ISP1705AET,118 [NXP]
IC UNIVERSAL SERIAL BUS CONTROLLER, PBGA36, 3.5 X 3.5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT912-1, TFBGA-36, Bus Controller;型号: | ISP1705AET,118 |
厂家: | NXP |
描述: | IC UNIVERSAL SERIAL BUS CONTROLLER, PBGA36, 3.5 X 3.5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT912-1, TFBGA-36, Bus Controller 时钟 外围集成电路 |
文件: | 总89页 (文件大小:437K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ISP1705
ULPI Hi-Speed USB transceiver
Rev. 01 — 13 June 2008
Product data sheet
1. General description
The ISP1705 is a UTMI+ Low Pin Interface (ULPI) Hi-Speed Universal Serial Bus (USB)
transceiver that is fully compliant with Universal Serial Bus Specification Rev. 2.0,
On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3 and UTMI+ Low Pin
Interface (ULPI) Specification Rev. 1.1.
The ISP1705 can transmit and receive USB data at high speed (480 Mbit/s), full speed
(12 Mbit/s) and low speed (1.5 Mbit/s), and provides a pin-optimized, physical layer
front-end attachment to the USB host, peripheral or OTG controller with Single Data Rate
(SDR) or Dual Data Rate (DDR) ULPI link. The ISP1705 can transparently transmit and
receive UART signaling.
It is ideal for use in portable electronic devices, such as mobile phones, digital still
cameras, digital video cameras, Personal Digital Assistants (PDAs) and digital audio
players. It allows USB Application-Specific Integrated Circuits (ASICs), Programmable
Logic Devices (PLDs) or any system chip set to interface with the physical layer of the
USB through an 8-pin (DDR) or 12-pin (SDR) interface.
The ISP1705 can interface to devices with digital I/O voltages in the range of 3.0 V to
3.6 V.
The ISP1705 is available in HVQFN36 and TFBGA36 packages.
2. Features
I Fully complies with:
N USB: Universal Serial Bus Specification Rev. 2.0
N OTG: On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3
N ULPI: UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1
I Interfaces to USB host, peripheral or OTG cores; optimized for portable devices or
system ASICs with built-in ULPI link
I Complete Hi-Speed USB physical front-end solution that supports high speed
(480 Mbit/s), full speed (12 Mbit/s) and low speed (1.5 Mbit/s)
N Integrated 45 Ω ± 10 % high-speed termination resistors, 1.5 kΩ ± 5 % full-speed
device pull-up resistor, and 15 kΩ ± 5 % host termination resistors
N Integrated parallel-to-serial and serial-to-parallel converters to transmit and receive
N USB clock and data recovery to receive USB data up to ±500 ppm
N Insertion of stuff bits during transmit and discarding of stuff bits during receive
N Non-Return-to-Zero Inverted (NRZI) encoding and decoding
N Supports bus reset, suspend, resume and high-speed detection handshake (chirp)
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
I Complete USB OTG physical front-end that supports Host Negotiation Protocol (HNP)
and Session Request Protocol (SRP)
N Supports external charge pump or external VBUS power switch
N Complete control over USB termination resistors
N Data line and VBUS pulsing session request methods
N Integrated VBUS voltage comparators
N Integrated cable (ID) detector
I Flexible system integration and very low power consumption, optimized for portable
devices
N 3.0 V to 4.5 V supply voltage input range
N Internal voltage regulator supplies 2.7 V or 3.3 V and 1.8 V
N Supports interfacing I/O voltage of 3.0 V to 3.6 V; separate I/O voltage supply pins
minimize crosstalk
N Power down internal regulators in Power-down mode when VCC(I/O) is not present
or when the chip is not selected
N Typical operating current of 13 mA to 32 mA, depending on the USB speed and
bus utilization
N Typical current consumption ICC is 70 µA in suspend mode and 0.5 µA in
Power-down mode
N 3-state ULPI interface by the CHIP_SEL or CHIP_SEL_N pin, allowing bus reuse
by other applications
I Highly optimized ULPI compliant
N 60 MHz, 8-pin or 12-pin interface between the core and the transceiver, including a
4-bit DDR bus or an 8-bit SDR bus
N DDR or SDR interface selectable by pin
N Supports 60 MHz output clock configuration
N Integrated Phase-Locked Loop (PLL) supporting input clock frequencies of
13 MHz, 19.2 MHz, 24 MHz or 26 MHz
N Crystal or clock frequency selectable by pin
N Fully programmable ULPI-compliant register set
N 3-pin or 6-pin full-speed or low-speed serial mode
N Internal Power-On Reset (POR) circuit
I UART interface:
N Supports transparent UART signaling on DP and DM pins for the UART accessory
application
N 2.7 V UART signaling on DP and DM pins
N Entering UART mode by register setting
N Exiting UART mode by asserting STP or by toggling the CHIP_SEL or
CHIP_SEL_N pin
I Full industrial grade operating temperature range from −40 °C to +85 °C
I ESD compliance:
N JESD22-A114D 2 kV contact Human Body Model (HBM)
N JESD22-A115-A 200 V Machine Model (MM)
N JESD22-C101-C 500 V Charged Device Model (CDM)
N IEC 61000-4-2 8 kV contact on the DP and DM pins
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
2 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
I Available in small HVQFN36 and TFBGA36 Restriction of Hazardous Substances
(RoHS) compliant, halogen-free and lead-free packages
3. Applications
I Digital still camera
I Digital TV
I Digital Video Disc (DVD) recorder
I External storage device, for example:
N Magneto-Optical (MO) drive
N Optical drive (CD-ROM, CD-RW, CD-DVD)
N Zip drive
I Mobile phone
I MP3 player
I PDA
I Printer
I Scanner
I Set-Top Box (STB)
I Video camera
4. Ordering information
Table 1.
Ordering information
Type number Package
Name
Description
Version
ISP1705HN
HVQFN36 plastic thermal enhanced very thin quad flat package; SOT818-1
no leads; 36 terminals; body 5 × 5 × 0.85 mm
ISP1705AET TFBGA36
plastic thin fine-pitch ball grid array package; 36 balls; SOT912-1
body 3.5 × 3.5 × 0.8 mm
5. Marking
Table 2.
Marking codes
Type number
ISP1705HN
ISP1705AET
Marking code[1]
1705
705A
[1] The package marking is the first line of text on the IC package and can be used for IC identification.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
3 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
6. Block diagram
29
CLOCK
1, 2, 24,
25, 27, 28,
30, 36
USB DATA
SERIALIZER
6
ULPI
INTERFACE
CONTROLLER
DP
8
HI-SPEED
USB ATX
DATA
[7:0]
ULPI
INTERFACE
19
22
23
DIR
TERMINATION
RESISTORS
5
USB DATA
DESERIALIZER
REGISTER
MAP
DM
STP
NXT
DATA0
UART
BUFFER
DATA1
7
DDR OR SDR
SELECTION
CFG0
OTG MODULE
ISP1705
34
CHIP_SEL_N
CHIP_SEL
ID
9
ID
DETECTOR
35
31
32
CLOCK
FREQUENCY
SELECTION
CFG1
CFG2
V
BUS
COMPARATORS
13
V
BUS
SRP CHARGE
AND DISCHARGE
RESISTORS
GLOBAL
CLOCKS
PLL
16
XTAL1
XTAL2
CRYSTAL
OSCILLATOR
17
14
10
PORT
POWER
CONTROL
3, 21, 26, 33
PSW_N
FAULT
interface voltage
internal power
V
CC(I/O)
18
12
20
4
POWER-ON
RESET
RESET_N
RREF
REG1V8
REG3V3
POR
BAND GAP
REFERENCE
VOLTAGE
V
REF
8
VOLTAGE
REGULATOR
V
CC
15
11
004aaa994
GND
n.c.
This figure shows the HVQFN pinout. For the TFBGA ballout, see Table 3.
Fig 1. Block diagram
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
4 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
7. Pinning information
7.1 Pinning
terminal 1
index area
DATA1
DATA0
1
2
3
4
5
6
7
8
9
27 DATA5
26
V
CC(I/O)
V
25 DATA6
24 DATA7
23 NXT
CC(I/O)
RREF
DM
DP
ISP1705HN
22 STP
CFG0
21 V
CC(I/O)
V
CC
20 RESET_N
19 DIR
ID
004aaa995
Transparent top view
Fig 2. Pin configuration HVQFN36
ball A1
index area
ISP1705AET
1
2
3
4
5
6
A
B
C
D
E
F
004aab094
Transparent top view
Fig 3. Pin configuration TFBGA36
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
5 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
7.2 Pin description
Table 3.
Pin description
Symbol[1]
Pin
Type[2] Description[3]
HVQFN36
TFBGA36
(ISP1705HN) (ISP1705AET)
DATA1
DATA0
1
2
A1
B1
I/O
I/O
ULPI data pin 1
3-state output; plain input
ULPI data pin 0
3-state output; plain input
VCC(I/O)
RREF
DM
3
4
5
B2
C2
C1
P
input I/O supply voltage; 3.0 V to 3.6 V; a 0.1 µF decoupling
capacitor is recommended
AI/O
AI/O
resistor reference; connect through a 12 kΩ ± 1 % resistor to
GND
connect to the D− pin of the USB connector
• USB mode: D− input or output
• UART mode: TXD output
DP
6
7
D1
E1
AI/O
connect to the D+ pin of the USB connector
• USB mode: D+ input or output
• UART mode: RXD input
During UART mode, an internal 125 kΩ ± 20 % pull-up resistor is
present on this pin.
CFG0
I
select SDR or DDR ULPI interface:
• SDR: connect this pin to GND
• DDR: connect this pin to REG3V3
plain input; TTL
VCC
8
F3
D3
E2
P
I
input supply voltage or battery source; 3.0 V to 4.5 V
Remark: Below 3.0 V, USB full-speed and low-speed
transactions are not guaranteed to work, though some devices
may work with the ISP1705 at these voltages.
ID
9
identification (ID) pin of the micro-USB connector; if this pin is not
in use, connect it directly to the REG3V3 pin (an internal 400 kΩ
pull-up resistor is present on this pin)
plain input; TTL
FAULT
10
I
input for the VBUS digital overcurrent or fault detector signal; if this
pin is not in use, connect it to GND
plain input, 5 V tolerant
not connected
n.c.
11
12
F1, F2
E3
-
REG3V3
P
3.3 V regulator output for USB mode or 2.7 V regulator output for
UART mode; requires parallel 0.1 µF and 4.7 µF capacitors;
internally powers ATX and other analog circuits; must not be used
to power external circuits
VBUS
13
14
F4
D4
AI/O
OD
connect to the VBUS pin of the USB connector; if this pin is not in
use, leave it open (RI(idle)(VBUS) is present on this pin)
PSW_N
active-LOW external VBUS power switch or external charge pump
enable
open-drain output, 4 mA current sinking capability, 5 V tolerant
ground
GND
15
C5, D2, E4
-
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
6 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
Table 3.
Pin description …continued
Symbol[1]
Pin
Type[2] Description[3]
HVQFN36
TFBGA36
(ISP1705HN) (ISP1705AET)
XTAL1
16
17
18
F5
F6
E6
AI/O
AI/O
P
crystal oscillator or clock input; 1.8 V peak input allowed;
frequency depends on status on the CFG1 pin
XTAL2
crystal oscillator output; when a crystal oscillator is used, leave
this pin open
REG1V8
1.8 V regulator output; requires parallel 0.1 µF and 4.7 µF
capacitors; internally powers the digital core; must not be used to
power external circuits
DIR
19
20
E5
C4
O
I
ULPI direction signal
3-state output
RESET_N
active-LOW, asynchronous reset input
plain input
VCC(I/O)
STP
21
22
B5
D6
P
I
input I/O supply voltage; 3.0 V to 3.6 V; a 0.1 µF decoupling
capacitor is recommended
ULPI stop signal
plain input
NXT
23
24
25
D5
C6
B6
O
ULPI next signal
3-state output
DATA7
DATA6
I/O
I/O
ULPI data pin 7
3-state output; plain input
ULPI data pin 6
3-state output; plain input
VCC(I/O)
DATA5
26
27
-
P
input I/O supply voltage; 3.0 V to 3.6 V; a 0.1 µF decoupling
capacitor is recommended
A6
I/O
ULPI data pin 5
3-state output; plain input
ULPI data pin 4
DATA4
28
29
A5
A4
I/O
O
3-state output; plain input
CLOCK
60 MHz clock output when crystal is attached or clock is applied
on the XTAL1 pin
3-state output
DATA3
CFG1
CFG2
VCC(I/O)
30
31
32
33
A3
B4
B3
I/O
ULPI data pin 3
3-state output; plain input
I
I
select crystal or clock frequency with CFG2; see Table 6
plain input
select crystal or clock frequency with CFG1; see Table 6
plain input
-
P
I
input I/O supply voltage; 3.0 V to 3.6 V; a 0.1 µF decoupling
capacitor is recommended
CHIP_SEL_N 34
C3
active-LOW chip select input; when this pin is not in use, connect
it to GND
plain input
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
7 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
Table 3.
Pin description …continued
Symbol[1]
Pin
Type[2] Description[3]
HVQFN36
TFBGA36
(ISP1705HN) (ISP1705AET)
CHIP_SEL
35
-
I
active-HIGH chip select input; when this pin is not in use, connect
it to VCC(I/O)
plain input
DATA2
GND
36
A2
-
I/O
P
ULPI data pin 2
3-state output; plain input
ground
exposed die
pad
[1] Symbol names ending with underscore N (for example, NAME_N) indicate active-LOW signals.
[2] I = input; O = output; I/O = digital input/output; OD = open-drain output; AI/O = analog input/output; P = power supply or ground pin.
[3] A detailed description of these pins can be found in Section 8.12.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
8 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
8. Functional description
8.1 ULPI interface controller
The ISP1705 provides a 12-pin interface that is compliant with UTMI+ Low Pin Interface
(ULPI) Specification Rev. 1.1. This interface must be connected to a USB link.
The ULPI interface controller provides the following functions:
• ULPI-compliant interface and register set
• Allows full control over the USB peripheral or host functionality
• Parses the USB transmit and receive data
• Prioritizes the USB receive data, USB transmit data, interrupts and register operations
• Low-power mode
• Transparent UART mode
• 3-pin serial mode
• 6-pin serial mode
• Generates RXCMDs (status updates)
• Maskable interrupts
For more information on the ULPI protocol, see Section 10.
8.2 USB serializer and deserializer
The USB data serializer prepares data to transmit on the USB bus. To transmit data, the
USB link sends a transmit command and data on the ULPI bus. The serializer performs
parallel-to-serial conversion, bit stuffing and NRZI encoding. For packets with a PID, the
serializer adds a SYNC pattern to the start of the packet, and an EOP pattern to the end
of the packet. When the serializer is busy and cannot accept any more data, the ULPI
interface controller deasserts NXT.
The USB data deserializer decodes data received from the USB bus. When data is
received, the deserializer strips the SYNC and EOP patterns, and then performs
serial-to-parallel conversion, NRZI decoding and discarding of stuff bits on the data
payload. The ULPI interface controller sends data to the USB link by asserting DIR, and
then asserting NXT whenever a byte is ready. The deserializer also detects various
receive errors, including bit stuff errors, elasticity buffer underrun or overrun, and
byte-alignment errors.
8.3 Hi-Speed USB (USB 2.0) ATX
The Hi-Speed USB ATX block is an analog front-end containing the circuitry needed to
transmit, receive and terminate the USB bus in high speed, full speed and low speed, for
USB peripheral, host or OTG implementations. The following circuitry is included:
• Differential drivers to transmit data at high speed, full speed and low speed
• Differential and single-ended receivers to receive data at high speed, full speed and
low speed
• Squelch circuit to detect high-speed bus activity
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
9 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
• High-speed disconnect detector
• 45 Ω high-speed bus terminations on pins DP and DM
• 1.5 kΩ pull-up resistor on pin DP
• 15 kΩ bus terminations on pins DP and DM
For details on controlling resistor settings, see Table 15.
8.4 Voltage regulator
The ISP1705 contains a built-in voltage regulator that conditions the VCC supply for use
inside the ISP1705. The voltage regulator:
• Supports input supply range 3.0 V < VCC < 4.5 V.
• Can be supplied from a battery with the voltage range mentioned above.
• Supplies internal digital circuitry with 1.8 V and analog circuitry with 3.3 V or 2.7 V.
• In USB mode, automatically bypasses the internal 3.3 V regulator when VCC < 3.5 V:
the internal analog circuitry directly draws power from the VCC pin. In UART mode, the
bypass switch will be disabled.
• Will be shut down when VCC(I/O) is not present or when chip select is deasserted.
8.5 Crystal oscillator and PLL
The ISP1705 has a built-in crystal oscillator and a Phase-Locked Loop (PLL) for clock
generation. When a crystal is in use, the built-in crystal oscillator generates a square wave
clock for internal use. A square wave clock of the same frequency can also be driven
directly into the XTAL1 pin. Using an existing square wave clock can save the cost of a
crystal and also reduce the board space. The crystal or clock frequencies supported are
13 MHz, 19.2 MHz, 24 MHz and 26 MHz.
The PLL takes the square wave clock from the crystal oscillator and multiplies or divides it
into various frequencies for internal use.
The PLL produces the following frequencies, irrespective of the clock source:
• 1.5 MHz for low-speed USB data
• 12 MHz for full-speed USB data
• 60 MHz clock for the ULPI interface controller
• 480 MHz for high-speed USB data
• Other internal frequencies for data conversion and data recovery
8.6 UART buffer
The UART buffer includes circuits to support the transparent UART signaling between the
DATA0 or DATA1 pin and the DM or DP pin.
When the ISP1705 is put into UART mode, it acts as a voltage level shifter between the
following pins:
• From DATA0 (VCC(I/O) level) to DM (2.7 V level) for the UART TXD signaling path.
• From DP (2.7 V level) to DATA1 (VCC(I/O) level) for the UART RXD signaling path.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
10 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
8.7 OTG module
This module contains several sub-blocks that provide all the functionality required by the
USB OTG specification. Specifically, it provides the following circuits:
• The ID detector to sense the ID pin of the micro-USB cable. The ID pin dictates which
device is initially configured as a host and which as a peripheral.
• VBUS comparators to determine the VBUS voltage level. This is required for the VBUS
detection, SRP and HNP.
• Resistors to temporarily charge and discharge VBUS. This is required for SRP.
8.7.1 ID detector
The ID detector detects which end of the micro-USB cable is plugged in. The ID detector
must first be enabled by setting the ID_PULLUP register bit to logic 1. If the ISP1705
senses a state of the ID pin that is different from the previously reported state, an RXCMD
status update will be sent to the USB link, or an interrupt will be asserted.
• If the micro-B end of the cable is plugged in (or nothing is plugged in), the ISP1705
will report that ID_GND is logic 1. The USB link must be in the B-device state.
• If the micro-A end of the cable is plugged in, the ISP1705 will report that ID_GND is
logic 0. The USB link must be in the A-device state.
The ID pin has a weak pull-up resistor (RweakPU(ID)) permanently enabled to avoid the
floating condition.
8.7.2 VBUS comparators
The ISP1705 provides three comparators to detect the VBUS voltage level. The
comparators are explained in the following subsections.
8.7.2.1 VBUS valid comparator
This comparator is used by hosts and A-devices to determine whether the voltage on
VBUS is at a valid level for operation. The ISP1705 minimum threshold for the VBUS valid
comparator is 4.4 V. Any voltage on VBUS below this threshold is considered invalid.
During power-up, it is expected that the comparator output will be ignored.
8.7.2.2 Session valid comparator
The session valid comparator is a TTL-level input that determines when VBUS is high
enough for a session to start. Peripherals, A-devices and B-devices use this comparator to
detect when a session is started. The A-device also uses this comparator to determine
when a session is completed. The session valid threshold of the ISP1705 is between
0.8 V to 2.0 V.
8.7.2.3 Session end comparator
The session end comparator determines when VBUS is below the B-device session end
threshold of 0.2 V to 0.8 V. The B-device uses this threshold to determine when a session
has ended.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
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ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
8.7.3 SRP charge and discharge resistors
The ISP1705 provides on-chip resistors for short-term charging and discharging of VBUS
.
These are used by the B-device to request a session, prompting the A-device to restore
the VBUS voltage. First, the B-device makes sure that VBUS is fully discharged from the
previous session by setting the DISCHRG_VBUS register bit to logic 1 and waiting for
SESS_END to be logic 1. Then the B-device charges VBUS by setting the CHRG_VBUS
register bit to logic 1. The A-device sees that VBUS is charged above the session valid
threshold and starts a session by turning on the VBUS voltage.
8.8 Port power control
For an OTG or host application, the ISP1705 uses the PSW_N pin to control the external
power switch for the VBUS 5 V supply. The overcurrent detector output of the external
power switch can be connected to the FAULT pin of the ISP1705 to indicate to the ULPI
link the VBUS overcurrent status. For the connection scheme, see Figure 4.
When the FAULT pin is not used, connect it to GND.
