0 V;
pin DAT3_PD = 0 V; pin VSD = 0 V
[1]
[1]
SD card to I/O interface
pins DAT3_PD, DAT3_PU and VSD
II = 1 mA
-
-
20
pF
pF
V
-
30
-
-
VBR
ILR
breakdown voltage
6
-
-
reverse leakage current per channel; VI = 3 V
-
100
nA
[1] Guaranteed by design.
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
4 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
Table 5.
Frequency response
Tamb = 25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
αil
insertion loss
all channels; Rgen = 50 Ω; RL = 50 Ω
f < 400 MHz
-
-
9
-
dB
dB
dB
dB
400 MHz < f < 800 MHz
800 MHz < f < 2.5 GHz
2.5 GHz < f < 6 GHz
9
-
13
28
-
-
32
-
Table 6.
Time domain response
Measured using source with 0 V to 3 V steps and 20 % to 70 % LOW-to-HIGH limits; Tamb = 25 °C;
unless otherwise specified.
Symbol Parameter
Conditions
Min Typ Max Unit
High speed Rgen = 50 Ω; tr = tf = 2 ns[1]
tr
tf
rise time
fall time
RL = 20 pF || 100 kΩ
RL = 40 pF || 100 kΩ
RL = 20 pF || 100 kΩ
RL = 40 pF || 100 kΩ
-
-
-
-
3.2 3.7 ns
4.4 ns
6
3.3 4.3 ns
5.5 7.5 ns
[1] Performed on all high speed lines (channels including R1 to R9, see Figure 2).
7. Application information
7.1 Insertion loss
The insertion loss was measured with a test PCB utilizing laser-drilled micro-via holes
which connect the PCB ground plane to the ground pins.
The configuration for measuring insertion loss in a 50 Ω system is shown in Figure 3.
IN
OUT
DUT
50 Ω
50 Ω
TEST BOARD
V
gen
001aai755
Fig 3. Frequency response measurement configuration
The frequency response curves measured on pins A1 and A4, E1 and E4 and C2 and C4
at frequencies up to 3 GHz are shown in Figure 4.
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
5 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
001aaj787
0
S
21
(dB)
−20
−40
−60
−80
(1)
(2)
(3)
2
3
4
1
10
10
10
10
f (MHz)
(1) Pin A1 to A4.
(2) Pin E1 to E4.
(3) Pin C2 to C4.
Fig 4. Measured insertion loss magnitudes
7.2 Crosstalk
The crosstalk between adjacent channels within the IP4352CX24 for different channel
pairs was measured in a 50 Ω NetWork Analyzer (NWA) system.
The configuration for measuring crosstalk in a 50 Ω system is shown in Figure 5.
IN_1
IN_2
OUT_2
OUT_1
DUT
50 Ω
50 Ω
TEST BOARD
50 Ω
50 Ω
V
gen
001aai756
Fig 5. Crosstalk measurement configuration
The crosstalk measured for five different pairs of channels is shown in Figure 6. In all
cases, all unused connections are terminated with 50 Ω to ground.
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
6 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
001aaj788
−10
α
ct
(dB)
−30
(1)
(2)
(3)
−50
−70
2
3
4
1
10
10
10
10
f (MHz)
(1) Pins A1 and B4.
(2) Pins A1 and E4.
(3) Pins A2 and B5.
Fig 6. Measured crosstalk between different channels
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
7 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
8. Package outline
WLCSP24: wafer level chip-size package; 24 bumps (5 x 5 - B3)
D
bump A1
index area
A
2
E
A
A
1
detail X
e
1
e
b
E
D
C
B
A
e
e
1
X
1
2
3
4
5
European
projection
wlcsp24_5x5-b3_po
Fig 7. Package outline IP4352CX24 (WLCSP24)
Table 7.
Dimensions for Figure 7
Symbol
Min
0.56
0.18
0.38
0.21
1.96
1.97
0.35
-
Typ
0.61
0.20
0.41
0.26
2.01
2.02
0.40
1.6
Max
0.66
0.22
0.44
0.31
2.06
2.07
0.45
-
Unit
mm
mm
mm
mm
mm
mm
mm
mm
A
A1
A2
b
D
E
e
e1
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
8 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
9. Design and assembly recommendations
9.1 PCB design guidelines
For optimum performance it is recommended to use a Non-Solder Mask PCB Design
(NSMD), also known as a copper-defined design, incorporating laser-drilled micro-vias
connecting the ground pads to a buried ground-plane layer. This results in the lowest
possible ground inductance and provides the best high frequency and ESD performance.
For this case, refer to Table 8 for the recommended PCB design parameters.
Table 8.
Recommended PCB design parameters
Parameter
Value or specification
200 μm
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
100 μm (0.004 inch)
370 μm
20 μm to 40 μm
AuNi
PCB material
FR4
9.2 PCB assembly guidelines for Pb-free soldering
Table 9.
Assembly recommendations
Parameter
Value or specification
330 μm
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder to flux ratio
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 : 50
Solder reflow profile
see Figure 8
T
(°C)
reflow(peak)
250
T
230
217
cooling rate
pre-heat
t (s)
t
t
2
1
t
3
t
4
t
5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 8. Pb-free solder reflow profile
IP4352CX24_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
9 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
Table 10. Characteristics
Symbol Parameter
Treflow(peak) peak reflow temperature
Conditions
Min
230
60
-
Typ
Max
260
180
30
Unit
°C
s
-
-
-
-
-
-
-
-
t1
time 1
time 2
time 3
time 4
time 5
soak time
t2
time during T ≥ 250 °C
s
t3
time during T ≥ 230 °C 10
50
s
t4
time during T > 217 °C 30
150
540
−6
s
t5
-
s
dT/dt
rate of change of
temperature
cooling rate
pre-heat
-
°C/s
°C/s
2.5
4.0
10. Abbreviations
Table 11. Abbreviations
Acronym
DECT
DUT
Description
Digital Enhanced Cordless Telecommunications
Device Under Test
EMI
ElectroMagnetic Interference
ElectroStatic Discharge
ESD
FR4
Flame Retard 4
NSMD
PCB
Non-Solder Mask PCB Design
Printed-Circuit Board
PCS
Personal Communication System
Restriction of Hazardous Substances
Wafer-Level Chip-Scale Package
RoHS
WLCSP
11. Revision history
Table 12. Revision history
Document ID
IP4352CX24_2
Modifications:
Release date
20100503
Data sheet status
Change notice
Supersedes
Product data sheet
-
IP4352CX24_1
• Features, Applications and Legal information updated.
• Figure 2: Zener diode symbol added.
• Figure 7: Package outline changed.
• Table 6: updated.
• Section 9: Soldering information changed.
IP4352CX24_1
20090813
Product data sheet
-
-
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
10 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
12.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
12.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
11 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4352CX24_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 3 May 2010
12 of 13
IP4352CX24
NXP Semiconductors
9-channel SD memory card interface filter with ESD protection
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
2
2.1
3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
5
6
7
7.1
7.2
Application information. . . . . . . . . . . . . . . . . . . 5
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
9
9.1
9.2
Design and assembly recommendations . . . . 9
PCB design guidelines . . . . . . . . . . . . . . . . . . . 9
PCB assembly guidelines for Pb-free
soldering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
10
11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . 12
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 May 2010
Document identifier: IP4352CX24_2
相关型号：
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