PCA9922N,112 [NXP]
PCA9922 - 8-channel constant current LED driver with output error detection;型号: | PCA9922N,112 |
厂家: | NXP |
描述: | PCA9922 - 8-channel constant current LED driver with output error detection PC 光电二极管 |
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PCA9922
8-channel constant current LED driver with output error
detection
Rev. 2 — 6 April 2011
Product data sheet
1. General description
The PCA9922 is an 8-channel constant current LED driver designed for LED signage and
display applications. The output current is adjustable from 15 mA to 60 mA controlled by
an external series resistor. The outputs are controlled via a serial interface with a
maximum clock frequency of 25 MHz to allow for the system requirement of high volume
data transmission. Each of the 8 channel outputs has edge rate control to limit the change
in current when the outputs are enabled or disabled.
The device has built-in circuitry for detecting LED open-circuit and output short to ground.
After signaling the specified error detect sequence on the input control lines, error status
can be read out of the device via the serial data out.
The device is designed such that it may be cascaded with other similar devices. The SDO
pin contains the output of the shift register which may be used for cascading to the SDI pin
of the next device in the series. SDO changes state on the falling edge of CLK. SDI
captures data on the rising edge of CLK.
The PCA9922 is a pin-to-pin functionally equivalent 5 V alternative (exception: error data
is inverted; see Section 7.2.1, Section 7.2.2 and Section 7.2.7) for the ST2221A and
STP08CDC596.
The PCA9922 is available in DIP16, TSSOP16 and HVQFN20 packages and is specified
over the −40 °C to +85 °C industrial temperature range.
2. Features and benefits
25 MHz serial interface
3.3 V to 5.5 V operation
8 LED low side constant current outputs
Global control for the 8 LED outputs variable between 15 mA to 60 mA
15 mA to 60 mA maximum current for all 8 output channels set by an external resistor
Constant current matching at 25 °C, VDD = 5.0 V
Bit-to-bit: ±6 %
Chip-to-chip: ±10 %
Gradual turn-on/turn-off output to limit EMI
Error detection mode for line open, output short to ground, LED open and LED short
−40 °C to +85 °C operation
ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
Packages offered: DIP16, TSSOP16, HVQFN20
3. Applications
Full color, multi-color, monochrome LED signs
LED billboard displays
Traffic display signs
Transportation and commercial LED signs
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
PCA9922N
PCA9922PW
PCA9922BS
DIP16
plastic dual in-line package; 16 leads (300 mil)
SOT38-4
SOT403-1
SOT662-1
TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm
HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals;
body 5 × 5 × 0.85 mm
4.1 Ordering options
Table 2.
Ordering options
Type number
PCA9922N
Topside mark
PCA9922N
PCA9922
P9922
Temperature range
Tamb = −40 °C to +85 °C
Tamb = −40 °C to +85 °C
Tamb = −40 °C to +85 °C
PCA9922PW
PCA9922BS
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
2 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
5. Block diagram
LED0
LED1
LED7
V
DD
ERROR
DETECT
R_EXT
CURRENT REGULATOR
V
DD
PCA9922
OE
LE
OUTPUT ENABLE
8× DATA LATCH
V
SS
SDI
8× SHIFT REGISTER
ERROR CONTROL
SDO
CLK
V
SS
002aad311
Fig 1. Block diagram of PCA9922
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
3 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
6. Pinning information
6.1 Pinning
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
V
DD
SS
SDI
CLK
R_EXT
SDO
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
V
DD
SS
LE/DM1
LED0
LED1
LED2
LED3
OE/DM2
LED7
LED6
LED5
LED4
SDI
CLK
R_EXT
SDO
PCA9922N
LE/DM1
LED0
LED1
LED2
LED3
OE/DM2
LED7
LED6
LED5
LED4
PCA9922PW
002aad161
002aad163
Fig 2. Pin configuration for DIP16
Fig 3. Pin configuration for TSSOP16
terminal 1
index area
1
2
3
4
5
15
14
13
12
11
CLK
LE/DM1
LED0
SDO
OE/DM2
LED7
LED6
LED5
PCA9922BS
LED1
LED2
002aad349
Transparent top view
Fig 4. Pin configuration for HVQFN20
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
4 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
6.2 Pin description
Table 3.
Pin description
I = input; O = output.
