MC145407DW [NXP]
IC,LINE TRANSCEIVER,CMOS,3 DRIVER,3 RCVR,SOP,20PIN,PLASTIC;
| 型号： | MC145407DW |
| 厂家： | 
NXP |
| 描述： | IC,LINE TRANSCEIVER,CMOS,3 DRIVER,3 RCVR,SOP,20PIN,PLASTIC 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总8页 (文件大小：208K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Order this document
by MC145407/D
SEMICONDUCTOR TECHNICAL DATA
Advance Information
P SUFFIX
PLASTIC DIP
CASE 738
EIA–232–E and CCITT V.28
20
1
The MC145407 is a silicon–gate CMOS IC that combines three drivers and
three receivers to fulfill the electrical specifications of EIA–232–E and CCITT
V.28 while operating from a single + 5 V power supply. A voltage doubler and
inverter convert the + 5 V to ± 10 V. This is accomplished through an on–board
20 kHz oscillator and four inexpensive external electrolytic capacitors. The
three drivers and three receivers of the MC145407 are virtually identical to
those of the MC145406. Therefore, for applications requiring more than three
drivers and/or three receivers, an MC145406 can be powered from an
MC145407, since the MC145407 charge pumps have been designed to
guarantee ± 5 V at the output of up to six drivers. Thus, the MC145407 provides
a high–performance, low–power, stand–alone solution or, with the MC145406,
a + 5 V only, high–performance two–chip solution.
DW SUFFIX
SOG PACKAGE
CASE 751D
20
1
ORDERING INFORMATION
MC145407P
MC145407DW
Plastic DIP
SOG Package
PIN ASSIGNMENT
Drivers
•
•
•
•
•
± 7.5 V Output Swing
300 Ω Power–Off Impedance
Output Current Limiting
TTL and CMOS Compatible Inputs
Slew Rate Range Limited from 4 V/µs to 30 V/µs
1
20
C2+
C1+
2
19
GND
V
CC
3
4
18
17
C2–
C1–
Receivers
•
•
•
+ 25 V Input Range
3 to 7 kΩ Input Impedance
0.8 V Hysteresis for Enhanced Noise Immunity
V
V
DD
SS
5
6
7
16
15
14
R
R
Rx1
Tx1
Rx2
Tx2
Rx3
DO1
DI1
Charge Pumps
•
•
+ 5 V to ± 10 V Dual Charge Pump Architecture
Supply Outputs Capable of Driving Three On–Chip Drivers and Three
Drivers on the MC145406 Simultaneously
Requires Four Inexpensive Electrolytic Capacitors
On–Chip 20 kHz Oscillator
D
D
D
DO2
DI2
•
•
8
13
12
11
9
R
DO3
10
Tx3
DI3
D = DRIVER
R = RECEIVER
This document contains information on a new product. Specifications and information herein are subject to change without notice.
REV 1
10/95
Motorola, Inc. 1995
FUNCTION DIAGRAM
CHARGE PUMPS
OSC
GND
V
CC
+
C4
VOLTAGE
DOUBLER
VOLTAGE
INVERTER
C3
+
V
C1
C2
SS
V
DD
+
+
C1 – C1 +
C2 + C2 –
RECEIVER
DRIVER
V
DD
V
DD
V
DD
V
*
CC
15 kΩ
V
CC
Rx
+
–
DO
300
Ω
+
–
DI
LEVEL
SHIFT
Tx
5.4 k
1.4 V
V
SS
1.0 V
1.8 V
V
* Proctection circuit
SS
MC145407
2
MOTOROLA
MAXIMUM RATINGS (Voltage polarities referenced to GND)
This device contains protection circuitry to
protect the inputs against damage due to high
static voltages or electric fields; however, it is
advised that normal precautions be taken to
avoid application of any voltage higher than
maximum rated voltages to this high imped-
ance circuit. For proper operation, it is recom-
mendedthatthevoltagesattheDIandDOpins
Rating
DC Supply Voltages
Symbol
Value
Unit
V
V
CC
– 0.5 to + 6.0
Input Voltage Range
V
IR
V
Rx1 – Rx3 Inputs
DI1 – DI3 Inputs
V
– 15 to V
+ 15
+ 0.5)
SS
– 0.5 to (V
DD
CC
DC Current per Pin
Power Dissipation
I
± 100
mA
W
be constrained to the range GND ≤ V ≤ V
DI CC
P
D
1
and GND ≤ V
DO
≤ V . Also, the voltage at
CC
the Rx pin should be constrained to (V
Operating Temperature Range
Storage Temperature Range
T
A
– 40 to + 85
°C
°C
SS
– 15 V) ≤ V
should be constrained to V
≤ (V
DD
+ 15 V), and Tx
≤ V
Rx1 – Rx3
T
stg
– 85 to + 150
SS
Tx1 – Tx3
≤ V
DD
.
