NX3L1G384_11_技术文档

NX3L1G384

Low-ohmic single-pole single-throw analog switch

Rev. 4 — 7 January 2011

Product data sheet

1. General description

The NX3L1G384 is a low-ohmic single-pole single-throw analog switch. It has two

input/output terminals (Y and Z) and an active LOW enable input pin (E). When E is HIGH,

the analog switch is turned off.

Schmitt trigger action at the enable input (E) makes the circuit tolerant to slower input rise

and fall times. The NX3L1G384 allows signals with amplitude up to V_CCto be transmitted

from Y to Z; or from Z to Y. Its low ON resistance (0.5 Ω) and flatness (0.13 Ω) ensures

minimal attenuation and distortion of transmitted signals.

2. Features and benefits

Wide supply voltage range from 1.4 V to 4.3 V

Very low ON resistance (peak):

1.6 Ω (typical) at V_CC= 1.4 V

1.0 Ω (typical) at V_CC= 1.65 V

0.55 Ω (typical) at V_CC= 2.3 V

0.50 Ω (typical) at V_CC= 2.7 V

0.50 Ω (typical) at V_CC= 4.3 V

High noise immunity

ESD protection:

HBM JESD22-A114F Class 3A exceeds 7500 V

MM JESD22-A115-A exceeds 200 V

CDM AEC-Q100-011 revision B exceeds 1000 V

IEC61000-4-2 contact discharge exceeds 4000 V for switch ports

CMOS low-power consumption

Latch-up performance exceeds 100 mA per JESD 78 Class II Level A

Direct interface with TTL levels at 3.0 V

Control input accepts voltages above supply voltage

High current handling capability (350 mA continuous current under 3.3 V supply)

Specified from −40 °C to +85 °C and from −40 °C to +125 °C

3. Applications

Cell phone

PDA

Portable media player

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

4. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

NX3L1G384GW

NX3L1G384GM

−40 °C to +125 °C

TSSOP5 plastic thin shrink small outline package; 5 leads;

body width 1.25 mm

SOT353-1

−40 °C to +125 °C

XSON6 plastic extremely thin small outline package; no leads; SOT886

6 terminals; body 1 × 1.45 × 0.5 mm

5. Marking

Table 2.

Marking codes^[1]

Type number

NX3L1G384GW

NX3L1G384GM

Marking code

ML

[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.

6. Functional diagram

Y

Z

E

Z

Y

E

001aag476

001aai598

Fig 1. Logic symbol

Fig 2. Logic diagram

7. Pinning information

7.1 Pinning

NX3L1G384

Y

Z

1

2

3

6

5

4

V

CC

1

2

3

5

4

Y

Z

V

E

CC

n.c.

E

GND

001aai610

Transparent top view

001aai609

Fig 3. Pin configuration SOT353-1 (TSSOP5)

Fig 4. Pin configuration SOT886 (XSON6)

NX3L1G384

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

7.2 Pin description

Table 3.

Symbol

Pin description

Description

SOT353-1

SOT886

Y

1

2

3

4

-

1

2

3

4

5

6

independent input or output

independent output or input

ground (0 V)

Z

GND

E

enable input (active LOW)

not connected

n.c.

V_CC

5

supply voltage

8. Functional description

Table 4.

Function table^[1]

Input E

Switch

L

ON-state

OFF-state

H

[1] H = HIGH voltage level; L = LOW voltage level.

9. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

V_CC

V_I

Parameter

Conditions

enable input E

V_I< −0.5 V

Min

−0.5

−50

-

Max

+4.6

Unit

V

supply voltage

input voltage

[1]

[2]

V

V_SW

I_IK

switch voltage

input clamping current

V_CC+ 0.5 V

-

mA

I_SK

switch clamping current V_I< −0.5 V or V_I> V_CC+ 0.5 V

±50

±350

mA

I_SW

switch current

V_SW> −0.5 V or V_SW< V_CC+ 0.5 V;

-

source or sink current

V_SW> −0.5 V or V_SW< V_CC+ 0.5 V;

pulsed at 1 ms duration, < 10 % duty cycle;

peak current

-

±500

mA

T_stg

P_tot

storage temperature

total power dissipation

−65

+150

250

°C

[3]

T_amb= −40 °C to +125 °C

-

mW

[1] The minimum input voltage rating may be exceeded if the input current rating is observed.

[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed but may not

exceed 4.6 V.

