JN5169-001-M03-2 [NXP]
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules;
| 型号： | JN5169-001-M03-2 |
| 厂家： | 
NXP |
| 描述： | ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules |
| 文件： | 总27页 (文件大小：801K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
JN5169-001-M0x-2
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
Rev. 3.0 — 19 September 2016
Product data sheet
1. General description
The JN5169-001-M0x-2 (with x = 0, 3 or 6) module family provides designers with a
ready-made component that provides a fully integrated solution for applications, using the
IEEE802.15.4 standard in the 2.4 GHz - 2.5 GHz ISM frequency band, including ZigBee
3.0 and ZigBee PRO stack with Home Automation, Light Link and Smart Energy profiles.
The modules integrate all of the RF components required, removing the need to perform
expensive RF design and test. Products can be designed by simply connecting sensors
and switches to the module IO pins. The modules use NXP’s single chip IEEE802.15.4
wireless microcontroller, allowing designers to make use of the extensive chip
development support material. Hence, this range of modules allows designers to bring
wireless applications to market in the minimum time with significantly reduced
development effort and cost.
3 variants are available: JN5169-001-M00-2, JN5169-001-M03-2 and
JN5169-001-M06-2. All modules have FCC modular approval. The JN5169-001-M00-2
and JN5169-001-M03-2 are also CE-compliant and subject to a Notified Body Opinion.
The variants available are described in the Table 1.
1.1 Regulatory Approvals
The JN5169-001-M00-2 and JN5169-001-M03-2 have been tested against the
requirements of the following European standards.
• Radio EN 300 328 v 1.9.1
• EMC, EN 301 489-17 v 2.2.1, EN 62479 2010, EN 301 489-1 v 1.9.2
• Basic Safety Assessment (BSA) EN 60950-1:2006
A Notified Body statement of opinion for this standard is available on request.
The High-power module with M06 suffix is not approved for use in Europe.
Additionally, both module types have received FCC “Modular Approval”, in compliance
with CFR 47 FCC part 15 regulations and in accordance to FCC public notice DA00-1407.
The modular approvals notice and test reports are available on request.
The JN5169-001-M06-2 module is subject to user proximity restrictions under FCC
regulations; more specific information is available in Section 13.1.2.
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
2. Features and benefits
2.1 Benefits
Microminiature module solutions
Ready to use in products
Minimizes product development time
No RF test required for systems
Compliant with:
FCC 47CFR Part 15C
ETSI EN 300-328 V1.9
EN 301-489-17 V2.2.1
EN60950-1-2006
Temperature range: 40 C to +85 C
Lead-free and RoHS compliant
2.2 Features: modules
2.4 GHz IEEE 802.15.4, ZigBee 3.0 and ZigBee PRO stack with Home Automation,
Light Link and Smart Energy compatible
JN5169-001-M00-2
Dimensions: 16 mm 30 mm
Integrated printed antenna
TX power 8.5 dBm/10 dBm
Receiver sensitivity –96 dBm
TX current 27.2 mA at 10 dBm
TX current 23.6 mA at 8.5 dBm
RX current 17.8 mA at maximum input level 10 dBm
RX current 16.2 mA at maximum input level 0 dBm
2.0 V/3.6 V operation
JN5169-001-M03-2
Dimensions: 16 mm 21 mm
Fl connector
TX power 8.5 dBm/10 dBm
Receiver sensitivity –96 dBm
TX current 27.2 mA at 10 dBm
TX current 23.6 mA at 8.5 dBm
RX current 17.8 mA at maximum input level 10 dBm
RX current 16.2 mA at maximum input level 0 dBm
2.0 V/3.6 V operation
JN5169-001-M06-2
Dimensions: 16 mm 30 mm
Fl connector
TX power 22 dBm
Receiver sensitivity –100 dBm
TX current 181 mA at 22 dBm
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
2 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
RX current 22.8 mA at maximum input level 10 dBm
2.0 V/3.6 V operation
2.3 Features: microcontroller
32-bit RISC CPU; 1 MHz to 32 MHz clock speed
Variable instruction width for high coding efficiency
Multi-stage instruction pipeline
512 kB Flash
32 kB RAM
4 kB EEPROM
Data EEPROM with guaranteed 100 k write operations
2-wire I2C-bus compatible serial interface; can operate as either master or slave
5 PWM (4 timers, 1 timer/counter)
2 low-power sleep counters
2 UARTs
SPI-bus Master and Slave port, 3 selects
Supply voltage monitor with 8 programmable thresholds
6-input 10-bit ADC, comparator
Battery and temperature sensors
Watchdog and Supply Voltage Monitor (SVM)
Up to 20 Digital IO (DIO) pins
3. Applications
Robust and secure low-power wireless applications
ZigBee Smart Energy networks
ZigBee Home Automation networks
Toys and gaming peripherals
Energy harvesting - for example, self-powered light switch
4. Overview
The JN5169-001-M0x-2 family is a range of ultra-low power, high performance surface
mount modules targeted at IEEE 802.15.4, ZigBee 3.0 and ZigBee Home Automation,
Light Link and Smart Energy networking applications, enabling users to realize products
with minimum time to market and at the lowest cost. They remove the need for expensive
and lengthy development of custom RF board designs and test suites. The modules use
NXP’s JN5169 wireless microcontroller to provide a comprehensive solution with large
memory, high CPU and radio performance and all RF components included. All that is
required to develop and manufacture wireless control or sensing products is to connect a
power supply and peripherals such as switches, actuators and sensors, considerably
simplifying product development.
