PCA9557BS [NXP]

8-bit I2C-bus and SMBus I/O port with reset; 8位I2C总线和复位的SMBus I / O端口
PCA9557BS
型号: PCA9557BS
厂家: NXP    NXP
描述:

8-bit I2C-bus and SMBus I/O port with reset
8位I2C总线和复位的SMBus I / O端口

并行IO端口 微控制器和处理器 外围集成电路
文件: 总26页 (文件大小:154K)
中文:  中文翻译
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PCA9557  
8-bit I2C-bus and SMBus I/O port with reset  
Rev. 06 — 11 June 2008  
Product data sheet  
1. General description  
The PCA9557 is a silicon CMOS circuit which provides parallel input/output expansion for  
SMBus and I2C-bus applications. The PCA9557 consists of an 8-bit input port register,  
8-bit output port register, and an I2C-bus/SMBus interface. It has low current consumption  
and a high-impedance open-drain output pin, IO0.  
The system master can enable the PCA9557’s I/O as either input or output by writing to  
the configuration register. The system master can also invert the PCA9557 inputs by  
writing to the active HIGH polarity inversion register. Finally, the system master can reset  
the PCA9557 in the event of a time-out by asserting a LOW in the reset input.  
The power-on reset puts the registers in their default state and initializes the  
I2C-bus/SMBus state machine. The RESET pin causes the same reset/initialization to  
occur without de-powering the part.  
2. Features  
I Lower voltage, higher performance migration path for the PCA9556  
I 8 general purpose input/output expander/collector  
I Input/output configuration register  
I Active HIGH polarity inversion register  
I I2C-bus and SMBus interface logic  
I Internal power-on reset  
I Noise filter on SCL/SDA inputs  
I Active LOW reset input  
I 3 address pins allowing up to 8 devices on the I2C-bus/SMBus  
I High-impedance open-drain on IO0  
I No glitch on power-up  
I Power-up with all channels configured as inputs  
I Low standby current  
I Operating power supply voltage range of 2.3 V to 5.5 V  
I 5 V tolerant inputs/outputs  
I 0 kHz to 400 kHz clock frequency  
I ESD protection exceeds 2000 V HBM per JESD22-A114, 150 V MM per  
JESD22-A115 and 1000 V CDM per JESD22-C101  
I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA  
I Three packages offered: SO16, TSSOP16, HVQFN16  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
PCA9557D  
PCA9557PW  
PCA9557BS  
SO16  
plastic small outline package; 16 leads;  
body width 3.9 mm  
SOT109-1  
TSSOP16 plastic thin shrink small outline package; 16 leads;  
body width 4.4 mm  
SOT403-1  
HVQFN16 plastic thermal enhanced very thin quad flat package; SOT629-1  
no leads; 16 terminals; body 4 × 4 × 0.85 mm  
3.1 Ordering options  
Table 2.  
Ordering options  
Type number  
PCA9557D  
PCA9557PW  
PCA9557BS  
Topside mark  
PCA9557D  
PCA9557  
9557  
Temperature range  
Tamb = 40 °C to +85 °C  
Tamb = 40 °C to +85 °C  
Tamb = 40 °C to +85 °C  
4. Block diagram  
PCA9557  
A0  
A1  
A2  
IO0  
IO1  
IO2  
IO3  
IO4  
IO5  
IO6  
IO7  
8-bit  
SCL  
SDA  
INPUT  
FILTER  
INPUT/  
OUTPUT  
PORTS  
2
I C-BUS/SMBus  
CONTROL  
write pulse  
read pulse  
V
DD  
POWER-ON  
RESET  
V
SS  
RESET  
002aad275  
Fig 1. Block diagram of PCA9557  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
2 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
data from  
shift register  
configuration  
register  
data from  
shift register  
D
Q
output port  
register data  
FF  
write configuration  
pulse  
D
Q
CK  
Q
FF  
IO0  
write pulse  
CK  
ESD protection  
diode  
output port  
register  
V
SS  
input port  
register  
D
Q
input port  
register data  
FF  
CK  
read pulse  
polarity inversion  
register  
data from  
shift register  
polarity inversion  
register data  
D
Q
FF  
write polarity  
pulse  
CK  
002aad277  
On power-up or reset, all registers return to default values.  
