PEMI8QFN/CT,132 [NXP]
PEMIxQFN; PEMI2STD family - Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection;型号: | PEMI8QFN/CT,132 |
厂家: | NXP |
描述: | PEMIxQFN; PEMI2STD family - Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection |
文件: | 总30页 (文件大小:1173K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Important notice
Dear Customer,
On 7 February 2017 the former NXP Standard Product business became a new company with the
tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS
semiconductors with its focus on the automotive, industrial, computing, consumer and wearable
application markets
In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
the references to Nexperia, as shown below.
Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/,
use http://www.nexperia.com
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salesaddresses@nexperia.com (email)
Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on
the version, as shown below:
- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
reserved
Should be replaced with:
- © Nexperia B.V. (year). All rights reserved.
If you have any questions related to the data sheet, please contact our nearest sales office via e-mail
or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and
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Kind regards,
Team Nexperia
PEMIxQFN; PEMI2STD family
Integrated 1-, 2-, 4-, 6- and 8-channel passive filter network
with ESD protection
Rev. 2 — 3 November 2011
Product data sheet
1. Product profile
1.1 General description
The devices are a family of RC low pass filters. They are designed to provide filtering of
undesired RF signals on the I/O ports of portable communication or computing devices.
The devices incorporate diodes to provide protection to downstream components from
ElectroStatic Discharge (ESD) voltages up to 25 kV.
The devices are fabricated using monolithic silicon technology in lead-free plastic
packages.
Table 1.
Product overview
Type number Package
Number of
channels
Package
pitch (mm)
Package configuration
PEMI1QFN
PEMI2QFN
PEMI2STD
PEMI4QFN
PEMI6QFN
PEMI8QFN
SOT883
1
2
1
4
6
8
-
3-pin MicroPak (QFN compatible)
6-pin MicroPak (QFN compatible)
5-pin microlead
SOT886
0.5
-
SOT665
SOT1157-1
SOT1158-1
SOT1159-1
0.4
0.4
0.4
8-pin extremely thin leadless
12-pin extremely thin leadless
16-pin extremely thin leadless
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
Integrated 1-, 2-, 4-, 6- and 8-channel -type RC filter network
ESD protection up to 25 kV contact discharge according to IEC 61000-4-2,
far exceeding level 4
1.3 Applications
General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency
Interference (RFI) filtering and downstream ESD protection for:
Cellular phone and Personal Communication Systems (PCS) mobile handsets
Cordless telephones
Wireless data (WAN/LAN) systems
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
1.4 Quick reference data
Table 2.
Quick reference data
Parameter
Symbol
Conditions
Typ
Unit
Rs(ch)
channel series resistance
PEMIxxxx/Cx
20
PEMIxxxx/Hx
45
PEMIxxxx/Lx
65
PEMIxxxx/Rx
100
200
PEMIxxxx/Wx
Cch
channel capacitance
for the total channel;
f = 100 kHz; Vbias(DC) = 0 V
PEMIxxxx/xE
PEMIxxxx/xG
PEMIxxxx/xK
PEMIxxxx/xM
PEMIxxxx/xP
PEMIxxxx/xR
PEMIxxxx/xT
15
19
23
28
32
36
40
pF
pF
pF
pF
pF
pF
pF
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Graphic symbol
PEMI1QFN (SOT883)
1 and 2
3
filter channel
ground (GND)
R
s(ch)
1
2
1
2
3
C
ch
C
ch
2
2
Transparent
top view
3
018aaa042
PEMI2QFN (SOT886)
1 and 6
2 and 5
3 and 4
filter channel 1
R
6
1
5
2
4
3
s(ch)
ground (GND)
filter channel 2
1,3
4,6
C
ch
C
ch
2
2
2,5
018aaa044
Transparent
top view
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
2 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 3.
Pin
PEMI2STD (SOT665)
Pinning …continued
Description
Simplified outline
Graphic symbol
1 and 5
2
filter channel 1
R
s(ch)
5
1
4
3
ground (GND)
filter channel 2
1,3
4,5
C
ch
C
ch
2
3 and 4
2
2
2
018aaa043
PEMI4QFN (SOT1157-1)
1 and 8
2 and 7
3 and 6
4 and 5
filter channel 1
filter channel 2
filter channel 3
filter channel 4
ground (GND)
R
8
5
s(ch)
1 to 4
5 to 8
C
ch
C
ch
2
2
1
4
Transparent
top view
ground
pad
GND
018aaa071
PEMI6QFN (SOT1158-1)
1 and 12
2 and 11
3 and 10
4 and 9
5 and 8
6 and 7
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
ground (GND)
R
s(ch)
12
7
6
1 to 6
7 to 12
C
ch
C
2
ch
2
1
Transparent
top view
GND
018aaa072
ground
pad
PEMI8QFN (SOT1159-1)
1 and 16
2 and 15
3 and 14
4 and 13
5 and 12
6 and 11
7 and 10
8 and 9
filter channel 1
filter channel 2
filter channel 3
filter channel 4
filter channel 5
filter channel 6
filter channel 7
filter channel 8
ground (GND)
R
s(ch)
16
1
9
8
1 to 8
9 to 16
C
ch
2
C
ch
2
Transparent top view
GND
018aaa073
ground
pad
PEMIXQFN_PEMI2STD_FAM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
3 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
3. Ordering information
Table 4.