3 module variants are available: JN5169-001-M00-2 with an integrated printed antenna,
JN5169-001-M03-2 and JN5169-001-M06-2 with a FL antenna connector. The
JN5169-001-M06-2 also has a power amplifier and LNA for extended range.
JN5169M0x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
3 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
5. Ordering information
Table 1.
Ordering information
Type number
Description
FCCID
JN5169-001-M00-2
JN5169-001-M03-2
JN5169-001-M06-2
Standard power, integrated printed antenna
Standard power, FL connector
High power, FL connector
XXMJN5169M0V2
XXMJN5169M3V2
XXMJN5169M6V2
For further details, refer to the Wireless Connectivity area of the NXP web site Ref. 3.
6. Marking
aaa-022822
(1) With x = 0, 3 or 6.
Fig 1. JN5169-001-M0x-2 package marking (top view)
Table 2.
Marking code
Line number
Line 1
Marking code
NXP Logo: B&W outline logo - 2D barcode (internal NXP usage)
Line 2
part ID: JN5169-001-M0x-2, with x the module type, 0, 3 or 6
Line 3
serial number: NNNNN
Line 4
• Z: SSMC
• b: SPIL
• H: halogen free
• Y: year
• WW: week code
Line 5
Line 6
FFC ID = FCCID: XXMJN5169MxV2, with x the module type 0, 3 or 6
IC ID = IC: 8764A-JN5169Mx, with x the module type 0, 3 or 6
JN5169M0x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
4 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
JN5169-001-M0x-2 modules meet the requirements of Directive 2002/95/EC of the
European Parliament and of the Council on the Restriction of Hazardous Substance
(RoHS) and of the Chinese RoHS requirements SJ/T11363-2006 which came into force
on 1 March 2007.
7. Block diagram
WATCHDOG
TIMER
RAM
32 kB
FLASH
512 kB
SPI-BUS
MASTER AND SLAVE
MATCHING
M00 option
integrated
antenna
2.4 GHz
RADIO
2-WIRE SERIAL
(MASTER/SLAVE)
VOLTAGE
BROWNOUT
32-BIT
INCLUDING
DIVERSITY
RISC CPU
4 X PWM
PLUS TIMER
µFL
CONNECTOR
O-QPSK
MODEM
MATCHING
M03 option
external
antenna
2 X UART
4kB
EEPROM
20 DIO
PLUS 2 DO
µFL
CONNECTOR
PA/LNA
SE2431
MATCHING
M06 option
IEEE802.15.4
MAC
ACCELERATOR
external
antenna
SLEEP
COUNTER
6 CHAN
10 BIT ADC
128-BIT AES
ENCRYPTION
ACCELERATOR
POWER
MANAGEMENT
BATTERY AND
TEMP SENSORS
XTAL
JN5169
POWER
aaa-022823
Fig 2. Block diagram
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
5 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
8. Pinning information
8.1 Pinning
ADC1
DO0/SPICLK/PWM2
1
2
3
4
5
6
7
8
9
27 VREF/ADC2
26 DIO17/SPISMISO/SIF_D/COMP1M/PWM4
25 DIO16/SPISMISO/SIF_CLK/COMP1P
DO1/SPIMISO/PWM3
(4)
DIO18/SPIMOSI
24 DIO15
(3)
DIO19/SPISEL0
23 DIO14
DIO0/ADO/SPISEL1/ADC3
DIO1/ADE/SPISEL2/ADC4/PC0
DIO2/RFRX/TIM0CK_GT/ADC5
DIO3/RFTX/TIM0CAP/ADC6
22 RESET_N
(2)
21 DIO13
(1)
20 DIO12
19 DIO11/PWM1/TXD1
Transparent top view
aaa-022824
The same basic pin configuration applies for all module designs. However, DIO2 (pin 8) and DIO3 (pin 9) are not available on
the JN5169-001-M06-2.
(1) Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.
(2) Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.
(3) Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.
(4) Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.
Fig 3. Pin configuration
8.2 Pin description
Table 3.
Symbol
ADC1
Pin description
Pin Type[1] Description
ADC1 — ADC input
1
I
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
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JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
Table 3.