Fig 2. Simplified schematic of IO0  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
3 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
data from  
shift register  
output port  
register data  
configuration  
register  
V
DD  
data from  
shift register  
D
Q
ESD protection  
diode  
FF  
write configuration  
pulse  
D
Q
CK  
Q
FF  
IO1 to IO7  
write pulse  
CK  
ESD protection  
diode  
output port  
register  
V
SS  
input port  
register  
D
Q
input port  
register data  
FF  
CK  
read pulse  
polarity inversion  
register  
data from  
shift register  
polarity inversion  
register data  
D
Q
FF  
write polarity  
pulse  
CK  
002aad278  
On power-up or reset, all registers return to default values.  
Fig 3. Simplified schematic of IO1 to IO7  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
4 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
5. Pinning information  
5.1 Pinning  
1
16  
15  
14  
13  
12  
11  
10  
9
SCL  
SDA  
A0  
V
DD  
2
3
4
5
6
7
8
RESET  
IO7  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
SCL  
SDA  
A0  
V
DD  
RESET  
IO7  
A1  
IO6  
PCA9557D  
A2  
IO5  
A1  
IO6  
PCA9557PW  
12 IO5  
IO0  
IO1  
IO4  
A2  
11  
10  
9
IO0  
IO1  
IO4  
IO3  
IO2  
IO3  
V
SS  
IO2  
V
SS  
002aad272  
002aad273  
Fig 4. Pin configuration for SO16  
Fig 5. Pin configuration for TSSOP16  
terminal 1  
index area  
1
2
3
4
12  
11  
10  
9
A0  
A1  
IO7  
IO6  
IO5  
IO4  
PCA9557BS  
A2  
IO0  
002aad274  
Transparent top view  
Fig 6. Pin configuration for HVQFN16  
5.2 Pin description  
Table 3.  
Pin description  
Symbol  
Pin  
Description  
SO16, TSSOP16  
HVQFN16  
SCL  
SDA  
A0  
1
2
3
4
5
6
7
15  
16  
1
serial clock line  
serial data line  
address input 0  
address input 1  
address input 2  
input/output 0 (open-drain)  
input/output 1  
A1  
2
A2  
3
IO0  
IO1  
4
5
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
5 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
Table 3.  
Pin description …continued  
Symbol  
Pin  
Description  
SO16, TSSOP16  
HVQFN16  
VSS  
IO2  
8
6[1]  
supply ground  
input/output 2  
input/output 3  
input/output 4  
input/output 5  
input/output 6  
input/output 7  
active LOW reset input  
supply voltage  
9
7
IO3  
10  
11  
12  
13  
14  
15  
16  
8
IO4  
9
IO5  
10  
11  
12  
13  
14  
IO6  
IO7  
RESET  
VDD  
[1] HVQFN16 package die supply ground is connected to both the VSS pin and the exposed center pad. The  
VSS pin must be connected to the supply ground for proper device operation. For enhanced thermal,  
electrical, and board-level performance, the exposed pad needs to be soldered to the board using a  
corresponding thermal pad on the board, and for proper heat conduction through the board thermal vias  
need to be incorporated in the PCB in the thermal pad region.  
6. System diagram  
INPUT  
PORT  
POLARITY  
INVERSION  
CONFIG.  
Q7  
OUTPUT  
PORT  
1.1 k  
1.1 kΩ  
Q7  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0  
Q7  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0  
Q7  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0  
IO0  
RESET  
Q6  
Q5  
Q4  
Q3  
Q2  
Q1  
Q0  
IO1  
IO2  
IO3  
IO4  
IO5  
IO6  
IO7  
1.6 kΩ  
SCL  
2
I C-BUS/SMBus  
1.6 kΩ  
1.1 kΩ  
1.1 kΩ  
1.1 kΩ  
INTERFACE  
LOGIC  
SDA  
A2  
or  
or  
or  
A1  
A0  
002aad276  
Fig 7. System diagram  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
6 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
7. Functional description  
Refer to Figure 1 “Block diagram of PCA9557”.  
7.1 Device address  
Following a START condition the bus master must output the address of the slave it is  
accessing. The address of the PCA9557 is shown in Figure 8. To conserve power, no  
internal pull-up resistors are incorporated on the hardware selectable address pins and  
they must be pulled HIGH or LOW.  
slave address  
0
0
1
1
A2 A1 A0 R/W  
fixed  
programmable  
002aad279  
Fig 8. PCA9557 device address  
The last bit of the slave address defines the operation to be performed. When set to  
logic 1 a read is selected, while a logic 0 selects a write operation.  