Ordering information
Type number Package
Name
Description
leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm
Version
PEMI1QFN
PEMI2QFN
SC-101
XSON6
SOT883
SOT886
plastic extremely thin small outline package; no leads; 6 terminals;
body 1 1.45 0.5 mm
PEMI2STD
PEMI4QFN
-
plastic surface-mounted package; 5 leads
SOT665
HXSON8 plastic thermal enhanced extremely thin small outline package; no leads;
SOT1157-1
8 terminals; body 1.2 1.7 0.5 mm
PEMI6QFN
PEMI8QFN
HXSON12 plastic thermal enhanced extremely thin small outline package; no leads;
SOT1158-1
SOT1159-1
12 terminals; body 1.2 2.5 0.5 mm
HXSON16 plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2 3.3 0.5 mm
4. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
0.5
+5.6
V
VESD
electrostatic discharge
voltage
IEC 61000-4-2, level 4
all pins to ground
contact discharge
air discharge
-
-
-
-
-
-
-
15
15
20
20
25
25
60
kV
kV
kV
kV
kV
kV
mW
PEMIxxxx/xM;
PEMIxxxx/xP
contact discharge
air discharge
PEMIxxxx/xR;
PEMIxxxx/xT
contact discharge
air discharge
Pch
Ptot
channel power dissipation continuous power;
Tamb = 85 C
total power dissipation
continuous power;
-
120
mW
Tamb = 85 C
Tstg
storage temperature
ambient temperature
55
40
+150
+85
C
C
Tamb
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
4 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
5. Characteristics
Table 6.
Channel characteristics
Tamb = 25 C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max Unit
Rs(ch)
channel series resistance
PEMIxxxx/Cx
18
40
20
22
PEMIxxxx/Hx
45
50
PEMIxxxx/Lx
58
65
72
PEMIxxxx/Rx
90
180
100
200
110
220
PEMIxxxx/Wx
Cch
channel capacitance
for the total channel;
f = 100 kHz
PEMIxxxx/xE
PEMIxxxx/xG
PEMIxxxx/xK
PEMIxxxx/xM
PEMIxxxx/xP
PEMIxxxx/xR
PEMIxxxx/xT
Vbias(DC) = 0 V
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
15
8.5
19
11
23
13.5
28
16
32
18.5
36
21
40
23
-
-
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
V
-
-
-
-
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
-
-
-
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
-
-
-
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
-
-
-
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
-
-
-
Vbias(DC) = 2.5 V
Vbias(DC) = 0 V
-
-
-
-
Vbias(DC) = 2.5 V
positive clamp; II = 1 mA
negative clamp; IF = 1 mA
per channel; VI = 3.5 V
-
-
VBR
VF
breakdown voltage
forward voltage
5.8
1.5
-
9
-
0.4
0.1
V
ILR
reverse leakage current
-
A
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
5 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
Cch = 15 pF
Rs(ch) = 20
Min
Typ
Max Unit
il
insertion loss
PEMIxxxx/CE
800 MHz < f < 3 GHz
7
-
-
-
-
dB
dB
f = 5 GHz
Rs(ch) = 45
30
PEMIxxxx/HE
PEMIxxxx/LE
PEMIxxxx/RE
PEMIxxxx/WE
800 MHz < f < 3 GHz
f = 4 GHz
9
-
-
-
-
dB
dB
31
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 3.5 GHz
11
-
-
-
-
dB
dB
32
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 3 GHz
13
-
-
-
-
dB
dB
33
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 2.2 GHz
18
-
-
-
-
dB
dB
34
il
insertion loss
PEMIxxxx/CG
Cch = 19 pF
Rs(ch) = 20
800 MHz < f < 3 GHz
f = 4 GHz
9
-
-
-
-
dB
dB
32
PEMIxxxx/HG
PEMIxxxx/LG
PEMIxxxx/RG
PEMIxxxx/WG
Rs(ch) = 45
800 MHz < f < 3 GHz
f = 3.2 GHz
11
-
-
-
-
dB
dB
33
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 2.8 GHz
13
-
-
-
-
dB
dB
33.5
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 2.5 GHz
15
-
-
-
-
dB
dB
34
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.9 GHz
21
-
-
-
-
dB
dB