Pin description …continued
Symbol
Pin Type[1] Description
DO0/SPICLK/PWM2[2]
2
O
DO0 — DO0
SPICLK — SPI-bus master clock output
PWM2 — PWM2 output
DO1/SPIMISO/PWM3[3]
3
I/O
DO1 — DO1
SPIMISO — SPI-bus Master In, Slave Out input
PWM3 — PWM3 output
DIO18/SPIMOSI
4
5
6
I/O
I/O
I/O
DIO18 — DIO18
SPIMOSI — SPI-bus Master Out Slave In output
DIO19 — DIO19
DIO19/SPISEL0
SPISEL0 — SPI-bus Master Select Output 0
DIO0 — DIO0
DIO0/ADO/SPISEL1/ADC3
ADO — antenna diversity odd output
SPISEL1 — SPI-bus master select output 1
ADC3 — ADC input: ADC3
DIO1 — DIO1
DIO1/ADE/SPISEL2/ADC4/PC0
7
I/O
ADE — antenna diversity even output
SPISEL2 — SPI-bus master select output 2
ADC4 — ADC input: ADC4
PC0 — pulse counter 0 input
DIO2 — DIO2
DIO2/RFRX/TIM0CK_GT/ADC5[4]
DIO3/RFTX/TIM0CAP/ADC6[4]
8
9
I/O
I/O
RFRX — radio receives control output
TIM0CK_GT — timer0 clock/gate input
ADC5 — ADC input: ADC5
DIO3 — DIO3
RFTX — radio transmit control output
TIM0CAP — timer0 capture input
ADC6 — ADC input: ADC6
DIO4 — DIO4
DIO4/CTS0/JTAG_TCK/TIM0OUT/PC0
10 I/O
11 I/O
12 I/O
CTS0 — UART 0 clear to send input
JTAG_TCK — JTAG CLK input
TIM0OUT — timer0 PWM output
PC0 — pulse counter 0 input
DIO5 — DIO5
DIO5/RTS0/JTAG_TMS/PWM1/PC1
DIO6/TXD0/JTAG_TDO/PWM2
RTS0 — UART 0 request to send output
JTAG_TMS — JTAG mode select input
PWM1 — PWM1 output
PC1 — pulse counter 1 input
DIO6 — DIO6
TXD0 — UART 0 transmit data output
JTAG_TDO — JTAG data output
PWM2 — PWM2 data output
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
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JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
Table 3.
Pin description …continued
Symbol
Pin Type[1] Description
DIO7/RXD0/JTAG_TDI/PWM3
13 I/O
14 I/O
15 I/O
DIO7 — DIO7
RXD0 — UART 0 receive data input
JTAG_TDI — JTAG data input
PWM3 — PWM 3 data output
DIO8 — DIO8
DIO8/TIM0CK_GT/PC1/PWM4
TIM0CK_GT — timer0 clock/gate input
PC1 — pulse counter1 input
PWM4 — PWM 4 output
DIO9/TIM0CAP/32KXTALIN/RXD1/32KIN
DIO9 — DIO9
TIM0CAP — Timer0 Capture input
32KXTALIN — 32 kHz External Crystal input
RXD1 — UART1 Receive Data input
32KIN — 32 kHz External clock input
DIO10 — DIO10
DIO10/TIM0OUT/32KXTALOUT
16 I/O
TIM0OUT — Timer0 PWM Output
32KXTALOUT — 32 kHz External Crystal output
VDD — supply voltage
VDD
17
P
VSS
18 GND
19 I/O
ground
DIO11/PWM1/TXD1
DIO11 — DIO11
PWM1 — PWM1 output
TXD1 — UART1 Transmit Data output
DIO12 — DIO12
DIO12[5]
20 I/O
PWM2 — PWM2 output
CTS0 — UART0 clear to send input
JTAG_TCK — JTAG CLK input
ADO — antenna diversity odd output
SPISMOSI — SPI-bus slave Master Out, Slave In input
DIO13 — DIO13
DIO13[6]
21 I/O
PWM3 — PWM3 output
RTS0 — UART0 request to send output
JTAG_TMS — JTAG mode select input
ADE — antenna diversity even output
SPISMISO — SPI-bus slave master in slave out output
RESET_N — reset input
RESET_N
DIO14[7]
22
I
23 I/O
DIO14 — DIO14
SIF_CLK — serial interface clock
TXD0 — UART 0 transmit data output
TXD1 — UART 1 transmit data output
JTAG_TDO — JTAG data output
SPISEL1 — SPI-bus master select output 1
SPISSEL — SPI-bus slave select input
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
8 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
Table 3.
Symbol
DIO15[8]
Pin description …continued
Pin Type[1] Description
24 I/O
DIO15 — DIO15
SIF_D — serial interface data
RXD0 — UART 0 receive data input
RXD1 — UART 1 receive data input
JTAG_TDI — JTAG data input
SPISEL2 — SPI-bus master select output 2
SPISCLK — SPI-bus slave clock input
DIO16 — DIO16
DIO16/SPISMOSI/SIF_CLK/COMP1P
DIO17/SPISMISO/SIF_D/COMP1M
25 I/O
COMP1P — comparator positive input
SIF_CLK — Serial Interface clock
SPISMOSI — SPI-bus Slave Master Out Slave In input
DIO17 — DIO17
26 I/O
COMP1M — COMP1M; comparator negative input
SIF_D — Serial Interface Data
SPISMISO — SPI-bus Slave Master In Slave Out output
PWM4 — PWM 4 output
VREF/ADC2
27
P
I
VREF — analog peripheral reference voltage
ADC2 — ADC input 2
[1] P = power supply; G = ground; I = input, O = output; I/O = input/output.
