PCA9410AUKZ_技术文档

PCA9410/9410A

WLCSP9

3.0 MHz, 500 mA, DC-to-DC boost converter

Rev. 1 — 5 August 2016

Product data sheet

1. General description

The PCA9410 and PCA9410A are highly efficient 3.0 MHz, 500 mA, step-up DC-to-DC

converters. They convert input voltages from 2.5 V to 5.25 V to a fixed output voltage of

5.0 V.

These devices are optimized for battery-powered applications. High efficiency of up to

94 % enables an extended battery life in all portable designs. Step-up operation at a

switching frequency of 3 MHz allows using 1 H inductor or smaller.

2. Features and benefits

 Efficiency up to 94 %

  3 % output voltage accuracy at nominal and static conditions

  3 % output voltage accuracy over full current, voltage and temperature range

 V_INV_O, (Pass-Through Mode Operation)

 Load disconnect

 Current-mode controller

 Soft start function for limiting inrush current with true load disconnect

 Overcurrent and over-temperature protection

 The PCA9410 totally disconnects input to output when disabled

 The PCA9410A connects input to output when disabled

 Wafer-Level Chip-Size Package (WLCSP) with 0.4 mm pitch; allows for the use of a

smaller antenna, or for greater signal strength

3. Applications

 Smartphones

 NFC terminals

4. Ordering information

Table 1.

Ordering information

Type number

Topside Package

mark

Name

Description

Version

PCA9410UK

P10

10A

WLCSP9 wafer-level chip-size package; 9 bumps; body 1.24  1.24 

-

0.525 mm

PCA9410AUK

WLCSP9 wafer-level chip-size package; 9 bumps; body 1.24  1.24 

-

0.525 mm

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

4.1 Ordering options

Table 2.

Ordering options

Type number

Orderable part

number

Package

Packing method Minimum

Temperature

order quantity

PCA9410UK

PCA9410UKZ

WLCSP9

REEL 7" Q1/T1

*SPECIAL MARK

CHIPS DP

3000

T_amb= 40 C to +85 C

PCA9410AUK

PCA9410AUKZ

WLCSP9

REEL 7" Q1/T1

*SPECIAL MARK

CHIPS DP

3000

T_amb= 40 C to +85 C

5. Block diagram

BANDGAP

REFERENCE

BIAS

SUPPLY

OVERCURRENT

PROTECTION

UNDERVOLTAGE

LOCKOUT

CONTROL

LOGIC

TEMPERATURE

WATCHDOG

PULSE

GENERATOR

GATE

DRIVER

SOFTSTART

aaa-013240

Fig 1. Block diagram

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

2 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

6. Pinning information

6.1 Pinning

PCA9410/9410A

ball A1

index area

1

2

3

1

2

3

A

B

VOUT VOUT

VIN

A

B

SW

EN

C

PGND PGND

AGND

C

aaa-013281

aaa-013280

Transparent top view

Fig 2. Pin configuration WLCSP9 package

Fig 3. Ball mapping for WLCSP9

6.2 Pin description

Table 3.

Symbol

VOUT

Pin description

Description

Output voltage. This pin is the output voltage terminal; connect

directly to C_OUT

A1, A2

.

VIN

SW

EN

A3

Input voltage. Connect to Li-Ion battery input power source.

Switching node. Connect to inductor.

B1, B2

B3

Enable. Used to enable/disable the device; HIGH = enabled.

Non-A version: EN low = total disconnect

A version: EN low = forced pass through

PGND

AGND

C1, C2

C3

Power ground. This is the power return for the IC. C_OUTcapacitor

should be returned with the shortest path possible to these pins.

Analog ground. This is the signal ground reference for the IC. All

voltage levels are measured with respect to this pin; connect to

PGND at a single point. The AGND pin should be flooded over by

the ground plane that is connecting the PGND pins to both the

input caps and the output caps.

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

3 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

7. Functional description

The step-up converter (Figure 4) generates a regulated constant output voltage.

L

i(ext)

SW SW

VOUT

C

2

VIN

C

1

Enable

EN

PGND PGND

AGND

aaa-013259

Fig 4. Typical DC-to-DC application

7.1 Enable (EN) pin

EN pin enables the boost converter when HIGH. However the effect of the EN when LOW

has two methods of operation, depending on which device is used.