35.5
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
6 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
Cch = 23 pF
Rs(ch) = 20
Min
Typ
Max Unit
il
insertion loss
PEMIxxxx/CK
800 MHz < f < 3 GHz
10
-
-
-
-
dB
dB
f = 3.6 GHz
Rs(ch) = 45
33
PEMIxxxx/HK
PEMIxxxx/LK
PEMIxxxx/RK
PEMIxxxx/WK
800 MHz < f < 3 GHz
f = 2.8 GHz
13
-
-
-
-
dB
dB
34
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 2.5 GHz
15
-
-
-
-
dB
dB
35
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 2.1 GHz
18
-
-
-
-
dB
dB
36
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.6 GHz
24
-
-
-
-
dB
dB
37
il
insertion loss
PEMIxxxx/CM
Cch = 28 pF
Rs(ch) = 20
800 MHz < f < 3 GHz
f = 3.2 GHz
12
-
-
-
-
dB
dB
34
PEMIxxxx/HM
PEMIxxxx/LM
PEMIxxxx/RM
PEMIxxxx/WM
Rs(ch) = 45
800 MHz < f < 3 GHz
f = 2.5 GHz
15
-
-
-
-
dB
dB
35
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 2.1 GHz
17
-
-
-
-
dB
dB
36
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 1.8 GHz
21
-
-
-
-
dB
dB
37
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.4 GHz
27
-
-
-
-
dB
dB
38
PEMIXQFN_PEMI2STD_FAM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
7 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
Cch = 32 pF
Rs(ch) = 20
Min
Typ
Max Unit
il
insertion loss
PEMIxxxx/CP
800 MHz < f < 3 GHz
13
-
-
-
-
dB
dB
f = 2.9 GHz
Rs(ch) = 45
36
PEMIxxxx/HP
PEMIxxxx/LP
PEMIxxxx/RP
PEMIxxxx/WP
800 MHz < f < 3 GHz
f = 2.2 GHz
17
-
-
-
-
dB
dB
36
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 1.9 GHz
19
-
-
-
-
dB
dB
37
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 1.6 GHz
23
-
-
-
-
dB
dB
38
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.2 GHz
30
-
-
-
-
dB
dB
39
il
insertion loss
PEMIxxxx/CR
Cch = 36 pF
Rs(ch) = 20
800 MHz < f < 3 GHz
f = 2.6 GHz
14
-
-
-
-
dB
dB
36
PEMIxxxx/HR
PEMIxxxx/LR
PEMIxxxx/RR
PEMIxxxx/WR
Rs(ch) = 45
800 MHz < f < 3 GHz
f = 2.0 GHz
18
-
-
-
-
dB
dB
37
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 1.8 GHz
21
-
-
-
-
dB
dB
38
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 1.6 GHz
25
-
-
-
-
dB
dB
39
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.2 GHz
32
-
-
-
-
dB
dB
40
PEMIXQFN_PEMI2STD_FAM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
8 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 7.
Frequency characteristics …continued
Tamb = 25 C; unless otherwise specified; Rsource = 50 ; RL = 50 .
Symbol
Parameter
Conditions
Cch = 40 pF
Rs(ch) = 20
Min
Typ
Max Unit
il
insertion loss
PEMIxxxx/CT
800 MHz < f < 3 GHz
16
-
-
-
-
dB
dB
f = 2.5 GHz
36
PEMIxxxx/HT
PEMIxxxx/LT
PEMIxxxx/RT
PEMIxxxx/WT
Rs(ch) = 45
800 MHz < f < 3 GHz
f = 1.9 GHz
20
-
-
-
-
dB
dB
38
Rs(ch) = 65
800 MHz < f < 3 GHz
f = 1.6 GHz
23
-
-
-
-
dB
dB
39
Rs(ch) = 100
800 MHz < f < 3 GHz
f = 1.4 GHz
27
-
-
-
-
dB
dB
40
Rs(ch) = 200
800 MHz < f < 3 GHz
f = 1.0 GHz
32
-
-
-
-
dB
dB
41
6. Application information
6.1 Use cases
The selection of one of the filter devices has to be performed in dependence of the
maximum clock frequency, the driver strength, the capacitive load of the sink and the
maximum applicable rise and fall times.
6.2 LCD interfaces, medium-speed interfaces
For digital interfaces such as Liquid Crystal Display (LCD) interfaces running at clock
speeds between 10 MHz and 25 MHz or more, the devices can be used in dependence of
the sink load, the clock speed, the driver strength and the rise and fall time requirements.
The minimum EMI filter requirements may be an important factor, too.