[3] For TSSOP5 package: above 87.5 °C the value of P_totderates linearly with 4.0 mW/K.

For XSON6 package: above 118 °C the value of P_totderates linearly with 7.8 mW/K.

NX3L1G384

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Product data sheet

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3 of 18

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Low-ohmic single-pole single-throw analog switch

10. Recommended operating conditions

Table 6.

Recommended operating conditions

Symbol Parameter

Conditions

Min

1.4

0

Max

4.3

Unit

V

V_CC

V_I

supply voltage

input voltage

enable input E

4.3

V

[1]

[2]

V_SW

T_amb

Δt/ΔV

switch voltage

0

V_CC

+125

200

V

ambient temperature

input transition rise and fall rate

−40

-

°C

ns/V

V_CC= 1.4 V to 4.3 V

[1] To avoid sinking GND current from of terminal Z when switch current flows in terminal Y, the voltage drop across the bidirectional switch

must not exceed 0.4 V. If the switch current flows into terminal Z, no GND current will flow from terminal Y. In this case, there is no limit

for the voltage drop across the switch.

[2] Applies to control signal levels.

11. Static characteristics

Table 7.

Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground 0 V).

Symbol Parameter

Conditions

T_amb= 25 °C

T_amb= −40 °C to +125 °C Unit

Min

Typ

Max

Min

Max

(85 °C) (125 °C)

V_IH

HIGH-level

input voltage

V_CC= 1.4 V to 1.95 V

V_CC= 2.3 V to 2.7 V

V_CC= 2.7 V to 3.6 V

V_CC= 3.6 V to 4.3 V

V_CC= 1.4 V to 1.95 V

V_CC= 2.3 V to 2.7 V

V_CC= 2.7 V to 3.6 V

V_CC= 3.6 V to 4.3 V

0.65V_CC

-

0.65V_CC

-

V

μA

1.7

-

1.7

2.0

-

2.0

0.7V_CC

-

0.35V_CC

0.7

0.7V_CC

V_IL

LOW-level

input voltage

-

0.35V_CC0.35V_CC

0.7

0.8

0.7

0.8

0.3V_CC

-

0.3V_CC0.3V_CC

I_I

input leakage enable input E;

±0.5

±1

current

V_I= GND to 4.3 V;

V_CC= 1.4 V to 4.3 V

I_S(OFF)

OFF-state

leakage

current

Y port; see Figure 5

V_CC= 1.4 V to 3.6 V

V_CC= 3.6 V to 4.3 V

Z port; see Figure 6

V_CC= 1.4 V to 3.6 V

V_CC= 3.6 V to 4.3 V

-

±5

-

±50

±500 nA

±10

I_S(ON)

ON-state

leakage

current

-

±5

-

±50

±500 nA

±10

I_CC

supply current V_I= V_CCor GND;

V_SW= GND or V_CC

V_CC= 3.6 V

V_CC= 4.3 V

-

100

150

-

690

800

6000 nA

7000 nA

NX3L1G384

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Product data sheet

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NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

Table 7.

Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground 0 V).

Symbol Parameter

Conditions

T_amb= 25 °C

T_amb= −40 °C to +125 °C Unit

Min

Typ

Max

Min

Max

(85 °C) (125 °C)

C_I

input

capacitance

-

1.0

35

-

pF

C_S(OFF)OFF-state

capacitance

C_S(ON)

ON-state

110

capacitance

11.1 Test circuits

V

CC

V

CC

E

Z

E

Z

V

IH

V

IL

Y

I

S

GND

V

O

I

O

I

001aag479

001aag480

V_I= 0.3 V or V_CC− 0.3 V; V_O= V_CC− 0.3 V or 0.3 V.

V_I= 0.3 V or V_CC− 0.3 V; V_O= open circuit.

Fig 5. Test circuit for measuring OFF-state leakage

current

Fig 6. Test circuit for measuring ON-state leakage

current

11.2 ON resistance

Table 8.

ON resistance

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14.

Symbol Parameter Conditions T_amb= −40 °C to +85 °C T_amb= −40 °C to +125 °C Unit

Min

Typ^[1]

Max

Min

Max

R_ON(peak)ON resistance V_I= GND to V_CC

;

(peak)

I_SW= 100 mA; see Figure 7

V_CC= 1.4 V

-

1.6

1.0

3.7

1.6

-

4.1

1.7

0.9

Ω

V_CC= 1.65 V

V_CC= 2.3 V

0.55

0.5

0.8

V_CC= 2.7 V

0.75

V_CC= 4.3 V

0.5

NX3L1G384

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

Table 8.