+5 V
POWER
SWITCH
WITH
FAULT
PSW_N
FAULT
V
BUS
INDICATOR
ISP1705
V
BUS
001aai189
Fig 4. Digital overcurrent detection scheme
8.9 Band gap reference voltage
The band gap circuit provides a stable internal voltage reference to bias the analog
circuitry. This band gap circuit requires an accurate external reference resistor. Connect a
12 kΩ ± 1 % resistor between the RREF pin and GND.
8.10 Power-On Reset (POR)
An internal POR pulse is generated when REG1V8 rises above VPOR(trip). The internal
POR pulse will be generated whenever REG1V8 drops below VPOR(trip) for more than
tw(REG1V8_L)
.
To give a better view of the functionality, Figure 5 shows a possible curve of REG1V8. The
internal POR starts with logic 0 at t0. At t1, the detector will see the passing of the trip
level so that a POR pulse is generated to reset all internal circuits. If REG1V8 dips from t2
to t3 for greater than tw(REG1V8_L), another POR pulse is generated. If the dip from t4 to t5
is less than tw(REG1V8_L), the internal POR pulse will not be generated and will remain
LOW.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
12 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
REG1V8
V
POR(trip)
t4
t3
t5
t0
t1
t2
POR
004aab023
Fig 5. Internal power-on reset timing
8.11 Power-up, reset and bus idle sequence
Figure 6 shows a typical start-up sequence.
On power-up, the ISP1705 performs an internal power-on reset and asserts DIR to
indicate to the link that the ULPI bus cannot be used. When the internal PLL is stable, the
ISP1705 deasserts DIR and drives a 60 MHz clock on the CLOCK pin. The power-up time
depends on the VCC supply rise time, the crystal start-up time, and the PLL start-up time
tstartup(PLL). When DIR is deasserted, the link must drive the data bus to a valid level. By
default, the link must drive data to LOW. Before beginning USB packets, the link must set
the RESET bit in the FUNC_CTRL register (see Section 11.5) to reset the ISP1705. After
the RESET bit is set, the ISP1705 will assert DIR until the internal reset completes. The
ISP1705 will automatically deassert DIR and clear the RESET bit when the reset has
completed. After every reset, an RXCMD is sent to the link to update USB status
information. After this sequence, the ULPI bus is ready for use and the link can start USB
operations.
If chip select is non-active, the ISP1705 will be kept in Power-down mode. In Power-down
mode, all ULPI interface pins will be put in 3-state, the internal regulator will be shut down,
and the total current consumption in Power-down mode will be less than that in low-power
mode.
The link can do a hardware reset to the ISP1705 by toggling chip select. The
recommended sequence is:
1. De-activate chip select.
2. Wait for at least tPWRDN
3. Activate chip select.
.
If the low-power mode is entered when VCC(I/O) is lost, see Table 9.
The recommended power-up sequence for the link is:
1. Apply the VCC and VCC(I/O) voltage.
2. Activate chip select.
3. The link waits for at least tPWRUP, ignoring all the ULPI pin statuses.
4. The link may start to detect the DIR status level. If DIR is detected LOW, the link may
send a RESET command.
The ULPI interface is ready for use.
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V
CC
V
CC(I/O)
CHIP_SEL_N
REG1V8
t
PWRUP
Internal
POR
XTAL1
bus idle
internal clocks stable
RESET command
t
+ t
d(det)clk(osc) startup(PLL)
CLOCK
(output)
DATA[7:0]
TXCMD
D
RXCMD
internal reset
update
DIR
STP
NXT
t1 t2
t3
t4
t5
t6
004aaa987
t1 = VCC is applied to the ISP1705.
t2 = VCC(I/O) is turned on. ULPI interface pins CLOCK, DATA[7:0], DIR and NXT are in 3-state as long as chip select is
non-active.
t3 = Chip select turns from non-active to active. The ISP1705 regulator starts to turn on. ULPI pads are not in 3-state and may
drive to either LOW or HIGH. It is recommended that the link ignores ULPI pins status during tPWRUP
.
t4 = Power-on reset threshold is reached and the POR pulse is generated. After the POR pulse, ULPI pins are driven to a
defined level. DIR is driven to HIGH and the other pins are driven to LOW.
t5 = The PLL is stabilized after td(det)clk(osc) + tstartup(PLL). The CLOCK pin starts to output 60 MHz. The DIR pin will transition
from HIGH to LOW. The link must drive DATA[7:0] and STP to LOW as the idle state. The link will then issue a reset command
to initialize the ISP1705.
t6 = The power-up sequence is completed and the ULPI bus interface is ready for use.
Fig 6. Power-up and reset sequence required before the ULPI bus is ready for use
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8.11.1 Interface protection
By default, the ISP1705 enables a weak pull-up resistor on STP. If the STP pin is
unexpectedly HIGH at any time, the ISP1705 will protect the ULPI interface by enabling
weak pull-down resistors on DATA[7:0].
The interface protect feature prevents unwanted activity of the ISP1705 whenever the
ULPI interface is not correctly driven by the link. For example, when the link powers up
more slowly than the ISP1705.
The interface protect feature can be disabled by setting the INTF_PROT_DIS bit to logic 1.
8.11.2 Interface behavior with respect to RESET_N
The use of the RESET_N pin is optional. When RESET_N is asserted (LOW), all logic in
the ISP1705 will be reset, including the analog circuitry and ULPI registers. During reset,
the link must drive DATA[7:0] and STP to LOW; otherwise undefined behavior may result.
When RESET_N is deasserted (HIGH), 60 MHz clock will start. Figure 7 shows the ULPI
interface behavior when RESET_N is asserted (LOW), and subsequently deasserted
(HIGH). The behavior of Figure 7 applies only when chip select is asserted. If RESET_N
is not used, it must be connected to VCC(I/O)
.
CLOCK
RESET_N
DATA[7:0]
Hi-Z (input)
Hi-Z (input)
Hi-Z (link must drive)
Hi-Z (link must drive)
Hi-Z (input)
DIR
Hi-Z (input)
STP
NXT
004aab065
Fig 7. Interface behavior with respect to RESET_N
8.11.3 Interface behavior with respect to chip select
The use of chip select as a power-down control signal is optional. When chip select is
deasserted, the ISP1705 will 3-state ULPI pins and power-down the internal circuitry. If
chip select is not used as a power-down control signal, CHIP_SEL_N must be connected
to LOW. Figure 8 shows the ULPI interface behavior when chip select is asserted and
subsequently deasserted.
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t
PWRDN
Hi-Z (ignored)
CLOCK
CHIP_SEL_N
DATA[7:0]
DIR
Hi-Z (input)
Hi-Z (ignored)
Hi-Z
Hi-Z (ignored)
Hi-Z
Hi-Z (input)
STP
NXT
004aaa988
Fig 8. Interface behavior with respect to chip select
8.12 Detailed description of pins
8.12.1 DATA[7:0]
Bidirectional data bus pins. The USB link must drive DATA[7:0] to LOW when the ULPI bus
is idle. When the link has data to transmit to the PHY, it drives a nonzero value. Weak
pull-down resistors are incorporated into DATA[7:0] pins as part of the interface protect
feature. For details, see Section 8.11.1.
DATA[7:0] pins can also be 3-stated when chip select is deasserted.
These pins can be reconfigured to carry various data types when the chip is not in
synchronous mode. For details, see Section 9.2.
8.12.2 VCC(I/O)
The input supply power pin that sets the I/O voltage level. A 0.1 µF decoupling capacitor is
recommended on each VCC(I/O) pin. VCC(I/O) powers the on-chip pads of the following pins:
• CFG1
• CFG2
• CHIP_SEL
• CHIP_SEL_N
• CLOCK
• DATA[7:0]
• DIR
• NXT
• STP
• RESET_N
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8.12.3 RREF
ULPI Hi-Speed USB transceiver
Resistor reference analog I/O pin. A 12 kΩ ± 1 % resistor must be connected between the
RREF pin and GND. This provides an accurate voltage reference that biases internal
analog circuitry. Less accurate resistors cannot be used. It will affect the biasing current
for analog circuits, thus the USB signal quality.
8.12.4 DP and DM
When the ISP1705 is in USB mode, the DP pin functions as the USB data plus line, and
the DM pin functions as the USB data minus line.
When the ISP1705 is in transparent UART mode, the DP pin functions as the UART RXD
input pin, and the DM pin functions as the UART TXD output pin.
The DP and DM pins must be connected to the D+ and D− pins of the USB receptacle.
8.12.5 CFG0
This input pin is used to select the SDR or DDR interface. For the SDR interface, connect
this pin to GND. For the DDR interface, connect this pin to REG3V3.
8.12.6 VCC
Main input supply voltage for the ISP1705. The ISP1705 operates correctly when VCC is
between 3.0 V and 4.5 V. A 0.1 µF decoupling capacitor is recommended.
8.12.7 ID
For OTG applications, the ID (identification) pin is connected to the ID pin of the micro-AB
receptacle. As defined in On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3,
the ID pin dictates the initial role of the link. If ID is detected as HIGH, the link must
assume the role of a peripheral. If ID is detected as LOW, the link must assume a host
role. Roles can be swapped at a later time by using HNP.
The ISP1705 provides an internal pull-up resistor (RUP(ID)) to sense the state of the ID pin.
The pull-up resistor must first be enabled by setting the ID_PULLUP register bit to logic 1.
If the state of ID has changed, the ISP1705 will send an RXCMD or interrupt to the link. If
the link does not receive any RXCMD or interrupt by time tID, then the ID state has not
changed.
The ISP1705 also provides an internal weak pull-up resistor (RweakPU(ID)). This weak
pull-up resistor is always enabled to avoid a possible floating condition on the ID pin.
8.12.8 FAULT
This pin is used to detect the VBUS fault condition. If the function is not used, this pin must
be connected to ground to avoid floating input.
If an external VBUS overcurrent or fault detection circuit is used, the output fault indicator of
that circuit can be connected to the FAULT input pin. The USE_EXT_VBUS_IND bit in the
OTG_CTRL register (see Section 11.7) and the IND_PASSTHRU bit in the INTF_CTRL
register (see Section 11.6) must be set to logic 1. The ISP1705 will inform the link of VBUS
fault events by sending RXCMDs on the ULPI bus.
The FAULT input pin is mapped to the A_VBUS_VLD bit in RXCMD. Any changes to the
FAULT input will trigger RXCMD carrying the FAULT condition with A_VBUS_VLD.
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For details, see Section 10.3.2 and Section 10.3.3.
8.12.9 REG3V3 and REG1V8
These are output voltage pins from the internal regulator. These supplies are used
internally to power digital and analog circuits.
For proper operation of the regulator, pins REG3V3 and REG1V8 must each be
connected to a 0.1 µF capacitor in parallel with a 4.7 µF low ESR capacitor.
REG3V3 powers on-chip pads of the following pins:
• CFG0
• DM
• DP
• FAULT
• ID
• PSW_N
• RREF
8.12.10 VBUS
This I/O pin acts as an input to VBUS comparators, and also as a power supply pin for SRP
charge and discharge resistors. For details, see Figure 9.
The VBUS pin requires a capacitive load. Table 4 provides the recommended capacitor
values for various applications.
Table 4.
Recommended VBUS capacitor value
Application
OTG
VBUS capacitor (CVBUS
1 µF to 6.5 µF, 10 V
120 µF ± 20 %, 10 V
1 µF to 10 µF, 10 V
)
Standard host
Standard peripheral
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REG3V3
CHRG_VBUS
ISP1705
R
UP(VBUS)
V
BUS
comparators
V
BUS
R
R
DN(VBUS)
I(idle)(VBUS)
DISCHRG_
VBUS
004aab045
Fig 9. VBUS pin internal pull-up and pull-down scheme
8.12.11 PSW_N
The PSW_N pin is an active-LOW open-drain output pin. It is used to control external
charge pumps or VBUS power switches to supply VBUS. When in use, an external pull-up
resistor is required. This allows for per-port or ganged power control.
To enable the external power source by driving PSW_N to LOW, the link must set the
DRV_VBUS_EXT bit in the OTG_CTRL register (see Section 11.7) to logic 1.
Table 5 summarizes settings to drive 5 V on VBUS
.
Table 5.
OTG_CTRL register power control bits
DRV_VBUS_EXT
Power source used
0
1
external 5 V VBUS power source disabled (PSW_N = HIGH)
external 5 V VBUS power source enabled (PSW_N = LOW)
8.12.12 XTAL1 and XTAL2
XTAL1 is the crystal oscillator input, and XTAL2 is the crystal oscillator output. The
allowed crystal or clock frequency on the XTAL1 pin is selectable by the CFG1 and CFG2
pins, as shown in Table 6.
Table 6.
Pin CFG1
LOW
Allowed crystal or clock frequency on the XTAL1 pin
Pin CFG2
LOW
Allowed crystal or clock frequency on the XTAL1 pin
19.2 MHz
26 MHz
24 MHz
13 MHz
LOW
HIGH
HIGH
LOW
HIGH
HIGH
When a clock is driven into XTAL1, XTAL2 must be left open.
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If a crystal is attached, it requires a capacitor on each terminal of the crystal to GND. The
recommended crystal specification and required external capacitors are given in Table 7
and Table 8.
Table 7.
External capacitor values for 13 MHz or 19.2 MHz clock frequency
Load capacitance CL of the
crystal[1]
Maximum series resistance RS of
the crystal[1]
External capacitor
XTAL value
C
10 pF
20 pF
< 180 Ω
< 100 Ω
18 pF
39 pF
[1] Specified by the crystal manufacturer.
Table 8.
External capacitor values for 24 MHz or 26 MHz clock frequency
Load capacitance CL of the
crystal[1]
Maximum series resistance RS of
the crystal[1]
External capacitor
XTAL value
C
10 pF
20 pF
< 140 Ω
< 60 Ω
18 pF
39 pF
[1] Specified by the crystal manufacturer.
8.12.13 DIR
ULPI direction output pin. Synchronous to the rising edge of CLOCK. Controls the
direction of the data bus. By default, the ISP1705 holds DIR at LOW, causing the data bus
to be an input. When DIR is LOW, the ISP1705 listens for data from the link. The ISP1705
pulls DIR to HIGH only when it has data to send to the link, which is for one of two
reasons:
• To send data (USB receive or register reads) and RXCMD status updates to the link.
• To block the link from driving the data bus during power-up, reset and low power
(suspend) mode.
This pin can be 3-stated when chip select is deasserted.
8.12.14 RESET_N
An active-LOW asynchronous reset pin that resets all circuits in the ISP1705. The
ISP1705 contains an internal power-on reset circuit, and therefore using the RESET_N
pin is optional. If RESET_N is not used, it must be connected to VCC(I/O)
.
For details on using RESET_N, see Section 8.11.2.
8.12.15 STP
ULPI stop input pin. Synchronous to the rising edge of CLOCK. The link must assert STP
to signal the end of a USB transmit packet or a register write operation. When DIR is
asserted, the link can optionally assert STP for one clock cycle to abort the ISP1705,
causing it to deassert DIR in the next clock cycle.
8.12.16 NXT
ULPI next data output pin. Synchronous to the rising edge of CLOCK. The ISP1705 holds
NXT at LOW, by default. When DIR is LOW and the link is sending data to the ISP1705,
NXT will be asserted to notify the link to provide the next data byte. When DIR is HIGH
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and the ISP1705 is sending data to the link, NXT will be asserted to notify the link that
another valid byte is on the bus. NXT is not used for register read data or the RXCMD
status update.
This pin can be 3-stated when chip select is deasserted.
8.12.17 CLOCK
A 60 MHz interface clock to synchronize the ULPI bus. All ULPI pins are synchronous to
the rising edge of CLOCK.
The ISP1705 provides two clocking options:
• A crystal is attached between the XTAL1 and XTAL2 pins.
• A clock is driven into the XTAL1 pin, with the XTAL2 pin left unconnected.
8.12.18 CFG1, CFG2
These input pins are used to select the crystal or clock frequency. For details, see Table 6.
8.12.19 CHIP_SEL, CHIP_SEL_N
When chip select is deasserted, ULPI pins DATA[7:0], CLOCK, DIR and NXT are 3-stated
and the STP input is ignored; internal circuits are powered-down as well.
When chip select is asserted, the ISP1705 will operate normally.
Both the CHIP_SEL and CHIP_SEL_N pins must be asserted for the chip select to
function. If any of the two is deasserted, the chip will enter Power-down mode.
8.12.20 GND
Global ground signal. To ensure the correct operation of the ISP1705, GND must be
soldered to the cleanest available ground.
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9. Modes of operation
9.1 Power modes
When both VCC(I/O) and VCC are not powered, there will be no leakage from the VBUS pin
to all the remaining pins, including VCC and VCC(I/O). Applying VBUS within the normal
range will not damage the ISP1705 chip.
When both VCC and VCC(I/O) are powered and are within the operating voltage range, the
ISP1705 will be fully functional as in normal mode.
When VCC(I/O) is powered and the VCC voltage is below the operating range of the
ISP1705, the application system must detect the low voltage condition and set chip select
to deassert (that is, put the ISP1705 in Power-down mode). This is to protect the ULPI and
USB interfaces from driving wrong levels. Under this condition, the VCC(I/O) voltage will not
leak to USB pins (VBUS, DP, DM and ID) and the VCC pin. All the digital pins (see
Section 8.12.2) powered by VCC(I/O) are configured as high-impedance inputs. These pins
must be driven to a defined state or terminated by using pull-up or pull-down resistors to
avoid a floating input condition. Other pins (see Section 8.12.9) are not powered.
9.1.1 Normal mode
In normal mode, both VCC and VCC(I/O) are powered. Chip select is asserted. The ISP1705
is fully functional.
9.1.2 Power-down mode
When VCC(I/O) is not present or when chip select is deasserted, the ISP1705 is put into
Power-down mode. In this mode, internal regulators are powered down to keep the VCC
current to a minimum. The voltage on the VCC pin will not leak to the VCC(I/O) and/or VBUS
pins. In this mode, the ISP1705 pin states are given in Table 9.
Table 9.
Pin states in Power-down mode
Pin name[1]
Pin state when
CC(I/O) is not
present
Pin state when VCC(I/O) is
present and chip select
is not active
V
VCC
3.0 V to 4.5 V
not powered[2]
not powered[2]
not powered[2]
3.0 V to 4.5 V
3.0 V to 3.6 V
HIGH
VCC(I/O)
CHIP_SEL, CHIP_SEL_N
CFG1, CFG2, RESET_N, CLOCK, STP, NXT,
DIR, DATA[7:0]
3.0 V to 3.3 V
CFG0, DP, DM, VBUS, ID, REG1V8, REG3V3,
XTAL1, XTAL2, RREF, PSW_N, FAULT
not powered[2]
not powered[2]
[1] When I/O pins are not powered, the input buffer is disabled and will ignore the external input level. The input
pins, however, should not be driven by another voltage source to prevent leakage.
[2] These pins must not be externally driven to HIGH. Otherwise, the ISP1705 behavior is undefined and
leakage current will occur.
When VCC(I/O) is not present, all the digital pins (see Section 8.12.2) that are powered by
VCC(I/O) are not powered. Other pins (see Section 8.12.9) are also not powered.
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When the ISP1705 is put into Power-down mode by disabling chip select, all the digital
pins (see Section 8.12.2) that are powered by VCC(I/O) are configured as high-impedance
inputs. These pins must be driven to defined states or terminated by using pull-up or
pull-down resistors to avoid a floating input condition. Other pins (see Section 8.12.9) are
not powered. In this mode, minimum current will be drawn by VCC(I/O) to detect the chip
select status.
9.2 ULPI modes
The ISP1705 ULPI interface can be programmed to operate in five modes. In each mode,
the signals on the data bus are reconfigured as described in the following subsections.
Setting more than one mode will lead to undefined behavior.
9.2.1 Synchronous mode
This is default mode. On power-up, and when CLOCK is stable, the ISP1705 will enter
synchronous mode.
In synchronous mode, the link must synchronize all ULPI signals to CLOCK, meeting the
set-up and hold times as defined in Section 15.
This mode is used by the link to perform the following tasks:
• High-speed detection handshake (chirp)
• Transmit and receive USB packets
• Read from and write to registers
• Receive USB status updates (RXCMDs) from the ISP1705
For more information on various synchronous mode protocols, see Section 10.
Table 10. ULPI signal description
Signal name Direction on
the ISP1705[1]
Signal description
CLOCK
O
60 MHz interface clock: When a crystal is attached or a clock is driven into the XTAL1
pin, the ISP1705 will drive a 60 MHz output clock.
During low-power, serial and UART modes, the clock can be turned off to save power.
DATA[7:0]
I/O
8-bit data bus: In synchronous mode, the link drives DATA[7:0] to LOW by default. The
link initiates transfers by sending a nonzero data pattern called a TXCMD (transmit
command). In synchronous mode, the direction of DATA[7:0] is controlled by DIR.
Contents of DATA[7:0] lines must be ignored for exactly one clock cycle whenever DIR
changes state. This is called a turnaround cycle.
Data lines have fixed directions and different meanings in low-power, 3-pin serial and
UART modes.
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Table 10. ULPI signal description …continued
Signal name Direction on
the ISP1705[1]
Signal description
DIR
O
Direction: Controls the direction of data bus DATA[7:0].