6.3 Keypad, low-speed interfaces
Especially for lower-speed interfaces such as keypads, low-speed serial interfaces and
low-speed control signals, the devices offer a very robust ESD protection and strong
suppression of unwanted frequencies (EMI filtering). Due to their small size the devices
can easily be spread on a Printed-Circuit Board (PCB) in order to move the ESD and EMI
protection close to the part of the design which shall be protected.
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
9 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4 Insertion loss
The devices are designed as EMI/RFI filters for multichannel interfaces.
All measurements were performed in a typical 50 NetWork Analyzer (NWA) setup as
shown in Figure 1. The insertion loss was measured with a test Printed-Circuit
Board (PCB) utilizing laser-drilled micro-via holes which connect the PCB ground plane to
the devices ground pins.
DUT
IN
OUT
50 Ω
50 Ω
V
gen
018aaa074
Fig 1. Frequency response setup
018aaa161
018aaa162
0
0
S
(dB)
S
21
(dB)
(1)
(2)
(3)
(1)
(2)
(3)
21
–10
–20
–30
–40
–50
–10
–20
–30
–40
–50
(4)
(5)
(6)
(4)
(5)
(6)
(7)
(7)
2
3
4
2
3
4
1
10
10
10
10
1
10
10
10
10
f (MHz)
f (MHz)
Rs(ch) = 20
Rs(ch) = 45
(1) PEMIxxxx/CE
(2) PEMIxxxx/CG
(3) PEMIxxxx/CK
(4) PEMIxxxx/CM
(5) PEMIxxxx/CP
(6) PEMIxxxx/CR
(7) PEMIxxxx/CT
(1) PEMIxxxx/HE
(2) PEMIxxxx/HG
(3) PEMIxxxx/HK
(4) PEMIxxxx/HM
(5) PEMIxxxx/HP
(6) PEMIxxxx/HR
(7) PEMIxxxx/HT
Fig 2. PEMIxxxx/Cx: Frequency response curves
Fig 3. PEMIxxxx/Hx: Frequency response curves
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
10 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
018aaa163
(1)
018aaa164
0
0
S
(dB)
S
21
(dB)
21
(1)
(2)
(3)
(2)
(3)
–10
–10
–20
–30
–40
–50
(4)
(5)
(6)
(4)
(5)
(6)
–20
–30
–40
–50
(7)
(7)
2
3
4
2
3
4
1
10
10
10
10
1
10
10
10
10
f (MHz)
f (MHz)
Rs(ch) = 65
(1) PEMIxxxx/LE
(2) PEMIxxxx/LG
(3) PEMIxxxx/LK
(4) PEMIxxxx/LM
(5) PEMIxxxx/LP
(6) PEMIxxxx/LR
(7) PEMIxxxx/LT
Rs(ch) = 100
(1) PEMIxxxx/RE
(2) PEMIxxxx/RG
(3) PEMIxxxx/RK
(4) PEMIxxxx/RM
(5) PEMIxxxx/RP
(6) PEMIxxxx/RR
(7) PEMIxxxx/RT
Fig 4. PEMIxxxx/Lx: Frequency response curves
Fig 5. PEMIxxxx/Rx: Frequency response curves
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
11 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
018aaa165
0
S
21
(dB)
–10
–20
–30
–40
–50
(1)
(2)
(3)
(4)
(5)
(6)
(7)
2
3
4
1
10
10
10
10
f (MHz)
Rs(ch) = 200
(1) PEMIxxxx/WE
(2) PEMIxxxx/WG
(3) PEMIxxxx/WK
(4) PEMIxxxx/WM
(5) PEMIxxxx/WP
(6) PEMIxxxx/WR
(7) PEMIxxxx/WT
Fig 6. PEMIxxxx/Wx: Frequency response curves
All important values of the RF behavior such as relative 3dB frequency, insertion loss at
800 MHz and above and also the DC attenuation in an NWA environment can be derived
from the insertion loss response curves depicted in Figure 2 to 6.
Note: insertion loss at low frequencies (1 MHz) is nearly independent from the channel
capacitance values available within the PEMI family.
6.4.1 Relative 3dB frequency (-filter structure)
Table 8.
Relative 3dB frequency (MHz) per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIxxxx/
xE
15
xG
19
xK
23
xM
28
xP
32
xR
36
xT
40
Cch (pF)
PEMIxxxx/ Rs(ch)
Cx
Hx
Lx
20
397 MHz 317 MHz 264 MHz 218 MHz 194 MHz 170 MHz 153 MHz
376 MHz 300 MHz 249 MHz 206 MHz 185 MHz 161 MHz 145 MHz
361 MHz 288 MHz 239 MHz 197 MHz 176 MHz 155 MHz 139 MHz
343 MHz 272 MHz 227 MHz 187 MHz 166 MHz 145 MHz 131 MHz
311 MHz 247 MHz 205 MHz 169 MHz 150 MHz 132 MHz 119 MHz
45
65
Rx
Wx
100
200
PEMIXQFN_PEMI2STD_FAM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
12 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
6.4.2 Insertion loss (dB) at 800 MHz (-filter structure)
Table 9.