7.2 Control register  
Following the successful acknowledgement of the slave address, the bus master will send  
a byte to the PCA9557, which will be stored in the control register. This register can be  
written and read via the I2C-bus.  
bit:  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
D1 D0  
002aad280  
Fig 9. Control register  
Table 4.  
Register definition  
D1  
0
D0  
0
Name  
Access  
Description  
Register 0  
Register 1  
Register 2  
Register 3  
read-only  
read/write  
read/write  
read/write  
Input port register  
Output port register  
Polarity inversion register  
Configuration register  
0
1
1
0
1
1
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
7 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
7.3 Register descriptions  
7.3.1 Register 0 - Input port register  
This register is a read-only port. It reflects the incoming logic levels of the pins, regardless  
of whether the pin is defined as an input or an output by the Configuration register. Writes  
to this register have no effect.  
Table 5.  
Bit  
Register 0 - Input port register bit allocation  
7
6
5
4
3
2
1
0
Symbol  
I7  
I6  
I5  
I4  
I3  
I2  
I1  
I0  
7.3.2 Register 1 - Output port register  
This register reflects the outgoing logic levels of the pins defined as outputs by the  
Configuration register. Bit values in this register have no effect on pins defined as inputs.  
In turn, reads from this register reflect the value that is in the flip-flop controlling the output  
selection, not the actual pin value.  
Table 6.  
Bit  
Register 1 - Output port register bit allocation  
7
O7  
0
6
O6  
0
5
O5  
0
4
O4  
0
3
O3  
0
2
O2  
0
1
O1  
0
0
O0  
0
Symbol  
Default  
7.3.3 Register 2 - Polarity inversion register  
This register enables polarity inversion of pins defined as inputs by the Configuration  
register. If a bit in this register is set (written with logic 1), the corresponding port pin’s  
polarity is inverted. If a bit in this register is cleared (written with logic 0), the  
corresponding port pin’s original polarity is retained.  
Table 7.  
Bit  
Register 2 - Polarity inversion register bit allocation  
7
N7  
1
6
N6  
1
5
N5  
1
4
N4  
1
3
N3  
0
2
N2  
0
1
N1  
0
0
N0  
0
Symbol  
Default  
7.3.4 Register 3 - Configuration register  
This register configures the directions of the I/O pins. If a bit in this register is set, the  
corresponding port pin is enabled as an input with high-impedance output driver. If a bit in  
this register is cleared, the corresponding port pin is enabled as an output.  
Table 8.  
Bit  
Register 3 - Configuration register bit allocation  
7
C7  
1
6
C6  
1
5
C5  
1
4
C4  
1
3
C3  
1
2
C2  
1
1
C1  
1
0
C0  
1
Symbol  
Default  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
8 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
7.4 Power-on reset  
When power is applied to VDD, an internal Power-On Reset (POR) holds the PCA9557 in  
a reset condition until VDD has reached VPOR. At that point, the reset condition is released  
and the PCA9557 registers and I2C-bus/SMBus state machine will initialize to their default  
states. Thereafter, VDD must be lowered below 0.2 V to reset the device.  
7.5 RESET input  
A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The  
PCA9557 registers and SMBus/I2C-bus state machine will be held in their default state  
until the RESET input is once again HIGH. This input requires a pull-up resistor to VDD if  
no active connection is used.  
8. Characteristics of the I2C-bus  
The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two  
lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be  
connected to a positive supply via a pull-up resistor when connected to the output stages  
of a device. Data transfer may be initiated only when the bus is not busy.  
8.1 Bit transfer  
One data bit is transferred during each clock pulse. The data on the SDA line must remain  
stable during the HIGH period of the clock pulse as changes in the data line at this time  
will be interpreted as control signals (see Figure 10).  
SDA  
SCL  
data line  
stable;  
data valid  
change  
of data  
allowed  
mba607  
Fig 10. Bit transfer  
8.1.1 START and STOP conditions  
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW  
transition of the data line while the clock is HIGH is defined as the START condition (S). A  
LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP  
condition (P) (see Figure 11).  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
9 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
SDA  
SCL  
SDA  
SCL  
S
P
STOP condition  
mba608  
START condition  
Fig 11. Definition of START and STOP conditions  
8.2 System configuration  
A device generating a message is a ‘transmitter’; a device receiving is the ‘receiver’. The  
device that controls the message is the ‘master’ and the devices which are controlled by  
the master are the ‘slaves’ (see Figure 12).  
