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PESD24VS1UL,315 [NXP]

PESDxS1UL series - Unidirectional ESD protection diodes DFN 2-Pin;
PESD24VS1UL,315
型号： PESD24VS1UL,315
厂家： NXP    NXP
描述：

PESDxS1UL series - Unidirectional ESD protection diodes DFN 2-Pin
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PESDxS1UL series  
Unidirectional ESD protection diodes  
Rev. 3 — 25 October 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Unidirectional ElectroStatic Discharge (ESD) protection diodes in a SOD882 leadless ultra  
small Surface Mounted Device (SMD) plastic package designed to protect one signal line  
from the damage caused by ESD and other transients.  
1.2 Features and benefits  
Ultra small SMD plastic package  
ESD protection of one line  
Ultra low leakage current: IRM < 700 nA  
ESD protection up to 30 kV  
Max. peak pulse power: PPP = 150 W  
Low clamping voltage: VCL = 20 V  
AEC-Q101 qualified  
IEC 61000-4-2; level 4 (ESD)  
IEC 61000-4-5; (surge); IPP up to 15 A  
1.3 Applications  
Computers and peripherals  
Audio and video equipment  
Parallel ports  
Communication systems  
High-speed data lines  
1.4 Quick reference data  
Table 1.  
Symbol Parameter  
VRWM reverse standoff voltage  
Quick reference data  
Conditions  
Min  
Typ  
Max  
Unit  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
diode capacitance  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
-
-
-
-
-
-
-
-
-
-
3.3  
5.0  
12  
V
V
V
V
V
15  
24  
Cd  
f = 1 MHz; VR = 0 V  
-
-
-
-
-
207  
152  
38  
300  
200  
75  
pF  
pF  
pF  
pF  
pF  
32  
70  
23  
50  
 
 
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
2. Pinning information  
Table 2.  
Pinning  
Pin  
1
Description  
cathode  
Simplified outline  
Graphic symbol  
[1]  
1
2
2
anode  
1
2
sym035  
Transparent  
top view  
[1] The marking bar indicates the cathode.  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
-
leadless ultra small plastic package; 2 terminals; SOD882  
body 1.0 0.6 0.5 mm  
4. Marking  
Table 4.  
Marking codes  
Type number  
Marking code  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
G1  
G2  
G3  
G4  
G5  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
2 of 15  
 
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
5. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
PPP  
Parameter  
Conditions  
tp = 8/20 s  
tp = 8/20 s  
Min  
Max  
Unit  
[1]  
[1]  
peak pulse power  
peak pulse current  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
junction temperature  
ambient temperature  
storage temperature  
-
150  
W
IPP  
-
15  
A
-
15  
A
-
5
A
-
5
A
-
3
A
Tj  
-
150  
+150  
+150  
C  
C  
C  
Tamb  
Tstg  
65  
65  
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.  
Table 6.  
Symbol Parameter  
VESD electrostatic discharge voltage  
ESD maximum ratings  
Conditions  
Min  
Max  
Unit  
[1]  
IEC 61000-4-2  
(contact discharge)  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
PESDxS1UL series  
-
-
-
-
-
-
30  
30  
30  
30  
23  
10  
kV  
kV  
kV  
kV  
kV  
kV  
MIL-STD-883  
(human body model)  
[1] Device stressed with ten non-repetitive ESD pulses.  
Table 7.  
ESD standards compliance  
Standard  
Conditions  
IEC 61000-4-2; level 4 (ESD)  
> 15 kV (air); > 8 kV (contact)  
> 8 kV  
MIL-STD-883; class 3B (human body model)  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
3 of 15  
 