[2] JTAG programming mode: must be left floating high during reset to avoid entering JTAG programming mode.
[3] UART programming mode: leave pin floating high during reset to avoid entering UART programming mode or hold it low to program.
[4] Not available on the JN5169-001-M06-2 since they are used to control the front-end module.
[5] Multi-function: DIO12/PWM2/CTS0/JTAG_TCK/ADO/SPISMOSI.
[6] Multi-function: DIO13/PWM3/RTS0/JTAG_TMS/ADE/SPISMISO.
[7] Multi-function: DIO14/SIF_CLK/TXD0/TXD1/JTAG_TDO/SPISEL1/SPISSEL.
[8] Multi-function: DIO15/SIF_D/RXD0/RXD1/JTAG_TDI/SPISEL2/SPISCLK.
9. Functional description
9.1 JN5169 single chip wireless microcontroller
The JN5169-001-M0x-2 series is constructed around the JN5169-001 single chip wireless
microcontroller, which includes the radio system, a 32-bit RISC CPU, Flash, RAM and
EEPROM memory and a range of analog and digital peripherals.
The chip is described fully in JN5169 Wireless Microcontroller Datasheet (see Ref. 2).
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
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JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
9.2 Peripherals
Table 4.
Peripherals description
Peripherals
JN5169-001-M00-2 JN5169-001-M03-2 JN5169-001-M06-2 Notes
Master SPI-bus port
Slave SPI-bus port
UART
3 selects
3 selects
3 selects
250 kHz - 16 MHz
250 kHz - 4 MHz
16550 compatible
Up to 400 kHz
1
2
1
1
2
1
1
2
1
Two-wire serial I/F (compatible with
SMbus and I2C-bus)
PWM
16 MHz clock
timer
4
4
4
timer/counter
1
1
1
Programmable Sleep Timers
2
2
2
32 kHz clock
Digital IO lines (multiplexed with
UARTs, timers and SPI-bus selects)
20
20
18
DIO2 and DIO3 are
not available on
JN5169-001-M06-2
modules
Analog-to-Digital converter
6
1
6
1
6
1
10-bit, up to
100 ks/s
Programmable analog comparator
ultra low-power
mode for sleep
Internal temperature sensor
Internal battery sensor
1
1
1
1
1
1
The performance of all peripherals is defined in the JN5169 Wireless Microcontroller
Datasheet (see Ref. 2).
NXP supplies all the development tools and networking stacks needed to enable
end-product development to occur quickly and efficiently. These are all freely available
from the NXP Wireless Connectivity (see Ref. 3). A range of evaluation/developer kits is
also available, allowing products to be quickly bread boarded. Efficient development of
software applications is enabled by the provision of a complete, unlimited, software
developer kit. Together with the available libraries for the IEEE802.15.4 MAC and
ZigBee 3.0 and ZigBee PRO network stacks, this package provides everything required to
develop application code and to trial it with hardware representative of the final module.
The modules can be user programmed both in development and in production using
software supplied by NXP. Access to the on-chip peripherals, MAC and network stack
software is provided through specific APIs. This information is available on the NXP
support website, together with many example applications, user guides, reference
manuals and application notes.
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
10 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
10. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
0.3
0.3
Max
Unit
V
VDD
supply voltage
+3.6
VVREF/ADC2 voltage on pin VREF/ADC2
VDD + 0.3
V
V
VADC1
VIO(dig)
Tstg
voltage on pin ADC1
digital input/output voltage
storage temperature
0.3
0.3
40
VDD + 0.3
V
V
VDD + 0.3
V
V
+150
C
11. Recommended operating conditions
Table 6.
Symbol
VDD
Operating conditions
Parameter
Conditions
Min
Max
3.6
Unit
V
[1]
supply voltage
2
Tamb
ambient temperature
standard range
40
+85
C
[1] To reach the maximum TX power, 2.8 V is the minimum.
12. Characteristics
12.1 DC current
Table 7.
Active processing
VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
supply current M00
radio in receive mode; maximum input level at 10 dBm
Conditions
Min
Typ
Max Unit
IDD
-
-
-
-
17.8
16.1
25
-
-
-
-
mA
mA
mA
mA
radio in receive mode; maximum input level at 0 dBm
radio in transmit mode 10 dBm
[1]
[1]
radio in transmit mode 8.5 dBm
22.7
M03
radio in receive mode; maximum input level at 10 dBm
radio in receive mode; maximum input level at 0 dBm
radio in transmit mode 10 dBm
-
-
-
-
17.8
16.1
25
-
-
-
-
mA
mA
mA
mA
[1]
[1]
radio in transmit mode 8.5 dBm
22.7
M06
radio in receive mode
radio in transmit mode
-
-
21.5
153
-
-
mA
mA
[1]
[1] To reach the maximum TX power, VDD = 2.8 V is the minimum.