In synchronous mode, the ISP1705 drives DIR to LOW by default, making the data bus an
input so the ISP1705 can listen for TXCMD from the link. The ISP1705 drives DIR to
HIGH only when it has data for the link. When DIR and NXT are HIGH, the byte on the
data bus contains decoded USB data. When DIR is HIGH and NXT is LOW, the byte
contains status information called an RXCMD (receive command). The only exception to
this rule is when the PHY returns register read data, where NXT is also LOW, replacing
the usual RXCMD byte. Every change in DIR causes a turnaround cycle on the data bus,
during which DATA[7:0] is not valid and must be ignored by the link.
DIR is always asserted during low-power, serial and UART modes.
STP
NXT
I
Stop: In synchronous mode, the link drives STP to HIGH for one cycle after the last byte
of data is sent to the ISP1705. The link can optionally assert STP to force DIR to be
deasserted.
In low-power, serial and UART modes, the link holds STP at HIGH to wake up the
ISP1705, causing the ULPI bus to return to synchronous mode.
O
Next: In synchronous mode, the ISP1705 drives NXT to HIGH to throttle data. If DIR is
LOW, the ISP1705 asserts NXT to notify the link to place the next data byte on DATA[7:0]
in the following clock cycle. If DIR is HIGH, the ISP1705 asserts NXT to notify the link that
a valid USB data byte is on DATA[7:0] in the current cycle. The ISP1705 always drives an
RXCMD when DIR is HIGH and NXT is LOW, unless register read data is to be returned
to the link in the current cycle.
NXT is not used in low-power, serial and UART modes.
[1] I = input; O = output.
9.2.2 Low-power mode
When the USB bus is idle, the link can place the ISP1705 into low-power mode (also
called suspend mode). In low-power mode, the data bus definition changes to that shown
in Table 11. To enter low-power mode, the link sets the SUSPENDM bit in the
FUNC_CTRL register (see Section 11.5) to logic 0. To exit low-power mode, the link
asserts the STP signal. After exiting low-power mode, the ISP1705 will send an RXCMD
to the link if a change was detected in any interrupt source, and the change still exists. An
RXCMD may not be sent if the interrupt condition is removed before exiting.
The ISP1705 will draw only suspend current from the VCC supply; see Table 53.
During low-power mode, the clock on XTAL1 may be stopped. The clock must be started
again before asserting STP to exit low-power mode.
For more information on low-power mode enter and exit protocols, refer to UTMI+ Low Pin
Interface (ULPI) Specification Rev. 1.1.
Table 11. Signal mapping during low-power mode
Signal
Maps to
Direction[1] Description
LINESTATE0
DATA0
O
combinatorial LINESTATE0 directly driven by
the analog receiver
LINESTATE1
DATA1
O
combinatorial LINESTATE1 directly driven by
the analog receiver
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Table 11. Signal mapping during low-power mode …continued
Signal
Maps to
Direction[1] Description
Reserved
DATA2
O
reserved; the ISP1705 will drive this pin to
LOW
INT
DATA3
O
active-HIGH interrupt indication; will be
asserted and latched whenever any
unmasked interrupt occurs
Reserved
DATA[7:4]
O
reserved; the ISP1705 will drive these pins to
LOW
[1] I = input; O = output.
9.2.3 6-pin full-speed or low-speed serial mode
If the link requires a 6-pin serial interface to transmit and receive full-speed or low-speed
USB data, it can set the ISP1705 to 6-pin serial mode. In 6-pin serial mode, the data bus
definition changes to that shown in Table 12. To enter 6-pin serial mode, the link sets the
6PIN_FSLS_SERIAL bit in the INTF_CTRL register (see Section 11.6) to logic 1. To exit
6-pin serial mode, the link asserts the STP signal. This is provided primarily for links that
contain legacy full-speed or low-speed functionality, providing a more cost-effective
upgrade path to high-speed functionality. An interrupt pin is also provided to inform the link
of USB events. If the link requires CLOCK to be running during 6-pin serial mode, the
CLOCK_SUSPENDM register bit must be set to logic 1 before entering 6-pin serial mode.
For more information on 6-pin serial mode enter and exit protocols, refer to UTMI+ Low
Pin Interface (ULPI) Specification Rev. 1.1.
Table 12. Signal mapping for 6-pin serial mode
Signal
Maps to
Direction[1] Description
TX_ENABLE DATA0
I
active-HIGH transmit enable
TX_DAT
TX_SE0
INT
DATA1
DATA2
DATA3
I
transmit differential data on DP and DM
transmit single-ended zero on DP and DM
I
O
active-HIGH interrupt indication; will be asserted and
latched whenever any unmasked interrupt occurs
RX_DP
DATA4
DATA5
DATA6
DATA7
O
O
O
O
single-ended receive data from DP
RX_DM
RX_RCV
Reserved
single-ended receive data from DM
differential receive data from DP and DM
reserved; the ISP1705 will drive this pin to LOW
[1] I = input; O = output.
9.2.4 3-pin full-speed or low-speed serial mode
If the link requires a 3-pin serial interface to transmit and receive full-speed or low-speed
USB data, it can set the ISP1705 to 3-pin serial mode. In 3-pin serial mode, the data bus
definition changes to that shown in Table 13. To enter 3-pin serial mode, the link sets the
3PIN_FSLS_SERIAL bit in the INTF_CTRL register (see Section 11.6) to logic 1. To exit
3-pin serial mode, the link asserts the STP signal. This is provided primarily for links that
contain legacy full-speed or low-speed functionality, providing a more cost-effective
upgrade path to high-speed functionality. An interrupt pin is also provided to inform the link
of USB events. If the link requires CLOCK to be running during 3-pin serial mode, the
CLOCK_SUSPENDM register bit must be set to logic 1 before entering 3-pin serial mode.
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For more information on 3-pin serial mode enter and exit protocols, refer to UTMI+ Low
Pin Interface (ULPI) Specification Rev. 1.1.
Table 13. Signal mapping for 3-pin serial mode
Signal
Maps to
Direction[1] Description
TX_ENABLE DATA0
I
active-HIGH transmit enable
DAT
SE0
DATA1
DATA2
I/O
transmit differential data on DP and DM when
TX_ENABLE is HIGH
receive differential data from DP and DM when
TX_ENABLE is LOW
I/O
transmit single-ended zero on DP and DM when
TX_ENABLE is HIGH
receive single-ended zero from DP and DM when
TX_ENABLE is LOW
INT
DATA3
O
O
active-HIGH interrupt indication; will be asserted
and latched whenever any unmasked interrupt
occurs
Reserved
DATA[7:4]
reserved; the ISP1705 will drive these pins to LOW
[1] I = input; O = output.
9.2.5 Transparent UART mode
In transparent UART mode, the ISP1705 functions as a voltage level shifter between
following pins:
• From pin DATA0 (VCC(I/O) level) to pin DM (2.7 V level).
• From pin DP (2.7 V level) to pin DATA1 (VCC(I/O) level).
The USB transceiver is used to drive the UART transmitting signal on the DM line. The
rise time and the fall time of the transmitting signal is determined by whether a full-speed
or low-speed transceiver is in use. It is recommended to use a low-speed transceiver if the
UART bit rate is below 921 kbit/s for better EMI performance. If the UART bit rate is equal
to or above 921 kbit/s, a full-speed transceiver can be used.
In transparent UART mode, data bus definitions change to that shown in Table 14.
Table 14. UART signal mapping
Signal
TXD
Maps to
DATA0
DATA1
Direction[1] Description
I
UART TXD signal that is routed to the DM pin
RXD
O
O
UART RXD signal that is routed from the DP pin
Reserved DATA2
reserved; the ISP1705 will drive this pin to LOW in UART
mode
INT DATA3
O
O
active-HIGH interrupt indication; will be asserted and
latched whenever any unmasked interrupt occurs
Reserved DATA[7:4]
[1] I = input; O = output.
reserved; the ISP1705 will drive these pins to LOW in
UART mode
Transparent UART mode is entered by setting some register bits in ULPI registers. The
recommended sequence is:
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1. Set the XCVRSELECT[1:0] bits in the FUNC_CTRL register (see Section 11.5) to 10b
(low speed) or 01b (full speed). This setting affects the rise time and the fall time of
the UART transmitting signal on the DM line.
2. Set the DP_PULLDOWN and DM_PULLDOWN bits in the OTG_CTRL register (see
Section 11.7) to logic 0.
3. Set the TERMSELECT bit in the FUNC_CTRL register (see Section 11.5) to logic 0
(power-on default value).
Remark: Mandatory when a full-speed driver is used and optional for a low-speed
driver.
4. Set the TXD_EN and RXD_EN bits in the CARKIT_CTRL register (see Section 11.14)
to logic 1. These two bits must be set together in one TXCMD.
5. Set the CARKIT_MODE bit in the INTF_CTRL register (see Section 11.6) to logic 1.
Remark: The CARKIT_MODE, TXD_EN and RXD_EN bits must be set to logic 1.
The sequence of setting these register bits is ignored.
After the register configuration is complete:
1. A weak pull-up resistor will be enabled on the DP and DATA0 pins. This is to avoid the
possible floating condition on these input pins when UART mode is enabled.
2. The 39 Ω serial termination resistors on the DP and DM pins will be enabled.
3. One clock cycle after DIR goes from LOW to HIGH, the ISP1705 will drive the data
bus for five clock cycles. This is to charge the DATA0 pin to a HIGH level for a slow
link. However, the link can start driving DATA0 to HIGH immediately after the
turnaround cycle.
4. UART buffers between DATA0 or DATA1 and DM or DP are enabled. Transparent
UART mode is entered.
Remark: The DP pin will be slowly charged up to HIGH by the weak pull-up resistor.
The time needed depends on the capacitive loading on DP.
By default, the clock is powered down when the ISP1705 enters UART mode. If the link
requires CLOCK to be running in UART mode, it can set the CLOCK_SUSPENDM bit in
the INTF_CTRL register (see Section 11.6) to logic 1 before entering UART mode.
Transparent UART mode is exited by asserting the STP pin to HIGH or by toggling chip
select.
The INT pin (DATA3) is asserted and latched whenever an unmasked interrupt event
occurs. When the link detects INT as HIGH, it must wake up the PHY from transparent
UART mode by asserting STP. When the PHY is in synchronous mode, the link can read
the USB_INTR_L register (see Section 11.11) to determine the source of the interrupt.
Note that the ISP1705 does not implement the optional Carkit Interrupt registers.
An alternative way to exit UART mode is to set chip select to non-active for more than
tPWRDN and then set it to active. A power-on reset will be generated and the ULPI bus will
be put in default synchronous mode.
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(1)
(2)
CLOCK
CLOCK
turnaround
TXCMD
(REGW)
DATA[7:0]
0001 0001
UART mode signals
DATA
DIR
STP
NXT
UART
mode
004aaa865
(1) Clock remains powered when the CLOCK_SUSPENDM register bit is set to logic 1.
(2) Clock is powered down when the CLOCK_SUSPENDM register bit is logic 0 (default).
Fig 10. Interface behavior when entering UART mode
(1)
CLOCK
(2)
CLOCK
turnaround
synchronous
mode signals
UART mode signals
0000 0000
DATA[7:0]
DIR
STP
NXT
UART
mode
004aaa867
(1) Clock remains powered when the CLOCK_SUSPENDM register bit is set to logic 1.
(2) Clock is powered down when the CLOCK_SUSPENDM register bit is logic 0 (default).
Fig 11. Interface behavior when exiting UART mode
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9.3 USB state transitions
A Hi-Speed USB peripheral, host or OTG device handles more than one electrical state as
defined in Universal Serial Bus Specification Rev. 2.0 and On-The-Go Supplement to the
USB 2.0 Specification Rev. 1.3. The ISP1705 accommodates various states through
register settings of the XCVRSELECT[1:0], TERMSELECT, OPMODE[1:0],
DP_PULLDOWN and DM_PULLDOWN bits.
Table 15 summarizes operating states. The values of register settings in Table 15 will
force resistor settings as also given in Table 15. Resistor setting signals are defined as
follows:
• RPU_DP_EN enables the 1.5 kΩ pull-up resistor on DP
• RPD_DP_EN enables the 15 kΩ pull-down resistor on DP
• RPD_DM_EN enables the 15 kΩ pull-down resistor on DM
• HSTERM_EN enables the 45 Ω termination resistors on DP and DM
It is up to the link to set the desired register settings.
Table 15. Operating states and their corresponding resistor settings
Signaling mode
Register settings
Internal resistor settings
XCVR
SELECT
[1:0]
TERM
SELECT [1:0]
OPMODE
DP_
PULL PULL
DOWN DOWN
DM_
RPU_
DP_EN
RPD_
DP_EN
RPD_
DM_EN EN
HSTERM_
General settings
3-state drivers
XXb
01b
Xb
0b
01b
00b
Xb
1b
Xb
1b
0b
0b
0b
1b
0b
1b
0b
0b
Power up or
VBUS < VB_SESS_END
Host settings
Host chirp
00b
00b
X1b
01b
0b
0b
1b
1b
10b
00b
00b
00b
1b
1b
1b
1b
1b
1b
1b
1b
0b
0b
0b
0b
1b
1b
1b
1b
1b
1b
1b
1b
1b
1b
0b
0b
Host high-speed
Host full-speed
Host high-speed or
full-speed suspend
Host high-speed or
full-speed resume
01b
1b
10b
1b
1b
0b
1b
1b
0b
Host low-speed
10b
10b
1b
1b
00b
00b
1b
1b
1b
1b
0b
0b
1b
1b
1b
1b
0b
0b
Host low-speed
suspend
Host low-speed
resume
10b
1b
0b
10b
10b
1b
1b
1b
1b
0b
0b
1b
1b
1b
1b
0b
1b
Host Test J or Test K 00b
Peripheral settings
Peripheral chirp
00b
00b
1b
0b
10b
00b
0b
0b
0b
0b
1b
0b
0b
0b
0b
0b
0b
1b
Peripheral high
speed
Peripheral full speed 01b
1b
00b
0b
0b
1b
0b
0b
0b
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Table 15. Operating states and their corresponding resistor settings …continued
Signaling mode
Register settings
Internal resistor settings
XCVR
SELECT
[1:0]
TERM
SELECT [1:0]
OPMODE
DP_
PULL PULL
DOWN DOWN
DM_
RPU_
DP_EN
RPD_
DP_EN
RPD_
DM_EN EN
HSTERM_
Peripheral high
speed or full speed
suspend
01b
1b
1b
0b
00b
10b
10b
0b
0b
0b
0b
0b
0b
1b
1b
0b
0b
0b
0b
0b
0b
0b
0b
0b
1b
Peripheral high
speed or full speed
resume
01b
Peripheral Test J or 00b
Test K
OTG settings
OTG device
peripheral chirp
00b
00b
1b
0b
10b
00b
0b
0b
1b
1b
1b
0b
0b
0b
1b
1b
0b
1b
OTG device
peripheral high
speed
OTG device
peripheral full speed
01b
01b
1b
1b
00b
00b
0b
0b
1b
1b
1b
1b
0b
0b
1b
1b
0b
0b
OTG device
peripheral high
speed and full speed
suspend
OTG device
01b
00b
1b
0b
10b
10b
0b
0b
1b
1b
1b
0b
0b
0b
1b
1b
0b
1b
peripheral high
speed and full speed
resume
OTG device
peripheral Test J or
Test K
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10. Protocol description
10.1 ULPI references
The ISP1705 provides a 12-pin ULPI interface to communicate with the link. It is highly
recommended that users of the ISP1705 read UTMI+ Specification Rev. 1.0 and UTMI+
Low Pin Interface (ULPI) Specification Rev. 1.1.
Commands between the ISP1705 and the link are described in the following subsections.
10.2 TXCMD
By default, the link must drive the ULPI bus to its idle state of 00h. To send commands and
USB packets, the link drives a nonzero value on DATA[7:0] to the ISP1705 by sending a
byte called TXCMD. Commands include USB packet transmissions, and register reads
and writes. Once the TXCMD is interpreted and accepted by the ISP1705, the NXT signal
is asserted and the link can follow up with the required number of data bytes. The TXCMD
byte format is given in Table 16. Any values other than those in Table 16 are illegal and will
result in undefined behavior.
Various TXCMD packet and register sequences are given in later sections.
Table 16. TXCMD byte format
Command Command Command
type name code payload
DATA[7:6] DATA[5:0]
Command Command description
name
Idle
00b
00 0000b
NOOP
NOPID
No operation. 00h is the idle value of the
data bus. The link must drive NOOP by
default.
Packet
transmit
01b
00 0000b
Transmit USB data that does not have a
PID, such as chirp and resume signaling.
The ISP1705 starts transmitting only
after accepting the next data byte.
00 XXXXb
10 1111b
PID
Transmit USB packet. DATA[3:0]
indicates USB packet identifier PID[3:0].
Register
write
10b
11b
EXTW
Extended register write command
(optional). The 8-bit address must be
provided after the command is accepted.
XX XXXXb
10 1111b
REGW
EXTR
Register write command with 6-bit
immediate address.
Register
read
Extended register read command
(optional). The 8-bit address must be
provided after the command is accepted.
XX XXXXb
REGR
Register read command with 6-bit
immediate address.
10.3 RXCMD
The ISP1705 communicates status information to the link by asserting DIR and sending
an RXCMD byte on the data bus. The RXCMD data byte format follows UTMI+ Low Pin
Interface (ULPI) Specification Rev. 1.1 and is given in Table 17.
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The ISP1705 will automatically send an RXCMD whenever there is a change in any of the
RXCMD data fields. The link must be able to accept an RXCMD at any time; including
single RXCMDs, back-to-back RXCMDs, and RXCMDs at any time during USB receive
packets when NXT is LOW. An example is shown in Figure 12. For details and diagrams,
refer to UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1.
Table 17. RXCMD byte format
DATA
Name
Description and value
1 to 0
LINESTATE LINESTATE signals: For a definition of LINESTATE, see Section 10.3.1.
DATA0 — LINESTATE0
DATA1 — LINESTATE1
3 to 2
VBUS state
Encoded VBUS voltage state: For an explanation of the VBUS state,
see Section 10.3.2.
5 to 4
RxEvent
ID
Encoded USB event signals: For an explanation of RxEvent,
see Section 10.3.4.
6
7
Reflects the state of the ID pin. Valid 50 ms after ID_PULLUP is set to
logic 1.
ALT_INT
By default, this signal is not used and is not needed in typical designs.
Optionally, the link can enable the BVALID_RISE and/or BVALID_FALL
bits in the PWR_CTRL register (see Section 11.15). Corresponding
changes in BVALID will cause an RXCMD to be sent to the link with the
ALT_INT bit asserted.
CLOCK
Single RXCMD
turnaround
Back-to-back RXCMDs
RXCMD RXCMD
turnaround
turnaround
turnaround
RXCMD
[
]
DATA 7:0
DIR
STP
NXT
004aaa695
Fig 12. Single and back-to-back RXCMDs from the ISP1705 to the link
10.3.1 Linestate encoding
LINESTATE[1:0] reflects the current state of DP and DM. Whenever the ISP1705 detects
a change in DP or DM, an RXCMD will be sent to the link with the new LINESTATE[1:0]
value. The value given on LINESTATE[1:0] depends on the setting of various registers.
Table 18 shows the LINESTATE[1:0] encoding for upstream facing ports, which applies to
peripherals. Table 19 shows the LINESTATE[1:0] encoding for downstream facing ports,
which applies to host controllers. Dual-role devices must choose the correct table,
depending on whether it is in peripheral or host mode.
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Table 18. LINESTATE[1:0] encoding for upstream facing ports: peripheral
DP_PULLDOWN = 0.[1]
Mode
Value
Full speed
01, 11
1
High speed
00
Chirp
00
XCVRSELECT[1:0]
TERMSELECT
LINESTATE[1:0]
0
1
00
01
SE0
squelch
!squelch
squelch
FS-J
!squelch and
HS_Differential_Receiver_Output
10
11
FS-K
SE1
invalid
invalid
!squelch and
!HS_Differential_Receiver_Output
invalid
[1] !squelch indicates inactive squelch. !HS_Differential_Receiver_Output indicates inactive
HS_Differential_Receiver_Output.
Table 19. LINESTATE[1:0] encoding for downstream facing ports: host
DP_PULLDOWN and DM_PULLDOWN = 1.[1]
Mode
Value Low
Full
High speed Chirp
speed speed
XCVRSELECT[1:0]
TERMSELECT
OPMODE[1:0]
10
01, 11 00
00
0
1
1
0
X
X
00, 01 or 11 10
LINESTATE[1:0]
00
01
SE0
LS-K
SE0
FS-J
squelch
!squelch
squelch
!squelch and
HS_Differential_Receiver_Output
10
11
LS-J
SE1
FS-K
SE1
invalid
invalid
!squelch and
!HS_Differential_Receiver_Output
invalid
[1] !squelch indicates inactive squelch. !HS_Differential_Receiver_Output indicates inactive
HS_Differential_Receiver_Output.
10.3.2 VBUS state encoding
USB devices must monitor the VBUS voltage for purposes such as overcurrent detection,
starting a session and SRP. The VBUS state field in the RXCMD is an encoding of the
voltage level on VBUS
.
The SESS_END and SESS_VLD indicators in the VBUS state are directly taken from the
internal comparators built-in to the ISP1705, and encoded as shown in Table 17 and
Table 20.