Symbol
Pin
Type
Description
DIP16,
HVQFN20
TSSOP16
VSS
SDI
CLK
1
2
3
19[1]
20
1
power supply
supply ground
serial data in
I
I
serial data clock used to shift data on SDI
into the shift register
LE/DM1
4
2
I
latch enable with internal pull-down
resistor; active HIGH signal used to
capture data in the shift register to present
to the outputs
Detection Mode 1
LED0
LED1
LED2
LED3
LED4
LED5
LED6
LED7
OE/DM2
5
3
O
O
O
O
O
O
O
O
I
constant current LED output driver 0
constant current LED output driver 1
constant current LED output driver 2
constant current LED output driver 3
constant current LED output driver 4
constant current LED output driver 5
constant current LED output driver 6
constant current LED output driver 7
6
4
7
5
8
6
9
10
11
12
13
14
10
11
12
13
output enable with internal pull-up resistor;
active LOW signal used to allow data
captured in the latch to be presented to the
constant current outputs
Detection Mode 2
serial data output
external resistor input
supply voltage
SDO
R_EXT
VDD
14
15
16
-
15
O
16
analog input
power supply
-
17
n.c.
7, 8, 9, 18
not connected
[1] HVQFN20 package die supply ground is connected to both VSS pin and exposed center pad. VSS pin must
be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board
level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad
on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the
PCB in the thermal pad region.
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
5 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7. Functional description
The PCA9922 is an 8-channel constant current LED driver with built-in LED output error
detection. The PCA9922 contains an 8-bit shift register and data latches, which convert
serial input data into parallel output data.
At the output stage, 8 regulated current sinks are designed to provide constant and
uniform current through LEDs with different forward voltages (VF).
Refer to Figure 1 “Block diagram of PCA9922”.
7.1 System interface
During normal operation, serial data can be transferred into the PCA9922 through SDI,
shifted into the shift register, and out through the SDO. Data shifts from the SDI pin into
the next sequential bit in the shift register on each rising edge of the CLK input. The MSB
is the first bit to be clocked in. Data shifts out of the shift register and is presented on the
SDO pin on the falling edge of CLK. The exception to this is during the error detect
sequence, at which time the error status is loaded in a parallel fashion into the shift
register. The shift register is never disabled. It is either shifting or it is loading the error
status on every rising edge of CLK. Additionally, the device is designed such that it may
be cascaded with other similar devices. The SDO pin contains the output of the shift
register which may be used for cascading to the SDI pin of the next device in the series.
Data is parallel loaded from the serial shift register to an output control register when LE
(Latch Enable) is asserted HIGH (serial-to-parallel conversion). The output control register
will continue to reflect the shift register data, even if changes occur in the shift register
data, as long as LE is HIGH. When LE is LOW the latch is closed and changes in the shift
register data no longer effect the output control register. Applications where the latches
are bypassed (LE tied HIGH) will require that the OE input be HIGH during serial data
entry.
The data in the output control register is then used to drive the constant current output
drivers when the outputs are enabled. The outputs are globally enabled or disabled
through the OE. A LOW level on the OE will enable the output drivers, LED0 to LED7, to
reflect the data contained in the output control register.
An example timing diagram of expected normal operation of the device is shown in
Figure 5.
Remark: It is recommended that OE and LE pulse widths be at least two clocks wide
when CLK is running to avoid inadvertent entry into the error detect modes.
There is no synchronization logic in the design between CLK, LE and OE. It is the user’s
responsibility to meet the timing presented in Table 10 in order to guarantee proper
operation.
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
6 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
CLK
SDI
LE
OE
LED0
LED1
LED2
LED3
LED4
LED5
LED6
LED7
002aad203
For each LEDn 0 is on, 1 is off.
Fig 5. Normal function timing diagram
7.2 LED output error detection
The PCA9922 has built-in circuitry for detecting LED open-circuit and output short
conditions. A predefined set of signal sequence on the input control lines must be initiated
to perform the output error detection. Once the error data is captured by this sequence,
error status can be read out of the device via the serial interface.
The error detection mode is entered by the user via specific timing sequences presented
on the CLK, OE and LE pins. There are three key sequences to be generated by the user:
enter error detect, capture faults, and exit error detect. It is the responsibility of the user to
enable all outputs that the user wants to test during the error detect sequence.
Performing an error mode detection sequence consists of several operations:
1. Entering error detect mode.
2. Setting all bits that you want to test by enabling all outputs to logical 1s in the output
latch.
3. Capture fault data.
4. Exit error detect.
7.2.1 Open-circuit detection principle
The LED open-circuit detection compares the effective current level IO with the open load
detection threshold current Ith(det). If IO is below Ith(det), the PCA9922 detects an open-load
condition. This error status can be read as an error status code in the error detect mode.