SDA  
SCL  
SLAVE  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
MASTER  
TRANSMITTER/  
RECEIVER  
2
SLAVE  
RECEIVER  
MASTER  
TRANSMITTER  
I C-BUS  
MULTIPLEXER  
SLAVE  
002aaa966  
Fig 12. System configuration  
8.3 Acknowledge  
The number of data bytes transferred between the START and the STOP conditions from  
transmitter to receiver is not limited. Each byte of eight bits is followed by one  
acknowledge bit. The acknowledge bit is a HIGH level put on the bus by the transmitter,  
whereas the master generates an extra acknowledge related clock pulse.  
A slave receiver which is addressed must generate an acknowledge after the reception of  
each byte. Also a master must generate an acknowledge after the reception of each byte  
that has been clocked out of the slave transmitter. The device that acknowledges has to  
pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable  
LOW during the HIGH period of the acknowledge related clock pulse; set-up and hold  
times must be taken into account.  
A master receiver must signal an end of data to the transmitter by not generating an  
acknowledge on the last byte that has been clocked out of the slave. In this event, the  
transmitter must leave the data line HIGH to enable the master to generate a STOP  
condition.  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
10 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
data output  
by transmitter  
not acknowledge  
acknowledge  
data output  
by receiver  
SCL from master  
1
2
8
9
S
clock pulse for  
START  
condition  
acknowledgement  
002aaa987  
Fig 13. Acknowledgement on the I2C-bus  
8.4 Bus transactions  
Data is transmitted to the PCA9557 registers using Write Byte transfers (see Figure 14  
and Figure 15). Data is read from the PCA9557 registers using Read and Receive Byte  
transfers (see Figure 16 and Figure 17).  
SCL  
1
2
3
4
5
6
7
8
9
STOP  
condition  
slave address  
A2 A1 A0  
command byte  
data to port  
DATA 1  
SDA  
S
0
0
1
1
0
A
0
0
0
0
0
0
0
1
A
A
P
START condition  
R/W acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
write to port  
t
v(Q)  
data out from port  
DATA 1 VALID  
002aad281  
Fig 14. Write to output port register  
SCL  
1
2
3
4
5
6
7
8
9
STOP  
condition  
slave address  
A2 A1 A0  
command byte  
data to register  
DATA  
SDA  
S
0
0
1
1
0
A
0
0
0
0
0
0
1
1/0  
A
A
P
START condition  
R/W acknowledge  
from slave  
acknowledge  
from slave  
acknowledge  
from slave  
002aad282  
Fig 15. Write to I/O configuration or polarity inversion registers  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
11 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
slave address  
command byte  
(cont.)  
SDA  
S
0
0
1
1
A2 A1 A0  
0
A
A
START condition  
R/W  
acknowledge  
from slave  
acknowledge  
from slave  
slave address  
data from register  
DATA (first byte)  
data from register  
(cont.)  
S
0
0
1
1
A2 A1 A0  
1
A
A
DATA (last byte)  
NA P  
(repeated)  
START condition  
R/W  
acknowledge  
from master  
no acknowledge STOP  
from master condition  
acknowledge  
from slave  
at this moment master-transmitter becomes master-receiver  
and slave-receiver becomes slave-transmitter  
002aad283  
Fig 16. Read from register  
no acknowledge  
from master  
slave address  
A2 A1 A0  
data from port  
DATA 1  
data from port  
DATA 4  
SDA  
S
0
0
1
1
1
A
A
NA  
P
START condition  
R/W acknowledge  
from slave  
acknowledge  
from master  
STOP  
condition  
read from  
port  
t
t
su(D)  
h(D)  
data into  
port  
DATA 1  
DATA 2  
DATA 3  
DATA 4  
002aad284  
Remark: This figure assumes the command byte has previously been programmed with 00h.  
Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the last acknowledge  
phase is valid (output mode). Input data is lost.  
Fig 17. Read input port register  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
12 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
9. Application design-in information  
V
(5 V)  
DD  
100 kΩ  
(× 5)  
620 Ω  
1.8 kΩ  
1.8 kΩ  
2 kΩ  
2 kΩ  
V
V
DD  
DD  
MASTER  
CONTROLLER  
PCA9557  
SUBSYSTEM 1  
IO0  
(e.g., temp. sensor)  
SCL  
SCL  
SDA  
INT  
SDA  
IO1  
IO2  
IO3  
IO4  
IO5  
IO6  
IO7  
RESET  
RESET  
RESET  
SUBSYSTEM 2  
(e.g., counter)  
V
SS  
A
controlled switch  
(e.g., CBT device)  
enable  
A2  
A1  
A0  
B
V
SS  
ALARM  
SUBSYSTEM 3  
(e.g., alarm system)  
V
DD  
002aad285  
Device address configured as 0011 100x for this example.  