Table 20. Encoded VBUS voltage state
Value VBUS voltage
SESS_END SESS_VLD A_VBUS_VLD
00
01
10
11
VBUS < VB_SESS_END
1
0
X
X
0
0
1
X
0
0
0
1
VB_SESS_END ≤ VBUS < VA_SESS_VLD
VA_SESS_VLD ≤ VBUS < VA_VBUS_VLD
VBUS ≥ VA_VBUS_VLD
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The A_VBUS_VLD indicator in the VBUS state provides several options and must be
configured based on current draw requirements. A_VBUS_VLD can input from one or
more VBUS voltage indicators, as shown in Figure 13.
A description on how to use and select the VBUS state encoding is given in Section 10.3.3.
A_VBUS_VLD comparator
internal A_VBUS_VLD
V
BUS
(0, X)
(1, 0)
RXCMD
A_VBUS_VLD
complement
output
FAULT indicator
FAULT
(1, 1)
IND_COMPL
USE_EXT_VBUS_IND,
IND_PASSTHRU
004aaa698
Fig 13. RXCMD A_VBUS_VLD indicator source
10.3.3 Using and selecting the VBUS state encoding
The VBUS state encoding is shown in Table 20. The ISP1705 will send an RXCMD to the
link whenever there is a change in the VBUS state. To receive VBUS state updates, the link
must first enable the corresponding interrupts in the USB_INTR_EN_R and
USB_INTR_EN_F registers.
The link can use the VBUS state to monitor VBUS and take appropriate actions. Table 21
shows the recommended usage for typical applications.
Table 21. VBUS indicators in RXCMD required for typical applications
Application
A_VBUS_VLD
SESS_VLD
SESS_END
Standard host
Standard peripheral
OTG A-device
OTG B-device
yes
no
no
no
no
no
yes
yes
yes
yes
yes
no
10.3.3.1 Standard USB host controllers
For standard hosts, the system must be able to provide 500 mA on VBUS in the range of
4.75 V to 5.25 V. An external circuit must be used to detect overcurrent conditions. If the
external overcurrent detector provides a digital fault signal, then the fault signal must be
connected to the ISP1705 FAULT input pin, and the link must do the following:
1. Set the IND_COMPL bit in the INTF_CTRL register (see Section 11.6) to logic 0 or
logic 1, depending on the polarity of the external fault signal.
2. Set the USE_EXT_VBUS_IND bit in the OTG_CTRL register (see Section 11.7) to
logic 1.
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3. If it is not necessary to qualify the fault indicator with the internal A_VBUS_VLD
comparator, set the IND_PASSTHRU bit in the INTF_CTRL register (see
Section 11.6) to logic 1.
10.3.3.2 Standard USB peripheral controllers
Standard peripherals must be able to detect when VBUS is at a sufficient level for
operation. SESS_VLD must be enabled to detect the start and end of USB peripheral
operations. Detection of A_VBUS_VLD and SESS_END thresholds is not needed for
standard peripherals.
10.3.3.3 OTG devices
When an OTG device is configured as an OTG A-device, it must be able to provide a
minimum of 8 mA on VBUS. If the OTG A-device provides less than 100 mA, then there is
no need for an overcurrent detection circuit because the internal A_VBUS_VLD
comparator is sufficient. If the OTG A-device provides more than 100 mA on VBUS, an
overcurrent detector must be used and Section 10.3.3.1 applies. The OTG A-device also
uses SESS_VLD to detect when an OTG B-device is initiating VBUS pulsing SRP.
When an OTG device is configured as an OTG B-device, SESS_VLD must be used to
detect when VBUS is at a sufficient level for operation. SESS_END must be used to detect
when VBUS has dropped to a LOW level, allowing the B-device to safely initiate VBUS
pulsing SRP.
10.3.4 RxEvent encoding
The RxEvent field (see Table 22) of the RXCMD informs the link of information related
packets received on the USB bus. RxActive and RxError are defined in USB 2.0
Transceiver Macrocell Interface (UTMI) Specification Ver. 1.05. HostDisconnect is defined
in UTMI+ Specification Rev. 1.0. A short definition is also given in the following
subsections.
Table 22. Encoded USB event signals
Value
00
RxActive
RxError
HostDisconnect
0
1
1
X
0
0
1
X
0
0
0
1
01
11
10
10.3.4.1 RxActive
When the ISP1705 has detected a SYNC pattern on the USB bus, it signals an RxActive
event to the link. An RxActive event can be communicated using two methods. The first
method is for the ISP1705 to simultaneously assert DIR and NXT. The second method is
for the ISP1705 to send an RXCMD to the link with the RxActive field in the RxEvent bits
set to logic 1. The link must be capable of detecting both methods. RxActive frames the
receive packet from the first byte to the last byte.
The link must assume that RxActive is set to logic 0 when indicated in an RXCMD or when
DIR is deasserted, whichever occurs first.
The link uses RxActive to time high-speed packets and ensure that bus turnaround times
are met. For more information on the USB packet timing, see Section 10.6.1.
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10.3.4.2 RxError
When the ISP1705 has detected an error while receiving a USB packet, it deasserts NXT
and sends an RXCMD with the RxError field set to logic 1. The received packet is no
longer valid and must be dropped by the link.
10.3.4.3 HostDisconnect
HostDisconnect is encoded into the RxEvent field of the RXCMD. HostDisconnect is valid
only when the ISP1705 is configured as a host (both DP_PULLDOWN and
DM_PULLDOWN are set to logic 1), and indicates to the host controller when a peripheral
is connected (0b) or disconnected (1b). The host controller must enable HostDisconnect
by setting the HOST_DISCON_R and HOST_DISCON_F bits in the USB_INTR_EN_R
and USB_INTR_EN_F registers, respectively. Changes in HostDisconnect will cause the
PHY to send an RXCMD to the link with the updated value.
10.4 Register read and write operations
Figure 14 shows register read and write sequences. The ISP1705 supports immediate
addressing and extended addressing register operations. Extended register addressing is
optional for links. Note that register operations will be aborted if the ISP1705 asserts DIR
during the operation. When a register operation is aborted, the link must retry until
successful. For more information on register operations, refer to UTMI+ Low Pin Interface
(ULPI) Specification Rev. 1.1.
CLOCK
TXCMD
(REGW) D
TXCMD
(REGR)
TXCMD
(EXTW) AD
TXCMD
(EXTW) AD
D
D
D
DATA[7:0]
immediate
register write
extended
register write
immediate
register read
extended
register read
DIR
STP
NXT
004aaa710
AD indicates the address byte, and D indicates the data byte.
Fig 14. Example of register write, register read, extended register write and extended register read
10.5 USB reset and high-speed detection handshake (chirp)
Figure 15 shows the sequence of events for USB reset and high-speed detection
handshake (chirp). The sequence is shown for hosts and peripherals. Figure 15 does not
show all RXCMD updates, and timing is not to scale. The sequence is as follows:
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1. USB reset: The host detects a peripheral attachment as low-speed if DM is HIGH and
as full-speed if DP is HIGH. If a host detects a low-speed peripheral, it does not follow
the remainder of this protocol. If a host detects a full-speed peripheral, it resets the
peripheral by writing to the FUNC_CTRL register (see Section 11.5) and setting
XCVRSELECT[1:0] = 00b (high speed) and TERMSELECT = 0b that drives SE0 on
the bus (DP and DM connected to ground through 45 Ω). The host also sets
OPMODE[1:0] = 10b for correct chirp transmit and receive. The start of SE0 is labeled
t0.
Remark: To receive chirp signaling, the host must also consider the high-speed
differential receiver output. The host controller must interpret LINESTATE as shown in
Table 19.
2. High-speed detection handshake (chirp)
a. Peripheral chirp: After detecting SE0 for no less than 2.5 µs, if the peripheral is
capable of high speed, it sets XCVRSELECT[1:0] to 00b (high speed) and
OPMODE[1:0] to 10b (chirp). The peripheral immediately follows this with a
TXCMD (NOPID), transmitting a Chirp K for no less than 1 ms and ending no more
than 7 ms after reset time t0. If the peripheral is in low-power mode, it must wake
up its clock within 5.6 ms, leaving 200 µs for the link to start transmitting the
Chirp K, and 1.2 ms for the Chirp K to complete (worst case with 10 % slow clock).
b. Host chirp: If the host does not detect the peripheral chirp, it must continue
asserting SE0 until the end of reset. If the host detects the peripheral Chirp K for
no less than 2.5 µs, then no more than 100 µs after the bus leaves the Chirp K
state, the host sends a TXCMD (NOPID) with an alternating sequence of Chirp Ks
and Js. Each Chirp K or Chirp J must last no less than 40 µs and no longer than
60 µs.
c. High speed idle: The peripheral must detect a minimum of Chirp K-J-K-J-K-J. Each
Chirp K and Chirp J must be detected for at least 2.5 µs. The peripheral sets
TERMSELECT = 0b and OPMODE[1:0] = 00b after seeing the minimum chirp
sequence. The peripheral is now in high-speed mode and sees !squelch (01b on
LINESTATE). When the peripheral sees squelch (10b on LINESTATE), it knows
that the host has completed chirp and waits for Hi-Speed USB traffic to begin. After
transmitting the chirp sequence, the host changes OPMODE[1:0] to 00b and
begins sending USB packets.
For more information, refer to UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1.
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ULPI Hi-Speed USB transceiver
USB reset
high-speed detection handshake (chirp)
t0
peripheral chirp
host chirp
HS idle
TXCMD
(REGW)
TXCMD
(REGW)
TXCMD
NOPID
SE0
K
00
K
...
J
K
J
DATA
[7:0]
DIR
STP
NXT
00 (HS)
01 (FS)
XCVR
SELECT
TERM
SELECT
00 (normal)
00 (normal)
J (01b)
01 (chirp)
OP
MODE
squelch
(00b)
SE0 (00b)
host chirp K (10b) or chirp J (01b)
peripheral chirp K (10b)
squelch (00b)
LINE
STATE
RXCMDs
TXCMD
TXCMD
(REGW)
TXCMD
NOPID
(REGW)
00
K
J
K
J
00
SE0
K
K
...
K
K
J
DATA
[7:0]
DIR
STP
NXT
01 (FS)
00 (HS)
XCVR
SELECT
TERM
SELECT
00 (normal)
10 (chirp)
00 (normal)
OP
MODE
squelch
(00b)
!squelch
(01b)
squelch (00b)
peripheral chirp K (10b)
J (01b)
SE0 (00b)
host chirp K or J (10b or 01b)
LINE
STATE
DP
DM
001aai188
Timing is not to scale.
Fig 15. USB reset and high-speed detection handshake (chirp) sequence
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10.6 USB packet transmit and receive
An example of a packet transmit and receive is shown in Figure 16. For details on USB
packets, refer to UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1.
ISP1705
deasserts
DIR, causing
ISP1705
asserts DIR,
causing
turnaround
cycle
link sends
the next data;
ISP1705
ISP1705
sends
RXCMD
(NXT LOW)
ISP1705
sends
ISP1705
accepts
TXCMD
link sends
TXCMD
link signals ULPI bus
end of data is idle
USB data turnaround
accepts
(NXT HIGH)
cycle
CLOCK
turnaround RXCMD
DATA
turnaround
[
]
TXCMD
DATA
DATA 7:0
DIR
STP
NXT
004aab046
Fig 16. Example of using the ISP1705 to transmit and receive USB data
10.6.1 USB packet timing
10.6.1.1 ISP1705 pipeline delays
The ISP1705 delays (in clock cycles) are shown in Table 23. For detailed description, refer
to UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1, Section 3.8.2.6.2.
Table 23. PHY pipeline delays
Parameter name
High-speed PHY
delay
Full-speed PHY
delay
Low-speed PHY
delay
RXCMD delay (J and K)
RXCMD delay (SE0)
TX start delay
4
4
4
4
4 to 6
16 to 18
1 to 2
3 to 4
6 to 9
5 to 6
5 to 6
6 to 10
74 to 75
TX end delay (packets)
TX end delay (SOF)
RX start delay
not applicable
not applicable
not applicable
17 to 18
not applicable
not applicable
not applicable
122 to 123
RX end delay
10.6.1.2 Allowed link decision time
The amount of clock cycles allocated to the link to respond to a received packet and
correctly receive back-to-back packets is given in Table 24. Link designs must follow the
values given in Table 24 for correct USB system operation. Examples of high-speed
packet sequences and timing are shown in Figure 17 and Figure 18. For details, refer to
UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1, Section 3.8.2.6.3.
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Table 24. Link decision times
Packet sequence High-speed Full-speed Low-speed Definition
link delay
link delay link delay
Transmit-Transmit 15 to 24
(host only)
7 to 18 77 to 247
Number of clock cycles a host link must wait before driving
the TXCMD for the second packet.
In high speed, the link starts counting from the assertion of
STP for the first packet.
In full speed, the link starts counting from the RXCMD,
indicating LINESTATE has changed from SE0 to J for the first
packet. The timing given ensures inter-packet delays of 2 bit
times to 6.5 bit times.
Receive-Transmit
(host or peripheral)
1 to 14
7 to 18
77 to 247
Number of clock cycles the link must wait before driving the
TXCMD for the transmit packet.
In high speed, the link starts counting from the end of the
receive packet; deassertion of DIR or an RXCMD indicating
RxActive is LOW.
In full speed or low speed, the link starts counting from the
RXCMD, indicating LINESTATE has changed from SE0 to J
for the receive packet. The timing given ensures inter-packet
delays of 2 bit times to 6.5 bit times.
Receive-Receive
(peripheral only)
1
1
1
Minimum number of clock cycles between consecutive
receive packets. The link must be capable of receiving both
packets.
Transmit-Receive
(host or peripheral)
92
80
718
Host or peripheral transmits a packet and will time-out after
this number of clock cycles if a response is not received. Any
subsequent transmission can occur after this time.
USB interpacket delay (88 to 192 high-speed bit times)
DP or
DM
IDLE
EOP
SYNC
D0
DATA
CLOCK
D
N−1
D
N
D1
TXCMD
DATA
[7:0]
DIR
STP
NXT
link decision time (15 to 24 clocks)
TX start delay
TX end delay (two to five clocks)
(one to two clocks)
004aaa712
Fig 17. High-speed transmit-to-transmit packet timing
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ULPI Hi-Speed USB transceiver
USB interpacket delay (8 to 192 high-speed bit times)
IDLE
DP or
DM
EOP
SYNC
DATA
CLOCK
D
N
D
N−4
D
N−2
D0
D1
TXCMD
DATA
[7:0]
turnaround
D
N−3
D
N−1
DIR
STP
NXT
link decision time (1 to 14 clocks)
RX end delay
(three to eight clocks)
TX start delay
(one to two clocks)
004aaa713
Fig 18. High-speed receive-to-transmit packet timing
10.7 Preamble
Preamble packets are headers to low-speed packets that must travel over a full-speed
bus, between a host and a hub. To enter preamble mode, the link sets
XCVRSELECT[1:0] = 11b in the FUNC_CTRL register (see Section 11.5). When in
preamble mode, the ISP1705 operates just as in full-speed mode, and sends all data with
the full-speed rise time and fall time. Whenever the link transmits a USB packet in
preamble mode, the ISP1705 will automatically send a preamble header at full-speed bit
rate before sending the link packet at low-speed bit rate. The ISP1705 will ensure a
minimum gap of four full-speed bit times between the last bit of the full-speed PRE PID
and the first bit of the low-speed packet SYNC. The ISP1705 will drive a J for at least one
full-speed bit time after sending the PRE PID, after which the pull-up resistor can hold the
J state on the bus. An example transmit packet is shown in Figure 19.
In preamble mode, the ISP1705 can also receive low-speed packets from the full-speed
bus.
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ULPI Hi-Speed USB transceiver
CLOCK
D1
D0
TXCMD (low-speed packet ID)
DATA[7:0]
DIR
STP
NXT
FS
PRE ID
IDLE (min
4 FS bits)
LS D0
LS D1
LS SYNC
LS PID
FS SYNC
DP or DM
004aaa714
DP and DM timing is not to scale.
Fig 19. Preamble sequence
10.8 USB suspend and resume
10.8.1 Full-speed or low-speed host-initiated suspend and resume
Figure 20 illustrates how a host or a hub places a full-speed or low-speed peripheral into
suspend and sometime later initiates resume signaling to wake-up the downstream
peripheral. Note that Figure 20 timing is not to scale, and does not show all RXCMD
LINESTATE updates.
The sequence of events for a host and a peripheral, both with ISP1705, is as follows:
1. Idle: Initially, the host and the peripheral are idle. The host has its 15 kΩ pull-down
resistors enabled (DP_PULLDOWN and DM_PULLDOWN are set to 1b) and 45 Ω
terminations are disabled (TERMSELECT is set to 1b). The peripheral has the 1.5 kΩ
pull-up resistor connected to DP for full speed or DM for low speed (TERMSELECT is
set to 1b).
2. Suspend: When the peripheral sees no bus activity for 3 ms, it enters the suspend
state. The peripheral link places the PHY into low-power mode by clearing the
SUSPENDM bit in the FUNC_CTRL register (see Section 11.5), causing the PHY to
draw only suspend current. The host may or may not be powered down.
3. Resume K: When the host wants to wake up the peripheral, it sets OPMODE[1:0] to
10b and transmits a K for at least 20 ms. The peripheral link sees the resume K on
LINESTATE, and asserts STP to wake up the PHY.
4. EOP: When STP is asserted, the ISP1705 on the host side automatically appends an
EOP of two bits of SE0 at low-speed bit rate, followed by one bit of J. The ISP1705 on
the host side knows to add the EOP because DP_PULLDOWN and DM_PULLDOWN
are set to 1b for a host. After the EOP is completed, the host link sets OPMODE[1:0]
to 00b for normal operation. The peripheral link sees the EOP and also resumes
normal operation.
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EOP
idle
idle
suspend
resume K
TXCMD
(REGW)
TXCMD
NOPID
K
...
K
TXCMD
K
DATA
[
]
7:0
DIR
STP
NXT
OPMODE
10b
00b
00b
LINE
STATE
K
SE0
J
J
CLOCK
TXCMD
(REGW)
LINESTATE J
LINESTATE K
SE0
J
DATA
[
]
7:0
DIR
STP
NXT
00b
OPMODE
10b
00b
SUSPENDM
LINE
STATE
K
SE0
J
J
DP
DM
004aab123
Timing is not to scale.
Fig 20. Full speed suspend and resume
10.8.2 High speed suspend and resume
Figure 21 illustrates how a host or a hub places a high-speed enabled peripheral into
suspend and then initiates resume signaling. The high-speed peripheral will wake up and
return to high-speed operations. Note that Figure 21 timing is not to scale, and does not
show all RXCMD LINESTATE updates.
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The sequence of events related to a host and a peripheral, both with ISP1705, is as
follows:
1. High speed idle: Initially, the host and the peripheral are idle. The host has its 15 kΩ
pull-down resistors enabled (DP_PULLDOWN and DM_PULLDOWN are set to 1b)
and 45 Ω terminations enabled (TERMSELECT is set to 0b). The peripheral has its
45 Ω terminations enabled (TERMSELECT is set to 0b).
2. Full speed suspend: When the peripheral sees no bus activity for 3 ms, it enters the
suspend state. The peripheral link places the ISP1705 into full-speed mode
(XCVRSELECT is set to 01b), removes 45 Ω terminations, and enables the 1.5 kΩ
pull-up resistor on DP (TERMSELECT is set to 1b). The peripheral link then places
the ISP1705 into low-power mode by clearing SUSPENDM, causing the ISP1705 to
draw only suspend current. The host also changes the ISP1705 to full speed,
(XCVRSELECT is set to 01b), removes 45 Ω terminations (TERMSELECT is set to
1b), and then may or may not be powered down.
3. Resume K: When the host wants to wake up the peripheral, it sets OPMODE to 10b
and transmits a full-speed K for at least 20 ms. The peripheral link sees the resume K
(10b) on LINESTATE, and asserts STP to wake up the ISP1705.
4. High-speed traffic: The host link sets high speed (XCVRSELECT is set to 00b), and
enables its 45 Ω terminations (TERMSELECT is set to 0b). The peripheral link sees
SE0 on LINESTATE and also sets high speed (XCVRSELECT is set to 00b), and
enables its 45 Ω terminations (TERMSELECT is set to 0b). The host link sets
OPMODE to 00b for normal high-speed operation.
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FS suspend
resume K
HS idle
HS idle
TXCMD
(REGW)
TXCMD
(REGW)
TXCMD
(REGW)
TXCMD
NOPID
K
K
...
K
DATA
[
]
7:0
DIR
STP
NXT
XCVR
01b
00b
00b
SELECT
TERM
SELECT
OP
10b
00b
00b
MODE
!SQUELCH
(01b)
!SQUELCH SQUELCH
FS J (01b)
FS K (10b)
SQUELCH (00b)
(01b)
(00b)
LINE
STATE
CLOCK
TXCMD
(REGW)
TXCMD
(REGW)
LINESTATE K
LINESTATE J
SE0
DATA
[
]
7:0
DIR
STP
NXT
XCVR
SELECT
01b
00b
00b
TERM
SELECT
OP
MODE
00b
10b
00b
SUSPENDM
!SQUELCH
(01b)
!SQUELCH
(01b)
SQUELCH
(00b)
FS K (10b)
SQUELCH (00b)
FS J (01b)
LINE
STATE
DP
DM
004aab124
Timing is not to scale.