PCA9410 device: the EN pin when LOW causes the part to go into a total disconnect

mode from input to output.

PCA9410A device: EN pin when LOW forces the part into Pass Through mode where the

output voltage is the same as the input voltage. This device emulates a conventional

boost converter (without the voltage drop of the internal diode).

When the EN pin is pulled HIGH it should be held HIGH for at least 500 s for the device

to properly initialize. This is for getting the forced Pass Through mode set up properly.

Shorter pulses may cause unpredictable behavior.

Table 4.

Mode

LIN

Operating modes

Description

Invoked when

linear start-up

V_IN> V_OUT

SS

boost soft-start

V_IN< V_OUT< V_OUT(TARGET)

V_OUT= V_OUT(TARGET)

BST

PT

boost operating mode

pass-through mode

V_IN> V_OUT(TARGET)or in the advanced

part when EN is pulled LOW

7.1.1 Pass-Through (PT) mode

With both devices, the device automatically transitions from Boost Mode to Pass-Through

Mode if V_INgoes above the V_OUTtarget. In Pass-Through Mode, the device provides a

very low impedance path from V_INto V_OUT. Entry to the Pass-Through Mode is triggered

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

4 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

by condition where V_IN> V_OUTtarget. Pass-Through Mode exit is triggered when V_OUT

going down reaches the target V_OUTvoltage. During Automatic Pass-Through Mode, the

PMOS overcurrent protection remains enabled.

In the PCA9410A, user can force the device in Forced Pass-Through Mode through the

EN pin. If the EN pin is pulled HIGH, the device starts operating in Boost Mode. Once the

EN pin is pulled LOW, the device is forced into Pass-Through Mode. To disable the

device, the input supply voltage must be removed. The device cannot start-up in Forced

Pass-Through Mode. During start-up, keep the EN pulled HIGH for 500 s, before pulling

it LOW and putting the device into Forced Pass-Through Mode. The EN pin has an

internal pull-down resistor (see Figure 5 for the sequence).

Table 5.

Enable

EN logic level

LOW

Description Non-A

Power-down isolated output

Boost mode

Description A

Forced pass-through

Boost mode

HIGH

V

IN

Enable

Boost

Forced Pass through

V

OUT

Disconnect

aaa-019181

Fig 5. Forced pass-through

7.2 Inrush current limiter (soft start)

The PCA9410 and PCA9410A have an integrated pre-charge circuit that prevents large

inrush currents when input voltage is applied. This inrush is accompanied with a current

limit that shuts down the device, and runs a delay timer then attempts a restart.

Once the output voltage reaches the input voltage the soft start function is enabled to limit

the maximum current in boost time and to reduce an input voltage dip. Therefore the

system has a turn-on procedure which starts up step-by-step and limits the inrush current

via a duty cycle control up to the maximum current capability.

7.3 Thermal protection

The PCA9410 and PCA9410A have an integrated thermal protection. The protection

circuit senses the internal temperature of the chip and switches off the integrated PMOS

power switch transistor when temperature reaches 150 C. After the temperature returns

to a safe value 20 C below the shutdown temperature, the system restarts in the

pre-charge phase.

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

5 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

7.4 Overcurrent protection

Overcurrent protection circuit senses the current through the integrated PMOS. If the

diagnostic circuit detects an overcurrent, the system switches off the PMOS and NMOS to

break the current flow, and a 20 ms timeout is started. Once the 20 ms timeout expires,

the part restarts in the pre-charge phase.

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

6 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

8. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_IN

Parameter

Conditions

Min

0.5

0.3

Max

Unit

V

voltage on pin IN

input voltage

+6.0

V_i

on pin EN

V_IN+ 0.3 V, up to

+6.0 V

V

V_O

output voltage

on pins SW, OUT

0.5

+6.0

V

[1]

P_tot

T_stg

T_j

total power dissipation

storage temperature

junction temperature

ambient temperature

electrostatic discharge voltage

65

40

2

+150

+125

+85

+2

C

kV

T_amb

V_ESD

human body model

(JESD22-001)

[1] Internally limited

9. Recommended operating conditions

Table 7.

