PCA8521 [NXP]
Infrared remote control transmitter RC5; 红外遥控发射器RC5
| 型号： | PCA8521 |
| 厂家： | 
NXP |
| 描述： | Infrared remote control transmitter RC5 |
| 文件： | 总20页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCA8521
Infrared remote control transmitter
RC5
1999 Jun 15
Product specification
Supersedes data of 1997 Jul 03
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
FEATURES
GENERAL DESCRIPTION
• RC5 protocol
The PCA8521 can be used in infrared remote control
transmitters. It generates output pulses, in accordance
with the RC5 protocol, when a key is pressed. The IC does
not contain a software programmable processor.
• Maximum of:
– 56 keys (20-pin version)
– 30 keys (16-pin version).
However, it does contain a ROM in which the codes that
have to be transmitted are stored. An example of an
application diagram using a 20-pin IC is illustrated in Fig.7.
The oscillator frequency may be optionally chosen as
432 kHz or 4 MHz. For 432 kHz additional external
capacitors must be connected. The capacitors for a 4 MHz
oscillator is integrated. When a key in the key-matrix is
pressed a drive line will be connected to a sense line. This
causes the oscillator to start and a corresponding code will
be generated conforming to the RC5 protocol.
• Option of multi-system or single system transmitter
– Multi-system: maximum 8 systems, selection by key
– Single system: maximum 8 different systems per IC,
selection by jumper wire or switch.
• Power-down and key wake-up
• High output current (≤ 45 mA)
• Oscillator frequency of 432 kHz or 4 MHz
• Multiple key protection
Seven drive lines (DR0 to DR6) and eight sense lines
(SN0 to SN7) may be connected via the key matrix to scan
the keys (see Fig.1).
• Option of 25% or 33% duty factor
• Contained in DIP16, SO16, DIP20 or SO20 packages.
When two or more keys are activated simultaneously no
transmission will take place.
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT38-4
PCA8521FP
PCA8521FT
PCA8521BP
PCA8521BT
DIP16
SO16
DIP20
SO20
plastic dual in-line package; 16 leads (300 mil)
SOT162-1
SOT146-1
SOT163-1
plastic small outline package; 16 leads; body width 7.5 mm
plastic dual in-line package; 20 leads (300 mil)
plastic small outline package; 20 leads; body width 7.5 mm
1999 Jun 15
2
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
BLOCK DIAGRAM
432 kHz or 4 MHz
XTAL1
XTAL2
2
1
TIMING GENERATOR
AND
OSCILLATOR
STOP
CONTROL
36 kHz
4
SN0
SN1
SN2
SN3
SN4
SN5
SN6
SN7
DR0
DR1
DR2
DR3
DR4
DR5
DR6
5
6
19
1K x 8
ROM
PULSE
GENERATOR
OUTPUT
DRIVER
7
LOUT
9
10
8
3
KEY
SCANNING
16
15
14
13
12
11
17
SHIFT REGISTER
PCA8521
20
18
V
V
SS
MBH038
DD
Fig.1 Block diagram (for DIP20 and SO20 packages).
1999 Jun 15
3
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
PINNING
16-pin dual in-line and small outline package
SYMBOL
XTAL1
XTAL2
SN0
PIN
1
DESCRIPTION
oscillator input
2
oscillator output
3
sense line 0 for key matrix
sense line 1 for key matrix
sense line 2 for key matrix
sense line 3 for key matrix
sense line 4 for key matrix
sense line 5 for key matrix
SN1
4
SN2
5
handbook, halfpage
V
XTAL1
XTAL2
SN0
1
2
3
4
5
6
7
8
16
DD
SN3
6
15 LOUT
SN4
7
V
14
SS
SN5
8
DR4
9
drive line 4 for key matrix
(active LOW)
SN1
13 DR0
12 DR1
11 DR2
10 DR3
PCA8521
SN2
DR3
DR2
DR1
DR0
10
11
12
13
drive line 3 for key matrix
(active LOW)
SN3
SN4
drive line 2 for key matrix
(active LOW)
SN5
DR4
9
drive line 1 for key matrix
(active LOW)
MBH032
drive line 0 for key matrix
(active LOW)
VSS
14
15
16
ground
LOUT
VDD
output signal (active LOW)
power supply
Fig.2 Pin configuration (DIP/SO16).