Fig 21. High speed suspend and resume
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10.8.3 Remote wake-up
The ISP1705 supports peripherals that initiate remote wake-up resume. When placed into
USB suspend, the peripheral link remembers at what speed it was originally operating.
Depending on the original speed, the link follows one of the protocols detailed here. In
Figure 22, timing is not to scale, and not all RXCMD LINESTATE updates are shown.
The sequence of events related to a host and a peripheral, both with ISP1705, is as
follows:
1. Both the host and the peripheral are assumed to be in low-power mode.
2. The peripheral begins remote wake-up by re-enabling its clock and setting its
SUSPENDM bit to 1b.
3. The peripheral begins driving K on the bus to signal resume. Note that the peripheral
link must assume that LINESTATE is K (01b) while transmitting because it will not
receive any RXCMDs.
4. The host recognizes the resume, re-enables its clock and sets its SUSPENDM bit.
5. The host takes over resume driving within 1 ms of detecting the remote wake-up.
6. The peripheral stops driving resume.
7. The peripheral sees the host continuing to drive the resume.
8. The host stops driving resume and the ISP1705 automatically adds the EOP to the
end of the resume. The peripheral recognizes the EOP as the end of resume.
9. Both the host and the peripheral revert to normal operation by writing 00b to
OPMODE. If the host or the peripheral was previously in high-speed mode, it must
revert to high speed before the SE0 of the EOP is completed. This can be achieved by
writing XCVRSELECT[1:0] = 00b and TERMSELECT = 0b after LINESTATE indicates
SE0.
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TXCMD
NOPID
TXCMD
REGW
TXCMD
REGW
00h
LINESTATE
DATA
[
]
7:0
DIR
STP
NXT
XCVR
SELECT
01b (FS), 10b (LS)
00b (HS only)
TERM
SELECT
0b (HS only)
00b
OP
MODE
10b
TXCMD
REGW
TXCMD
REGW
TXCMD
NOPID
LINESTATE
00h
RXCMD
RXCMD
RXCMD
DATA
[
]
7:0
DIR
STP
NXT
00b (HS only)
0b (HS only)
XCVR
SELECT
00b (HS), 01b (FS), 10b (LS)
TERM
SELECT
OP
MODE
10b
00b
004aaa718
Timing is not to scale.
Fig 22. Remote wake-up from low-power mode
10.9 No automatic SYNC and EOP generation (optional)
This setting allows the link to turn off the automatic SYNC and EOP generation, and must
be used for high-speed packets only. It is provided for backwards compatibility with legacy
controllers that include SYNC and EOP bytes in the data payload when transmitting
packets. The ISP1705 will not automatically generate SYNC and EOP patterns when
OPMODE[1:0] is set to 11b. The ISP1705 will still NRZI encode data and perform bit
stuffing. An example of a sequence is shown in Figure 23. The link must always send
packets using the TXCMD (NOPID) type. The ISP1705 does not provide a mechanism to
control bit stuffing in individual bytes, but will automatically turn off bit stuffing for EOP
when STP is asserted with data set to FEh. If data is set to 00h when STP is asserted, the
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PHY will not transmit any EOP. The ISP1705 will also detect if the PID byte is A5h,
indicating an SOF packet, and automatically send a long EOP when STP is asserted. To
transmit chirp and resume signaling, the link must set OPMODE to 10b.
CLOCK
... ...
TXCMD
00h
00h 00h 80h PID D1 D2 D3
D
N − 1
D
N
FEh
DATA
[7:0]
DIR
STP
NXT
TXVALID
TXREADY
TXBIT
STUFF
ENABLE
IDLE
SYNC
PID
DATA PAYLOAD
EOP
IDLE
DP, DM
004aab125
Fig 23. Transmitting USB packets without automatic SYNC and EOP generation
10.10 On-The-Go operations
On-The-Go (OTG) is a supplement to Universal Serial Bus Specification Rev. 2.0 that
allows a portable USB device to assume the role of a limited USB host by defining
improvements, such as a small connector and low power. Non-portable devices, such as
standard hosts and embedded hosts, can also benefit from OTG features.
The ISP1705 OTG PHY is designed to support all the tasks specified in the OTG
supplement. The ISP1705 provides the front end analog support for Host Negotiation
Protocol (HNP) and Session Request Protocol (SRP) for dual-role devices. The
supporting components include:
• Voltage comparators
– A_VBUS_VLD
– SESS_VLD (session valid, can be used for both A-session and B-session valid)
– SESS_END (session end)
• Pull-up and pull-down resistors on DP and DM
• ID detector indicates if micro-A or micro-B plug is inserted
• Charge and discharge resistors on VBUS
The following subsections describe how to use the ISP1705 OTG components.
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10.10.1 OTG comparators
The ISP1705 provides comparators that conform to On-The-Go Supplement to the
USB 2.0 Specification Rev. 1.3 requirements of VA_VBUS_VLD, VA_SESS_VLD, VB_SESS_VLD
and VB_SESS_END. In this data sheet, VA_SESS_VLD and VB_SESS_VLD are combined into
VA_SESS_VLD. Comparators are described in Section 8.7.2. Changes in comparator values
are communicated to the link by RXCMDs as described in Section 10.3.2. Control over
comparators is described in Section 11.8 to Section 11.11.
10.10.2 Pull-up and pull-down resistors
The USB resistors on DP and DM can be used to initiate data-line pulsing SRP. The link
must set the required bus state using the mode settings in Table 15.
10.10.3 ID detection
The ISP1705 provides an internal pull-up resistor to sense the state of the ID pin. The
pull-up resistor must first be enabled by setting the ID_PULLUP register bit to logic 1. If
the state of pin ID has changed, the ISP1705 will send an RXCMD or interrupt to the link
by time tID. If the link does not receive any RXCMD or interrupt by tID, then the ID state has
not changed.
10.10.4 VBUS charge and discharge resistors
A pull-up resistor, RUP(VBUS), is provided to perform VBUS pulsing SRP. A B-device is
allowed to charge VBUS above the session valid threshold to request the host to turn on
the VBUS voltage.
A pull-down resistor, RDN(VBUS), is provided for a B-device to discharge VBUS. This is done
whenever the A-device turns off the VBUS voltage; the B-device can use the pull-down
resistor to ensure VBUS is below VB_SESS_END before starting a session.
For details, refer to On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3.
10.11 Serial modes
The ISP1705 supports both 6-pin serial mode and 3-pin serial mode, controlled by
bits 6PIN_FSLS_SERIAL and 3PIN_FSLS_SERIAL of the INTF_CTRL register (see
Section 11.6). For details, refer to UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1,
Section 3.10.
Figure 24 and Figure 25 provide examples of 6-pin serial mode and 3-pin serial mode,
respectively.
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TRANSMIT
DATA
RECEIVE
SYNC
SYNC
DATA
EOP
EOP
DATA0
(TX_ENABLE)
DATA1
(TX_DAT)
DATA2
(TX_SE0)
DATA4
(RX_DP)
DATA5
(RX_DM)
DATA6
(RX_RCV)
DP
DM
004aaa692
Fig 24. Example of transmit followed by receive in 6-pin serial mode
TRANSMIT
RECEIVE
DATA
DATA
SYNC
SYNC
EOP
EOP
DATA0
(TX_ENABLE)
DATA1
(TX_DAT/
RX_RCV)
DATA2
(TX_SE0/
RX_SE0)
DP
DM
004aaa693
Fig 25. Example of transmit followed by receive in 3-pin serial mode
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10.12 Aborting transfers
The ISP1705 supports aborting transfers on the ULPI bus. For details, refer to UTMI+ Low
Pin Interface (ULPI) Specification Rev. 1.1, Section 3.8.4.
10.13 Avoiding contention on the ULPI data bus
Because the ULPI data bus is bidirectional, avoid situations in which both the link and the
PHY simultaneously drive the data bus.
The following points must be considered while implementing the data bus drive control on
the link.
After power-up and clock stabilization, default states are as follows:
• The ISP1705 drives DIR to LOW.
• The data bus is input to the ISP1705.
• The ULPI link data bus is output, with all data bus lines driven to LOW.
When the ISP1705 wants to take control of the data bus to initiate a data transfer, it
changes the DIR state from LOW to HIGH.
At this point, the link must disable its output buffers. This must be as fast as possible so
the link must use a combinational path from DIR.
The ISP1705 will not immediately enable its output buffers, but will delay the enabling of
its buffers until the next clock edge, avoiding bus contention.
When the data transfer is no longer required by the ISP1705, it changes DIR from HIGH to
LOW and starts to immediately turn off its output drivers. The link senses the change of
DIR from HIGH to LOW, but delays enabling its output buffers for one CLOCK cycle,
avoiding data bus contention.
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11. Register map
Table 25. Register map
Field name
Size (bit)
Address (6 bit)
R[1]
References
W[2]
S[3]
-
C[4]
-
VENDOR_ID_LOW
VENDOR_ID_HIGH
PRODUCT_ID_LOW
PRODUCT_ID_HIGH
FUNC_CTRL
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
00h
-
Section 11.1 on page 52
Section 11.2 on page 52
Section 11.3 on page 53
Section 11.4 on page 53
Section 11.5 on page 53
Section 11.6 on page 55
Section 11.7 on page 56
Section 11.8 on page 58
Section 11.9 on page 58
Section 11.10 on page 59
Section 11.11 on page 59
Section 11.12 on page 60
Section 11.13 on page 61
Section 11.14 on page 61
-
01h
-
-
-
02h
-
-
-
03h
-
-
-
04h to 06h
07h to 09h
0Ah to 0Ch
0Dh to 0Fh
10h to 12h
13h
04h
07h
0Ah
0Dh
10h
-
05h
08h
0Bh
0Eh
11h
-
06h
09h
0Ch
0Fh
12h
-
INTF_CTRL
OTG_CTRL
USB_INTR_EN_R
USB_INTR_EN_F
USB_INTR_STAT
USB_INTR_L
14h
-
-
-
DEBUG
15h
-
-
-
SCRATCH
16h to 18h
19h to 1Bh
1Ch to 3Ch
3Dh to 3Fh
16h
19h
-
17h
1Ah
-
18h
1Bh
-
CARKIT_CTRL
Reserved
PWR_CTRL
3Dh
3Eh
3Fh
Section 11.15 on page 62
[1] Read (R): A register can be read. Read-only if this is the only mode given.
[2] Write (W): The pattern on the data bus will be written over all bits of a register.
[3] Set (S): The pattern on the data bus is OR-ed with and written to a register.
[4] Clear (C): The pattern on the data bus is a mask. If a bit in the mask is set, then the corresponding register bit will be set to zero
(cleared).
11.1 VENDOR_ID_LOW register
Table 26 shows the bit description of the register.
Table 26. VENDOR_ID_LOW - Vendor ID low register (address R = 00h) bit description
Legend: * reset value
Bit
Symbol
Access Value
CCh*
Description
7 to 0 VENDOR_
ID_LOW[7:0]
R
Vendor ID low: Lower byte of the NXP vendor ID
supplied by USB-IF; fixed value of CCh
11.2 VENDOR_ID_HIGH register
Table 27 shows the bit description of the register.
Table 27. VENDOR_ID_HIGH - Vendor ID high register (address R = 01h) bit description
Legend: * reset value
Bit
Symbol
Access Value
04h*
Description
7 to 0 VENDOR_
ID_HIGH[7:0]
R
Vendor ID high: Upper byte of the NXP vendor ID
supplied by USB-IF; fixed value of 04h
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11.3 PRODUCT_ID_LOW register
The bit description of the register is given in Table 28.
Table 28. PRODUCT_ID_LOW - Product ID low register (address R = 02h) bit description
Legend: * reset value
Bit
Symbol
Access Value
05h*
Description
7 to 0 PRODUCT_ID_
LOW[7:0]
R
Product ID low: Lower byte of the NXP product
ID number; fixed value of 05h
11.4 PRODUCT_ID_HIGH register
The bit description of the register is given in Table 29.
Table 29. PRODUCT_ID_HIGH - Product ID high register (address R = 03h) bit description
Legend: * reset value
Bit
Symbol
Access Value
17h*
Description
7 to 0 PRODUCT_ID_
HIGH[7:0]
R
Product ID high: Upper byte of the NXP product
ID number; fixed value of 17h
11.5 FUNC_CTRL register
This register controls UTMI function settings of the PHY. The bit allocation of the register
is given in Table 30.
Table 30. FUNC_CTRL - Function control register (address R = 04h to 06h, W = 04h, S = 05h, C = 06h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved SUSPENDM
RESET
OPMODE[1:0]
TERM
XCVRSELECT[1:0]
SELECT
Reset
0
1
0
0
0
0
0
1
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
Table 31. FUNC_CTRL - Function control register (address R = 04h to 06h, W = 04h, S = 05h, C = 06h) bit
description
Bit
7
Symbol
Description
-
reserved
6
SUSPENDM
Suspend: Active-LOW PHY suspend.
Places the PHY into low-power mode. The PHY will power down all blocks, except the
full-speed receiver, OTG comparators and ULPI interface pins.
To come out of low-power mode, the link must assert STP. The PHY will automatically clear
this bit when it exits low-power mode.
0b — Low-power mode
1b — Powered
5
RESET
Reset: Active-HIGH transceiver reset.
After the link sets this bit, the PHY will assert DIR and reset the digital core. This does not
reset the ULPI interface or the ULPI register set.
When the reset is completed, the PHY will deassert DIR and automatically clear this bit,
followed by an RXCMD update to the link.
The link must wait for DIR to be deasserted before using the ULPI bus.
0b — Do not reset
1b — Reset
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Table 31. FUNC_CTRL - Function control register (address R = 04h to 06h, W = 04h, S = 05h, C = 06h) bit
description …continued
Bit
Symbol
Description
4 to 3
OPMODE[1:0]
Operation mode: Selects the required bit-encoding style during transmit.
00b — Normal operation
01b — Non-driving
10b — Disable bit-stuffing and NRZI encoding
11b — Do not automatically add SYNC and EOP when transmitting; must be used only for
high-speed packets
2
TERMSELECT
Termination select: Controls the internal 1.5 kΩ full-speed pull-up resistor and 45 Ω
high-speed terminations. Control over bus resistors changes, depending on
XCVRSELECT[1:0], OPMODE[1:0], DP_PULLDOWN and DM_PULLDOWN, as shown in
Table 15.
1 to 0
XCVRSELECT[1:0] Transceiver select: Selects the required transceiver speed.
00b — Enable the high-speed transceiver
01b — Enable the full-speed transceiver
10b — Enable the low-speed transceiver
11b — Enable the full-speed transceiver for low-speed packets (full-speed preamble is
automatically prefixed)
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11.6 INTF_CTRL register
The INTF_CTRL register enables alternative interfaces. All of these modes are optional
features provided for legacy link cores. Setting more than one of these fields results in
undefined behavior. Table 32 provides the bit allocation of the register.
Table 32. INTF_CTRL - Interface control register (address R = 07h to 09h, W = 07h, S = 08h, C = 09h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
INTF_
PROT_DIS
IND_PASS
THRU
IND_
COMPL
reserved
CLOCK_
SUSPENDM
CARKIT_
MODE
3PIN_
FSLS_
SERIAL
6PIN_
FSLS_
SERIAL
Reset
0
0
0
0
0
0
0
0
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
Table 33. INTF_CTRL - Interface control register (address R = 07h to 09h, W = 07h, S = 08h,
C = 09h) bit description
Bit Symbol
Description
7
INTF_PROT_DIS
Interface protect disable: Controls circuitry built into the ISP1705
to protect the ULPI interface when the link 3-states STP and
DATA[7:0]. When this bit is enabled, the ISP1705 will automatically
detect when the link stops driving STP.
0b — Enables the interface protect circuit. The ISP1705 attaches
a weak pull-up resistor on STP. If STP is unexpectedly HIGH, the
ISP1705 attaches weak pull-down resistors on DATA[7:0],
protecting data inputs
1b — Disables the interface protect circuit, detaches weak
pull-down resistors on DATA[7:0], and a weak pull-up resistor on
STP
6
5
IND_PASSTHRU
Indicator pass-through: Controls whether the complement output
is qualified with the internal A_VBUS_VLD comparator before
being used in the VBUS state in RXCMD.
0b — The complement output signal is qualified with the internal
A_VBUS_VLD comparator
1b — The complement output signal is not qualified with the
internal A_VBUS_VLD comparator
IND_COMPL
Indicator complement: Informs the PHY to invert the FAULT input
signal, generating the complement output.
0b — The ISP1705 will not invert the FAULT signal
1b — The ISP1705 will invert the FAULT signal
reserved
4
3
-
CLOCK_SUSPENDM Clock suspend: Active-LOW clock suspend.
Powers down the internal clock circuitry only. By default, the clock
will not be powered in 6-pin serial mode or 3-pin serial mode.
Valid only in 6-pin serial mode and 3-pin serial mode. Valid only
when SUSPENDM is set to logic 1, otherwise this bit is ignored.
0b — Clock will not be powered in 3-pin or 6-pin serial mode or
UART mode
1b — Clock will be powered in 3-pin and 6-pin serial mode or
UART mode
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Table 33. INTF_CTRL - Interface control register (address R = 07h to 09h, W = 07h, S = 08h,
C = 09h) bit description …continued
Bit Symbol
Description
2
CARKIT_MODE
Carkit mode: Changes the ULPI interface to the carkit interface
(UART mode). Bits TXD_EN and RXD_EN in the CARKIT_CTRL
register (see Section 11.14) must change as well. The PHY must
automatically clear this bit when carkit mode is exited.
0b — Disable carkit mode
1b — Enable carkit mode
1
3PIN_FSLS_SERIAL
6PIN_FSLS_SERIAL
3-pin full-speed low-speed serial mode: Changes the ULPI
interface to a 3-bit serial interface. The ISP1705 will automatically
clear this bit when 3-pin serial mode is exited.
0b — Full-speed or low-speed packets are sent using the parallel
interface
1b — Full-speed or low-speed packets are sent using the 3-pin
serial interface
0
6-pin full-speed low-speed serial mode: Changes the ULPI
interface to a 6-bit serial interface. The ISP1705 will automatically
clear this bit when 6-pin serial mode is exited.
0b — Full-speed or low-speed packets are sent using the parallel
interface
1b — Full-speed or low-speed packets are sent using the 6-pin
serial interface
11.7 OTG_CTRL register
This register controls various OTG functions of the ISP1705. The bit allocation of the
OTG_CTRL register is given in Table 34.
Table 34. OTG_CTRL - OTG control register (address R = 0Ah to 0Ch, W = 0Ah, S = 0Bh, C = 0Ch) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
USE_EXT_
VBUS_IND VBUS_EXT
DRV_
reserved
CHRG_
VBUS
DISCHRG_ DM_PULL
DP_PULL
DOWN
ID_PULL
UP[1]
VBUS
DOWN
Reset
0
0
0
0
0
1
1
0
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
[1] A weak pull-up, which can detect ID correctly, is present when the ID_PULLUP bit is disabled. It is, however, mandatory that the link
enables ID_PULLUP.
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Table 35. OTG_CTRL - OTG control register (address R = 0Ah to 0Ch, W = 0Ah, S = 0Bh,
C = 0Ch) bit description
Bit Symbol
Description
7
USE_EXT_
Use external VBUS indicator: Informs the PHY to use an external
VBUS_IND
VBUS overcurrent indicator.
0b — Use the internal OTG comparator
1b — Use the external VBUS valid indicator signal input from the
FAULT pin
6
DRV_VBUS_EXT
Drive VBUS external: Controls the external charge pump or 5 V supply
by the PSW_N pin.
0b — PSW_N is HIGH
1b — PSW_N to LOW
5
4
reserved
-
CHRG_VBUS
Charge VBUS: Charges VBUS through a resistor. Used for the VBUS
pulsing of SRP. The link must first check that VBUS is discharged (see
bit DISCHRG_VBUS), and that both the DP and DM data lines have
been LOW (SE0) for 2 ms.
0b — Do not charge VBUS
1b — Charge VBUS
3
DISCHRG_VBUS
Discharge VBUS: Discharges VBUS through a resistor. If the link sets
this bit to logic 1, it waits for an RXCMD indicating that SESS_END
has changed from logic 0 to logic 1, and then resets this bit to logic 0
to stop the discharge.
0b — Do not discharge VBUS
1b — Discharge VBUS
2
1
0
DM_PULLDOWN
DP_PULLDOWN
ID_PULLUP
DM pull down: Enables the 15 kΩ pull-down resistor on DM.
0b — pull-down resistor is not connected to DM
1b — pull-down resistor is connected to DM
DP pull down: Enables the 15 kΩ pull-down resistor on DP.
0b — Pull-down resistor is not connected to DP
1b — Pull-down resistor is connected to DP
ID pull up: Connects a pull-up to the ID line and enables sampling of
the ID level. Disabling the ID line sampler will reduce the PHY power
consumption.