Symbol

V_IN

Operating conditions

Parameter

Conditions

Min

2.5

Typ

-

Max

5.25

V_IN

-

Unit

V

voltage on pin IN

V_i

input voltage

on pin EN

V_IN= 4.8 V

V_O= 5 V

0.3

2.0

-

V

[1]

C₁

external input capacitance

external output capacitance

external input inductance

4.2

1

F

H

C₂

3.0

10

L_i(ext)

0.47

2.2

[1] This is the capacitance at 5 V bias. Check application section for more details.

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

7 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

10. Static characteristics

Table 8.

Static characteristics

At recommended input voltages and T_amb= 40 C to +85 C; voltages are referenced to GND (ground = 0 V); unless

otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Input voltage and input current

V_IN

I_Q

input voltage

2.5

3.6

3.0

36

5.25

V

supply current

EN = 0 V

-

10.0

A

mA

EN = 1.8 V, V_IN= 2.5 V

EN = 1.8 V, V_IN= 4.8 V

EN = 1.8 V, V_IN= 5.25 V

-

11

3.57

Output voltage and output current

V_OUT

output voltage

I_O 15 mA

4.85 (3 %) 5.0

5.15 (+3 %)

V

I_OUT(lim)

f_o(boost)

V_th(r)(UVLO)

output current limit

boost output frequency

EN = HIGH

0.5

-

A

2.91

1.9

3

3.09

2.3

MHz

V

rising threshold voltage

on V_INUVLO

2.1

V_{th(f)(UVLOhyst)}falling UVLO hysteresis

70

-

120

2

mV

V_{o(noise_p-p_coh)}V_ocoherent

peak-to-peak noise

100 kHz to 1.5 MHz, V_IN< 4.8 V

12 MHz to 15 MHz, V_IN< 4.8 V

mV

2

mV

V_{o(noise_rms)}

V_orms noise (incoherent 100 kHz to 1.5 MHz, V_IN< 4.8 V

660

µV rms

noise)

12 MHz to 15 MHz, V_IN< 4.8 V

Control input and timing

V_IH

HIGH-level input voltage pins EN

1.16

-

V

V_IL

LOW-level input voltage pins EN

start-up time

-

0.4

600

V

t_startup

500

S

Over-temperature protection

T_sd

shutdown temperature

-

150

20

-

C

T_sd(hys)

hysteresis of shutdown

temperature

Switches

R_DSon

drain-source on-state

resistance

N-channel FET

P-channel FET

V_IN= 3.6 V; EN = LOW

EN = LOW

-

70

80

-

m

A

-

I_L

leakage current

enable pull down

0

0.051 10

R_{pd(en_low)}

I_{(ena-pulldown)}

450

-

640

100

800

k

nA

enable pull down current EN = HIGH, VIN  2.5 V

-

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

8 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

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Fig 6. Output regulation vs Iload and V_IN

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Fig 7. Output ripple vs Iload and V_IN

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

9 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

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Fig 8. Output regulation vs Iload and temp (V_IN= 3.6 V)

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Fig 9. Frequency vs load current and V_IN

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

10 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

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Fig 10. Efficiency vs Iload and V_IN

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Fig 11. Efficiency vs Iload and temp (V_IN= 3.6 V)

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

11 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

aaa-017046

Fig 12. Line step response

aaa-017047

Fig 13. Pass through

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

12 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

aaa-017049

Fig 14. Load step

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Fig 15. Typical load current capability vs V_INand temp

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

13 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

11. Application information

11.1 Overcurrent protection

Conventional Boost convertors have no output current limit protection. Additionally they

have a phantom power path made up of the inductor and output diode connecting the

input directly to the output; this causes an inrush of current when power is applied. The

PCA9410 has extra provisions to prevent the inrush current and output current limit

problems.

To implement these protections this device has a start-up state machine. This machine

includes a two-stage pre-charge of the output circuitry:

• Stage 1, Inrush control: a 1 A current source is turned on providing a path from input

to output while a voltage comparator and a timer1 are active. If the output voltage

doesn't reach V_IN- 200 mV within 1 ms, the device goes into the fault state. If the

output voltage reaches 200 mV below the input voltage first the state machine

advances to the boost mode soft start state.