For open-circuit error detection, a channel must be on.
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
7 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
Table 4.
Open-circuit detection
Condition of
State of
Error status code
Meaning
output port
output current
off
on
IO = 0 mA
0
detection not possible
open circuit
[1]
IO < Ith(det)
1
[1]
IO ≥ Ith(det)
channel n error status bit 0
normal
[1] Ith(det) = 0.5 × IO (target) (typical).
7.2.2 Short-circuit detection principle
The LED short-circuit detection compares the effective voltage level (VO) with the
shorted-load detection threshold voltages Vth(det)sc and Vth(norm). If VO is above the
V
V
th(det)sc threshold, the PCA9922 detects a shorted-load condition. If VO is below the
th(norm) threshold, no error is detected or error bit is reset. This error status can be read
as an error status code in the Special mode. For short-circuit error detection, a channel
must be on.
Table 5.
Shorted-load detection
State of
Condition of
Error status code
Meaning
output port
output voltage
off
on
IO = 0 mA
0
detection not possible
short circuit
VO ≥ Vth(det)sc
VO < Vth(norm)
1
channel n error status bit 0
normal
7.2.3 Entering error detect mode
Entering the error detect mode consists of a 5-clock sequence involving CLK, OE and LE
as shown in Figure 6. The user must meet the set-up and hold times for OE and LE as
detailed inTable 10 to guarantee proper operation of the error detect circuitry. It should be
noted that the act of driving LE HIGH around the rising edge of clock 4 opens the latch in
the current control register block and data captured in the shift register at that point in time
is moved into the output control register. It should also be noted that the output logic was
enabled for a brief period of time while OE is LOW around the rising edge of clock 2. The
outputs LED[7:0] will glitch during this period.
CLK
LE
OE
002aad204
Fig 6. Timing for ‘Enter Error Detect Mode’ command
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
8 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7.2.4 Setting the outputs to test
Before the Capture Fault sequence may be performed, the outputs must be set up. A logic
HIGH must be sent to the output control register for all eight bits. This is done after the
Enter Error Detect sequence is performed as a normal data load sequence as seen in
Figure 5. Please note that this process is completely destructive to the data that is stored
in the output control register (and the LED[7:0] pins). The output control register will have
to be restored to its proper values by the user after the error detect sequence has been
completed.
7.2.5 Capturing the fault/output error data
The Capture Fault/Error Data sequence can only follow the Enter Error Detect sequence.
If the Error Detect sequence has not occurred, this sequence will be treated as a normal
operational sequence. Once the Capture Fault sequence has occurred, an Exit Error
Detect sequence should be performed. There can be no more Capture Sequences until
another Enter Error Detect sequence has occurred.
The Capture Fault Sequence consists of holding OE LOW for no less than 3 clocks (CLK)
and for a minimum of 2 μs, whichever is longer. During this period of time, the shift register
is being loaded with the fault status. As such, data presented to the device via SDI will not
be captured. Bit 7 of the fault data will be present on SDO by the first falling edge CLK
after the user de-asserts OE for this cycle. An error condition is output as a 1 (HIGH bit),
and a 0 (LOW bit) designates a normal status. Timing for this sequence is shown in
Figure 7.
CLK
LE
OE
OE = 1'b0 for minimum of 3 clocks
or 2 μs, whichever is longer
SDO
previous serial data
fault data MSB
resume shift
with fault data
002aad205
Fig 7. Timing for ‘Capture Fault Mode’ command
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
9 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
7.2.6 Exit error detect mode
The ‘Exit error detect mode’ sequence is used to exit the error detect mode of operation
and resume normal mode. This is a 5-clock timing sequence using CLK, OE and LE. This
sequence consists of LE being held inactive for all five clocks. OE is active in the second
clock for one and only one clock. Figure 8 shows the timing for this sequence.
CLK
LE
OE
002aad206
Fig 8. Timing for ‘Exit Error Detect Mode’ command
7.2.7 Error detection data
The PCA9922 will return a logical 1 for each output pin that has an error condition
detected as described in Table 4 and Table 5. An error condition may be either an
open circuit or short-circuit at the output pin. Once the Capture Fault sequence has
completed, the resultant fault/output error data may be shifted out of the device by issuing
8 clocks and reading the data at the SDO pin. If more than one device is connected in
series, then more than 8 clocks will be needed to shift all of the data from all of the devices
through to the last SDO pin in the chain.
Figure 9 shows a complete error detection sequence.