Insertion loss (dB) at 800 MHz per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIxxxx/
xE
15
xG
19
xK
23
xM
28
xP
32
xR
36
xT
40
Cch (pF)
PEMIxxxx/ Rs(ch)
Cx
Hx
Lx
20
9 dB
11 dB
14 dB
17 dB
20 dB
26 dB
13 dB
17 dB
19 dB
23 dB
29 dB
15 dB
19 dB
22 dB
26 dB
34 dB
16 dB
21 dB
25 dB
29 dB
36 dB
18 dB
23 dB
27 dB
32 dB
39 dB
19 dB
25 dB
29 dB
35 dB
41 dB
45
12 dB
14 dB
17 dB
22 dB
65
Rx
Wx
100
200
6.4.3 Insertion loss (dB) at frequencies lower than 1 MHz (-filter structure)
Table 10. Insertion loss (dB) at 1 MHz per RC combination; typical values
Tamb = 25 C; unless otherwise specified.
PEMIxxxx/
xE
15
xG
19
xK
23
xM
28
xP
32
xR
36
xT
40
Cch (pF)
PEMIxxxx/ Rs(ch)
Cx
Hx
Lx
20
1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB 1.6 dB
3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB 3.2 dB
4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB 4.3 dB
6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB 6.0 dB
9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB 9.5 dB
45
65
Rx
Wx
100
200
7. Marking
Table 11. Marking codes
Type number
Marking Type number
code
Marking
code
Type number
Marking
code
Type number
Marking
code
PEMI1QFN/CE
CE
PEMI2QFN/LP
PEMI2QFN/LR
PEMI2QFN/LT
PEMI2QFN/RE
LP
LR
LT
PEMI4QFN/CE
CE
PEMI6QFN/LP
PEMI6QFN/LR
PEMI6QFN/LT
PEMI6QFN/RE
LP
LR
LT
PEMI1QFN/CG CG
PEMI1QFN/CK CK
PEMI1QFN/CM CM
PEMI4QFN/CG CG
PEMI4QFN/CK CK
PEMI4QFN/CM CM
RE
RE
PEMI1QFN/CP
PEMI1QFN/CR
PEMI1QFN/CT
PEMI1QFN/HE
CP
CR
CT
HE
PEMI2QFN/RG RG
PEMI2QFN/RK RK
PEMI2QFN/RM RM
PEMI4QFN/CP
PEMI4QFN/CR
PEMI4QFN/CT
PEMI4QFN/HE
CP
CR
CT
HE
PEMI6QFN/RG RG
PEMI6QFN/RK RK
PEMI6QFN/RM RM
PEMI2QFN/RP
PEMI2QFN/RR
PEMI2QFN/RT
RP
RR
RT
PEMI6QFN/RP
PEMI6QFN/RR
PEMI6QFN/RT
RP
RR
RT
PEMI1QFN/HG HG
PEMI1QFN/HK HK
PEMI1QFN/HM HM
PEMI4QFN/HG HG
PEMI4QFN/HK HK
PEMI4QFN/HM HM
PEMI2QFN/WE WE
PEMI2QFN/WG WG
PEMI2QFN/WK WK
PEMI2QFN/WM WM
PEMI6QFN/WE WE
PEMI6QFN/WG WG
PEMI6QFN/WK WK
PEMI6QFN/WM WM
PEMI1QFN/HP
PEMI1QFN/HR
PEMI1QFN/HT
HP
HR
HT
PEMI4QFN/HP
PEMI4QFN/HR
PEMI4QFN/HT
HP
HR
HT
PEMIXQFN_PEMI2STD_FAM
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Product data sheet
Rev. 2 — 3 November 2011
13 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Table 11. Marking codes …continued
Type number
Marking Type number
code
Marking
code
Type number
Marking
code
Type number
Marking
code
PEMI1QFN/LE
PEMI1QFN/LG
PEMI1QFN/LK
PEMI1QFN/LM
PEMI1QFN/LP
PEMI1QFN/LR
PEMI1QFN/LT
PEMI1QFN/RE
LE
LG
LK
LM
LP
LR
LT
PEMI2QFN/WP WP
PEMI2QFN/WR WR
PEMI2QFN/WT WT
PEMI4QFN/LE
PEMI4QFN/LG
PEMI4QFN/LK