• Stage 2, Boost Soft-Start: Starting from V_OUT= V_IN, the output will ramp up to V_OUT

target. The PMOS current limit will be enabled during this stage.

The current levels are implemented through the synchronous rectifier transistor properties

and drive states.

11.2 Thermal shutdown

A thermal shutdown state shuts out all other states out until the device has cooled to the

(HiTemp  Thysteresis) turn back on temperature, and then it enters the fault state.

11.3 Fault recovery

When a fault occurs, the device has a fault state that disables the output for 20 ms. After

the 20 ms timeout, the device will attempt a restart starting from the inrush state.

11.4 Enable delay

Once the device has been running and gets disabled, it cannot be re-enabled until the

output voltage discharges down to the input voltage. The device has an internal pull-down

to accomplish this, however in the absence of any external load this will take 3 ms. Any

external load will shorten the time it takes to get re-enabled.

11.5 Connection diagram

The DC-to-DC converter requires an external inductor and two decoupling capacitors.

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

14 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

L

i(ext)

SW SW

VOUT

C

2

VIN

C

1

Enable

EN

PGND PGND

AGND

aaa-013259

Fig 16. Simple DC-to-DC application diagram

11.6 Recommended inductors

In order to ensure proper operation of the step-up DC-to-DC converter an inductor with a

sufficient inductance and sufficient saturation current value needs to be used. Recommended

inductance is 1 H. Using this recommended 0603 inductor puts a 300 mA current limit on the

circuit; this inductor has a 800 mA saturation current. For more output current a larger, higher

saturation current inductor will be required according to Figure 17. The saturation current of the

inductor has to be properly chosen for the input voltage and load current range. The lower the

input voltage the higher the input current for a given load current. Once the saturation current of

the inductor is reached, the ferromagnetic core of the inductor will show a rapid nonlinear

behavior and the output current capability of the circuit will drop significantly.

Table 9.

Inductor Manufacturer

Abracon

Recommended inductors

Product

Parameter

Package size

L

ASMPH-0603-1R0M-T

1 H

0603

PCA9410

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Product data sheet

Rev. 1 — 5 August 2016

15 of 27

PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

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Fig 17. Inductor peak current vs Iload and V_IN

11.7 Input capacitor

To eliminate unwanted voltage transients at the input, place an input decoupling capacitor

of at least 2.2 F as close as possible to the input pin. Due to the voltage dependence of

the capacitor, care should be taken that the effective capacitance of 2 F is available at

input voltages up to 5.25 V. To ensure best performance, it is recommended to use a

capacitor with a low Equivalent Series Resistance (ESR). When using a capacitor with

X5R or X7R dielectric keep in mind that the capacitance drops significantly with voltage,

thus a 22 F cap will actually only have 4.2 F at 5 V as shown in Table 10.

Table 10. Recommended input capacitors

Manufacturer

Product

Parameter

Package size

Samsung

CL05A106MQ5NUNC

10 f 6.3 V, 

2.5 F at 5 V

0402

TDK

C1608X5R0J226M080AC 22 f at 6.3 V,

4.2 F at 5 V

0603

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Product data sheet

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11.8 Output capacitor

Because of the narrow voltage-dependent capacitance spread, high temperature stability

and low ESR at high frequencies, it is recommended to use the dielectric X7R or X5R.

The rated capacitance of the output capacitor will be much greater than the actual

capacitance at the 5 V output voltage. The device requires at least 3 F of output

capacitance at its rated output voltage for suppression of ringing, overshoot, as well as for

loop stability. We recommend a 22 F 6.3 V capacitor that is actually a 4.2 F capacitor

when biased at 5 V.