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
10 of 27
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at least 8 clocks
some number of
optional clocks to
clock in 1s for testing
shift halted
load fault
command
enter error detect
command
shift
resumed
exit error detect
command
CLK
SDI
shift_reg[n-1:0]
SDO
fault data
fault data MSB
previous serial data shifting out
this must be min. 2 μs wide
and 3 clocks minimum with
output enable LOW
OE
LE
fault_load goes LOW
on this edge of OE
fault_load
fault_data[n-1:0]
fault data 8 bits
error_detect_mode
002aad208
Lower-case signal names are internal signals shown to aid understanding of timing.
Fig 9. Timing for a complete error detection sequence
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
8. Application design-in information
5 V
C
10 μF
3.3 V to 5.5 V
LED0 LED1 LED2 LED3
LED7
OE
V
DD
PCA9922
R_EXT
SDI
SDO
to next stage
CLK
LE
V
SS
PWM
OR
BLANKING
INPUT
MICROCONTROLLER
SDO from last stage
002aad312
Fig 10. Typical application
V
LED
= 3 V ∼ 4 V
+
V
CE
V
DD
−
scan
R
OE
CLK
LE
V
O
V
I
LED0
LED7
CPU
PCA9922
SDI
R_EXT
V
SS
SDO
OE
CLK
LE
V
O
V
I
LED0
LED7
PCA9922
SDI
R_EXT
V
SS
SDO
002aad504
Fig 11. The PCA9922 in a typical multi-device architecture
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
12 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
9. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDD
Parameter
Conditions
Min
−0.5
−0.5
−0.5
−0.4
-
Max
+6.0
+6.0
+6.0
VDD + 0.4
485
Unit
V
supply voltage
VO(LED)
VO(SDO)
VI
LED output voltage
output voltage on pin SDO
input voltage
pins LED0 to LED7
V
V
V
ISS
ground supply current
output current on pin LEDn
clock frequency
mA
mA
MHz
°C
°C
IO(LEDn)
fclk
-
60
operating
-
25
Tstg
storage temperature
junction temperature
total power dissipation
−65
−40
+150
+125
Tj
Ptot
Tamb = 25 °C
DIP16
-
-
-
1.12
W
W
W
TSSOP16
HVQFN20
0.625
3.125
10. Recommended operating conditions
Table 7.
Symbol
VDD
Operating conditions
Parameter
Conditions
Min
Max
Unit
supply voltage
3.3
5.5
V
VO(LED)
LED output voltage
pins LED0 to LED7
inactive
-
5.5
2.2
60
V
output active
-
V
IO(LEDn)
VO(SDO)
Ptot
output current on pin LEDn
output voltage on pin SDO
total power dissipation
15
-
mA
V
5.5
Tamb = 85 °C
DIP16
-
0.44
0.25
1.25
+85
W
W
W
°C
TSSOP16
HVQFN20
-
-
Toper
operating temperature
−40
11. Thermal characteristics
Table 8.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Typ
Unit
thermal resistance from junction
to ambient
DIP16
89
°C/W
°C/W
°C/W
TSSOP16
HVQFN20
160
32
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
13 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
12. Static characteristics
Table 9.
Static characteristics
VDD = 5.0 V; Tamb = 25 °C; unless otherwise specified.
Symbol
Vth(det)sc
Parameter
Conditions
Min
Typ
Max
Unit
short-circuit detection threshold
voltage
for short-error detection;
IO (target) = 5 mA to 120 mA
2.4
2.5
2.6
V
Vth(norm)
normal mode threshold voltage
for short-error detection;
2.3
-
-
V
IO (target) = 5 mA to 120 mA
Control interface (OE, LE, CLK, SDI, SDO)
[1]
VIH
VIL
VOL
VOH
ILI
HIGH-level input voltage
LOW-level input voltage
LOW-level output voltage
HIGH-level output voltage
input leakage current
input capacitance
0.7VDD
-
VDD + 0.3
V
−0.3
-
0.3VDD
0.4
-
V
IOL = 1 mA
-
-
V
IOL = −1 mA
VI = VDD or VSS (CLK, SDI)
VI = VDD or 0 V
OE pin
VDD − 0.4
-
V
−1
-
-
+1
μA
pF
kΩ
kΩ
Ci
1.5
300
200
5
RPU
Rpd
pull-up resistance
150
100
600
400
pull-down resistance
LE pin
Current controlled outputs (LED[7:0])
IOL
LOW-level output current
VO = 0.7 V; Rext = 910 Ω
VO = 0.7 V; Rext = 470 Ω
17.5
35.4
19.5
38.1
21.7
40.8
mA
mA
ΔIOL
LOW-level output current variation between bits
VO = 0.7 V; Rext = 910 Ω
-
-
-
-
-
-
-
±3.0
±1.5
0.7
±7
%
VO = 0.7 V; Rext = 470 Ω
Rext = open; LED[7:0] = off
Rext = 910 Ω; LED[7:0] = off
Rext = 470 Ω; LED[7:0] = off
Rext = 910 Ω; LED[7:0] = on
Rext = 470 Ω; LED[7:0] = on
±4
%
IDD
supply current
1.05
6.0
9.0
6.0
9.0
mA
mA
mA
mA
mA
3.6
6.2
3.6
6.2
[1] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to
active LOW times for executing error detect sequences.