1999 Jun 15
4
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
20-pin dual in-line and small outline package
SYMBOL
PIN
DESCRIPTION
oscillator input
XTAL1
XTAL2
SN7
SN0
SN1
SN2
SN3
SN6
SN4
SN5
DR5
1
2
oscillator output
3
sense line 7 for key matrix
sense line 0 for key matrix
sense line 1 for key matrix
sense line 2 for key matrix
sense line 3 for key matrix
sense line 6 for key matrix
sense line 4 for key matrix
sense line 5 for key matrix
4
5
6
7
handbook, halfpage
V
1
2
20
19
18
17
16
15
14
XTAL1
XTAL2
SN7
DD
8
LOUT
9
V
10
11
3
SS
drive line 5 for key matrix
(active LOW)
4
SN0
DR6
DR0
DR1
DR2
5
SN1
DR4
DR3
DR2
DR1
DR0
DR6
12
13
14
15
16
17
drive line 4 for key matrix
(active LOW)
PCA8521
6
SN2
drive line 3 for key matrix
(active LOW)
7
SN3
SN6
8
13 DR3
12 DR4
drive line 2 for key matrix
(active LOW)
9
SN4
DR5
11
10
SN5
drive line 1 for key matrix
(active LOW)
MBH033
drive line 0 for key matrix
(active LOW)
drive line 6 for key matrix
(active LOW)
VSS
18
19
20
ground
LOUT
VDD
output signal (active LOW)
power supply
Fig.3 Pin configuration (DIP/SO20).
1999 Jun 15
5
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
FUNCTIONAL DESCRIPTION
Key numbering for the matrix is given in Tables 1 and 2.
Table 1 Key numbering for 16-pin package
SENSE LINES
DRIVER
LINES
SN0
SN1
SN2
SN3
SN4
SN5
DR0
0
1
2
3
4
5
DR1
DR2
DR3
DR4
8
9
10
18
26
34
11
19
27
35
12
20
28
36
13
21
29
37
16
24
32
17
25
33
Table 2 Key numbering for 20-pin package
SENSE LINES
SN3 SN4
DRIVER
LINES
SN0
SN1
SN2
SN5
SN6
SN7
DR0
DR1
DR2
DR3
DR4
DR5
DR6
0
1
2
3
4
5
6
7
8
9
10
18
26
34
42
50
11
19
27
35
43
51
12
20
28
36
44
52
13
21
29
37
45
53
14
22
30
38
46
54
15
23
31
39
47
55
16
24
32
40
48
17
25
33
41
49
When the keys have been scanned the key-number of the
activated key serves as the address of the ROM to obtain
the required code-word. When a 16-pin IC is used the
following sense lines and driver lines will not be connected;
SN6, SN7, DR5 and DR6. Consequently, key numbers 6,
7, 14, 15, 22, 23, 30, 31, 38, 39 and 40 to 55 will not be
addressed.
A single system option is available however, whereby
instead of keys a jumper wire and/or a switch may be used
for bank selection. Using this option it is possible to
program different transmitter models in one IC and select
the required bank by means of a jumper wire. Instead of a
jumper wire a side-switch may also be used to change the
generated code temporarily (select different bank) to
obtain multi-function keys. With this option the jumper
wires or switch must be connected between sense line
SN0 and one of the drive lines DR0 to DR6 or ground. This
means that SN0 cannot be used to connect keys and the
maximum number of keys will be 25 keys for a 16-pin
package and 49 keys for a 20-pin package.
The ROM contains 8 banks of 64 code-words. Thus for
each key a maximum of 8 different code-words may be
generated. With multi-system use, 8 different systems
(e.g. TV, VCR, tuner, CD etc.) may be selected. Apart from
the system bits the command bits may also be different in
different banks (true multi-function keys). Selection can be
performed using the keys. For each key three bank select
bits are present that determine which bank will be selected
for the next key.
It is not possible to use a combination of jumper wires and
selection keys for bank selection in one unit.
The output of the ROM is loaded into a shift register that
provides the input bits for the pulse generator. This pulse
generator drives the output pin.
For each key an ‘inhibit’ bit is also present. When this bit is
at logic 1 at an address in a given bank, and when the
corresponding key is pressed (when this bank has been
selected) no transmission will take place.
1999 Jun 15
6
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
When no key is pressed the oscillator will stop at the end
of the control timer (see Section “Timing generator”).
In this situation all drive lines will be set to logic 0. When
one of the keys is pressed again a wake-up will occur by
starting the oscillator.
Timing generator
A schematic diagram of the timing generator is illustrated
in Fig.4. The oscillator frequency is 432 kHz or 4 MHz.
The timing generator is stopped when no key is activated
and started again when a key is pressed.
An option is available to select ‘single’ or ‘multi’ system.
The output of the oscillator (CLK1) is divided by 111 for
4 MHz or by 12 for 432 kHz. Selection is achieved using a
mask option. The output of the divider is CLK2 which is
used for clocking of the control timer. The frequency of
CLK2 is 36 kHz and the inverse is used to generate the
output pulses in the subcarrier frequency. By mask option
the duty factor can be chosen to be 25% or 33%.