Unused inputs must always be tied to
appropriate logic voltage level (e.g., GND or
V
CC
foDI, and GND for Rx).
DC ELECTRICAL CHARACTERISTICS (All polarities referenced to GND = 0 V; C1, C2, C3, C4 = 10 µF; T = – 40 to + 85°C)
A
Parameter
Symbol
Min
4.5
—
Typ
5
Max
5.5
Unit
V
DC Supply Voltage
V
CC
Quiescent Supply Current
(Outputs unloaded, inputs low)
I
1.2
3.0
mA
CC
Output Voltage
I
I
= 0 mA
= 5 mA
= 10 mA
V
8.5
7.5
6
10
9.5
9
11
—
—
V
load
load
DD
I
I
load
I
I
= 0 mA
= 5 mA
= 10 mA
V
– 8.5
– 7.5
– 6
– 10
– 9.2
– 8.6
–11
—
—
load
load
SS
load
RECEIVER ELECTRICAL SPECIFICATIONS
= + 5 V ± 10%; C1, C2, C3, C4 = 10 µF; T = – 40 to + 85°C)
(Voltage polarities referenced to GND = 0 V; V
CC
A
Characteristic
Symbol
Min
Typ
Max
Unit
Input Turn–on Threshold
= V
Rx1 – Rx3
Rx1 – Rx3
V
1.35
1.8
2.35
V
on
V
DO1 – DO3
OL
Input Turn–off Threshold
= V
V
off
0.75
1.0
1.25
V
V
DO1 – DO3
OH
Input Threshold Hysteresis (V – V
)
Rx1 – Rx3
Rx1 – Rx3
DO1 – DO3
V
0.6
3.0
0.8
5.4
—
V
kΩ
V
on off
hys
Input Resistance
R
7.0
in
High–Level Output Voltage
V
OH
V
= – 3 V to – 25 V
= – 20 µA
= – 1 mA
Rx1 – Rx3
I
I
V
V
– 0.1
—
4.3
—
—
OH
OH
CC
CC
– 0.7
Low–Level Output Voltage
= + 3 V to + 25 V
DO1 – DO3
V
OL
V
V
Rx1 – Rx3
I
I
= + 20 µA
= + 1.6 mA
—
—
0.01
0.5
0.1
0.7
OL
OL
MOTOROLA
MC145407
3
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V: V
= +5 V ±10%; C1, C2, C3, C4 = 10 µF; T = –40 to +85°C)
A
CC
Characteristic
Symbol
Min
Typ
Max
Unit
Digital Input Voltage
Logic 0
Logic 1
DI1 – DI3
DI1 – DI3
V
V
—
2.0
—
—
0.8
—
IL
V
IH
Input Current
GND ≤ V
DI1 – DI3
I
in
—
—
± 1.0
µA
V
≤ V
CC
Output High Voltage
= Logic 0, R = 3.0 kΩ
Tx1 – Tx3
Tx1 – Tx6*
V
OH
6
5
7.5
6.5
—
—
V
DI1 – DI3
Output Low Voltage
= Logic 1, R = 3.0 kΩ
L
Tx1 – Tx3
Tx1 – Tx6*
V
OL
– 6
– 5
– 7.5
– 6.5
—
—
V
V
DI1 – DI3
L
Off Source Impedance (Figure 1)
Tx1 – Tx3
Tx1 – Tx3
Tx1 – Tx3 shorted to GND**
Tx1 – Tx3 shorted to ± 15 V***
Z
300
—
—
Ω
off
Output Short–Circuit Current
I
mA
SC
V
CC
= + 5.5 V
—
—
—
—
± 60
± 100
*Specifications for an MC145407 powering an MC145406 with three additional drivers/receivers.