PEMI4QFN/LM
PEMI4QFN/LP
PEMI4QFN/LR
PEMI4QFN/LT
PEMI4QFN/RE
LE
LG
LK
LM
LP
LR
LT
PEMI6QFN/WP WP
PEMI6QFN/WR WR
PEMI6QFN/WT WT
PEMI2STD/CE
PEMI2STD/CG
PEMI2STD/CK
PEMI2STD/CM
PEMI2STD/CP
PEMI2STD/CR
PEMI2STD/CT
PEMI2STD/HE
PEMI2STD/HG
PEMI2STD/HK
PEMI2STD/HM
PEMI2STD/HP
PEMI2STD/HR
PEMI2STD/HT
PEMI2STD/LE
PEMI2STD/LG
PEMI2STD/LK
PEMI2STD/LM
PEMI2STD/LP
PEMI2STD/LR
PEMI2STD/LT
PEMI2STD/RE
PEMI2STD/RG
PEMI2STD/RK
PEMI2STD/RM
PEMI2STD/RP
PEMI2STD/RR
PEMI2STD/RT
CE
CG
CK
CM
CP
CR
CT
HE
HG
HK
HM
HP
HR
HT
LE
PEMI8QFN/CE
PEMI8QFN/CG CG
PEMI8QFN/CK CK
PEMI8QFN/CM CM
CE
RE
RE
PEMI8QFN/CP
PEMI8QFN/CR
PEMI8QFN/CT
PEMI8QFN/HE
CP
CR
CT
HE
PEMI1QFN/RG RG
PEMI1QFN/RK RK
PEMI1QFN/RM RM
PEMI4QFN/RG RG
PEMI4QFN/RK RK
PEMI4QFN/RM RM
PEMI1QFN/RP
PEMI1QFN/RR
PEMI1QFN/RT
RP
RR
RT
PEMI4QFN/RP
PEMI4QFN/RR
PEMI4QFN/RT
RP
RR
RT
PEMI8QFN/HG HG
PEMI8QFN/HK HK
PEMI8QFN/HM HM
PEMI1QFN/WE WE
PEMI1QFN/WG WG
PEMI1QFN/WK WK
PEMI1QFN/WM WM
PEMI1QFN/WP WP
PEMI1QFN/WR WR
PEMI1QFN/WT WT
PEMI4QFN/WE WE
PEMI4QFN/WG WG
PEMI4QFN/WK WK
PEMI4QFN/WM WM
PEMI4QFN/WP WP
PEMI4QFN/WR WR
PEMI4QFN/WT WT
PEMI8QFN/HP
PEMI8QFN/HR
PEMI8QFN/HT
PEMI8QFN/LE
PEMI8QFN/LG
PEMI8QFN/LK
PEMI8QFN/LM
PEMI8QFN/LP
PEMI8QFN/LR
PEMI8QFN/LT
PEMI8QFN/RE
HP
HR
HT
LE
LG
LK
LM
LP
LR
LT
LG
LK
LM
LP
PEMI2QFN/CE
PEMI2QFN/CG CG
PEMI2QFN/CK CK
PEMI2QFN/CM CM
CE
PEMI6QFN/CE
PEMI6QFN/CG CG
PEMI6QFN/CK CK
PEMI6QFN/CM CM
CE
LR
LT
RE
RG
RK
RM
RP
RR
RT
RE
PEMI2QFN/CP
PEMI2QFN/CR
PEMI2QFN/CT
PEMI2QFN/HE
CP
CR
CT
HE
PEMI6QFN/CP
PEMI6QFN/CR
PEMI6QFN/CT
PEMI6QFN/HE
CP
CR
CT
HE
PEMI8QFN/RG RG
PEMI8QFN/RK RK
PEMI8QFN/RM RM
PEMI8QFN/RP
PEMI8QFN/RR
PEMI8QFN/RT
RP
RR
RT
PEMI2QFN/HG HG
PEMI2QFN/HK HK
PEMI2QFN/HM HM
PEMI6QFN/HG HG
PEMI6QFN/HK HK
PEMI6QFN/HM HM
PEMI2STD/WE WE
PEMI2STD/WG WG
PEMI2STD/WK WK
PEMI2STD/WM WM
PEMI2STD/WP WP
PEMI2STD/WR WR
PEMI8QFN/WE WE
PEMI8QFN/WG WG
PEMI8QFN/WK WK
PEMI8QFN/WM WM
PEMI8QFN/WP WP
PEMI8QFN/WR WR
PEMI8QFN/WT WT
PEMI2QFN/HP
PEMI2QFN/HR
PEMI2QFN/HT
PEMI2QFN/LE
PEMI2QFN/LG
PEMI2QFN/LK
PEMI2QFN/LM
HP
HR
HT
LE
LG
LK
LM
PEMI6QFN/HP
PEMI6QFN/HR
PEMI6QFN/HT
PEMI6QFN/LE
PEMI6QFN/LG
PEMI6QFN/LK
PEMI6QFN/LM
HP
HR
HT
LE
LG
LK
LM
PEMI2STD/WT
-
WT
-
-
-
PEMIXQFN_PEMI2STD_FAM
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Product data sheet
Rev. 2 — 3 November 2011
14 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
8. Package outline
Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT883
L
L
1
2
b
3
b
e
1
1
e
1
A
A
1
E
D
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
1
UNIT
A
b
b
D
E
e
e
L
L
1
1
1
max.