JN5169M0x
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© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
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JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
Table 8.
Sleep mode
VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IDD(IO)
input/output supply
current
in sleep mode; with I/O and RC oscillator
timer wake-up; Tamb = 25 C
-
0.73
-
A
Table 9.
Deep sleep mode
VDD = 2 V to 3.6 V; Tamb = 40 C to +85 C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
IDD
supply current
deep sleep mode; measured at 25 C and
-
70
-
nA
VDD = 3.3 V
[1] Waiting on chip RESET or I/O event.
12.2 AC characteristics
12.2.1 Radio transceiver
These modules meet all the requirements of the IEEE802.15.4 standard over 2.0 V
to 3.6 V and offers the improved RF characteristics shown in Table 10. All RF
characteristics are measured single ended.
Table 10. RF port characteristics
Single-ended; Impedance = 50 [1]; VDD = 2 V to 3.6 V; Tamb = 40C to +85C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
frange
frequency range
2.4
-
2.485 GHz
[1] With external matching inductors and assuming PCB layout.
Table 11. Radio transceiver characteristics: +25 C
VDD = 2 V to 3.6 V; unless otherwise specified.
Symbol
Receiver
M00
Parameter
Conditions
Min
Typ
Max
Unit
SRX
receiver sensitivity
nominal for 1 % PER, as per 802.15.4
-
-
96
-
-
dBm
dBm
Pi(RX)(max) maximum receiver input 1 % PER, measured as sensitivity; supply
10
power
current at 17.8 mA
1 % PER, measured as sensitivity; supply
current at 16.2 mA
-
0
-
-
dBm
dB
RSSI
RSSI variation
95 dBm to 10 dBm; available through
4
+4
JN5169M0x Integrated Peripherals API
M03
SRX
receiver sensitivity
nominal for 1 % PER, as per 802.15.4
-
-
96
-
-
dBm
dBm
Pi(RX)(max) maximum receiver input 1 % PER, measured as sensitivity; supply
10
power
current at 17.8 mA
1 % PER, measured as sensitivity; supply
current at 16.2 mA
-
0
-
-
dBm
dB
RSSI
RSSI variation
95 dBm to 10 dBm; available through
4
+4
JN5169M0x Integrated Peripherals API
M06
JN5169M0x
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Table 11. Radio transceiver characteristics: +25 C …continued
VDD = 2 V to 3.6 V; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
100
5
Max
Unit
dBm
dBm
SRX
receiver sensitivity
nominal for 1 % PER, as per 802.15.4
-
-
-
-
Pi(RX)(max) maximum receiver input 1 % PER, measured as sensitivity
power
RSSI
RSSI variation
100 dBm to 25 dBm; available through
JN5169M0x Integrated Peripherals API
4
-
+4
dB
Transmitter
M00
Po
[1]
[1]
[2]
output power
IDD = 27.2 mA
-
-
-
10
-
-
-
dBm
dBm
dB
IDD = 23.6 mA
8.5
42
Po(cr)
control range output
power
in 6 major steps and then 4 fine steps
M03
Po
[1]
[1]
[2]
output power
IDD = 27.2 mA
-
-
-
10
-
-
-
dBm
dBm
dB
IDD = 23.6 mA
8.5
42
Po(cr)
control range output
power
in 6 major steps and then 4 fine steps
M06
Po
[1]
output power
-
22
-
dBm
[1] To reach the maximum TX power, 2.8 V is the minimum on VDD
.
[2] Up to an extra 2.5 dB of attenuation is available if required.
13. Application information
13.1 Federal Communication Commission Interference Statement
This equipment has been tested and found to comply with the limits for a Class B digital
device, according to Part 15 of the FCC Rules, see Ref. 4. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment and receiver
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected
• Consult the dealer or an experienced radio/TV technician for help
This device complies with Part 15 of the FCC Rules, see Ref. 4. Operation is subject to
the following two conditions:
1. This device may not cause harmful interference
JN5169M0x
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2. this device must accept any interference received, including interference that may
cause undesired operation
FCC Caution: Any changes or modifications not expressly approved by the party
responsible for compliance could void the user's authority to operate this equipment.
Remark: FCC Radiation Exposure Statement:
This portable equipment with its antenna complies with FCC’s RF radiation exposure
limits set forth for an uncontrolled environment. To maintain compliance, follow the
instructions below;
1. This transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
2. Avoid direct contact to the antenna, or keep it to a minimum while using this
equipment.
This transmitter module is authorized to be used in other devices only by OEM integrators
under the following condition:
The transmitter module must not be co-located with any other antenna or transmitter.
As long as the above condition is met, further transmitter testing will not be required.
However, the OEM integrator is still responsible for testing their end product for any
additional compliance requirements required with this module installed (for example,
digital device emissions, PC peripheral requirements, etc.).