0b — Disable sampling of the ID line
1b — Enable sampling of the ID line
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11.8 USB_INTR_EN_R register
The bits in this register enable interrupts and RXCMDs to be sent when the corresponding
bits in the USB_INTR_STAT register change from logic 0 to logic 1. By default, all
transitions are enabled. Table 36 shows the bit allocation of the register.
Table 36. USB_INTR_EN_R - USB interrupt enable rising register (address R = 0Dh to 0Fh, W = 0Dh, S = 0Eh,
C = 0Fh) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
ID_GND_R
SESS_
END_R
SESS_
VALID_R
VBUS_
VALID_R DISCON_R
HOST_
Reset
0
0
0
1
1
1
1
1
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
Table 37. USB_INTR_EN_R - USB interrupt enable rising register (address R = 0Dh to 0Fh,
W = 0Dh, S = 0Eh, C = 0Fh) bit description
Bit
7 to 5
4
Symbol
Description
-
reserved
ID_GND_R
ID ground rise: Enables interrupts and RXCMDs for logic 0 to
logic 1 transitions on ID_GND
3
2
1
SESS_END_R
SESS_VALID_R
VBUS_VALID_R
Session end rise: Enables interrupts and RXCMDs for logic 0 to
logic 1 transitions on SESS_END
Session valid rise: Enables interrupts and RXCMDs for logic 0
to logic 1 transitions on SESS_VLD
VBUS valid rise: Enables interrupts and RXCMDs for logic 0 to
logic 1 transitions on A_VBUS_VLD
0
HOST_DISCON_R Host disconnect rise: Enables interrupts and RXCMDs for
logic 0 to logic 1 transitions on HOST_DISCON
11.9 USB_INTR_EN_F register
The bits in this register enable interrupts and RXCMDs to be sent when the corresponding
bits in the USB_INTR_STAT register change from logic 1 to logic 0. By default, all
transitions are enabled. See Table 38.
Table 38. USB_INTR_EN_F - USB interrupt enable falling register (address R = 10h to 12h, W = 10h, S = 11h,
C = 12h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
ID_GND_F
SESS_
END_F
SESS_
VALID_F
VBUS_
VALID_F
HOST_
DISCON_F
Reset
0
0
0
1
1
1
1
1
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
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ULPI Hi-Speed USB transceiver
Table 39. USB_INTR_EN_F - USB interrupt enable falling register (address R = 10h to 12h,
W = 10h, S = 11h, C = 12h) bit description
Bit
7 to 5
4
Symbol
Description
-
reserved
ID_GND_F
ID ground fall: Enables interrupts and RXCMDs for logic 1 to
logic 0 transitions on ID_GND.
3
2
1
SESS_END_F
SESS_VALID_F
VBUS_VALID_F
Session end fall: Enables interrupts and RXCMDs for logic 1 to
logic 0 transitions on SESS_END.
Session valid fall: Enables interrupts and RXCMDs for logic 1 to
logic 0 transitions on SESS_VLD.
VBUS valid fall: Enables interrupts and RXCMDs for logic 1 to
logic 0 transitions on A_VBUS_VLD.
0
HOST_DISCON_F
Host disconnect fall: Enables interrupts and RXCMDs for logic 1
to logic 0 transitions on HOST_DISCON.
11.10 USB_INTR_STAT register
This register (see Table 40) indicates the current value of the interrupt source signal.
Table 40. USB_INTR_STAT - USB interrupt status register (address R = 13h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
ID_GND
SESS_
END
SESS_
VALID
VBUS_
VALID
HOST_
DISCON
Reset
X
R
X
R
X
R
0
0
0
0
0
Access
R
R
R
R
R
Table 41. USB_INTR_STAT - USB interrupt status register (address R = 13h) bit description
Bit
7 to 5
4
Symbol
-
Description
reserved
ID_GND
SESS_END
ID ground: Reflects the current state of the ID detector circuit.
3
Session end: Reflects the current value of the session end
voltage comparator.
2
1
SESS_VALID
VBUS_VALID
Session valid: Reflects the current value of the session valid
voltage comparator.
VBUS valid: Reflects the current value of the VBUS valid voltage
comparator.
0
HOST_DISCON
Host disconnect: Reflects the current value of the host
disconnect detector.
11.11 USB_INTR_L register
The bits of the USB_INTR_L register are automatically set by the ISP1705 when an
unmasked change occurs on the corresponding interrupt source signal. The ISP1705 will
automatically clear all bits when the link reads this register, or when the PHY enters
low-power mode.
Remark: It is optional for the link to read this register when the clock is running because
all signal information will automatically be sent to the link through the RXCMD byte.
The bit allocation of this register is given in Table 42.
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Table 42. USB_INTR_L - USB interrupt latch register (address R = 14h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
ID_GND_L
SESS_
END_L
SESS_
VALID_L
VBUS_
VALID_L
HOST_
DISCON_L
Reset
0
0
0
0
0
0
0
0
Access
R
R
R
R
R
R
R
R
Table 43. USB_INTR_L - USB interrupt latch register (address R = 14h) bit description
Bit
Symbol
Description
7 to 5 reserved
-
4
3
2
1
ID_GND_L
ID ground latch: Automatically set when an unmasked event occurs
on ID_GND. Cleared when this register is read.
SESS_END_L
SESS_VALID_L
VBUS_VALID_L
Session end latch: Automatically set when an unmasked event
occurs on SESS_END. Cleared when this register is read.
Session valid latch: Automatically set when an unmasked event
occurs on SESS_VLD. Cleared when this register is read.
VBUS valid latch: Automatically set when an unmasked event occurs
on A_VBUS_VLD. Cleared when this register is read.
0
HOST_DISCON_L Host disconnect latch: Automatically set when an unmasked event
occurs on HOST_DISCON. Cleared when this register is read.
11.12 DEBUG register
The bit allocation of the DEBUG register is given in Table 44. This register indicates the
current value of signals useful for debugging.
Table 44. DEBUG - Debug register (address R = 15h) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
LINE
LINE
STATE1
STATE0
Reset
0
0
0
0
0
0
0
0
Access
R
R
R
R
R
R
R
R
Table 45. DEBUG - Debug register (address R = 15h) bit description
Bit
7 to 2
1
Symbol
-
Description
reserved
LINESTATE1
LINESTATE0
Line state 1: Contains the current value of LINESTATE 1
Line state 0: Contains the current value of LINESTATE 0
0
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11.13 SCRATCH register
This is a 1-byte empty register for testing purposes, see Table 46.
Table 46. SCRATCH - Scratch register (address R = 16h to 18h, W = 16h, S = 17h, C = 18h)
bit description
Bit
Symbol
Access Value Description
7 to 0 SCRATCH[7:0] R/W/S/C 00h
Scratch: This is an empty register byte for testing
purposes. Software can read, write, set and clear
this register. The functionality of the PHY will not be
affected.
11.14 CARKIT_CTRL register
This register controls transparent UART mode. This register is only valid when the
CARKIT_MODE bit in the INTF_CTRL register (see Section 11.6) is set. When entering
UART mode, set the CARKIT_MODE bit, and then set the TXD_EN and RXD_EN bits.
After entering UART mode, the ULPI interface is not available. When exiting UART mode,
assert the STP pin or perform a hardware reset using chip select.
For bit allocation, see Table 47.
Table 47. CARKIT_CTRL - Carkit control register (address R = 19h to 1Bh, W = 19h, S = 1Ah, C = 1Bh) bit
allocation
Bit
7
6
5
4
3
2
1
0
Symbol
Reset
Access
reserved
RXD_EN
0
TXD_EN
0
reserved
0
0
0
0
0
0
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
Table 48. CARKIT_CTRL - Carkit control register (address R = 19h to 1Bh, W = 19h,
S = 1Ah, C = 1Bh) bit description
Bit
7 to 4
3
Symbol
-
Description
reserved; the link must never write logic 1 to these bits
RXD_EN
RXD enable: Routes the UART RXD signal from the DP pin to the
DATA1 pin. This bit will automatically be cleared when UART mode is
exited.
2
TXD_EN
-
TXD enable: Routes the UART TXD signal from the DATA0 pin to the
DM pin. This bit will automatically be cleared when UART mode is
exited.
1 to 0
reserved; the link must never write logic 1 to these bits
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ULPI Hi-Speed USB transceiver
11.15 PWR_CTRL register
This vendor-specific register controls the power feature of the ISP1705. The bit allocation
of the register is given in Table 49.
Table 49. PWR_CTRL - Power control register (address R = 3Dh to 3Fh, W = 3Dh, S = 3Eh, C = 3Fh) bit allocation
Bit
7
6
5
4
3
2
1
0
Symbol
reserved
DP_WKPU_
EN
BVALID_
FALL
BVALID_
RISE
reserved
Reset
0
0
0
0
0
0
0
0
Access
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
R/W/S/C
Table 50. PWR_CTRL - Power control register (address R = 3Dh to 3Fh, W = 3Dh, S = 3Eh,
C = 3Fh) bit description
Bit
7 to 5
4
Symbol
Description
-
reserved; the link must never write logic 1 to these bits
DP_WKPU_EN DP weak pull-up enable: Enable the weak pull-up resistor on the DP
pin (RweakUP(DP)) in synchronous mode when VBUS is above the
VA_SESS_VLD threshold. Note that when the ISP1705 is in UART
mode, the DP weak pull-up will be enabled, regardless of the value of
this register bit.
0 — DP weak pull-up is disabled.
1 — DP weak pull-up is enabled when VBUS > VA_SESS_VLD
.
3
BVALID_FALL
BVALID fall: Enables RXCMDs for HIGH-to-LOW transitions on
BVALID. When BVALID changes from HIGH to LOW, the ISP1705
will send an RXCMD to the link with the ALT_INT bit set to logic 1.
This bit is optional and is not necessary for OTG devices. This bit is
provided for debugging purposes. Disabled by default.
2
BVALID_RISE
BVALID rise: Enables RXCMDs for LOW-to-HIGH transitions on
BVALID. When BVALID changes from LOW to HIGH, the ISP1705
will send an RXCMD to the link with the ALT_INT bit set to logic 1.
This bit is optional and is not necessary for OTG devices. This bit is
provided for debugging purposes. Disabled by default.
1 to 0
-
reserved; the link must never write logic 1 to these bits
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ULPI Hi-Speed USB transceiver
12. Limiting values
Table 51. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VCC supply voltage
VCC(I/O) input/output supply voltage
Conditions
Min
Max
+5.5
+4.6
+5.5
Unit
V
−0.5
−0.5
−0.5
−0.5
V
VI
input voltage
on pins PSW_N and FAULT
V
on pins CLOCK, STP, DATA[7:0], CFG1,
CFG2, RESET_N, CHIP_SEL and
CHIP_SEL_N
VCC(I/O) + 0.5 V
on pins ID and CFG0
−0.5
−0.5
−0.5
−0.5
−2
+4.6
+2.5
+4.6
+5.5
+2
V
on pin XTAL1
V
[1]
[2]
on pins DP and DM
V
on pin VBUS
V
VESD
electrostatic discharge
voltage
human body model (JESD22-A114D)
machine model (JESD22-A115-A)
charged device model (JESD22-C101-C)
IEC 61000-4-2 contact on pins DP and DM
kV
V
−200
−500
−8
+200
+500
+8
V
[3]
kV
mA
°C
Ilu
latch-up current
-
100
Tstg
storage temperature
−60
+125
[1] The ISP1705 has been tested according to the additional requirements listed in Universal Serial Bus Specification Rev. 2.0,
Section 7.1.1. The short circuit withstand test and the AC stress test were performed for 24 hours, and the ISP1705 was found to be fully
operational after the test completed.
[2] When an external series resistor is added to the VBUS pin, it can withstand higher voltages for longer periods of time because the
resistor limits the current flowing into the VBUS pad. For example, with an external 1 kΩ resistor, VBUS can tolerate 10 V for at least
5 seconds. Actual performance may vary depending on the resistor used and whether other components are connected to VBUS
.
[3] The ISP1705 has been tested in-house according to the IEC 61000-4-2 standard on the DP and DM pins. It is recommended that
customers perform their own ESD tests, depending on application requirements.
13. Recommended operating conditions
Table 52. Recommended operating conditions
Symbol
VCC
Parameter
Conditions
Min
3.0
3.0
0
Typ
3.6
3.3
-
Max
4.5
Unit
V
supply voltage
VCC(I/O)
VI
input/output supply voltage
input voltage
3.6
V
on pins PSW_N, FAULT and VBUS
5.25
VCC(I/O)
V
on pins CLOCK, STP, DATA[7:0],
CFG1, CFG2, RESET_N,
0
-
V
CHIP_SEL and CHIP_SEL_N
on pins DP, DM, ID and CFG0
on pin XTAL1
0
-
3.6
V
0
-
1.95
+125
+85
V
Tj
junction temperature
ambient temperature
−40
−40
-
°C
°C
Tamb
+25
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ULPI Hi-Speed USB transceiver
14. Static characteristics
Table 53. Static characteristics: supply pins
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
VPOR(trip)
ICC
Parameter
power-on reset trip voltage on REG1V8 pin
supply current Power-down mode (VCC(I/O) is
Conditions
Min
0.95
-
Typ
-
Max
1.5
10
Unit
V
0.5
µA
lost or chip select is
non-active)
full-speed transceiver; bus idle;
no USB activity
-
-
13
-
-
mA
mA
full-speed transceiver; 100 %
transmission; no inter-packet
delay
25.65
high-speed transceiver; 100 %
transmission; no inter-packet
delay
-
55.30
-
mA
low-power mode (bit
SUSPENDM is logic 0); VBUS
valid detector disabled (bits
VBUS_VALID_R and
VBUS_VALID_F are cleared)
for host
-
-
-
70
100
330
-
µA
µA
µA
for peripheral
240
750
UART mode; low-speed
transceiver; idle
UART mode; full-speed
transceiver; idle
-
-
-
600
-
µA
µA
mA
ICC(I/O)(stat) static supply current on
pin VCC(I/O)
Power-down mode (chip select
is non-active)
-
10
-
[1]
ICC(I/O)
supply current on
pin VCC(I/O)
ULPI bus idle; 15 pF load on
pin CLOCK
2
[1] The actual value of ICC(I/O) varies depending on the capacitance loading, interface voltage and bus activity. Use the value provided here
only as a reference.
Table 54. Static characteristics: digital pins
Digital pins: CLOCK, DIR, STP, NXT, DATA[7:0], CHIP_SEL_N, CHIP_SEL, CFG1, CFG2 and RESET_N; unless otherwise
specified.
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol Parameter
Input levels
Conditions
Min
Typ
Max
Unit
VIH
VIL
ILI
HIGH-level input voltage
0.7VCC(I/O)
-
-
-
-
V
LOW-level input voltage
input leakage current
-
0.3VCC(I/O)
+1
V
−1
µA
Output levels
VOH
HIGH-level output voltage
IOL = +2 mA
V
CC(I/O) − 0.4 -
-
V
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Table 54. Static characteristics: digital pins …continued
Digital pins: CLOCK, DIR, STP, NXT, DATA[7:0], CHIP_SEL_N, CHIP_SEL, CFG1, CFG2 and RESET_N; unless otherwise
specified.
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
V
VOL
IOH
IOL
LOW-level output voltage
IOH = −2 mA
-
-
-
-
0.4
HIGH-level output current
LOW-level output current
VOH = VCC(I/O) − 0.4 V
VOL = 0.4 V
8
8
-
-
mA
mA
Impedance
ZL
load impedance
45
-
65
Ω
Pull-up and pull-down
Ipu
pull-up current
interface protect enabled;
STP pin only; VI = 0 V
−30
−50
−80
µA
UART mode; DATA0 pin only
−30
−50
−80
µA
µA
Ipd
pull-down current
interface protect enabled;
DATA[7:0] pins only;
VI = VCC(I/O)
25
50
95
Capacitance
Cin input capacitance
-
-
2.9
pF
Table 55. Static characteristics: digital input pin FAULT
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
VIL
Parameter
Conditions
Min
-
Typ
Max
Unit
V
LOW-level input voltage
HIGH-level input voltage
LOW-level input current
HIGH-level input current
-
-
-
-
0.8
VIH
2.0
−1
-
-
V
IIL
VI = 0 V
-
µA
µA
IIH
VI = 5.25 V
1
Table 56. Static characteristics: digital output pin PSW_N
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
3.0[1]
-
Typ
Max
5.25
0.4
1
Unit
V
VOH
VOL
IOH
IOL
HIGH-level output voltage external pull-up resistor connected
-
-
-
-
LOW-level output voltage
HIGH-level output current
LOW-level output current
IOL = −4 mA
V
external pull-up resistor connected
VO = 0.4 V
-
µA
mA
4.0
-
[1] When VOH is less than VO(REG3V3), ICC may increase because of the cross current.
Table 57. Static characteristics: analog pins (DP, DM)
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Original USB transceiver (full speed and low speed)
Input levels (differential data receiver)
VDI
differential input sensitivity voltage
|VDP − VDM
|
0.2
-
-
V
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Table 57. Static characteristics: analog pins (DP, DM) …continued
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCM
differential common mode voltage
range
includes VDI range
0.8
-
2.5
V
Input levels (single-ended receivers)
VIL
LOW-level input voltage
HIGH-level input voltage
-
-
-
0.8
-
V
V
VIH
2.0
Output levels
VOL
LOW-level output voltage
HIGH-level output voltage
output signal crossover voltage
pull-up on DP; RL = 1.5 kΩ
to 3.6 V
0.0
2.8
1.3
-
-
-
0.3
3.6
2.0
V
V
V
VOH
pull-down on pins DP and
DM; RL = 15 kΩ to GND
VCRS
excluding the first transition
from the idle state
Termination
VTERM
termination voltage for upstream
facing port pull-up
for 1.5 kΩ pull-up resistor
3.0
-
3.6
V
Resistance
RUP(DP)
pull-up resistance on pin DP
1425
100
1500
125
1575
150
Ω
RweakUP(DP) weak pull-up resistance on pin DP
bit DP_WKPU_EN = 1 and
kΩ
VBUS > VA_SESS_VLD
Hi-Speed USB transceiver (HS)
Input levels
VHSSQ
high-speed squelch detection
threshold voltage (differential signal
amplitude)
100
525
-
-
150
625
mV
mV
VHSDSC
high-speed disconnect detection
threshold voltage (differential signal
amplitude)
VHSDI
high-speed differential input sensitivity |VDP − VDM
|
300
-
-
-
mV
mV
VHSCM
high-speed data signaling common
mode voltage range (guideline for
receiver)
includes VDI range
−50
+500
Output levels
VHSOI
high-speed idle level voltage
−10
−10
-
-
+10
+10
mV
mV
VHSOL
high-speed data signaling LOW-level
voltage
VHSOH
high-speed data signaling HIGH-level
voltage
360
-
440
mV
VCHIRPJ
VCHIRPK
Leakage current
Chirp J level (differential voltage)
700
-
-
1100
mV
mV
Chirp K level (differential voltage)
−900
−500
ILZ
off-state leakage current
−1.0
-
-
+1.0
5
µA
Capacitance
Cin
input capacitance
pin to GND
-
pF
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Product data sheet
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Table 57. Static characteristics: analog pins (DP, DM) …continued
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Resistance
RDN(DP)
pull-down resistance on pin DP
pull-down resistance on pin DM
14.25
14.25
15
15
15.75
15.75
kΩ
kΩ
RDN(DM)
Termination
ZO(drv)(DP)
ZO(drv)(DM)
ZINP
driver output impedance on pin DP
driver output impedance on pin DM
steady-state drive
steady-state drive
40.5
40.5
1
45
45
-
49.5
49.5
-
Ω
Ω
input impedance exclusive of
MΩ
pull-up/pull-down (for low-/full-speed)
UART mode
Input levels
VIL
LOW-level input voltage
HIGH-level input voltage
pin DP
pin DP
-
-
-
0.8
-
V
V
VIH
2.35
Output levels
VOL
LOW-level output voltage
HIGH-level output voltage
pin DM; IOL = −4 mA
-
-
-
0.3
-
V
V
VOH
pin DM; IOH = +4 mA
2.4
Table 58. Static characteristics: analog pin VBUS
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Comparators
VA_VBUS_VLD
VA_SESS_VLD
A-device VBUS valid voltage
A-device session valid voltage
4.4
0.8
-
-
4.75
2.0
-
V
for A-device and B-device
1.6
100
V
Vhys(A_SESS_VLD) A-device session valid hysteresis for A-device and B-device
voltage
mV
VB_SESS_END
Resistance
RUP(VBUS)
B-device session end voltage
0.2
-
0.8
V
pull-up resistance on pin VBUS
connect to REG3V3 when
CHRG_VBUS = 1
281
656
680
-
-
Ω
Ω
RDN(VBUS)
pull-down resistance on pin VBUS connect to GND when
DISCHRG_VBUS = 1
1200
RI(idle)(VBUS)
idle input resistance on pin VBUS not in Power-down mode
75
40
90
-
100
100
kΩ
kΩ
chip deasserted
(Power-down mode)
VCC(I/O) lost (Power-down
mode)
140
-
220
kΩ
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ULPI Hi-Speed USB transceiver
Table 59. Static characteristics: analog pin CFG0
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Input levels
VIL
VIH
ILI
LOW-level input voltage
HIGH-level input voltage
input leakage current
-
-
-
-
0.8
-
V
2.0
−1
V
+1
µA
Table 60. Static characteristics: ID detection circuit
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
tID
Parameter
Conditions
Min
50
Typ
-
Max
-
Unit
ms
V
ID detection time
Vth(ID)
RUP(ID)
ID detector threshold voltage
ID pull-up resistance
1.0
40
-
2.0
60
bit ID_PULLUP = 1
bit ID_PULLUP = 0
50
400
3.3
kΩ
kΩ
V
RweakPU(ID) weak pull-up resistance on pin ID
VPU(ID) pull-up voltage on pin ID
320
3.0
480
3.6
Table 61. Static characteristics: resistor reference
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SUSPENDM = HIGH.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VO(RREF)
output voltage on pin RREF
-
1.22
-
V
Table 62. Static characteristics: regulator
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SUSPENDM = HIGH.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
1.65
3.0
Typ
1.8
Max
1.95
3.6
Unit
V
VO(REG1V8) output voltage from internal 1.8 V regulator
VO(REG3V3) output voltage from internal 3.3 V regulator not in UART mode
in UART mode
3.3
V
2.5
2.77
2.9
V
Table 63. Static characteristics: pin XTAL1
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
VIL
Parameter
Conditions
Min
-
Typ
Max
0.37
-
Unit
V
LOW-level input voltage
HIGH-level input voltage
-
-
VIH
1.32
V
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ISP1705
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ULPI Hi-Speed USB transceiver
15. Dynamic characteristics
Table 64. Dynamic characteristics: reset and power
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tW(POR)
internal power-on reset
pulse width
0.2
-
-
µs
tw(REG1V8_H)
tw(REG1V8_L)
tW(RESET_N)
REG1V8 HIGH pulse width
REG1V8 LOW pulse width
-
-
-
-
2
µs
µs
ns
-
11
-
external RESET_N pulse
width
200
tstartup(PLL)
td(det)clk(osc)
PLL start-up time
measured after td(det)clk(osc)
-
-
-
-
640
640
µs
µs
oscillator clock detector
delay
measured from regulator
start-up time
tPWRUP
regulator start-up time
4.7 µF ± 20 % capacitor
each on the REG1V8 and
REG3V3 pins
-
-
-
-
1
ms
ms
tPWRDN
regulator power-down time
4.7 µF ± 20 % capacitor
each on the REG1V8 and
REG3V3 pins
100
Table 65. Dynamic characteristics: clock applied to XTAL1
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
MHz
MHz
MHz
MHz
ps
fi(XTAL1)
input frequency on pin XTAL1 see Table 6
-
-
-
-
-
-
26.000
24.000
19.300
13.000
-
-
see Table 6
see Table 6
see Table 6
-
-
-
tjit(i)(XTAL1)RMS RMS input jitter on pin XTAL1
200
200
∆fi(XTAL1)
input frequency tolerance on
pin XTAL1
-
ppm
[1]
δi(XTAL1)
tr(XTAL1)
tf(XTAL1)
input duty cycle on pin XTAL1 for the first transaction
-
-
-
50
-
-
%
rise time on pin XTAL1
fall time on pin XTAL1
only for square wave input
only for square wave input
5
5
ns
ns
-
[1] The internal PLL is triggered only on the positive edge from the crystal oscillator. Therefore, the duty cycle is not critical.