ON resistance …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for graphs see Figure 8 to Figure 14.

Symbol Parameter Conditions T_amb= −40 °C to +85 °C T_amb= −40 °C to +125 °C Unit

Min

Typ^[1]

Max

Min

Max

[2]

R_ON(flat)

ON resistance V_I= GND to V_CC;

(flatness)

I_SW= 100 mA

V_CC= 1.4 V

V_CC= 1.65 V

V_CC= 2.3 V

V_CC= 2.7 V

V_CC= 4.3 V

-

1.0

0.5

3.3

1.2

0.3

0.4

-

3.6

1.3

Ω

0.15

0.13

0.2

0.35

0.45

[1] Typical values are measured at T_amb= 25 °C.

[2] Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical V_CCand

temperature.

11.3 ON resistance test circuit and graphs

001aag564

1.6

R

ON

(Ω)

1.2

V

SW

V

(1)

0.8

0.4

0

V

CC

(2)

(3)

E

Z

V

IL

(4)

(5)

(6)

Y

GND

V

I

SW

l

0

1

2

3

4

5

V (V)

I

001aai599

R_ON= V_SW/ I_SW

.

(1) V_CC= 1.5 V.

(2) V_CC= 1.8 V.

(3) V_CC= 2.5 V.

(4) V_CC= 2.7 V.

(5) V_CC= 3.3 V.

(6) V_CC= 4.3 V.

Measured at T_amb= 25 °C.

Fig 7. Test circuit for measuring ON resistance

Fig 8. Typical ON resistance as a function of input

voltage

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

001aag565

001aag564

1.6

R

ON

R

ON

(Ω)

1.2

(1)

(2)

(3)

(4)

(1)

0.8

0.4

0

0.8

0.4

0

(2)

(3)

(4)

(5)

(6)

0

1

2

3

0

1

2

3

4

5

V (V)

I

V (V)

I

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

Fig 9. ON resistance as a function of input voltage;

V_CC= 1.5 V

Fig 10. ON resistance as a function of input voltage;

V_CC= 1.8 V

001aag567

001aag568

1.0

R

ON

R

ON

(Ω)

0.8

0.6

0.4

0.2

0

0.6

0.4

0.2

0

(1)

(2)

(3)

(4)

(1)

(2)

(3)

(4)

0

1

2

3

0

1

2

3

V (V)

I

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

Fig 11. ON resistance as a function of input voltage;

V_CC= 2.5 V

Fig 12. ON resistance as a function of input voltage;

V_CC= 2.7 V

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Product data sheet

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NX3L1G384

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Low-ohmic single-pole single-throw analog switch

001aag569

001aaj896

1.0

R

ON

R

ON

(Ω)

0.8

(1)

(2)

(3)

(4)

0.6

0.4

0.2

0

0.6

0.4

0.2

0

(1)

(2)

(3)

(4)

0

1

2

3

4

0

1

2

3

4

5

V (V)

I

V (V)

I

(1)

T

_amb= 125 °C.

(1) T_amb= 125 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

(2) T_amb= 85 °C.

(3) T_amb= 25 °C.

(4) T_amb= −40 °C.

Fig 13. ON resistance as a function of input voltage;

V_CC= 3.3 V

Fig 14. ON resistance as a function of input voltage;

V_CC= 4.3 V

12. Dynamic characteristics

Table 9.

Dynamic characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for load circuit see Figure 16.

Symbol Parameter

Conditions

T_amb= 25 °C

T_amb= −40 °C to +125 °C Unit

Min

Typ^[1]

Max

Min

Max

(85 °C) (125 °C)

t_en

enable time

E to Z or Y; see Figure 15

V_CC= 1.4 V to 1.6 V

V_CC= 1.65 V to 1.95 V

V_CC= 2.3 V to 2.7 V

V_CC= 2.7 V to 3.6 V

V_CC= 3.6 V to 4.3 V

E to Z or Y; see Figure 15

V_CC= 1.4 V to 1.6 V

V_CC= 1.65 V to 1.95 V

V_CC= 2.3 V to 2.7 V

V_CC= 2.7 V to 3.6 V

V_CC= 3.6 V to 4.3 V

-

27

22

17

14

41

35

26

24

-

44

37

28

25

48

40

31

27

ns

t_dis

disable time

-

9

7

4

17

13

8

-

19

14

9

21

15

10

9

ns

7

8

7

8

9

[1] Typical values are measured at T_amb= 25 °C and V_CC= 1.5 V, 1.8 V, 2.5 V, 3.3 V and 4.3 V respectively.