0.50
0.46
0.20 0.55 0.62 1.02
0.12 0.47 0.55 0.95
0.30 0.30
0.22 0.22
mm
0.03
0.35 0.65
Note
1. Including plating thickness
REFERENCES
JEDEC
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEITA
03-02-05
03-04-03
SOT883
SC-101
Fig 7. Package outline PEMI1QFN (SOT883/SC-101)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
15 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4×
(2)
L
L
1
e
6
5
4
e
1
e
1
6×
A
(2)
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
A
1
UNIT
b
D
E
e
e
L
L
1
1
max max
0.25
0.17
1.5
1.4
1.05
0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.6
0.5
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
04-07-15
04-07-22
SOT886
MO-252
Fig 8. Package outline PEMI2QFN (SOT886/XSON6)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
16 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Plastic surface-mounted package; 5 leads
SOT665
D
A
E
X
Y
S
S
H
E
5
4
A
c
1
2
3
e
b
w M
1
A
p
L
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
b
c
D
E
e
e
H
L
w
y
A
p
p
1
E
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.7
1.5
0.3
0.1
mm
1.0
0.5
0.1
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT665
Fig 9. Package outline PEMI2STD (SOT665)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
17 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 1.2 x 1.7 x 0.5 mm
SOT1157-1
X
D
B
A
E
A
A
1
A
3
terminal 1
index area
detail X
e
1
C
terminal 1
index area
v
C A
C
B
e
b
y
1
y
w
C
1
4
L
k
E
2
8
5
D
2
0
1
2 mm
v
scale
Dimensions
(1)
Unit
A
A
A
b
D
D
2
E
E
e
e
1
k
L
w
y
y
1
1
3
2
max 0.5 0.05
mm nom
min
0.25 1.8 1.25 1.3 0.35
0.127 0.20 1.7 1.20 1.2 0.30 0.4 1.2 0.2 0.25 0.1 0.05 0.05 0.05
0.15 1.6 1.15 1.1 0.25 0.20
0.30
0.00
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
sot1157-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-12-16
09-12-17
SOT1157-1
Fig 10. Package outline PEMI4QFN (SOT1157-1/HXSON8)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
18 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON12: plastic thermal enhanced extremely thin small outline package; no leads;
12 terminals; body 1.2 x 2.5 x 0.5 mm
SOT1158-1
X
D
B
A
E
A
A
1
A
3
terminal 1
index area
detail X
e
1
C
terminal 1
index area
v
C A
C
B
e
b
y
y
w
C
1
1
6
L
k
E
2
12
7
D
2
0
1
2 mm
v
scale
Dimensions
(1)
Unit
A
A
A
b
D
D
2
E
E
e
e
1
k
L
w
y
y
1
1
3
2
max 0.5 0.05
mm nom
min
0.25 2.6 2.1 1.3 0.35
0.127 0.20 2.5 2.0 1.2 0.30 0.4
0.15 2.4 1.9 1.1 0.25
0.30
2
0.2 0.25 0.1 0.05 0.05 0.05
0.20
0.00
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
sot1158-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-12-16
09-12-17
SOT1158-1
Fig 11. Package outline PEMI6QFN (SOT1158-1/HXSON12)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
19 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
HXSON16: plastic thermal enhanced extremely thin small outline package; no leads;
16 terminals; body 1.2 x 3.3 x 0.5 mm
SOT1159-1
X
D
B
A
E
A
A
1
A
3
terminal 1
index area
detail X
e
1
C
terminal 1
index area
v
C A
C
B
e
b
y
y
w
C
1
1
8
L
k
E
2
16
9
D
2
0
1
2 mm
v
scale
Dimensions
(1)
Unit
A
A
A
b
D
D
2
E
E
e
e
1
k
L
w
y
y
1
1
3
2
max 0.5 0.05
mm nom
min
0.25 3.4 2.9 1.3 0.35
0.30
0.127 0.20 3.3 2.8 1.2 0.30 0.4 2.8 0.2 0.25 0.1 0.05 0.05 0.05
0.15 3.2 2.7 1.1 0.25 0.20
0.00
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included.
sot1159-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
- - -
JEITA
- - -
09-12-16
09-12-17
SOT1159-1
Fig 12. Package outline PEMI8QFN (SOT1159-1/HXSON16)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
20 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
9. Soldering
1.3
0.7
R0.05 (12×)
solder lands
solder resist
0.9
0.6 0.7
solder paste
0.25
(2×)
occupied area
0.3
(2×)
0.4
(2×)
0.3
0.4
Dimensions in mm
sot883_fr
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering PEMI1QFN (SOT883/SC-101)
1.250
0.675
0.370
(6×)
0.500
1.700
0.500
solder resist
solder paste = solderland
occupied area
0.270
(6×)
Dimensions in mm
0.325
0.425
(6×)
(6×)
sot886_fr
Reflow soldering is the only recommended soldering method.