This applies to the JN5169-001-M00-2 and JN5169-001-M03-2 devices, the
JN5169-001-M06-2 is a mobile device (see Section 13.1.2).
13.1.1 Antennas approved by FCC for use with JN5169-001-M0x-2
Table 12. Antennas description (FCC)
Brand
Model Number
E-0005-AC
E-2411-GC
E-2410-CA
E-2410-HA
E-2410-GC
E-2820-CA
E-2820-GC
Description
Gain (dBi) Connector type
1
2
3
4
5
6
7
8
9
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
vertical- flying lead
2
RP-SMA
RP-SMA
FL
vertical - swivel
2
vertical - bulkhead- flying lead
vertical- flying lead
2
2
FL
vertical - swivel
2
RP-SMA
FL
vertical - bulkhead- flying lead
vertical - swivel
2
2
RP-SMA
RP-SMA
FL
Embedded Antenna Design FBKR35068-RS-KR
vertical - knuckle antenna
vertical - knuckle-flying lead
vertical - knuckle-flying lead
vertical - knuckle-flying lead
vertical - right angle
2
Nearson
S131CL-L-PX-2450S
WRR2400-IP04
WRR2400-RPSMA
E-6170-DA
2
10 Laird Technologies
11 Laird Technologies
12 Aveslink Technology, Inc
13 Laird Technologies
1.5
1.3
1
FL
RP-SMA
FL
WCR2400-SMRP
vertical - knuckle antenna
1
RP-SMA
JN5169M0x
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This device has been designed to operate with the antennas listed above, and having a
maximum gain of 2 dBi. Alternative vertical antennas may be used provided that the gain
does not exceed 2 dBi. Antennas having a gain greater than 2 dBi are strictly prohibited
for use with this device.
The required antenna impedance is 50 .
13.1.2 High-power module usage limitation
The high-power module variants are classified as ‘mobile’ device pursuant with FCC §
2.1091 and must not be used at a distance of < 20 cm (8”) from any people. This applies
to the JN5169-001-M06-2 module type (XXMJN5169M6V2).
Remark: In the event that these conditions cannot be met (for certain configurations or
co-location with another transmitter), then the FCC authorization is no longer considered
valid and the FCC ID cannot be used on the final product. In these circumstances, the
OEM integrator will be responsible for re-evaluating the end product (including the
transmitter) and obtaining a separate FCC authorization.
The OEM integrator has to be aware not to provide information to the end user regarding
how to install or remove this RF module in the user manual of the end product.
The user manual for the end product must include the following information in a prominent
location;
“To comply with FCC’s RF radiation exposure requirements, the antenna(s) used for this
transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.”
13.1.3 FCC end product labeling
The final ‘end product’ should be labeled in a visible area with the following:
“Contains TX FCC ID: XXMJN5169M0V2, XXMJN5169M3V2 or XXMJN5169M6V2” to
reflect the version of the module being used inside the product.
13.2 European R&TTE Directive 1999/5/EC statement
JN5169-001-M00-2 and JN5169-001-M03-2 are compliant with ETSI EN 300 328 V1.9,
EMC, EN 301 489-17 v2.1.1 (2009-02) and the Basic Safety Assessment (BSA) EN
60950-1:2006 (2006-06) and are subject to a Notified Body Opinion.
These modules are approved for use with the antennas listed in the following table. The
JN5169-001-M06-2 module is not approved for use in Europe.
Alternative vertical antennas may be used provided that the gain does not exceed 2 dBi.
Table 13. Antennas description (R&TTE)
Brand
Model Number
E-0005-AC
E-2411-GC
E-2410-CA
E-2410-HA
E-2410-GC
Description
Gain (dBi) Connector type
1
2
3
4
5
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
Aveslink Technology, Inc
vertical- flying lead
vertical - swivel
2
2
2
2
2
RP-SMA
RP-SMA
FL
vertical - bulkhead- flying lead
vertical- flying lead
vertical - swivel
FL
RP-SMA
JN5169M0x
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Table 13. Antennas description (R&TTE) …continued
Brand
Model Number
E-2820-CA
Description
Gain (dBi) Connector type
6
7
8
9
Aveslink Technology, Inc
Aveslink Technology, Inc
vertical - bulkhead- flying lead
vertical - swivel
2
FL
E-2820-GC
2
RP-SMA
RP-SMA
FL
Embedded Antenna Design FBKR35068-RS-KR
vertical - knuckle antenna
vertical - knuckle-flying lead
vertical - knuckle-flying lead
vertical - knuckle-flying lead
Vertical - right angle
2
Nearson
S131CL-L-PX-2450S
WRR2400-IP04
WRR2400-RPSMA
E-6170-DA
2
10 Laird Technologies
11 Laird Technologies
12 Aveslink Technology, Inc
13 Laird Technologies
1.5
1.3
1
FL
RP-SMA
FL
WCR2400-SMRP
Vertical - knuckle antenna
1
RP-SMA
JN5169M0x
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14. Footprint and PCB placement
14.1 Footprint information for reflow soldering
16
1.27
Ø 1
2.54
1.5
2.54
Dimensions in mm
All modules have the same footprint.