IO0, IO2, IO3 configured as outputs.  
IO1, IO4, IO5 configured as inputs.  
IO6, IO7 are not used.  
Fig 18. Typical application  
9.1 Minimizing IDD when the I/Os are used to control LEDs  
When the I/Os are used to control LEDs, they are normally connected to VDD through a  
resistor as shown in Figure 18. Since the LED acts as a diode, when the LED is off the  
I/O VI is about 1.2 V less than VDD. The supply current, IDD, increases as VI becomes  
lower than VDD  
.
Designs needing to minimize current consumption, such as battery power applications,  
should consider maintaining the I/O pins greater than or equal to VDD when the LED is off.  
Figure 19 shows a high value resistor in parallel with the LED. Figure 20 shows VDD less  
than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI  
at or above VDD and prevents additional supply current consumption when the LED is off.  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
13 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
3.3 V  
5 V  
V
DD  
V
100 kΩ  
V
DD  
DD  
LED  
LED  
IOn  
IOn  
002aac660  
002aac661  
Fig 19. High value resistor in parallel with  
the LED  
Fig 20. Device supplied by a lower voltage  
10. Limiting values  
Table 9.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDD  
Parameter  
Conditions  
Min  
Max  
+6  
Unit  
V
supply voltage  
input voltage  
input current  
0.5  
VI  
V
-
SS 0.5  
5.5  
V
II  
±20  
±400  
mA  
µA  
IIHL(max)  
maximum allowed input current  
VI VDD or VI VSS  
-
through protection diode (IO1 to IO7)  
VI/O  
voltage on an input/output pin  
input/output current  
I/O as an input, except IO0  
IO0 as an input  
V
V
-
SS 0.5  
SS 0.5  
5.5  
V
5.5  
V
II/O  
IO0 as an input  
+400  
20  
±50  
85  
µA  
mA  
mA  
mA  
mA  
mW  
°C  
-
IO(IOn)  
IDD  
output current on pin IOn  
supply current  
-
-
ISS  
ground supply current  
total power dissipation  
storage temperature  
ambient temperature  
-
100  
200  
+150  
+85  
Ptot  
-
Tstg  
Tamb  
65  
40  
operating  
°C  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
14 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
11. Static characteristics  
Table 10. Static characteristics  
VDD = 2.3 V to 5.5 V; VSS = 0 V; Tamb = 40 °C to +85 °C; unless otherwise specified.  
Symbol  
Supplies  
VDD  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
supply current  
2.3  
-
-
5.5  
25  
V
IDD  
operating mode; VDD = 5.5 V;  
no load; fSCL = 100 kHz  
19  
µA  
IstbL  
LOW-level standby current  
standby mode; VDD = 5.5 V;  
no load; VI = VSS; fSCL = 0 kHz;  
I/O = inputs  
-
-
-
-
0.25  
0.25  
0.8  
1
µA  
µA  
mA  
V
IstbH  
Istb  
VPOR  
HIGH-level standby current standby mode; VDD = 5.5 V;  
no load; VI = VDD; fSCL = 0 kHz;  
I/O = inputs  
1
additional standby current  
standby mode; VDD = 5.5 V;  
every LED I/O at VI = 4.3 V;  
1
fSCL = 0 kHz  
[1]  
power-on reset voltage  
no load; VI = VDD or VSS  
1.65  
2.1  
Input SCL; input/output SDA  
VIL  
VIH  
IOL  
IL  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level output current  
leakage current  
0.5  
-
+0.3VDD  
V
0.7VDD  
-
5.5  
-
V
VOL = 0.4 V  
VI = VDD or VSS  
VI = VSS  
3
-
mA  
µA  
pF  
1  
-
-
+1  
10  
Ci  
input capacitance  
6
I/Os  
VIL  
VIH  
IOL  
IOH  
LOW-level input voltage  
HIGH-level input voltage  
LOW-level output current  
HIGH-level output current  
0.5  
-
+0.8  
V
2.0  
-
5.5  
V
[2]  
[3]  
8
4
-
10  
-
-
mA  
mA  
µA  
µA  
µA  
pF  
pF  
except pin IO0; VOH = 2.4 V  
pin IO0; VOH = 4.6 V  
pin IO0; VOH = 3.3 V  
VDD = 5.5 V; VI = VSS  
-
-
1
-
-
1
ILI  
Ci  
Co  
input leakage current  
input capacitance  
output capacitance  
-
-
100  
-
3.7  
3.7  
5
5
-
Select inputs A0, A1, A2 and RESET  
VIL  
VIH  
ILI  
LOW-level input voltage  
HIGH-level input voltage  
input leakage current  
0.5  
2.0  
1  
-
-
-
+0.8  
5.5  
+1  
V
V
µA  
[1] VDD must be lowered to 0.2 V in order to reset part.  