Single system
SN0 should be connected to one of the drive lines or
ground.
The bank that will be selected is equal to drive line number
to which SN0 is connected. When connected to ground the
number will be 7. This is achieved by loading the bank
select flip-flops BS0 to BS2 with the contents of C5 to C7
of the control timer (see Fig.4) when sense line SN0 is at
logic 0. In this way it is possible to use two different
systems in one transmitter by using a side switch. With this
option SN0 cannot be used to connect keys, so the
maximum number of keys will be lower. (49 keys with
20-pin IC and 25 keys with 16-pin IC).
The control timer has a length of 4096 subcarrier (pulse)
periods. This is equal to the transmission repetition time.
A bit time is equal to 64 pulses and the repetition time is
64 bit times. The control timer provides the timing of the
key scanning, the ROM access and the code transmission.
When the control timer has arrived at a certain state, and
no key has been pressed for at least 28 ms, a stop signal
will be generated which will stop the oscillator. All drive
lines will then be set to logic 0. As soon as a key is pressed
one of the sense lines will become logic 0. This will
generate a start signal which will restart the oscillator.
Multi system
The bank is selected by key for maximum 8 different
systems (e.g. TV, VCR, CD, etc.), any key is flexible for
bank selection. When a user inserts a new battery, the
default bank is always in bank 7. If only bank 7 is used,
then maximum number of keys can be:
Key scanning
Six bits of the control timer are used to control the key
scanning, subsequently 64 time slots are available. Each
time slot corresponds to a key number. The 3 most
significant bits (MSBs) control the drive lines and the
3 least significant bits (LSBs) control the sense lines.
The scan timing is illustrated in Fig.5. In the first 8 time
slots drive line DR0 is LOW. During this time the 8 sense
lines SN0 to SN7 are sequentially tested. The same
occurs for the next 8 time slots when DR1 is at logic 0 and
so on until DR6 is at logic 0. After testing there are 8 time
slots when no drive line is at logic 0 (all drive lines HIGH).
• 56 keys for a 20-pin IC
• 30 keys for 16-pin IC.
ROM
A schematic diagram of the ROM is illustrated in Fig.6.
The ROM is divided into 8 banks of 2 × 64 bytes. Bank
selection is performed using flip-flops BS0 to BS2 that are
the 3 highest bits of the address. With the ‘single system’
these bits are loaded from the 3 MSBs of the scan control
when SN0 = 0. At power-on the bank select flip-flops will
be in an arbitrary state.
When, during time slots 0 to 63, one of the sense lines is
at logic 0 the contents of the 6 bits is stored in the key
register. This register is used to address the ROM.
When a key was activated, the key number is stored in the
6-bit key register. This register forms the lower bits of the
ROM address. For each command the ROM will be
accessed twice. This gives 16 bits in total (M0L to M7L
and M0H to M7H). The bits are described in Table 3.
No transmission will take place when two or more keys are
activated. This situation is considered to be the same as
‘no key’ and the control bit in the command word for the
next transmission will be toggled.
1999 Jun 15
7
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
Table 3 ROM bit description
BITS
FUNCTION
M0L to M5L
M6L
Command bits 0 to 5.
Field bit. This bit indicates whether command codes 0 to 63 are used (field bit is at logic 1) or
command codes 64 to 127 are used (field bit is at logic 0).
M7L
Inhibit bit. When this bit is at logic 1 no transmission will take place. When this bit is at logic 0
the appropriate code-word will be transmitted.
M0H to M4H
M5H to M7H
System bits 0 to 4.
Bank select. Will be stored in BS0 to BS2 when the ‘multi-system’ option is selected. With
single system bits M5H to M7H are don't care.
Pulse output
The bits of the remote control word, as indicated by the addressed ROM locations, are loaded into a shift register every
bit-time this register is shifted. The output is used to generate a logic 0 or a logic 1 in the biphase (Manchester) coding,
modulated with a frequency of 36 kHz. The duty factor of the modulation pulses may be selected (optionally) to be 25%
or 33.3%. The output of the pulse generator controls the output driver that can provide a maximum current of 45 mA.
4 MHz
DIVIDE BY 111
DIVIDE BY 12
432 kHz
or
4 MHz
CLK1
pulse
OSCILLATOR
STOP
CLK2
INV
432 kHz
C0
CONTROL
TIMER
no key
S
DIVIDE-BY-4096
Q
Q
C11
end control
CLK
R
CLR
start input
MBH035
Fig.4 Timer schematic diagram.