3.30
1
aaa-022825
Fig 4. Footprint information for reflow soldering of modules
14.2 Optimal PCB placement of the module JN5169-001-M00-2
The JN5169-001-M00-2 module features an optimised, low cost, integrated, inverted F,
printed PCB antenna. The antenna has a vertically polarised near omnidirectional
radiation pattern and up to 1.6 dBi of peak gain. The PCB design has been elongated in
order to increase the ground plane area which increases the antenna efficiency. This
allows stand alone operation without any additional ground plane however care must be
taken when mounting this module onto another PCB. The area around the antenna must
be kept clear of conductors or other metal objects for an absolute minimum of 20 mm.
This is true for all layers of the PCB and not just the top layer. Any conductive objects
close to the antenna could severely disrupt the antenna pattern resulting in deep nulls and
high directivity in some directions.
The Figure 5 shows various possible scenarios. The top 3 scenarios are correct;
groundplane may be placed beneath JN5169-001-M00-2 modules as long as it does not
protrude beyond the edge of the top layer ground plane on the module PCB.
The bottom 3 scenarios are incorrect; the left-hand side example because there is
groundplane underneath the antenna, the middle example because there is insufficient
clearance around the antenna (it is best to have no conductors anywhere near the
antenna), finally the right-hand example has a battery’s metal casing in the recommended
keep out area.
JN5169M0x
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aaa-024222
Fig 5. PCB placement of the JN5169-001-M00-2 modules
14.3 Reflow Profile
For reflow soldering, it is recommended to follow the reflow profile in Figure 6 as a guide,
as well as the paste manufacturer’s guidelines on peak flow temperature, soak times, time
above liquid and ramp rates.
aaa-024461
250
Temperature
(°C)
200
150
100
50
0
0
20
40
60
80
100 120 140 160 180 200 220 240 260 280
Time (seconds)
Fig 6. Guide for reflow profile of JN5169-001-M0x-2
JN5169M0x
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Table 14. Recommended solder reflow profile
Temperature range (°C)
Target time range (s)
between 90 and ~130
between 30 and ~60
between 20 and ~50
between 10 and ~20
between 150 and ~260
from 25 to ~160
from 160 to ~220
from 220 to ~230
from 230 to ~peak
from 25 to ~peak
14.4 Soldering paste and cleaning
NXP does not recommend use of a solder paste that requires the module and PCB
assembly to be cleaned (rinsed in water) for the following reasons:
• Solder flux residues and water can be trapped by the PCB, can or components and
result in short circuits
NXP recommends use of a 'no clean' solder paste for all its module products.
JN5169M0x
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15. Package outline
16
30
1.27
2.54
2.54
3.30
Thickness: 3.5 mm
Dimensions in mm
aaa-022826
Fig 7. Package outline JN5169-001-M00-2
16
10.85
2.53
1.27
21
2.54
2.54
3.30
Thickness: 3.5 mm
Dimensions in mm
aaa-022827
Fig 8. Package outline JN5169-001-M03-2
JN5169M0x
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16
8
2.81
30
1.27
2.54
2.54
3.30
Thickness: 3.5 mm
Dimensions in mm
aaa-022828
Fig 9. Package outline JN5169-001-M06-2
16. Abbreviations
Table 15. Abbreviations
Acronym
AC
Description
Alternating Current
ADC
API
Analog-to-Digital Converter
Application Program Interface
Conformity European
Central Processing Unit
Direct Current
CE
CPU
DC
DIO
Digital Input Output
EEPROM
FCC
ID
Electrically Erasable Programmable Read-Only Memory
Federal Communication Commission
IDentification
IO
Input Output
ISM
Industrial, Scientific and Medical radio bands
Joint Test Action Group
JTAG
LNA
Low Noise Amplifier
JN5169M0x
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Table 15. Abbreviations …continued
Acronym Description
MAC
OEM
PC
Media Access Control
Original Equipment Manufacturer
Pulse Counter
PCB
PER
PRO
PWM
TX
Printed-Circuit Board
Packet Error Rate
PROtocol
Pulse-Width Modulation
Transmit
R&TTE
RAM
RC
Radio And Terminal Telecommunication Equipment
Random Access Memory
Resistance-Capacitance
Radio Frequency
RF
RISC
RoHS
RSSI
RX
Reduced Instruction Set Computing
Restriction of Hazardous Substance
Received Signal Strength Indicator
Receive
UART
Universal Asynchronous Receiver Transmitter
17. References
[1] IEEE Std 802.15.4-2003 — IEEE Std 802.15.4-2003 IEEE Standard for Information
Technology – Part 15.4 Wireless Medium Access Control (MAC) and Physical Layer
(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs).
[2] JN5169 — JN5169 wireless microcontroller data sheet.