[2] The total amount sunk by all I/Os must be limited to 100 mA and 25 mA per bit.  
[3] The total current sourced by all I/Os must be limited to 85 mA and 20 mA per bit.  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
15 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
12. Dynamic characteristics  
Table 11. Dynamic characteristics  
Symbol Parameter  
Conditions  
Standard-mode  
I2C-bus  
Fast-mode I2C-bus Unit  
Min  
0
Max  
100  
-
Min  
0
Max  
400  
-
fSCL  
tBUF  
SCL clock frequency  
kHz  
bus free time between a STOP and  
START condition  
4.7  
1.3  
µs  
tHD;STA  
tSU;STA  
hold time (repeated) START condition  
4.0  
4.7  
-
-
0.6  
0.6  
-
-
µs  
µs  
set-up time for a repeated START  
condition  
tSU;STO  
tHD;DAT  
tVD;ACK  
tVD;DAT  
tSU;DAT  
tLOW  
tHIGH  
tf  
set-up time for STOP condition  
data hold time  
4.0  
-
0.6  
-
-
µs  
ns  
µs  
ms  
ns  
µs  
µs  
ns  
ns  
ns  
0
-
0
[1]  
[2]  
data valid acknowledge time  
data valid time  
-
-
1
-
0.9  
0.9  
-
1
-
data set-up time  
250  
4.7  
4.0  
-
-
-
100  
1.3  
LOW period of the SCL clock  
HIGH period of the SCL clock  
fall time of both SDA and SCL signals  
rise time of both SDA and SCL signals  
-
-
0.6  
-
[3]  
[3]  
300  
1000  
50  
20 + 0.1Cb  
20 + 0.1Cb  
-
300  
300  
50  
tr  
-
tSP  
pulse width of spikes that must be  
suppressed by the input filter  
-
Port timing  
tv(Q)  
data output valid time  
pin IO0  
-
-
250  
-
-
250  
ns  
ns  
ns  
ns  
pins IO1 to IO7  
200  
200  
tsu(D)  
th(D)  
Reset timing  
data input set-up time  
0
-
-
0
-
-
data input hold time  
200  
200  
tw(rst)  
trec(rst)  
trst  
reset pulse width  
6
0
-
-
-
6
0
-
-
-
ns  
ns  
ns  
reset recovery time  
reset time  
400  
400  
[1] tVD;ACK = time for acknowledgement signal from SCL LOW to SDA (out) LOW.  
[2] tVD;DAT = minimum time for SDA data out to be valid following SCL LOW.  
[3] Cb = total capacitance of one bus line in pF.  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
16 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
SDA  
t
t
t
t
SP  
t
r
f
HD;STA  
BUF  
t
LOW  
SCL  
t
t
t
SU;STO  
HD;STA  
SU;STA  
t
t
t
SU;DAT  
HD;DAT  
HIGH  
P
S
Sr  
P
002aaa986  
Fig 21. Definition of timing on the I2C-bus  
ACK or read cycle  
START  
SCL  
SDA  
30 %  
t
rst  
RESET  
50 %  
50 %  
50 %  
t
rec(rst)  
t
w(rst)  
t
rst  
I/O configured  
as inputs  
IOn  
50 %  
002aad289  
Fig 22. Definition of RESET timing  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
17 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
13. Package outline  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
D
E
A
X
v
c
y
H
M
A
E
Z
16  
9
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
8
e
w
M
detail X  
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
10.0  
9.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.39  
0.014 0.0075 0.38  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.020  
0.028  
0.012  
inches  
0.069  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT109-1  
076E07  
MS-012  
Fig 23. Package outline SOT109-1 (SO16)  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
18 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
D
E
A
X
c
y
H
v
M
A
E
Z
9
16  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
8
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.40  
0.06  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT403-1  
MO-153  
Fig 24. Package outline SOT403-1 (TSSOP16)  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
19 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
HVQFN16: plastic thermal enhanced very thin quad flat package; no leads;  
16 terminals; body 4 x 4 x 0.85 mm  
SOT629-1  
B
A
D
terminal 1  
index area  
A
A
1
E
c
detail X  
e
1
C
1/2 e  
y
y
e
v
M
M
b
C
C
A B  
C
1
w
5
8
L
9
4
1
e
e
E
h
2
1/2 e  
12  
terminal 1  
index area  
16  
13  
X
D
h
0
2.5  
scale  
5 mm  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
e
2
y
D
D
E
L
v
w
y
1
1
h
h
max.  
