PBHV8540Z [NXP]
500 V, 0.5 A NPN high-voltage low VCEsat(BISS) transistor; 500 V ， 0.5 A NPN高电压低VCEsat晶体管（ BISS ）晶体管
| 型号： | PBHV8540Z |
| 厂家： | 
NXP |
| 描述： | 500 V, 0.5 A NPN high-voltage low VCEsat(BISS) transistor |
| 文件： | 总12页 (文件大小：126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PBHV8540Z
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
Rev. 01 — 7 February 2008
Product data sheet
1. Product profile
1.1 General description
NPN high-voltage low VCEsat Breakthrough In Small Signal (BISS) transistor in a
SOT223 (SC-73) medium power Surface-Mounted Device (SMD) plastic package.
PNP complement: PBHV9040Z.
1.2 Features
I High voltage
I Low collector-emitter saturation voltage VCEsat
I High collector current capability IC and ICM
I High collector current gain (hFE) at high IC
I AEC-Q101 qualified
1.3 Applications
I Electronic ballast for fluorescent lighting
I LED driver for LED chain module
I LCD backlighting
I High Intensity Discharge (HID) front lighting
I Automotive motor management
I Hook switch for wired telecom
I Switch mode power supply
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
collector-emitter peak voltage VBE = 0 V
Min Typ Max Unit
VCESM
VCEO
IC
-
-
-
-
-
500
400
0.5
-
V
V
A
collector-emitter voltage
collector current
open base
-
-
hFE
DC current gain
VCE = 10 V; IC = 50 mA
100
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
2. Pinning information
Table 2.
Pinning
Pin
1
Description
base
Simplified outline
Symbol
4
2, 4
2
collector
emitter
3
1
4
collector
1
2
3
3
sym016
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
Description
Version
PBHV8540Z
SC-73
plastic surface-mounted package with increased heatsink; SOT223
4 leads
4. Marking
Table 4.
Marking codes
Type number
Marking code
PBHV8540Z
V8540Z
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
2 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
open emitter
open base
Min
Max
500
400
500
6
Unit
V
VCBO
VCEO
VCESM
VEBO
IC
collector-base voltage
-
-
-
-
-
-
collector-emitter voltage
collector-emitter peak voltage
emitter-base voltage
collector current
V
VBE = 0 V
V
open collector
V
0.5
1
A
ICM
peak collector current
single pulse;
A
tp ≤ 1 ms
IBM
Ptot
peak base current
single pulse;
tp ≤ 1 ms
-
-
200
mA
[1]
[2]
total power dissipation
Tamb ≤ 25 °C
0.7
W
1.4
W
Tj
junction temperature
ambient temperature
storage temperature
-
150
+150
+150
°C
°C
°C
Tamb
Tstg
−55
−65
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
006aab155
1600
(1)
P
tot
(mW)
1200
800
400
0
(2)
−75
−25
25
75
125
175
(°C)
T
amb
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, standard footprint
Fig 1. Power derating curves
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
3 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min Typ Max Unit
[1]
[2]
thermal resistance from junction to
ambient
in free air
-
-
-
-
-
-
175
89
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from junction to
solder point
20
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2.
006aab156
3
10
Z
th(j-a)
(K/W)
duty cycle = 1
2
0.75
0.5
0.33
10
0.2
0.1
10
0.05
0.02
0.01
1
0
−1
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab157
3
10
Z
th(j-a)
(K/W)
duty cycle = 1
2
10
0.75
0.5
0.33
0.2
10
0.1
0.05
0.02
0.01
1
0
−1
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, mounting pad for collector 6 cm2
Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
4 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
collector-basecut-off VCB = 320 V; IE = 0 A
Min
Typ
Max
100
10
Unit
nA
ICBO
-
-
-
-
current
VCB = 320 V; IE = 0 A;
µA
Tj = 150 °C
ICES
IEBO
hFE
collector-emitter
cut-off current
VCE = 320 V; IC = 0 A
-
-
-
-
100
100
nA
nA
emitter-base cut-off VEB = 4 V; IC = 0 A
current
DC current gain
VCE = 10 V
IC = 50 mA
100
200
150
20
-
IC = 100 mA
80
10
-
-
[1]
[1]
IC = 300 mA
-
VCEsat
collector-emitter
saturation voltage
IC = 100 mA; IB = 10 mA
IC = 100 mA; IB = 20 mA
IC = 300 mA; IB = 60 mA
IC = 300 mA; IB = 60 mA
100
60
200
90
250
1.1
mV
mV
mV
V
-
-
135
0.91
VBEsat
fT
base-emitter
saturation voltage
-
transition frequency VCE = 10 V;
IC = 100 mA;
-
30
-
MHz
f = 100 MHz
Cc
Ce
collector capacitance VCB = 20 V; IE = ie = 0 A;
f = 1 MHz
-
-
4
-
-
pF
pF
emitter capacitance VEB = 0.5 V;
IC = ic = 0 A; f = 1 MHz