NX3L1G384

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

12.1 Waveform and test circuits

V

I

V

M

E input

M

GND

t

dis

en

V

OH

Y or Z output

LOW to OFF

OFF to LOW

V

X

GND

switch

disabled

enabled

disabled

001aai600

Measurement points are given in Table 10.

Logic level: V_OHis the typical output voltage that occurs with the output load.

Fig 15. Enable and disable times

Table 10. Measurement points

Supply voltage

V_CC

Input

V_M

Output

V_X

1.4 V to 4.3 V

0.5V_CC

0.9V_OH

V

CC

E

Y/Z

Z/Y

G

V

EXT

= 1.5 V

R

L

C

L

V

V V

O

I

001aai601

Test data is given in Table 11.

Definitions test circuit:

R_L= load resistance.

C_L= load capacitance including jig and probe capacitance.

V_EXT= external voltage for measuring switching times.

Fig 16. Load circuit for switching times

Table 11. Test data

Supply voltage

V_CC

Input

V_I

Load

C_L

t_r, t_f

≤ 2.5 ns

R_L

1.4 V to 4.3 V

V_CC

35 pF

50 Ω

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

12.2 Additional dynamic characteristics

Table 12. Additional dynamic characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V); V_I= GND or V_CC(unless otherwise

specified); t_r= t_f≤ 2.5 ns.

Symbol Parameter

Conditions

T_amb= 25 °C

Unit

Min

Typ

Max

[1]

THD

total harmonic

distortion

f_i= 20 Hz to 20 kHz; R_L= 32 Ω; see Figure 17

V_CC= 1.4 V; V_I= 1 V (p-p)

V_CC= 1.65 V; V_I= 1.2 V (p-p)

V_CC= 2.3 V; V_I= 1.5 V (p-p)

V_CC= 2.7 V; V_I= 2 V (p-p)

V_CC= 4.3 V; V_I= 2 V (p-p)

R_L= 50 Ω; see Figure 18

-

0.15

0.10

0.02

-

%

[1]

f_(−3dB)

−3 dB frequency

response

V_CC= 1.4 V to 4.3 V

-

60

-

MHz

dB

α_iso

isolation (OFF-state)

crosstalk voltage

f_i= 100 kHz; R_L= 50 Ω; see Figure 19

V_CC= 1.4 V to 4.3 V

−90

V_ct

between digital inputs and switch;

f_i= 1 MHz; C_L= 50 pF; R_L= 50 Ω; see Figure 20

V_CC= 1.4 V to 3.6 V

V_CC= 3.6 V to 4.3 V

-

0.2

-

V

Q_inj

charge injection

f_i= 1 MHz; C_L= 0.1 nF; R_L= 1 MΩ; V_gen= 0 V;

R_gen= 0 Ω; see Figure 21

V_CC= 1.5 V

V_CC= 1.8 V

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 4.3 V

-

3

6

-

pC

[1] f_iis biased at 0.5V_CC

.

12.3 Test circuits

V

CC

0.5V

CC

E

V

IL

R

L

Y/Z

Z/Y

f

i

D

001aai602

Fig 17. Test circuit for measuring total harmonic distortion

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

V

CC

0.5V

CC

E

V

IL

R

L

Y/Z

Z/Y

f

i

dB

001aai603

Adjust f_ivoltage to obtain 0 dBm level at output. Increase f_ifrequency until dB meter reads −3 dB.

Fig 18. Test circuit for measuring the frequency response when channel is in ON-state

V

CC

0.5V

CC

E

V

IH

R

L

Y/Z

Z/Y

f

i

dB

001aai604

Adjust f_ivoltage to obtain 0 dBm level at input.

Fig 19. Test circuit for measuring isolation (OFF-state)

V

CC

E

Y/Z

Z/Y

G

V

R

L

C

L

V

O

I

L

0.5V

CC

001aai605

a. Test circuit

logic

input (E)

off

on

off

V

ct

O

001aai606

b. Input and output pulse definitions

Fig 20. Test circuit for measuring crosstalk voltage between digital inputs and switch

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Product data sheet

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Low-ohmic single-pole single-throw analog switch

V

CC

E

R

gen

Y/Z

Z/Y

G

V

gen

R

C

L

I

V

O

L

GND

001aai607

a. Test circuit

logic

input (E)

off

on

off

V

O

001aai608

b. Input and output pulse definitions

Definition: Q_inj= ΔV_O× C_L.