0.05 0.38  
0.00 0.23  
4.1  
3.9  
2.25  
1.95  
4.1  
3.9  
2.25  
1.95  
0.75  
0.50  
mm  
0.05  
0.1  
1
0.2  
0.65  
1.95 1.95  
0.1 0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
01-08-08  
02-10-22  
SOT629-1  
- - -  
MO-220  
- - -  
Fig 25. Package outline SOT629-1 (HVQFN16)  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
20 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
14. Handling information  
Inputs and outputs are protected against electrostatic discharge in normal handling.  
However, to be completely safe you must take normal precautions appropriate to handling  
integrated circuits.  
15. Soldering of SMD packages  
This text provides a very brief insight into a complex technology. A more in-depth account  
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow  
soldering description”.  
15.1 Introduction to soldering  
Soldering is one of the most common methods through which packages are attached to  
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both  
the mechanical and the electrical connection. There is no single soldering method that is  
ideal for all IC packages. Wave soldering is often preferred when through-hole and  
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not  
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high  
densities that come with increased miniaturization.  
15.2 Wave and reflow soldering  
Wave soldering is a joining technology in which the joints are made by solder coming from  
a standing wave of liquid solder. The wave soldering process is suitable for the following:  
Through-hole components  
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board  
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless  
packages which have solder lands underneath the body, cannot be wave soldered. Also,  
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,  
due to an increased probability of bridging.  
The reflow soldering process involves applying solder paste to a board, followed by  
component placement and exposure to a temperature profile. Leaded packages,  
packages with solder balls, and leadless packages are all reflow solderable.  
Key characteristics in both wave and reflow soldering are:  
Board specifications, including the board finish, solder masks and vias  
Package footprints, including solder thieves and orientation  
The moisture sensitivity level of the packages  
Package placement  
Inspection and repair  
Lead-free soldering versus SnPb soldering  
15.3 Wave soldering  
Key characteristics in wave soldering are:  
© NXP B.V. 2008. All rights reserved.  
PCA9557  
Product data sheet  
Rev. 06 — 11 June 2008  
21 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
Process issues, such as application of adhesive and flux, clinching of leads, board  
transport, the solder wave parameters, and the time during which components are  
exposed to the wave  
Solder bath specifications, including temperature and impurities  
15.4 Reflow soldering  
Key characteristics in reflow soldering are:  
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to  
higher minimum peak temperatures (see Figure 26) than a SnPb process, thus  
reducing the process window  
Solder paste printing issues including smearing, release, and adjusting the process  
window for a mix of large and small components on one board  
Reflow temperature profile; this profile includes preheat, reflow (in which the board is  
heated to the peak temperature) and cooling down. It is imperative that the peak  
temperature is high enough for the solder to make reliable solder joints (a solder paste  
characteristic). In addition, the peak temperature must be low enough that the  
packages and/or boards are not damaged. The peak temperature of the package  
depends on package thickness and volume and is classified in accordance with  
Table 12 and 13  
Table 12. SnPb eutectic process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
235  
350  
220  
< 2.5  
2.5  
220  
220  
Table 13. Lead-free process (from J-STD-020C)  
Package thickness (mm) Package reflow temperature (°C)  
Volume (mm3)  
< 350  
260  
350 to 2000  
> 2000  
260  
< 1.6  
260  
250  
245  
1.6 to 2.5  
> 2.5  
260  
245  
250  
245  
Moisture sensitivity precautions, as indicated on the packing, must be respected at all  
times.  