Table 11. Recommended output capacitors

Cap

Manufacturer

Product

Parameter

Package size

C₂

TDK

C1608X5R0J226M080AC 22 F 6.3 V, 

4.2 F at 5 V

0603

When the space on the application board allows, it is recommended to use two capacitors

instead of a single large value. The reason is that the equivalent series inductance

reduces to half when using two capacitors with the same value and this helps the

capacitors to work more efficiently against high frequency noise where it can be reduced

by a factor of 2. The minimum capacitance needed can either be obtained with a single

22 F capacitor or two 10 F capacitors when the space allows and lower noise is

targeted; keep in mind that the bulk capacitance at the output voltage needs to be greater

than 3.0 F for control loop stability, and two large capacitors will have superior

performance when compared with two smaller capacitors. The boost factor, output

current, switching frequency and the desired peak to peak ripple limit define the minimum

capacitance needed.

The duty cycle (D) needed with 90 % efficiency at a worst case of 2.5 V V_IN.

Eff  V_IN

V_OUT

----------------------

D = 1 –

(1)

For the minimum input voltage 2.5 V and 5 V output voltage D = 0.55

Using the simplified correlation between the current (I_OUT(max)), ripple (V_ripple), duty cycle

(D) and switching frequency (f_sw) the minimum C_outcapacitance can be calculated as

follows:

D

-----------------------------

C_OUTmin= I_OUTmax

(2)

f_sw V_ripple

With a sample set of values: I_out= 300 mA, D = 0.55, f_sw= 3 MHz, V_ripple= 20 mV

C_OUT(min)= 2.75 F (This is not the nominal value at 0 V bias, it is the derated value at 5 V

bias).

This value presumes that the ESR and ESL of the capacitor is negligible and the path

output-capacitor-ground is as short as possible. Compensating for the listed factors, the

minimum output capacitance is specified at 3.0 f at 5 V. How much the capacitance

degrades at high bias voltage is supplier dependent and especially when 0402 size

capacitors are chosen the voltage dependence should be taken into consideration.

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11.9 Layout of the PCB

The most critical layout constraint of this circuit is that the output Cap C2 be placed as

close to the IC as possible. Use short wide traces to connect this capacitor to the IC. See

below for an example of the layout detailing the IC and the output capacitor. The

connection from switch pin to the inductor should have minimum capacitance to GND.

aaa-016344

Fig 18. Layout of PCB

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12. Package outline

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Fig 19. Package outline WLCSP9

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Product data sheet

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PCA9410/9410A

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3.0 MHz, 500 mA, DC-to-DC boost converter

BD: 260 µm ± 30 µm

Solder ball: SAC105N

UBM: 1K Ti: 1K ± 0.2K

2 K Cu: 2K ± 0.2K

8.3 µm Cu:

BH: 200 µm ± 30 µm

UBM: 240 µm ± 4 µm

PI opening: 160 µm

All: 8.6 µm ± 1.7 µm

PI: 10 µm

Passivation opening: 190 µm

Al pad: 220 µm

aaa-019496

Fig 20. WLCSP9 Under Ball Metal (UBM) structure

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13. Soldering of WLCSP packages

13.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

All NXP WLCSP packages are lead-free.

13.2 Board mounting

Board mounting of a WLCSP requires several steps:

1. Solder paste printing on the PCB

2. Component placement with a pick and place machine

3. The reflow soldering itself

13.3 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 21) than a SnPb process, thus

reducing the process window

• Solder paste printing issues, such as smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature), and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic) while being low enough that the packages and/or boards are not

damaged. The peak temperature of the package depends on package thickness and

volume and is classified in accordance with Table 12.

Table 12. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

260

> 2000

260

< 1.6

1.6 to 2.5

> 2.5

260

250

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 21.

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maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 21. Temperature profiles for large and small components

For further information on temperature profiles, refer to application note AN10365

“Surface mount reflow soldering description”.

13.3.1 Stand off

The stand off between the substrate and the chip is determined by:

• The amount of printed solder on the substrate

• The size of the solder land on the substrate

• The bump height on the chip

The higher the stand off, the better the stresses are released due to TEC (Thermal

Expansion Coefficient) differences between substrate and chip.

13.3.2 Quality of solder joint

A flip-chip joint is considered to be a good joint when the entire solder land has been

wetted by the solder from the bump. The surface of the joint should be smooth and the

shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps

after reflow can occur during the reflow process in bumps with high ratio of bump diameter

to bump height, i.e. low bumps with large diameter. No failures have been found to be

related to these voids. Solder joint inspection after reflow can be done with X-ray to

monitor defects such as bridging, open circuits and voids.