1999 Jun 15
8
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
DR0
DR1
DR2
DR3
DR4
DR5
DR6
SN0
SN1
SN2
SN3
SN4
SN5
SN6
SN7
MBH037
Fig.5 Scan timing.
1999 Jun 15
9
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
ROM 1K x 8
BANK 0 LSB
BANK 1 LSB
BANK 2 LSB
BANK 3 LSB
BANK 4 LSB
BANK 5 LSB
BANK 6 LSB
BANK 7 LSB
BANK 0 MSB
BANK 1 MSB
BANK 2 MSB
BANK 3 MSB
BANK 4 MSB
BANK 5 MSB
BANK 6 MSB
BANK 7 MSB
address
BS2
BS1
BS0
KN5
KN4
KN3
KN2
KN1
KN0
M7H M6H M5H M4H M3H M2H M1H M0H M7L M6L M5L M4L M3L M2L M1L M0L
MBH036
Fig.6 ROM schematic diagram.
CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
2.0
TYP.
MAX.
5.5
UNIT
VDD
IDD
operating supply voltage
supply current
−
−
−
−
V
VDD = 5 V; Tamb = 25 °C
VDD = 3 V; Tamb = 25 °C
−
2
mA
µA
°C
IDD(q)
Tamb
quiescent current
−
1
operating ambient temperature
−10
+50
Sense lines (input only and will have a weak internal pull-up resistance)
VIL
LOW level input voltage
HIGH level input voltage
pull-up resistance
−
−
−
−
0.3VDD
−
V
VIH
Rpu
0.7VDD
50
V
VDD = 2 V
100
kΩ
Driver lines (output only; open drain; maximum on-resistance when LOW)
Ron
maximum on-resistance
VDD = 2 V
−
−
2
kΩ
Output driver (has a weak pull-up resistance)
Isink
Rpu
sink current
VDD = 2 V; Vo = 1 V
VDD = 2 V
−
−
−
−
45
5
mA
pull-up resistance
kΩ
1999 Jun 15
10
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
SYSTEM DEVELOPMENT
Software (RC8521)
A PC program is provided that enables the user to fill in system and command codes for each key number in each bank.
This program converts the input data into a ROM code-file needed to produce the metal mask and to program an EPROM
to be used in the hardware emulator.
Hardware (OM4839)
An emulator is available that functionally emulates the IC. An EPROM with the ROM code information is inserted into the
emulator to produce the required remote control codes corresponding to the keys in the prototype device.
APPLICATION INFORMATION
V
XTAL1
XTAL2
SN7
DD
432 kHz
or
4 MHz
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
LOUT
V
SS
SN0
DR6
DR0
DR1
DR2
DR3
DR4
DR5
SN1
PCA8521
SN2
SN3
SN6
SN4
SN5
MBH034
Fig.7 Application diagram (for DIP20 and SO20 packages).
1999 Jun 15
11
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
INTERNAL PIN CONFIGURATION
V
V
DD
DD
V
V
DD
DD
3, 5 to 10
4
MBH323
MBH322
Fig.8 Pin configuration for pin SN0.
Fig.9 Pin configuration for pins SN1 to SN7.
V
V
DD
V
DD
DD
19
11 to 17
MBH325
MBH324
Fig.10 Pin configuration for pins DR0 to DR6.
Fig.11 Pin configuration for pin LOUT.
1999 Jun 15
12
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.030
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT38-4
1999 Jun 15
13
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1999 Jun 15
14
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
20
11
pin 1 index
E
1
10
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
(1)
(1)
Z
1
2
UNIT
mm
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
2.0
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.078
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-05-24
SOT146-1
SC603
1999 Jun 15
15
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
0.25
0.01
1.27
0.050
1.4
0.25 0.25
0.01
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT163-1
075E04
MS-013AC
1999 Jun 15
16
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Jun 15
17
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
suitable(2)
MOUNTING
PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
−
suitable
Surface mount
BGA, SQFP
not suitable
not suitable(3)
suitable
suitable
−
−
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
−
−
−
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jun 15
18
Philips Semiconductors
Product specification
Infrared remote control transmitter RC5
PCA8521
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS RC5 COMPONENTS
Purchase of Philips RC5 components conveys a license under the Philips RC5 patent to use the components in RC5
system products conforming to the RC5 standard UATM-5000 for allocation of remote control commands defined
by Philips.
1999 Jun 15
19
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© Philips Electronics N.V. 1999
SCA66
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/05/pp20
Date of release: 1999 Jun 15
Document order number: 9397 750 06095
相关型号：
PCA8521BT-T
IC INFRARED, TRANSMITTER IC, PDSO20, 7.50 MM, PLASTIC, MS-013AC, SOT-163-1, SOP-20, Remote Control IC
NXP
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