Table 66. Dynamic characteristics: CLOCK output
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
fo(AV)(CLOCK)
average output frequency on
pin CLOCK
59.970
60.000
60.030
MHz
tjit(o)(CLOCK)RMS RMS output jitter on pin CLOCK
-
-
500
55
ps
%
δo(CLOCK)
output clock duty cycle on pin CLOCK
45
50
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
69 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
Table 67. Dynamic characteristics: digital I/O pins (SDR)
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified. See Figure 30.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
tsu(STP) STP set-up time with respect to
the rising edge of pin CLOCK
input-only pin (STP)
6.0
-
-
ns
tsu(DATA) DATA set-up time with respect to bidirectional pins (DATA[7:0]) as inputs
the rising edge of pin CLOCK
6.0
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
pF
th(STP)
STP hold time with respect to the input-only pin (STP)
rising edge of pin CLOCK
0.0
-
th(DATA) DATA hold time with respect to
the rising edge of pin CLOCK
bidirectional pins (DATA[7:0]) as inputs
0.0
-
td(DIR)
DIR output delay with respect to output-only pin DIR
-
-
-
-
9.0
9.0
9.0
20
the rising edge of pin CLOCK
td(NXT)
NXT output delay with respect to output-only pin NXT
the rising edge of pin CLOCK
td(DATA) DATA output delay with respect to bidirectional pins as output (DATA[7:0])
the rising edge of pin CLOCK
[1]
CL
load capacitance
pins DATA[7:0], CLOCK, DIR, NXT, STP
[1] Load capacitance on each ULPI pin.
Table 68. Dynamic characteristics: digital I/O pins (DDR)
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified. See Figure 30.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
tsu(STP)
STP set-up time with respect to input-only pin (STP)
the rising edge of pin CLOCK
6.0
-
-
ns
[1][2]
tsu(DATA) DATA set-up time with respect to bidirectional pins (DATA[3:0]) as inputs
the rising edge of pin CLOCK
4.0
0.0
0.0
-
-
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
th(STP)
th(DATA)
td(DIR)
td(NXT)
td(DATA)
CL
STP hold time with respect to the input-only pin (STP)
rising edge of pin CLOCK
-
[2]
DATA hold time with respect to
the rising edge of pin CLOCK
bidirectional pins (DATA[7:0]) as inputs
-
DIR output delay with respect to output-only pin DIR
the rising edge of pin CLOCK
9.0
9.0
4.4
NXT output delay with respect to output-only pin NXT
the rising edge of pin CLOCK
-
[2]
[3]
DATA output delay with respect
to the rising edge of pin CLOCK
bidirectional pins (DATA[3:0]) as output
-
load capacitance
pins DATA[3:0], CLOCK, DIR, NXT, STP
td = 4 ns
-
-
-
-
10
15
pF
pF
td = 4.4 ns
[1] Note that the value exceeds that specified in UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1.
[2] Also with respect to the falling edge of pin CLOCK.
[3] Load capacitance on each ULPI pin.
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
70 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
Table 69. Dynamic characteristics: analog I/O pins (DP, DM) in USB mode
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Typical values refer to VCC = 3.6 V; VCC(I/O) = 3.3 V; Tamb = +25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
High-speed driver characteristics; see Figure 26
tHSR
tHSF
rise time (10 % to 90 %)
fall time (10 % to 90 %)
drive 45 Ω to GND on DP and DM
drive 45 Ω to GND on DP and DM
500
500
-
-
-
-
ps
ps
Full-speed driver characteristics; see Figure 26
tFR
rise time
fall time
CL = 50 pF; 10 % to 90 % of |VOH − VOL
|
|
4
-
-
-
20
ns
ns
%
tFF
CL = 50 pF; 10 % to 90 % of |VOH − VOL
4
20
tFRFM
differential rise and fall time tFR / tFF; excluding the first transition from
matching the idle state
90
111.1
Low-speed driver characteristics; see Figure 26
tLR
transition time: rise time
transition time: fall time
rise and fall time matching
CL = 200 pF to 600 pF; 1.5 kΩ pull-up on
75
75
80
-
-
-
300
300
125
ns
ns
%
DM enabled; 10 % to 90 % of |VOH − VOL
|
tLF
CL = 200 pF to 600 pF; 1.5 kΩ pull-up on
DM enabled; 10 % to 90 % of |VOH − VOL
|
tLRFM
tLR / tLF; excluding the first transition from
the idle state
Table 70. Dynamic characteristics: analog I/O pins (DP, DM) in transparent UART mode
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Full-speed driver characteristics (DM only)
tr(UART)
tf(UART)
tPLH(drv)
rise time for UART TXD
fall time for UART TXD
CL = 185 pF; 0.37 V to 2.16 V
CL = 185 pF; 2.16 V to 0.37 V
CL = 185 pF; DATA0 to DM
25
25
-
-
-
-
75
75
39
ns
ns
ns
driver propagation delay
(LOW to HIGH)
tPHL(drv)
driver propagation delay
(HIGH to LOW)
CL = 185 pF; DATA0 to DM
-
-
34
ns
Low-speed driver characteristics (DM only)
tr(UART)
tf(UART)
tPLH(drv)
rise time for UART TXD
fall time for UART TXD
CL = 185 pF; 0.37 V to 2.16 V
CL = 185 pF; 2.16 V to 0.37 V
CL = 185 pF; DATA0 to DM
100
100
-
-
-
-
400
400
614
ns
ns
ns
driver propagation delay
(LOW to HIGH)
tPHL(drv)
driver propagation delay
(HIGH to LOW)
CL = 185 pF; DATA0 to DM
-
-
614
ns
Full-speed receiver characteristics (DP only)
tPLH(rcv)
receiver propagation delay
(LOW to HIGH)
DP to DATA1
-
-
-
-
7
7
ns
ns
tPHL(rcv)
receiver propagation delay
(HIGH to LOW)
DP to DATA1
Low-speed receiver characteristics (DP only)
tPLH(rcv)
receiver propagation delay
(LOW to HIGH)
DP to DATA1
-
-
-
-
7
7
ns
ns
tPHL(rcv)
receiver propagation delay
(HIGH to LOW)
DP to DATA1
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
71 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
Table 71. Dynamic characteristics: analog I/O pins (DP, DM) in serial mode
VCC = 3.0 V to 4.5 V; VCC(I/O) = 3.0 V to 3.6 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Driver timing (valid only for serial mode)
tPLH(drv) driver propagation delay (LOW to
HIGH)
TX_DAT, TX_SE0 to DP, DM;
see Figure 27
-
-
-
-
11
11
ns
ns
tPHL(drv) driver propagation delay (HIGH to
LOW)
TX_DAT, TX_SE0 to DP, DM;
see Figure 27
tPHZ
tPLZ
tPZH
tPZL
driver disable delay from HIGH level TX_ENABLE to DP, DM; see Figure 28
driver disable delay from LOW level TX_ENABLE to DP, DM; see Figure 28
-
-
-
-
-
-
-
-
12
12
20
20
ns
ns
ns
ns
driver enable delay to HIGH level
driver enable delay to LOW level
TX_ENABLE to DP, DM; see Figure 28
TX_ENABLE to DP, DM; see Figure 28
Receiver timing (valid only for serial mode)
Differential receiver
tPLH(rcv) receiver propagation delay (LOW to DP, DM to RX_RCV, RX_DP and RX_DM;
HIGH) see Figure 29
-
-
-
-
17
17
ns
ns
tPHL(rcv) receiver propagation delay (HIGH to DP, DM to RX_RCV, RX_DP and RX_DM;
LOW)
see Figure 29
Single-ended receiver
tPLH(se) single-ended propagation delay
(LOW to HIGH)
DP, DM to RX_RCV, RX_DP and RX_DM;
see Figure 29
-
-
-
-
17
17
ns
ns
tPHL(se) single-ended propagation delay
(HIGH to LOW)
DP, DM to RX_RCV, RX_DP and RX_DM;
see Figure 29
1.8 V
0.9 V
logic input 0.9 V
t
, t , t
HSF FF LF
t
, t , t
HSR FR LR
0 V
V
t
t
PHL(drv)
OH
PLH(drv)
90 %
90 %
V
OH
differential
data lines
V
V
CRS
CRS
10 %
10 %
V
OL
V
OL
004aaa861
004aaa573
Fig 26. Rise time and fall time
Fig 27. Timing of TX_DAT and TX_SE0 to DP and DM
2.0 V
1.8 V
differential
data lines
V
V
CRS
CRS
logic
input
0.9 V
0.9 V
0.8 V
0 V
t
t
t
PHL(rcv)
PLH(rcv)
PLH(se)
t
t
t
PHZ
PZH
t
PHL(se)
t
PLZ
PZL
V
OH
V
OH
V
− 0.3 V
OH
0.9 V
0.9 V
logic output
differential
data lines
V
CRS
V
+ 0.3 V
OL
V
OL
V
004aaa574
001aai187
OL
Fig 28. Timing of TX_ENABLE to DP and DM
Fig 29. Timing of DP and DM to RX_RCV, RX_DP and
RX_DM
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
72 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
CLOCK
t
t
su(STP) h(STP)
CONTROL IN
(STP)
t
t
su(DATA)
h(DATA)
DATA IN
(8-BIT)
t
,
d(DIR)
t
d(NXT)
CONTROL OUT
(DIR, NXT)
t
,
d(DIR)
t
t
d(NXT)
d(DATA)
DATA OUT
(8-BIT)
004aaa722
Fig 30. ULPI timing interface
16. Application information
Table 72. Recommended bill of materials
Designator Application
Part type
Remark
Cbypass
highly recommended for all
applications
0.1 µF ± 20 %
-
Cfilter
highly recommended for all
applications
4.7 µF ± 20 %
use a LOW ESR capacitor (0.2 Ω to 2 Ω) for best
performance
CVBUS
mandatory for peripherals
mandatory for host
mandatory for OTG
in all applications
1 µF to 10 µF
120 µF (min)
1 µF to 6.5 µF
18 pF ± 20 %
-
use low ESR capacitor
use low ESR capacitor
use low ESR capacitor
-
CXTAL
DESD
recommended to prevent
damages from ESD
IP4359CX4/LF; Wafer-Level Chip-Scale Package
(WLCSP); ESD IEC 61000-4-2 level 4; ±15 kV contact;
±15 kV air discharge compliant protection.
Note: ISP1705 and IP4359CX4/LF together have an IEC
61000-4-2 contact discharge tolerance of ±20 kV.
RRREF
mandatory in all applications
12 kΩ ± 1 %
-
-
RS(VBUS)
recommended for peripherals 1 kΩ ± 5 %
or external 5 V applications
Rpullup
recommended; for applications 10 kΩ
with an external VBUS supply
controlled by PSW_N
-
xtal
mandatory in all applications
19.2 MHz
24 MHz
CL = 10 pF; RS < 220 Ω; CXTAL = 18 pF
CL = 10 pF; RS < 160 Ω; CXTAL = 18 pF
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
73 of 89
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xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
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V
CC
V
CC(I/O)
V
C
bypass
V
CC
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
NXT
CC(I/O)
8
3
35
29
2
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
NXT
C
C
C
C
bypass
bypass
bypass
bypass
V
V
V
CC(I/O)
CC(I/O)
CC(I/O)
21
26
33
20
13
5
1
RESET_N
36
30
28
27
25
24
23
22
19
16
7
R
S(VBUS)
V
V
BUS
BUS
1
2
3
4
5
6
USB
PERIPHERAL
CONTROLLER
DM
DP
D−
D+
6
USB
STANDARD-B
RECEPTACLE
FAULT
ID
GND
10
9
ISP1705
C
VBUS
A1
A2
SHIELD
SHIELD
IP4359CX4/LF
B1
B2
(1)
CFG2
32
31
11
14
4
D
ESD
(1)
STP
CFG1
STP
DIR
n.c.
DIR
C
XTAL1
XTAL1
CFG0
PSW_N
004aab061
R
RREF
RREF
REG3V3
XTAL2
REG1V8
18
34
12
17
CHIP_SEL_N
C
C
filter
C
C
filter
bypass
bypass
15
GND
This figure shows the HVQFN pinout. For the TFBGA ballout, see Table 3.
(1) Connect to either GND or VCC(I/O), depending on the clock frequency used. See Table 6.
Fig 31. ISP1705 in peripheral-only application
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xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
V
CC
V
CC(I/O)
+5 V
C
bypass
V
8
CC
IN
FAULT
BUS
SWITCH
V
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
NXT
CC(I/O)
35
29
2
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
DATA4
3
V
R
pullup
C
C
bypass
bypass
V
V
V
CC(I/O)
CC(I/O)
CC(I/O)
ON OUT
21
26
33
20
13
5
C
C
bypass
bypass
1
RESET_N
36
30
28
27
25
24
23
22
19
7
R
S(VBUS)
V
V
BUS
BUS
DM
DP
ID
1
2
3
4
5
6
7
8
9
D−
D+
ID
OTG
CONTROLLER
DATA5
DATA6
DATA7
NXT
6
9
ISP1705
USB
MICRO-AB
RECEPTACLE
GND
FAULT
10
32
31
34
11
14
17
16
C
VBUS
A1
A2
SHIELD
SHIELD
SHIELD
SHIELD
(1)
CFG2
IP4359CX4/LF
STP
(1)
CFG1
STP
B1
B2
D
ESD
DIR
CHIP_SEL_N
n.c.
DIR
CFG0
004aab062
R
RREF
RREF
PSW_N
XTAL2
4
REG3V3
12
18
xtal
REG1V8
C
C
C
XTAL1
bypass
filter
15
C
filter
bypass
C
XTAL
C
XTAL
GND
This figure shows the HVQFN pinout. For the TFBGA ballout, see Table 3.
(1) Connect to either GND or VCC(I/O), depending on the crystal frequency used. See Table 6.
Fig 32. ISP1705 in OTG application
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx
xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
V
CC
+5 V
V
CC(I/O)
V
C
bypass
IN
FAULT
BUS
SWITCH
V
8
CC
V
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
DATA4
DATA5
DATA6
DATA7
NXT
CC(I/O)
CC(I/O)
CC(I/O)
CC(I/O)
R
CHIP_SEL
CLOCK
DATA0
DATA1
DATA2
DATA3
pullup
3
35
29
2
C
C
bypass
bypass
ON OUT
V
21
26
33
20
4
C
C
bypass
bypass
V
V
1
RESET_N
36
30
28
27
25
24
23
22
19
7
R
RREF
RREF
DM
V
BUS
1
2
3
4
5
6
USB HOST
CONTROLLER
D−
DATA4
DATA5
DATA6
DATA7
NXT
5
DP
D+
USB
6
STANDARD-A
RECEPTACLE
C
VBUS
FAULT
ID
GND
ISP1705
10
9
SHIELD
SHIELD
A1
A2
(1)
CFG2
IP4359CX4/LF
32
31
11
14
12
16
17
B1
B2
(1)
STP
CFG1
STP
D
ESD
DIR
n.c.
PSW_N
REG3V3
XTAL1
DIR
CFG0
004aab063
V
BUS
13
CHIP_SEL_N
REG1V8
34
18
C
C
filter
bypass
xtal
XTAL2
15
GND
C
XTAL
C
XTAL
C
C
filter
bypass
This figure shows the HVQFN pinout. For the TFBGA ballout, see Table 3.
(1) Connect to either GND or VCC(I/O), depending on the crystal frequency used. See Table 6.
Fig 33. ISP1705 in host application
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
17. Package outline
HVQFN36: plastic thermal enhanced very thin quad flat package; no leads;
36 terminals; body 5 x 5 x 0.85 mm
SOT818-1
D
B
A
terminal 1
index area
A
E
A
1
c
detail X
C
y
e
1
y
v
M
C
C
A B
1 C
e
b
w
M
10
18
L
19
9
e
e
2
E
h
1
27
terminal 1
index area
36
28
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
D
D
E
E
e
e
1
e
2
L
v
w
y
y
1
1
h
h
max
0.05 0.30
0.00 0.18
5.1
4.9
3.75
3.45
5.1
4.9
3.75
3.45
0.5
0.3
mm
1
0.2
0.4
3.2
3.2
0.1
0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
- - -
SOT818-1
- - -
03-06-13
MO-220
Fig 34. Package outline SOT818-1 (HVQFN36)
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
77 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
TFBGA36: plastic thin fine-pitch ball grid array package; 36 balls; body 3.5 x 3.5 x 0.8 mm
SOT912-1
D
B
A
E
ball A1
index area
A
2
A
A
1
detail X
e
1
1/2 e
e
C
y
M
M
v
C A
C
B
b
y
w
C
1
F
E
D
C
B
A
e
e
2
1/2 e
ball A1
index area
1
2
3
4
5
6
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
A
2
b
D
E
e
e
e
2
v
w
y
y
1
1
max
0.25 0.90 0.35
0.15 0.75 0.25
3.6
3.4
3.6
3.4
mm
1.15
0.5
2.5
2.5
0.15 0.05 0.08
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
05-08-09
05-09-01
- - -
- - -
- - -
SOT912-1
Fig 35. Package outline SOT912-1 (TFBGA36)
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
78 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
18. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
18.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
18.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
18.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
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ULPI Hi-Speed USB transceiver
18.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 36) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 73 and 74
Table 73. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 74. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 36.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 36. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
19. Abbreviations
Table 75. Abbreviations
Acronym
ASIC
ATX
Description
Application Specific Integrated Circuit
Analog USB Transceiver
Charged Device Model
Compact Disc - Digital Video Disc
Compact Disc - Read-Only Memory
Compact Disc - ReWritable
Dual Data Rate
CDM
CD-DVD
CD-ROM
CD-RW
DDR
EMI
ElectroMagnetic Interference
End-Of-Packet
EOP
ESD
ElectroStatic Discharge
Effective Series Resistance
Field Programmable Gate-Array
Full Speed
ESR
FPGA
FS
HBM
HNP
HS
Human Body Model
Host Negotiation Protocol
High Speed
ID
Identification
IEC
International Electrotechnical Commission
Low Speed
LS
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Table 75. Abbreviations …continued
Acronym
Description
MM
Machine Model
NRZI
OTG
Non-Return to Zero Inverted
On-The-Go
PDA
Personal Digital Assistant
Physical
PHY
PID
Packet Identifier
PLL
Phase-Locked Loop
Power-On Reset
POR
RoHS
RXCMD
RXD
Restriction of Hazardous Substances
Receive Command
Receive Data
SDR
Single Data Rate
Single-Ended Zero
System-On-Chip
SE0
SOC
SOF
Start-Of-Frame
SRP
Session Request Protocol
Synchronous
SYNC
TTL
Transistor-Transistor Logic
Transmit Command
Transmit Data
TXCMD
TXD
UART
ULPI
USB
Universal Asynchronous Receiver-Transmitter
UTMI+ Low Pin Interface
Universal Serial Bus
USB-IF
UTMI
UTMI+
WLCSP
USB Implementers Forum
USB Transceiver Macrocell Interface
USB Transceiver Macrocell Interface Plus
Wafer-Level Chip-Scale Package
20. Glossary
A-device — An OTG device with an attached micro-A plug.