ΔV_O= output voltage variation.

R_gen= generator resistance.

V_gen= generator voltage.

Fig 21. Test circuit for measuring charge injection

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Product data sheet

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NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

13. Package outline

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

SOT353-1

D

E

A

X

c

y

H

v

M

A

E

Z

5

4

A

2

A

(A )

3

A

1

θ

L

p

1

3

e

w M

b

p

detail X

e

1

0

1.5

3 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

A

b

c

D

E

e

1

H

L

p

UNIT

v

w

y

Z

θ

1

2

3

p

E

max.

0.1

0

1.0

0.8

0.30

0.15

0.25

0.08

2.25

1.85

1.35

1.15

2.25

2.0

0.46

0.21

0.60

0.15

7°

0°

mm

1.1

0.65

1.3

0.15

0.425

0.3

0.1

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

00-09-01

03-02-19

SOT353-1

MO-203

SC-88A

Fig 22. Package outline SOT353-1 (TSSOP5)

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Rev. 4 — 7 January 2011

13 of 18

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

b

1

2

3

4×

(2)

L

1

e

6

5

4

e

1

e

1

6×

A

(2)

A

1

D

E

terminal 1

index area

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

A

1

UNIT

b

D

E

e

L

1

max max

0.25

0.17

1.5

1.4

1.05

0.95

0.35 0.40

0.27 0.32

mm

0.5 0.04

0.6

0.5

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

REFERENCES

JEDEC JEITA

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

04-07-15

04-07-22

SOT886

MO-252

Fig 23. Package outline SOT886 (XSON6)

NX3L1G384

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 7 January 2011

14 of 18

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

14. Abbreviations

Table 13. Abbreviations

Acronym

CDM

CMOS

ESD

Description

Charged Device Model

Complementary Metal Oxide Semiconductor

ElectroStatic Discharge

HBM

MM

Human Body Model

Machine Model

PDA

Personal Digital Assistant

Transistor-Transistor Logic

TTL

15. Revision history

Table 14. Revision history

Document ID

NX3L1G384 v.4

Modifications:

Release date

20110107

Data sheet status

Change notice

Supersedes

Product data sheet

-

NX3L1G384 v.3

• Section 2: IEC61000-4-2 added.

NX3L1G384 v.3

NX3L1G384 v.2

NX3L1G384 v.1

20090817

20090406

20080908

Product data sheet

-

NX3L1G384 v.2

NX3L1G384 v.1

-

NX3L1G384

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 7 January 2011

15 of 18

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

16. Legal information

16.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

suitable for use in medical, military, aircraft, space or life support equipment,

16.2 Definitions

nor in applications where failure or malfunction of an NXP Semiconductors

product can reasonably be expected to result in personal injury, death or

severe property or environmental damage. NXP Semiconductors accepts no

liability for inclusion and/or use of NXP Semiconductors products in such

equipment or applications and therefore such inclusion and/or use is at the

customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. The product is not designed, authorized or warranted to be

NX3L1G384

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 7 January 2011

16 of 18

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NX3L1G384

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 7 January 2011

17 of 18

NX3L1G384

NXP Semiconductors

Low-ohmic single-pole single-throw analog switch

18. Contents

1

2

3

4

5

6

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

7

7.1

7.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

8

Functional description . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Recommended operating conditions. . . . . . . . 4

9

10

11

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 5

ON resistance test circuit and graphs. . . . . . . . 6

11.1

11.2

11.3

12

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

Waveform and test circuits . . . . . . . . . . . . . . . . 9

Additional dynamic characteristics . . . . . . . . . 10

Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

12.1

12.2

12.3

13

14

15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

16

Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

16.1

16.2

16.3

16.4

17

18

Contact information. . . . . . . . . . . . . . . . . . . . . 17

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 7 January 2011

Document identifier: NX3L1G384


型号：	NX3L1G384_11
厂家：	NXP
描述：	Low-ohmic single-pole single-throw analog switch 低欧姆的单刀单掷模拟开关开关
文件：	总18页 (文件大小：208K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NX3L1G384_11 [NXP]

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