PCA9922
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 6 April 2011
14 of 27
PCA9922
NXP Semiconductors
8-channel constant current LED driver with output error detection
13. Dynamic characteristics
Table 10. Dynamic characteristics
Symbol
tw(LE)
Parameter
Conditions
Min
10
200
5
Typ
Max
Unit
ns
[1]
[2]
LE pulse width
VDD = 3.3 V
-
-
-
-
-
-
tw(OE)
OE pulse width
-
ns
tsu(SDI)
th(SDI)
SDI set-up time
SDI hold time
from SDI to CLK
from CLK to SDI
-
ns
5
-
ns
fCLK
frequency on pin CLK
clock duty cycle
CLK HIGH pulse width
CLK LOW pulse width
0
25
MHz
%
δ
-
50 to 50 60 to 40
tw(CLKH)
tw(CLKL)
tPD(CLK-SDO)
16
16
-
-
-
-
-
ns
-
ns
propagation delay
from CLK to SDO
10
ns
[3]
[3]
[3]
[3]
tsu(LE)
LE set-up time
OE set-up time
LE hold time
from LE to CLK
from OE to CLK
from CLK to LE
from CLK to OE
20
20
5
-
-
-
-
-
-
ns
ns
ns
ns
ns
tsu(OE)
-
th(LE)
-
th(OE)
OE hold time
5
-
tPD(OE-LEDH)
propagation delay
from OE to LED HIGH
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
210
tPD(OE-LEDL)
propagation delay
from OE to LED LOW
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
-
210
210
-
-
ns
ns
tPD(LEH-LEDH)
propagation delay
pins LED0 to LED7; VDD = 5.0 V;
from LE HIGH to LED HIGH CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
tPD(LEH-LEDL)
propagation delay
from LE HIGH to LED LOW
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
-
-
-
210
210
210
-
-
-
ns
ns
ns
tPD(CLKH-LEDH) propagation delay
pins LED0 to LED7; VDD = 5.0 V;
from CLK HIGH to LED HIGH CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0; LE = logic 1
tPD(CLKH-LEDL) propagation delay
pins LED0 to LED7; VDD = 5.0 V;
from CLK HIGH to LED LOW CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0; LE = logic 1
tr
tf
rise time
fall time
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω
-
-
175
190
-
-
ns
ns
pins LED0 to LED7; VDD = 5.0 V;
CL = 30 pF; RL = 15 Ω; VL = 1.9 V;
IO = 20.7 mA; Rext = 910 Ω;
OE = logic 0
[1] Applies to normal device operation. This pulse width does not apply to active HIGH times for executing error detect sequences.
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[2] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to
active LOW times for executing error detect sequences.
[3] Timing required for signaling of error detection sequences. Not necessary for ‘normal’ operation.