**Specificationis for one Tx output pin to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation
limits could be exceeded.
***This condition could exceed package limitations.
SWITCHING CHARACTERISTICS (V
CC
= + 5 V ± 10%; C1, 2, C3, C4 = 10 µF; T = – 40 to + 85°C; See Figures 2 and 3)
A
Characteristic
Symbol
Min
Typ
Max
Unit
Drivers
Propagation Delay Time
Low–to–High
Tx1 – Tx3
t
µs
PLH
R
= 3 kΩ, C = 50 pF or 2500 pF
—
—
0.5
0.5
1
1
L
L
High–to–Low
= 3 kΩ, C = 50 pF r 2500 pF
t
PHL
SR
R
L
L
Output Slew Rate
Minimum Load: R = 7 kΩ, C = 0 pF
Tx1 – Tx3
V/µs
µs
—
9.0
—
± 30
L
L
Maximum Load: R = 3 kΩ, C = 2500 pF
4.0
—
L
L
Receivers (C = 50 pF)
L
Propagation Delay Time
Low–to–High
DO1 – DO3
t
t
—
—
—
—
—
—
1
PLH
High–to–Low
Output Rise Time
Output Fall Time
1
PHL
DO1 – DO3
DO1 – DO3
t
r
250
40
400
100
ns
ns
t
f
MC145407
4
MOTOROLA
PIN DESCRIPTIONS
17
19
V
V
CC
V
DD
CC
15
13
11
6
Digital Power Supply (Pin 19)
DI1
Tx1
The digital supply pin, which is connected to the logic pow-
er supply. This pin should have a 0.33 µF capacitor to
ground.
8
DI2
Tx2
V
in =
±
2 V
GND
Ground (Pin 2)
10
DI3
Tx3
Ground return pin is typically connected to the signal
ground pin of the EIA–232–E connector (Pin 7) as well as to
the logic power supply ground.
V
4
V
SS GND
2
in
I
R
=
out
V
DD
Positive Power Supply (Pin 17)
This is the positive output of the on–chip voltage doubler
and the positive power supply input of the driver/receiver
sections of the device. This pin requires an external storage
capacitor tfilter the 50% duty cycle voltage generated by
the charge pump.
Figure 1. Power–Off Source Resistance
V
SS
Negative Power Supply (Pin 4)
This is the negative output of the on–chip voltage doubler/
inverter and the negative power supply input of the driver/re-
ceiver sections of the device. This pin requires an external
storage capacitor to filter the 50% duty cycle voltage gener-
ated by the charge pump.
DRIVERS
3 V
0 V
DI1 – DI3
50%
t
t
f
r
V
C2+, C2–, C1–, C1+
Voltage Doubler and Inverter (Pins 1, 3, 18, 20)
OH
90%
Tx1 – Tx3
10%
t
V
These are the connections to the internal voltage doubler
and inverter, which generate the V
OL
and V voltages.
DD
SS
t
PLH
PHL
Rx1, Rx2, Rx3
Receive Data Input (Pins 5, 7, 9)
RECEIVERS
+ 3 V
0 V
These are the EIA–232–E receive signal inputs. A voltage
between + 3 and + 25 V is decoded as a space and causes
the corresponding DO pin to swing to ground (0 V). A voltage
between – 3 and – 25 V is decoded as a mark, and causes
Rx1 – Rx3
50%
t
t
PLH
PHL
the DO pin to swing up to V
.