B-device — An OTG device with an attached micro-B plug.
Link — ASIC, SOC or FPGA that contains the USB host or peripheral core.
PHY — Physical layer containing the USB transceiver.
21. References
[1] Universal Serial Bus Specification Rev. 2.0
[2] On-The-Go Supplement to the USB 2.0 Specification Rev. 1.3
[3] UTMI+ Low Pin Interface (ULPI) Specification Rev. 1.1
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[4] UTMI+ Specification Rev. 1.0
[5] USB 2.0 Transceiver Macrocell Interface (UTMI) Specification Ver. 1.05
[6] Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM)
(JESD22-A114D)
[7] Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
(JESD22-A115-A)
[8] Field-Induced Charged-Device Model Test Method for
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components
(JESD22-C101-C)
[9] Electromagnetic compatibility (EMC) - Part 4-2: Testing and measurement
techniques - Electrostatic discharge immunity test (IEC 61000-4-2)
22. Revision history
Table 76. Revision history
Document ID
Release date
20080613
Data sheet status
Change notice
Supersedes
ISP1705_1
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-
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23. Legal information
23.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
23.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
23.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
23.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
24. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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25. Tables
Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .3
Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3
Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 4. Recommended VBUS capacitor value . . . . . . .18
Table 5. OTG_CTRL register power control bits . . . . . .19
Table 6. Allowed crystal or clock frequency on the
XTAL1 pin . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 7. External capacitor values for 13 MHz or
19.2 MHz clock frequency . . . . . . . . . . . . . . . .20
Table 8. External capacitor values for 24 MHz or
26 MHz clock frequency . . . . . . . . . . . . . . . . .20
Table 9. Pin states in Power-down mode . . . . . . . . . . .22
Table 10. ULPI signal description . . . . . . . . . . . . . . . . . .23
Table 11. Signal mapping during low-power mode . . . . .24
Table 12. Signal mapping for 6-pin serial mode . . . . . . .25
Table 13. Signal mapping for 3-pin serial mode . . . . . . .26
Table 14. UART signal mapping . . . . . . . . . . . . . . . . . . .26
Table 15. Operating states and their corresponding
resistor settings . . . . . . . . . . . . . . . . . . . . . . . .29
Table 16. TXCMD byte format . . . . . . . . . . . . . . . . . . . . .31
Table 17. RXCMD byte format . . . . . . . . . . . . . . . . . . . . .32
Table 18. LINESTATE[1:0] encoding for upstream
facing ports: peripheral . . . . . . . . . . . . . . . . . .33
Table 19. LINESTATE[1:0] encoding for downstream
facing ports: host . . . . . . . . . . . . . . . . . . . . . . .33
Table 20. Encoded VBUS voltage state . . . . . . . . . . . . . .33
Table 21. VBUS indicators in RXCMD required for
typical applications . . . . . . . . . . . . . . . . . . . . . .34
Table 22. Encoded USB event signals . . . . . . . . . . . . . .35
Table 23. PHY pipeline delays . . . . . . . . . . . . . . . . . . . . .39
Table 24. Link decision times . . . . . . . . . . . . . . . . . . . . .40
Table 25. Register map . . . . . . . . . . . . . . . . . . . . . . . . . .52
Table 26. VENDOR_ID_LOW - Vendor ID low register
(address R = 00h) bit description . . . . . . . . . . .52
Table 27. VENDOR_ID_HIGH - Vendor ID high
C = 09h) bit allocation . . . . . . . . . . . . . . . . . . . 55
Table 33. INTF_CTRL - Interface control register
(address R = 07h to 09h, W = 07h, S = 08h,
C = 09h) bit description . . . . . . . . . . . . . . . . . . 55
Table 34. OTG_CTRL - OTG control register
(address R = 0Ah to 0Ch, W = 0Ah, S = 0Bh,
C = 0Ch) bit allocation . . . . . . . . . . . . . . . . . . . 56
Table 35. OTG_CTRL - OTG control register
(address R = 0Ah to 0Ch, W = 0Ah, S = 0Bh,
C = 0Ch) bit description . . . . . . . . . . . . . . . . . 57
Table 36. USB_INTR_EN_R - USB interrupt enable
rising register (address R = 0Dh to 0Fh,
W = 0Dh, S = 0Eh, C = 0Fh) bit allocation . . . 58
Table 37. USB_INTR_EN_R - USB interrupt enable
rising register (address R = 0Dh to 0Fh,
W = 0Dh, S = 0Eh, C = 0Fh) bit description . . 58
Table 38. USB_INTR_EN_F - USB interrupt enable
falling register (address R = 10h to 12h,
W = 10h, S = 11h, C = 12h) bit allocation . . . . 58
Table 39. USB_INTR_EN_F - USB interrupt enable
falling register (address R = 10h to 12h,
W = 10h, S = 11h, C = 12h) bit description . . . 59
Table 40. USB_INTR_STAT - USB interrupt status
register (address R = 13h) bit allocation . . . . . 59
Table 41. USB_INTR_STAT - USB interrupt status
register (address R = 13h) bit description . . . . 59
Table 42. USB_INTR_L - USB interrupt latch
register (address R = 14h) bit allocation . . . . . 60
Table 43. USB_INTR_L - USB interrupt latch
register (address R = 14h) bit description . . . . 60
Table 44. DEBUG - Debug register (address R = 15h)
bit allocation . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 45. DEBUG - Debug register (address R = 15h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 46. SCRATCH - Scratch register (address
R = 16h to 18h, W = 16h, S = 17h, C = 18h)
bit description . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 47. CARKIT_CTRL - Carkit control register
(address R = 19h to 1Bh, W = 19h, S = 1Ah,
C = 1Bh) bit allocation . . . . . . . . . . . . . . . . . . . 61
Table 48. CARKIT_CTRL - Carkit control register
(address R = 19h to 1Bh, W = 19h, S = 1Ah,
C = 1Bh) bit description . . . . . . . . . . . . . . . . . . 61
Table 49. PWR_CTRL - Power control register
(address R = 3Dh to 3Fh, W = 3Dh, S = 3Eh,
C = 3Fh) bit allocation . . . . . . . . . . . . . . . . . . . 62
Table 50. PWR_CTRL - Power control register
(address R = 3Dh to 3Fh, W = 3Dh, S = 3Eh,
register (address R = 01h) bit description . . . .52
Table 28. PRODUCT_ID_LOW - Product ID low
register (address R = 02h) bit description . . . .53
Table 29. PRODUCT_ID_HIGH - Product ID high
register (address R = 03h) bit description . . . .53
Table 30. FUNC_CTRL - Function control register
(address R = 04h to 06h, W = 04h, S = 05h,
C = 06h) bit allocation . . . . . . . . . . . . . . . . . . .53
Table 31. FUNC_CTRL - Function control register
(address R = 04h to 06h, W = 04h, S = 05h,
C = 06h) bit description . . . . . . . . . . . . . . . . . .53
Table 32. INTF_CTRL - Interface control register
(address R = 07h to 09h, W = 07h, S = 08h,
continued >>
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ULPI Hi-Speed USB transceiver
C = 3Fh) bit description . . . . . . . . . . . . . . . . . .62
Table 51. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .63
Table 52. Recommended operating conditions . . . . . . . .63
Table 53. Static characteristics: supply pins . . . . . . . . . .64
Table 54. Static characteristics: digital pins . . . . . . . . . . .64
Table 55. Static characteristics: digital input pin
FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Table 56. Static characteristics: digital output pin
PSW_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Table 57. Static characteristics: analog pins (DP, DM) . .65
Table 58. Static characteristics: analog pin VBUS . . . . . .67
Table 59. Static characteristics: analog pin CFG0 . . . . . .68
Table 60. Static characteristics: ID detection circuit . . . .68
Table 61. Static characteristics: resistor reference . . . . .68
Table 62. Static characteristics: regulator . . . . . . . . . . . .68
Table 63. Static characteristics: pin XTAL1 . . . . . . . . . . .68
Table 64. Dynamic characteristics: reset and power . . . .69
Table 65. Dynamic characteristics: clock applied to
XTAL1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .69
Table 66. Dynamic characteristics: CLOCK output . . . . .69
Table 67. Dynamic characteristics: digital I/O pins
(SDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Table 68. Dynamic characteristics: digital I/O pins
(DDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
Table 69. Dynamic characteristics: analog I/O pins
(DP, DM) in USB mode . . . . . . . . . . . . . . . . . .71
Table 70. Dynamic characteristics: analog I/O pins
(DP, DM) in transparent UART mode . . . . . . . .71
Table 71. Dynamic characteristics: analog I/O pins
(DP, DM) in serial mode . . . . . . . . . . . . . . . . . .72
Table 72. Recommended bill of materials . . . . . . . . . . . .73
Table 73. SnPb eutectic process (from J-STD-020C) . . .80
Table 74. Lead-free process (from J-STD-020C) . . . . . .80
Table 75. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .81
Table 76. Revision history . . . . . . . . . . . . . . . . . . . . . . . .83
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ULPI Hi-Speed USB transceiver
26. Figures
Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Fig 2. Pin configuration HVQFN36. . . . . . . . . . . . . . . . . .5
Fig 3. Pin configuration TFBGA36 . . . . . . . . . . . . . . . . . .5
Fig 4. Digital overcurrent detection scheme. . . . . . . . . .12
Fig 5. Internal power-on reset timing . . . . . . . . . . . . . . .13
Fig 6. Power-up and reset sequence required before
the ULPI bus is ready for use. . . . . . . . . . . . . . . .14
Fig 7. Interface behavior with respect to RESET_N. . . .15
Fig 8. Interface behavior with respect to chip select . . .16
Fig 9.
VBUS pin internal pull-up and pull-down scheme .19
Fig 10. Interface behavior when entering UART mode . .28
Fig 11. Interface behavior when exiting UART mode. . . .28
Fig 12. Single and back-to-back RXCMDs from the
ISP1705 to the link. . . . . . . . . . . . . . . . . . . . . . . .32
Fig 13. RXCMD A_VBUS_VLD indicator source . . . . . . .34
Fig 14. Example of register write, register read,
extended register write and extended
register read. . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Fig 15. USB reset and high-speed detection
handshake (chirp) sequence . . . . . . . . . . . . . . . .38
Fig 16. Example of using the ISP1705 to transmit and
receive USB data. . . . . . . . . . . . . . . . . . . . . . . . .39
Fig 17. High-speed transmit-to-transmit packet timing. . .40
Fig 18. High-speed receive-to-transmit packet timing . . .41
Fig 19. Preamble sequence. . . . . . . . . . . . . . . . . . . . . . .42
Fig 20. Full speed suspend and resume . . . . . . . . . . . . .43
Fig 21. High speed suspend and resume . . . . . . . . . . . .45
Fig 22. Remote wake-up from low-power mode . . . . . . .47
Fig 23. Transmitting USB packets without automatic
SYNC and EOP generation . . . . . . . . . . . . . . . . .48
Fig 24. Example of transmit followed by receive
in 6-pin serial mode . . . . . . . . . . . . . . . . . . . . . . .50
Fig 25. Example of transmit followed by receive
in 3-pin serial mode . . . . . . . . . . . . . . . . . . . . . . .50
Fig 26. Rise time and fall time . . . . . . . . . . . . . . . . . . . . .72
Fig 27. Timing of TX_DAT and TX_SE0 to DP and DM. .72
Fig 28. Timing of TX_ENABLE to DP and DM. . . . . . . . .72
Fig 29. Timing of DP and DM to RX_RCV, RX_DP
and RX_DM . . . . . . . . . . . . . . . . . . . . . . . . . . . . .72
Fig 30. ULPI timing interface . . . . . . . . . . . . . . . . . . . . . .73
Fig 31. ISP1705 in peripheral-only application . . . . . . . .74
Fig 32. ISP1705 in OTG application . . . . . . . . . . . . . . . .75
Fig 33. ISP1705 in host application . . . . . . . . . . . . . . . . .76
Fig 34. Package outline SOT818-1 (HVQFN36) . . . . . . .77
Fig 35. Package outline SOT912-1 (TFBGA36). . . . . . . .78
Fig 36. Temperature profiles for large and small
components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81
ISP1705_1
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ULPI Hi-Speed USB transceiver
27. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
8.12.15 STP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.12.16 NXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.12.17 CLOCK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.12.18 CFG1, CFG2 . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.12.19 CHIP_SEL, CHIP_SEL_N . . . . . . . . . . . . . . . 21
8.12.20 GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
9
9.1
Modes of operation . . . . . . . . . . . . . . . . . . . . . 22
Power modes . . . . . . . . . . . . . . . . . . . . . . . . . 22
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . 22
Power-down mode . . . . . . . . . . . . . . . . . . . . . 22
ULPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Synchronous mode . . . . . . . . . . . . . . . . . . . . 23
Low-power mode . . . . . . . . . . . . . . . . . . . . . . 24
6-pin full-speed or low-speed serial mode . . . 25
3-pin full-speed or low-speed serial mode . . . 25
Transparent UART mode . . . . . . . . . . . . . . . . 26
USB state transitions . . . . . . . . . . . . . . . . . . . 29
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
9.1.1
9.1.2
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.5
9.3
8
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.7.1
8.7.2
8.7.2.1
8.7.2.2
8.7.2.3
8.7.3
8.8
Functional description . . . . . . . . . . . . . . . . . . . 9
ULPI interface controller . . . . . . . . . . . . . . . . . . 9
USB serializer and deserializer. . . . . . . . . . . . . 9
Hi-Speed USB (USB 2.0) ATX . . . . . . . . . . . . . 9
Voltage regulator. . . . . . . . . . . . . . . . . . . . . . . 10
Crystal oscillator and PLL. . . . . . . . . . . . . . . . 10
UART buffer . . . . . . . . . . . . . . . . . . . . . . . . . . 10
OTG module . . . . . . . . . . . . . . . . . . . . . . . . . . 11
ID detector . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
VBUS comparators. . . . . . . . . . . . . . . . . . . . . . 11
10
10.1
10.2
10.3
10.3.1
10.3.2
10.3.3
Protocol description . . . . . . . . . . . . . . . . . . . . 31
ULPI references . . . . . . . . . . . . . . . . . . . . . . . 31
TXCMD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
RXCMD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Linestate encoding. . . . . . . . . . . . . . . . . . . . . 32
VBUS valid comparator . . . . . . . . . . . . . . . . . . 11
Session valid comparator . . . . . . . . . . . . . . . . 11
Session end comparator. . . . . . . . . . . . . . . . . 11
SRP charge and discharge resistors . . . . . . . 12
Port power control. . . . . . . . . . . . . . . . . . . . . . 12
Band gap reference voltage . . . . . . . . . . . . . . 12
Power-On Reset (POR) . . . . . . . . . . . . . . . . . 12
Power-up, reset and bus idle sequence . . . . . 13
Interface protection. . . . . . . . . . . . . . . . . . . . . 15
Interface behavior with respect to
VBUS state encoding. . . . . . . . . . . . . . . . . . . . 33
Using and selecting the VBUS state encoding. 34
10.3.3.1 Standard USB host controllers. . . . . . . . . . . . 34
10.3.3.2 Standard USB peripheral controllers . . . . . . . 35
10.3.3.3 OTG devices . . . . . . . . . . . . . . . . . . . . . . . . . 35
8.9
8.10
8.11
8.11.1
8.11.2
10.3.4
RxEvent encoding . . . . . . . . . . . . . . . . . . . . . 35
10.3.4.1 RxActive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.3.4.2 RxError. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
10.3.4.3 HostDisconnect . . . . . . . . . . . . . . . . . . . . . . . 36
RESET_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Interface behavior with respect to
8.11.3
10.4
10.5
Register read and write operations . . . . . . . . 36
USB reset and high-speed detection
chip select. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Detailed description of pins . . . . . . . . . . . . . . 16
DATA[7:0] . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
VCC(I/O) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
RREF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DP and DM . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
CFG0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
8.12
handshake (chirp) . . . . . . . . . . . . . . . . . . . . . 36
USB packet transmit and receive . . . . . . . . . . 39
USB packet timing . . . . . . . . . . . . . . . . . . . . . 39
8.12.1
8.12.2
8.12.3
8.12.4
8.12.5
8.12.6
8.12.7
8.12.8
8.12.9
10.6
10.6.1
10.6.1.1 ISP1705 pipeline delays. . . . . . . . . . . . . . . . . 39
10.6.1.2 Allowed link decision time . . . . . . . . . . . . . . . 39
10.7
10.8
10.8.1
Preamble . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
USB suspend and resume . . . . . . . . . . . . . . . 42
Full-speed or low-speed host-initiated
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
REG3V3 and REG1V8 . . . . . . . . . . . . . . . . . . 18
suspend and resume . . . . . . . . . . . . . . . . . . . 42
High speed suspend and resume . . . . . . . . . 43
Remote wake-up . . . . . . . . . . . . . . . . . . . . . . 46
No automatic SYNC and EOP generation
10.8.2
10.8.3
10.9
8.12.10 VBUS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
8.12.11 PSW_N. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
8.12.12 XTAL1 and XTAL2. . . . . . . . . . . . . . . . . . . . . . 19
8.12.13 DIR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
8.12.14 RESET_N . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
(optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
On-The-Go operations . . . . . . . . . . . . . . . . . . 48
10.10
continued >>
ISP1705_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 13 June 2008
88 of 89
ISP1705
NXP Semiconductors
ULPI Hi-Speed USB transceiver
10.10.1 OTG comparators . . . . . . . . . . . . . . . . . . . . . . 49
10.10.2 Pull-up and pull-down resistors. . . . . . . . . . . . 49
10.10.3 ID detection. . . . . . . . . . . . . . . . . . . . . . . . . . . 49
10.10.4
10.11
10.12
10.13
VBUS charge and discharge resistors . . . . . . . 49
Serial modes. . . . . . . . . . . . . . . . . . . . . . . . . . 49
Aborting transfers . . . . . . . . . . . . . . . . . . . . . . 51
Avoiding contention on the ULPI data bus . . . 51
11
Register map . . . . . . . . . . . . . . . . . . . . . . . . . . 52
VENDOR_ID_LOW register . . . . . . . . . . . . . . 52
VENDOR_ID_HIGH register. . . . . . . . . . . . . . 52
PRODUCT_ID_LOW register . . . . . . . . . . . . . 53
PRODUCT_ID_HIGH register . . . . . . . . . . . . 53
FUNC_CTRL register . . . . . . . . . . . . . . . . . . . 53
INTF_CTRL register . . . . . . . . . . . . . . . . . . . . 55
OTG_CTRL register . . . . . . . . . . . . . . . . . . . . 56
USB_INTR_EN_R register . . . . . . . . . . . . . . . 58
USB_INTR_EN_F register . . . . . . . . . . . . . . . 58
USB_INTR_STAT register. . . . . . . . . . . . . . . . 59
USB_INTR_L register. . . . . . . . . . . . . . . . . . . 59
DEBUG register . . . . . . . . . . . . . . . . . . . . . . . 60
SCRATCH register . . . . . . . . . . . . . . . . . . . . . 61
CARKIT_CTRL register . . . . . . . . . . . . . . . . . 61
PWR_CTRL register. . . . . . . . . . . . . . . . . . . . 62
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
11.11
11.12
11.13
11.14
11.15
12
13
14
15
16
17
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 63
Recommended operating conditions. . . . . . . 63
Static characteristics. . . . . . . . . . . . . . . . . . . . 64
Dynamic characteristics . . . . . . . . . . . . . . . . . 69
Application information. . . . . . . . . . . . . . . . . . 73
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 77
18
Soldering of SMD packages . . . . . . . . . . . . . . 79
Introduction to soldering . . . . . . . . . . . . . . . . . 79
Wave and reflow soldering . . . . . . . . . . . . . . . 79
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 79
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 80
18.1
18.2
18.3
18.4
19
20
21
22
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 81
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 83
23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 84
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 84
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 84
23.1
23.2
23.3
23.4
24
25
26
27
Contact information. . . . . . . . . . . . . . . . . . . . . 84
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 June 2008
Document identifier: ISP1705_1
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