f
CLK
t
t
w(CLKL)
w(CLKH)
CLK
50 %
h(SDI)
t
t
t
t
su(SDI)
SDI
OE
LE
50 %
50 %
50 %
50 %
t
su(OE)
h(OE)
h(LE)
50 %
t
su(LE)
50 %
t
PD(CLK-SDO)
SDO
50 %
002aad209
Fig 12. Timing 1
90 %
10 %
90 %
10 %
LEDn
t
t
r
f
002aad210
Fig 13. LED[7:0] rise/fall timing
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8-channel constant current LED driver with output error detection
t
w(OE)
OE
50 %
50 %
t
t
t
t
PD(OE-LEDH)
PD(OE-LEDL)
PD(OE-LEDH)
PD(OE-LEDL)
LEDn
LE
50 %
50 %
50 %
50 %
t
w(LE)
50 %
50 %
t
t
PD(LEH-LEDH)
PD(LEH-LEDL)
LEDn
CLK
50 %
50 %
t
t
PD(CLKH-LEDH)
PD(CLKH-LEDL)
LEDn
002aad211
Fig 14. Timing 2
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8-channel constant current LED driver with output error detection
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-14
03-02-13
SOT38-4
Fig 15. Package outline SOT38-4 (DIP16)
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8-channel constant current LED driver with output error detection
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 16. Package outline SOT403-1 (TSSOP16)
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8-channel constant current LED driver with output error detection
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 5 x 5 x 0.85 mm
SOT662-1
B
A
D
terminal 1
index area
A
A
1
E
c
detail X
C
e
1
y
y
e
b
v
M
M
C
C
A B
C
1
w
6
10
L
11
5
e
e
E
h
2
1
15
terminal 1
index area
20
16
X
D
h
0
2.5
scale
5 mm
DIMENSIONS (mm are the original dimensions)
(1)
A
max.
(1)
(1)
UNIT
A
b
c
E
e
e
1
e
2
y
D
D
E
L
v
w
y
1
1
h
h
0.05 0.38
0.00 0.23
5.1
4.9
3.25 5.1
2.95 4.9
3.25
2.95
0.75
0.50
mm
0.05
0.1
1
0.2
0.65
2.6
2.6
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
01-08-08
02-10-22
SOT662-1
- - -
MO-220
- - -
Fig 17. Package outline SOT662-1 (HVQFN20)
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8-channel constant current LED driver with output error detection
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
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8-channel constant current LED driver with output error detection
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 18) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 11 and 12
Table 11. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
235
≥ 350
220
< 2.5
≥ 2.5
220
220
Table 12. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 18.
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8-channel constant current LED driver with output error detection
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 18. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of through-hole mount packages
17.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 °C and 400 °C, contact may be up to 5 seconds.
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17.4 Package related soldering information
Table 13. Suitability of through-hole mount IC packages for dipping and wave soldering
Package
Soldering method
Dipping
Wave
CPGA, HCPGA
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP[2]
suitable
-
suitable[1]
not suitable
[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
[2] For PMFP packages hot bar soldering or manual soldering is suitable.
18. Abbreviations
Table 14. Abbreviations
Acronym
CDM
EMI
Description
Charged-Device Model
ElectroMagnetic Interference
ElectroStatic Discharge
Human Body Model
Light Emitting Diode
Machine Model
ESD
HBM
LED
MM
MSB
PCB
Most Significant Bit
Printed-Circuit Board
Pulse Width Modulator
PWM
19. Revision history
Table 15. Revision history
Document ID
PCA9922 v.2
Modifications:
PCA9922 v.1
Release date
Data sheet status
Change notice
Supersedes
20110406
Product data sheet
-
PCA9922 v.1
• Figure 1 “Block diagram of PCA9922”: removed block “auto shutdown and auto power-up”
20090115 Product data sheet
-
-
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20. Legal information
20.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
20.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
20.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
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8-channel constant current LED driver with output error detection
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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8-channel constant current LED driver with output error detection
22. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
20.4
21
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Contact information . . . . . . . . . . . . . . . . . . . . 26
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3
22
4
4.1
5
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
Functional description . . . . . . . . . . . . . . . . . . . 6
System interface. . . . . . . . . . . . . . . . . . . . . . . . 6
LED output error detection . . . . . . . . . . . . . . . . 7
Open-circuit detection principle . . . . . . . . . . . . 7
Short-circuit detection principle. . . . . . . . . . . . . 8
Entering error detect mode. . . . . . . . . . . . . . . . 8
Setting the outputs to test. . . . . . . . . . . . . . . . . 9
Capturing the fault/output error data. . . . . . . . . 9
Exit error detect mode . . . . . . . . . . . . . . . . . . 10
Error detection data . . . . . . . . . . . . . . . . . . . . 10
8
Application design-in information . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Recommended operating conditions. . . . . . . 13
Thermal characteristics . . . . . . . . . . . . . . . . . 13
Static characteristics. . . . . . . . . . . . . . . . . . . . 14
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Handling information. . . . . . . . . . . . . . . . . . . . 21
9
10
11
12
13
14
15
16
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 22
16.1
16.2
16.3
16.4
17
17.1
Soldering of through-hole mount packages . 23
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Soldering by dipping or by solder wave . . . . . 23
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 24
17.2
17.3
17.4
18
19
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
20.1
20.2
20.3
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 April 2011
Document identifier: PCA9922
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