Studies have shown that small packages reach higher temperatures during reflow  
soldering, see Figure 26.  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
22 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
maximum peak temperature  
= MSL limit, damage level  
temperature  
minimum peak temperature  
= minimum soldering temperature  
peak  
temperature  
time  
001aac844  
MSL: Moisture Sensitivity Level  
Fig 26. Temperature profiles for large and small components  
For further information on temperature profiles, refer to Application Note AN10365  
“Surface mount reflow soldering description”.  
16. Abbreviations  
Table 14. Abbreviations  
Acronym  
CBT  
Description  
Cross Bar Technology  
Charged-Device Model  
Complementary Metal-Oxide Semiconductor  
ElectroStatic Discharge  
Human Body Model  
CDM  
CMOS  
ESD  
HBM  
I2C-bus  
I/O  
Inter-Integrated Circuit bus  
Input/Output  
LED  
Light-Emitting Diode  
MM  
Machine Model  
PCB  
Printed-Circuit Board  
Power-On Reset  
POR  
SMBus  
System Management Bus  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
23 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
17. Revision history  
Table 15. Revision history  
Document ID  
PCA9557_6  
Modifications:  
Release date  
Data sheet status  
Change notice  
Supersedes  
20080611  
Product data sheet  
-
PCA9557_5  
Section 2 “Features”, 17th bullet item: changed from “200 V MM” to “150 V MM”  
Table 11 “Dynamic characteristics”, sub-section “Reset timing”: changed Min value for tw(rst) from  
“4 ns” to “6 ns” (for both Standard-mode and Fast-mode)  
Updated soldering information  
PCA9557_5  
20070912  
Product data sheet  
-
-
PCA9557_4  
PCA9557_3  
PCA9557_4  
20041124  
Product data sheet  
(9397 750 13336)  
PCA9557_3  
(9397 750 10872)  
20021213  
20020513  
20011212  
Product data  
Product data  
Product data  
ECN 853-2308 29160  
of 06 Nov 2002  
PCA9557_2  
PCA9557_1  
-
PCA9557_2  
(9397 750 09819)  
ECN 853-2308 28188  
of 13 May 2002  
PCA9557_1  
ECN 853-2308 27449  
of 12 Dec 2001  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
24 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
to result in personal injury, death or severe property or environmental  
18.2 Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
18.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
I2C-bus — logo is a trademark of NXP B.V.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PCA9557  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 06 — 11 June 2008  
25 of 26  
PCA9557  
NXP Semiconductors  
8-bit I2C-bus and SMBus I/O port with reset  
20. Contents  
1
General description . . . . . . . . . . . . . . . . . . . . . . 1  
18.4  
19  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Contact information . . . . . . . . . . . . . . . . . . . . 25  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26  
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
3
3.1  
4
20  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
6
System diagram . . . . . . . . . . . . . . . . . . . . . . . . . 6  
7
7.1  
7.2  
7.3  
7.3.1  
7.3.2  
7.3.3  
7.3.4  
7.4  
Functional description . . . . . . . . . . . . . . . . . . . 7  
Device address. . . . . . . . . . . . . . . . . . . . . . . . . 7  
Control register . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Register descriptions . . . . . . . . . . . . . . . . . . . . 8  
Register 0 - Input port register . . . . . . . . . . . . . 8  
Register 1 - Output port register. . . . . . . . . . . . 8  
Register 2 - Polarity inversion register . . . . . . . 8  
Register 3 - Configuration register . . . . . . . . . . 8  
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 9  
RESET input. . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
7.5  
8
Characteristics of the I2C-bus. . . . . . . . . . . . . . 9  
Bit transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
START and STOP conditions . . . . . . . . . . . . . . 9  
System configuration . . . . . . . . . . . . . . . . . . . 10  
Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 11  
8.1  
8.1.1  
8.2  
8.3  
8.4  
9
9.1  
Application design-in information . . . . . . . . . 13  
Minimizing IDD when the I/Os are used to  
control LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
10  
11  
12  
13  
14  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 14  
Static characteristics. . . . . . . . . . . . . . . . . . . . 15  
Dynamic characteristics . . . . . . . . . . . . . . . . . 16  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18  
Handling information. . . . . . . . . . . . . . . . . . . . 21  
15  
Soldering of SMD packages . . . . . . . . . . . . . . 21  
Introduction to soldering . . . . . . . . . . . . . . . . . 21  
Wave and reflow soldering . . . . . . . . . . . . . . . 21  
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21  
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22  
15.1  
15.2  
15.3  
15.4  
16  
17  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24  
18  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
18.1  
18.2  
18.3  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 11 June 2008  
Document identifier: PCA9557  

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