CC
V
OH
90%
50%
10%
DO1, DO2, DO3
DO1 – DO3
Data Output (Pins 16, 14, 12)
These are the receiver digital output pins, which swing
from V to GND. Each output pin is capable of driving one
V
OL
t
t
r
f
CC
LSTTL input load.
Figure 2. Switching Characteristics
DI1, DI2, DI3
Data Input (Pins 15, 13, 11)
These are the high impedance digital input pins to the driv-
ers. Input voltage levels on these pins must be between V
and GND.
CC
DRIVERS
3 V
3 V
Tx1, Tx2, Tx3
Tx1 – Tx3
Transmit Data Output (Pins 6, 8, 10)
– 3 V
SLH
– 3 V
t
t
These are the EIA–232–E transmit signal output pins,
which swing toward V and V A logic 1 at a DI input
SHL
DD
SS.
– 3 V – (3 V)
3 V – ( – 3 V)
SLEW RATE (SR) =
OR
causes the corresponding Tx output to swing toward V . A
SS
t
t
SHL
SLH
logic 0 causes the output to swing toward V . The actual
DD
levels and slew rate achieved will depend on the output load-
Figure 3. Slew Rate Characterization
ing (R C ).
L
L
MOTOROLA
MC145407
5
using 10 µF charge pump caps to illustrate its capability in
driving a companion MC145406 or MC145403. If there is no
requirement to support a second interface device and/or the
charge pump is not being used to power any other com-
ponents, the MC145407 is capable of complying with
EIA–232–E and V.28 with smaller value charge pump caps.
Table 1 summarizes driver performance with both 2.2 µF and
1.0 µF charge pump caps.
APPLICATIONS INFORMATION
ESD CONSIDERATIONS
ESD protection on IC devices that have their pins acces-
sible to the outside world is essential. High static voltages
applied to the pins when someone touches them either di-
rectly or indirectly can cause damage to gate oxides and
transistor junctions by coupling a portion of the energy from
the I/O pin to the power supply busses of the IC. This cou-
pling will usually occur through the internal ESD protection
diodes. The key to protecting the IC is to shunt as much of
the energy to ground as possible before it enters the IC. Fig-
ure 7 shows a technique which will clamp the ESD voltage at
approximately + 15 V using the MMBZ15VDLT1. Any resid-
ual voltage which appears on the supply pins is shunted to
ground through the 0.1 µF capacitors.
Table 1. Typical Performance
Parameter
@ 25°C
2.2 µF
7.3
1.0 µF
7.2
Tx V
Tx V
Tx V
Tx V
OH
OH
OL
OL
@ 85°C
@ 25°C
@ 85°C
7.2
7.1
– 6.5
– 6.4
– 6.1
– 6.0
OPERATION WITH SMALLER VALUE CHARGE PUMP
CAPS
Tx Slew Rate @ 5°C
Tx Slew Rae @ 85°C
8.0 V/µs
7.0 V/µs
8.0 V/µs
7.0 V/µs
The MC145407 is characterized in the electrical tables
+ 5 V
0.1 µF
0.1
X
µF
0.1 µF
1.0 µF
17
+
19
6
20
1
9
3
V
TLA
DSI
V
DD
V
CC
in
C1 –
DD
C2 –
C
RTLA
DSI
3.579
MHz
R
1.0 µF
1.0 µF
DSI
DTMF
INPUT
1
8
3
X
C2 +
DI1
C1 +
Tx1
out
17
15
20 k
Ω
15
16
13
0.1 µF
TxA
RxA2
CD
6
5
11
5
DO1
DI2
8
2
TxD
RxD
R