Fig 14. Reflow soldering PEMI2QFN (SOT886/XSON6)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
21 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
2.45
2.1
1.6
solder lands
0.4
0.7
(5×)
(2×)
placement area
1
0.25 0.3 0.55
2
solder paste
0.45 0.4
(2×) (2×)
0.538
occupied area
0.325 0.375
(2×) (2×)
Dimensions in mm
1.7
0.6
0.45
(4×)
0.65
0.5
(4×)
sot665_fr
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering PEMI2STD (SOT665)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
22 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON8 package
SOT1157-1
Hx
Gx
P
D
0.025
0.025
Hy Ay Gy By
SPy
SLy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
Ay By
P
D
Slx
Sly
SPx SPy
Gx
Gy
Hx
Hy
0.40 1.75 0.75 0.22 1.25 0.35
0.6 0.2 1.65 1.45 1.95 2.0
11-06-27
Issue date
sot1157-1_fr
11-07-06
Reflow soldering is the only recommended soldering method.
Fig 16. Reflow soldering PEMI4QFN (SOT1157-1/HXSON8)
PEMIXQFN_PEMI2STD_FAM
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Product data sheet
Rev. 2 — 3 November 2011
23 of 29
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1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON12 package
SOT1158-1
Hx
Gx
D
P
0.025
0.025
Hy Ay Gy By
SPy SPy tot SLy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
Ay By
P
D
Slx
Sly
SPx SPy
Gx
Gy
Hx
Hy
0.40 1.75 0.75 0.22 2.1 0.35
0.9 0.2 2.45 1.45 2.75 2.0
11-06-27
Issue date
sot1158-1_fr
11-07-06
Reflow soldering is the only recommended soldering method.
Fig 17. Reflow soldering PEMI6QFN (SOT1158-1/HXSON12)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
24 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Footprint information for reflow soldering of HXSON16 package
SOT1159-1
Hx
Gx
D
P
0.025
0.025
Hy Ay Gy By
SPy SPy tot SLy
nSPx
SPx
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
Ay By
P
D
Slx
Sly
SPx SPy
Gx
Gy
Hx
Hy
0.40 2.15 0.75 0.21 2.9 0.35
1.3 0.2 3.25 1.45 3.55 2.4
11-06-27
Issue date
sot1159-1_fr
11-07-06
Reflow soldering is the only recommended soldering method.
Fig 18. Reflow soldering PEMI8QFN (SOT1159-1/HXSON16)
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
25 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
10. Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PEMIXQFN_PEMI2STD_ 20111103
FAM v.2
Product data sheet
-
PEMIXQFN_PEMI2STD_
FAM v.1
Modifications:
• Table 3 “Pinning”: corrected pinning description for PEMI8QFN (SOT1159-1); updated
simplified outline of SOT886
• Section 11 “Legal information”: updated
PEMIXQFN_PEMI2STD_ 20110729
FAM v.1
Product data sheet
-
-
PEMIXQFN_PEMI2STD_FAM
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
26 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
11.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
11.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
27 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PEMIXQFN_PEMI2STD_FAM
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 2 — 3 November 2011
28 of 29
PEMIxQFN; PEMI2STD family
NXP Semiconductors
1-, 2-, 4-, 6- and 8-channel passive filter network with ESD protection
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
1.1
1.2
1.3
1.4
2
3
4
5
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6
Application information. . . . . . . . . . . . . . . . . . . 9
Use cases. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
LCD interfaces, medium-speed interfaces . . . . 9
Keypad, low-speed interfaces. . . . . . . . . . . . . . 9
Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . 10
Relative -3dB frequency (p-filter structure). . . 12
Insertion loss (dB) at 800 MHz (p-filter
6.1
6.2
6.3
6.4
6.4.1
6.4.2
structure) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Insertion loss (dB) at frequencies lower than
1 MHz (p-filter structure). . . . . . . . . . . . . . . . . 13
6.4.3
7
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 26
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 27
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 27
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 28
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . 28
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 November 2011
Document identifier: PEMIXQFN_PEMI2STD_FAM
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