13.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the

chip from the substrate and replacing it with a new chip. If a chip is removed from the

substrate, most solder balls of the chip will be damaged. In that case it is recommended

not to re-use the chip again.

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Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and flux residues

and/or underfill removed. When a new chip is placed on the substrate, use the flux

process instead of solder on the solder lands. Apply flux on the bumps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reflow the solder, use the solder profile shown in application note

AN10365 “Surface mount reflow soldering description”.

13.3.4 Cleaning

Cleaning can be done after reflow soldering.

14. References

[1] IEC60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[2] IEC61340-3-1 — Method for simulation of electrostatic effects - Human body model

(HBM) electrostatic discharge test waveforms

[3] JESD22-A115C — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model

(MM)

[4] NX2-00001 — NXP Semiconductors Quality and Reliability Specification

[5] AN10365 — NXP Semiconductors application note “Surface mount reflow soldering

description”

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Product data sheet

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PCA9410/9410A

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3.0 MHz, 500 mA, DC-to-DC boost converter

15. Revision history

Table 13. Revision history

Document ID

PCA9410 v.1.1

Modifications:

PCA9410 v.1

Release date

20160805

Data sheet status

Change notice

Supersedes

Product data sheet

-

PCA9410 v.1

• Deleted Figure 12 Startup

20151008 Product data sheet

-

PCA9410

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16. Legal information

16.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

16.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

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Product data sheet

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PCA9410/9410A

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3.0 MHz, 500 mA, DC-to-DC boost converter

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

non-automotive qualified products in automotive equipment or applications.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

PCA9410

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Product data sheet

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PCA9410/9410A

NXP Semiconductors

3.0 MHz, 500 mA, DC-to-DC boost converter

18. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

18

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 1

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Functional description . . . . . . . . . . . . . . . . . . . 4

Enable (EN) pin . . . . . . . . . . . . . . . . . . . . . . . . 4

Pass-Through (PT) mode. . . . . . . . . . . . . . . . . 4

Inrush current limiter (soft start) . . . . . . . . . . . . 5

Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5

Overcurrent protection . . . . . . . . . . . . . . . . . . . 6

7.1

7.1.1

7.2

7.3

7.4

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

Recommended operating conditions. . . . . . . . 7

Static characteristics. . . . . . . . . . . . . . . . . . . . . 8

9

10

11

Application information. . . . . . . . . . . . . . . . . . 14

Overcurrent protection . . . . . . . . . . . . . . . . . . 14

Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 14

Fault recovery. . . . . . . . . . . . . . . . . . . . . . . . . 14

Enable delay. . . . . . . . . . . . . . . . . . . . . . . . . . 14

Connection diagram . . . . . . . . . . . . . . . . . . . . 14

Recommended inductors . . . . . . . . . . . . . . . . 15

Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . 16

Output capacitor . . . . . . . . . . . . . . . . . . . . . . . 17

Layout of the PCB . . . . . . . . . . . . . . . . . . . . . 18

11.1

11.2

11.3

11.4

11.5

11.6

11.7

11.8

11.9

12

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19

13

13.1

13.2

13.3

13.3.1

13.3.2

13.3.3

13.3.4

Soldering of WLCSP packages. . . . . . . . . . . . 21

Introduction to soldering WLCSP packages . . 21

Board mounting . . . . . . . . . . . . . . . . . . . . . . . 21

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 21

Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Quality of solder joint . . . . . . . . . . . . . . . . . . . 22

Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

14

15

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24

16

Legal information. . . . . . . . . . . . . . . . . . . . . . . 25

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26

16.1

16.2

16.3

16.4

17

Contact information. . . . . . . . . . . . . . . . . . . . . 26

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 August 2016

Document identifier: PCA9410


型号：	PCA9410AUKZ
厂家：	NXP
描述：	PCA9410/9410A - 3.0 MHz, 500 mA, DC-to-DC boost converter PC
文件：	总27页 (文件大小：1101K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

PCA9410AUKZ [NXP]

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