600
Tx
10 µF
MC145442
OR
MC145443
10 kΩ
EIA–232–E
DB–25
CONNECTOR
10 kΩ
Rx1
16
+
MC145407
RxA1
TIP
14
2
8
7
9
SQT
LB
Tx2
Rx2
600:600
3
7
*
10 kΩ
RING
18
10
DI3
ExI
FB
V
DD
C
FB
10 kΩ
0.1
µ
F
Rx3
13
7
0.1 µF
MODE
CDA
19
4
V
BYPASS
DD
V
AG
CDT
V
GND
V
SS
SS
C
4
2
CDA
0.1
µ
F
12
0.1
C
µF
CDT
1.0 µF
0.1 µF
V
BYPASS
SS
* Line protection circuit
Figure 4. 5 V, 300 Baud Modem with EIA–232–E Interface
MC145407
6
MOTOROLA
+ 5 V
1
2
3
4
16
15
1
2
20
10
µF
V
V
CC
C1+
DD
C2+
GND
C2–
19
18
10
µF
V
Rx1
Tx1
Rx2
DO1
DI1
10 µF
CC
14
13
12
11
10
9
3
4
5
6
7
C1–
17
16
15
14
13
12
11
V
V
DO2
SS
DD
MC145406
5
6
7
8
Tx2
Rx3
Tx3
MC145407
Rx1
Tx1
Rx2
Tx2
Rx3
DI2
DO1
DI1
DO3
DI3
DO2
8
9
V
GND
SS
DI2
DO3
DI3
10 µF
10
Tx3
Figure 5. MC145406/MC145407 5 V Only Solution for up to Six EIA–232–E Drivers and Receivers
+ 5 V
+ 10 V
C2
C2+
GND
C2–
C1+
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
0.1
0.1
µ
µ
F
F
V
CC
C1–
V
V
DD
SS
C4
Figure 6. Two Supply Configuration (MC145407 Generates V
SS
Only)
+ 5 V
MMBZ15VDLT
× 6
C2
C4
C1
C2+
GND
C2–
C1+
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
0.1
µ
µ
F
F
V
CC
C1–
V
V
C3
SS
DD
Rx1
Tx1
Rx2
Tx2
Rx3
Tx3
DO1
DI1
0.1
DO2
DI2
TO
CONNECTOR
DO3
DI3
Figure 7. ESD Protection Scheme
MOTOROLA
MC145407
7
PACKAGE DIMENSIONS
P SUFFIX
PLASTIC DIP
CASE 738–03
-A-
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
20
1
11
10
B
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
C
L
INCHES
MILLIMETERS
DIM
A
B
C
D
E
F
G
J
K
L
M
N
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
1.27 BSC
1.27
2.54 BSC
0.21
MAX
27.17
6.60
4.57
0.55
1.010
.240
0.150
0.015
0.050 BSC
0.050
0.100 BSC
0.008
0.110
-T-
SEATING
PLANE
K
M
0.070
1.77
E
N
0.015
0.140
0.38
3.55
G
F
J 20 PL
2.80
0.300 BSC
15
0.040
7.62 BSC
15
0.51 1.01
D 20 PL
M
M
0.25 (0.00)
T
B
0°
°
0°
°
0.020
M
M
0.25 (0.010)
T
A
DW SUFFIX
SOG PACKAGE
CASE 751D–04
NOTES:
–A–
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
20
11
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
10X P
–B–
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
M
M
0.010 (0.25)
B
1
10
MILLIMETERS
INCHES
20X D
DIM
A
B
C
D
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
MAX
0.510
0.299
0.104
0.019
0.035
J
0.499
0.292
0.093
0.014
0.020
M
S
S
0.010 (0.25)
T
A
B
F
F
G
J
K
M
P
R
1.27 BSC
0.050 BSC
0.25
0.10
0
0.32
0.25
7
0.010
0.004
0
0.012
0.009
7
R X 45
10.05
0.25
10.55
0.75
0.395
0.010
0.415
0.029
C
SEATING
PLANE
–T–
M
18X G
K
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit,
andspecifically disclaims any and all liability, includingwithoutlimitationconsequentialorincidentaldamages. “Typical” parameters can and do vary in different
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MC145407/D
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