[3] Wireless Connectivity —
http://www.nxp.com/products/interface-and-connectivity/wireless-connectivity:WIRE
LESS-CONNECTIVITY
[4] Part 15 of the FCC Rules —
http://www.ecfr.gov/cgi-bin/text-idx?SID=d01e00935bfcb0d53b914e7c8e63f383&no
de=47:1.0.1.1.16&rgn=div5
JN5169M0x
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18. Revision history
Table 16. Revision history
Document ID
Release date
20160919
Data sheet status
Change notice
Supersedes
JN5169-001-M0x-2 v3.0
Modifications:
Product data sheet
-
JN5169-001-M0x-2 v2.0
• Section 1 updated.
• Section 2 updated.
• Section 4 updated.
• Section 6 updated.
• Figure 2 updated.
• Figure 3 updated.
• Table 7 updated.
• Table 9 updated.
• Table 11 updated.
• Table 12 updated.
• Table 13 updated.
• Section 14 updated.
• Section 14.3 added.
• Section 14.4 added.
• Section 17 updated.
JN5169-001-M0x-2 v2.0
JN5169-001-M0x-2 v1.1
JN5169-001-M0x-2 v1.0
Modifications:
20160530
Preliminary data sheet
-
-
-
JN5169-001-M0x-2 v1.1
20160524
Objective data sheet
Objective data sheet
JN5169-001-M0x-2 v1.0
-
20160513
• initial version.
JN5169M0x
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19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
19.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
JN5169M0x
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
JN5169M0x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
25 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
21. Tables
Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .4
Table 2. Marking code . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Table 3. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .6
Table 4. Peripherals description . . . . . . . . . . . . . . . . . .10
Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 6. Operating conditions . . . . . . . . . . . . . . . . . . . .11
Table 7. Active processing . . . . . . . . . . . . . . . . . . . . . .11
Table 8. Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Table 9. Deep sleep mode . . . . . . . . . . . . . . . . . . . . . . 12
Table 10. RF port characteristics . . . . . . . . . . . . . . . . . . 12
Table 11. Radio transceiver characteristics: +25 °C . . . . 12
Table 12. Antennas description (FCC) . . . . . . . . . . . . . . 14
Table 13. Antennas description (R&TTE) . . . . . . . . . . . . 15
Table 14. Recommended solder reflow profile . . . . . . . . 19
Table 15. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23
22. Figures
Fig 1. JN5169-001-M0x-2 package marking (top view) . .4
Fig 2. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Fig 3. Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .6
Fig 4. Footprint information for reflow soldering of
modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Fig 5. PCB placement of the JN5169-001-M00-2
modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Fig 6. Guide for reflow profile of JN5169-001-M0x-2. . .18
Fig 7. Package outline JN5169-001-M00-2 . . . . . . . . . .20
Fig 8. Package outline JN5169-001-M03-2 . . . . . . . . . .20
Fig 9. Package outline JN5169-001-M06-2 . . . . . . . . . .21
JN5169M0x
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet
Rev. 3.0 — 19 September 2016
26 of 27
JN5169-001-M0x-2
NXP Semiconductors
ZigBee 3.0, ZigBee PRO and IEEE802.15.4 modules
23. Contents
1
1.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Regulatory Approvals . . . . . . . . . . . . . . . . . . . . 1
19.2
19.3
19.4
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 2
Benefits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Features: modules . . . . . . . . . . . . . . . . . . . . . . 2
Features: microcontroller . . . . . . . . . . . . . . . . . 3
20
21
22
23
Contact information . . . . . . . . . . . . . . . . . . . . 25
Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.1
2.2
2.3
3
4
5
6
7
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
8.1
8.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 6
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
9
9.1
9.2
Functional description . . . . . . . . . . . . . . . . . . . 9
JN5169 single chip wireless microcontroller. . . 9
Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
10
11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommended operating conditions. . . . . . . 11
12
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
AC characteristics. . . . . . . . . . . . . . . . . . . . . . 12
Radio transceiver . . . . . . . . . . . . . . . . . . . . . . 12
12.1
12.2
12.2.1
13
13.1
Application information. . . . . . . . . . . . . . . . . . 13
Federal Communication Commission Interference
Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Antennas approved by FCC for use with
13.1.1
JN5169-001-M0x-2. . . . . . . . . . . . . . . . . . . . . 14
High-power module usage limitation. . . . . . . . 15
FCC end product labeling. . . . . . . . . . . . . . . . 15
European R&TTE Directive 1999/5/EC
13.1.2
13.1.3
13.2
statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
14
14.1
14.2
Footprint and PCB placement . . . . . . . . . . . . 17
Footprint information for reflow soldering . . . . 17
Optimal PCB placement of the module
JN5169-001-M00-2. . . . . . . . . . . . . . . . . . . . . 17
Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . 18
Soldering paste and cleaning . . . . . . . . . . . . . 19
14.3
14.4
15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 21
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
16
17
18
19
19.1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 September 2016
Document identifier: JN5169M0x
相关型号：
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