165
td
tr
delay time
rise time
VCC = 6 V; IC = 0.5 A;
-
-
-
-
-
-
50
-
-
-
-
-
-
ns
ns
ns
ns
ns
ns
IBon = 0.1 A;
6200
6250
800
IBoff = −0.1 A
ton
ts
turn-on time
storage time
fall time
tf
2200
3000
toff
turn-off time
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
5 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
006aab174
006aab175
400
1.0
I
(mA) = 35
B
31.5
24.5
I
C
(A)
28
21
h
FE
0.8
17.5
300
14
(1)
(2)
10.5
0.6
0.4
0.2
0
7
200
100
0
3.5
(3)
−1
2
3
10
1
10
10
10
0
1
2
3
4
5
I
(mA)
V
(V)
CE
C
VCE = 10 V
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
Fig 4. DC current gain as a function of collector
current; typical values
Fig 5. Collector current as a function of
collector-emitter voltage; typical values
006aab176
006aab177
1.6
1.3
V
(V)
BE
V
BEsat
(V)
1.2
0.9
0.5
0.1
(1)
(2)
(3)
(1)
(2)
(3)
0.8
0.4
0
−1
2
3
4
−1
2
3
4
10
1
10
10
10
10
(mA)
10
1
10
10
10
10
I (mA)
C
I
C
VCE = 10 V
IC/IB = 5
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
(1) Tamb = −55 °C
(2) Tamb = 25 °C
(3) Tamb = 100 °C
Fig 6. Base-emitter voltage as a function of collector
current; typical values
Fig 7. Base-emitter saturation voltage as a function of
collector current; typical values
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
6 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
006aab178
006aab179
10
10
V
V
CEsat
(V)
CEsat
(V)
1
1
(1)
(2)
(3)
−1
−1
(1)
10
10
10
10
(2)
(3)
−2
−2
−1
2
3
−1
2
3
10
1
10
10
10
10
1
10
10
10
I
(mA)
I (mA)
C
C
IC/IB = 5
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) IC/IB = 20
(2) IC/IB = 10
(3) IC/IB = 5
Fig 8. Collector-emitter saturation voltage as a
function of collector current; typical values
Fig 9. Collector-emitter saturation voltage as a
function of collector current; typical values
006aab180
006aab181
3
3
10
10
R
CEsat
R
CEsat
(Ω)
(Ω)
2
2
10
10
10
10
(1) (2) (3)
(1)
(2)
(3)
1
1
−1
−1
10
10
−1
2
3
−1
2
3
10
1
10
10
10
10
1
10
10
10
I
(mA)
I (mA)
C
C
IC/IB = 5
Tamb = 25 °C
(1) Tamb = 100 °C
(2) Tamb = 25 °C
(3) Tamb = −55 °C
(1) IC/IB = 20
(2) IC/IB = 10
(3) IC/IB = 5
Fig 10. Collector-emitter saturation resistance as a
function of collector current; typical values
Fig 11. Collector-emitter saturation resistance as a
function of collector current; typical values
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
7 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
8. Test information
V
V
CC
BB
R
B
R
C
V
o
(probe)
(probe)
oscilloscope
oscilloscope
450 Ω
450 Ω
R2
V
I
DUT
R1
mlb826
Fig 12. Test circuit for switching times
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
6.7
6.3
3.1
2.9
1.8
1.5
4
1.1
0.7
7.3 3.7
6.7 3.3
1
2
3
0.8
0.6
0.32
0.22
2.3
4.6
Dimensions in mm
04-11-10
Fig 13. Package outline SOT223 (SC-73)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
1000
-115
4000
PBHV8540Z
SOT223
8 mm pitch, 12 mm tape and reel
-135
[1] For further information and the availability of packing methods, see Section 14.
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
8 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
11. Soldering
7.00
3.85
3.60
3.50
0.30
1.20
(4 ×)
4
7.40
4.80
3.90
7.65
1
2
3
1.20 (3 ×)
1.30 (3 ×)
5.90
6.15
solder lands
solder paste
occupied area
solder resist
sot223_fr
Dimensions in mm
Fig 14. Reflow soldering footprint SOT223 (SC-73)
8.90
6.70
4
4.30 8.10 8.70
1
2
3
1.90 (2×)
1.10
7.30
transport direction during soldering
sot223_fw
solder lands
occupied area
solder resist
Dimensions in mm
Fig 15. Wave soldering footprint SOT223 (SC-73)
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
9 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PBHV8540Z_1
20080207
Product data sheet
-
-
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
10 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
13.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
PBHV8540Z_1
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 — 7 February 2008
11 of 12
PBHV8540Z
NXP Semiconductors
500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
Quality information . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information. . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 February 2008
Document identifier: PBHV8540Z_1
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