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
001aaa631  
I
PP  
001aaa630  
120  
100 %  
90 %  
100 % I ; 8 μs  
PP  
I
PP  
(%)  
80  
−t  
e
50 % I ; 20 μs  
PP  
40  
10 %  
t
t = 0.7 ns to 1 ns  
r
0
30 ns  
60 ns  
0
10  
20  
30  
40  
t (μs)  
Fig 1. 8/20 s pulse waveform according to  
Fig 2. ESD pulse waveform according to  
IEC 61000-4-2  
IEC 61000-4-5  
6. Characteristics  
Table 8.  
Characteristics  
Tamb = 25 C unless otherwise specified  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Unit  
VRWM  
reverse standoff voltage  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
reverse leakage current  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
breakdown voltage  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
-
-
-
-
-
-
-
-
-
-
3.3  
5.0  
12  
V
V
V
V
V
15  
24  
IRM  
VRWM = 3.3 V  
VRWM = 5.0 V  
VRWM = 12 V  
VRWM = 15 V  
VRWM = 24 V  
IR = 5 mA  
-
-
-
-
-
0.7  
0.1  
< 1  
< 1  
< 1  
2
A  
A  
nA  
nA  
nA  
1
50  
50  
50  
[1]  
VBR  
5.2  
6.4  
5.6  
6.8  
6.0  
7.2  
V
V
V
V
V
14.7 15.0 15.3  
17.6 18.0 18.4  
26.5 27.0 27.5  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
4 of 15  
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
Table 8.  
Characteristics …continued  
Tamb = 25 C unless otherwise specified  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Unit  
Cd  
diode capacitance  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
clamping voltage  
PESD3V3S1UL  
f = 1 MHz; VR = 0 V  
-
-
-
-
-
207  
152  
38  
300  
200  
75  
pF  
pF  
pF  
pF  
pF  
32  
70  
23  
50  
[2]  
VCL  
IPP = 1 A  
IPP = 15 A  
IPP = 1 A  
IPP = 15 A  
IPP = 1 A  
IPP = 5 A  
IPP = 1 A  
IPP = 5 A  
IPP = 1 A  
IPP = 3 A  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
8
V
V
V
V
V
V
V
V
V
V
20  
9
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
20  
19  
35  
23  
40  
36  
70  
rdif  
differential resistance  
PESD3V3S1UL  
PESD5V0S1UL  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
IR = 1 mA  
IR = 1 mA  
IR = 1 mA  
IR = 1 mA  
IR = 0.5 mA  
-
-
-
-
-
-
-
-
-
-
400  
80  
200  
225  
300  
[1] Pulse test: tp 300 s; duty cycle 0.02.  
[2] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
5 of 15  
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
001aaa726  
001aaa193  
4
10  
1.2  
P
PP  
P
PP  
(W)  
P
PP(25°C)  
3
10  
0.8  
2
10  
0.4  
10  
0
2
3
1
10  
10  
10  
0
50  
100  
150  
200  
t
(μs)  
T (°C)  
j
p
Tamb = 25 C  
Fig 3. Peak pulse power as a function of exponential  
pulse duration; typical values  
Fig 4. Relative variation of peak pulse power as a  
function of junction temperature; typical  
values  
001aaa727  
001aaa728  
240  
50  
C
C
d
d
(pF)  
200  
(pF)  
40  
160  
120  
80  
30  
20  
10  
0
(1)  
(2)  
(1)  
(2)  
(3)  
40  
0
1
2
3
4
5
0
5
10  
15  
20  
25  
V
(V)  
V (V)  
R
R
f = 1 MHz; Tamb = 25 C  
f = 1 MHz; Tamb = 25 C  
(1) PESD3V3S1UL; VRWM = 3.3 V  
(2) PESD5V0S1UL; VRWM = 5.0 V  
(1) PESD12VS1UL; VRWM = 12 V  
(2) PESD15VS1UL; VRWM = 15 V  
(3) PESD24VS1UL; VRWM = 24 V  
Fig 5. Diode capacitance as a function of reverse  
voltage; typical values  
Fig 6. Diode capacitance as a function of reverse  
voltage; typical values  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
6 of 15  
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
I
001aaa729  
10  
I
RM  
I
RM(25°C)  
(1)  
(2)  
−V  
CL  
−V −V  
BR RWM  
V
−I  
−I  
RM  
R
1
−
+
P-N  
−1  
−100  
−I  
10  
PP  
−50  
0
50  
100  
150  
T (°C)  
j
006aaa407  
(1) PESD3V3S1UL; VRWM = 3.3 V  
(2) PESD5V0S1UL; VRWM = 5.0 V  
IR is less than 15 nA at 150 C for:  
PESD12VS1UL; VRWM = 12 V  
PESD15VS1UL; VRWM = 15 V  
PESD24VS1UL; VRWM = 24 V  
Fig 7. Relative variation of reverse leakage current  
as a function of junction temperature; typical  
values  
Fig 8. V-I characteristics for a unidirectional ESD  
protection diode  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
7 of 15  
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
ESD TESTER  
RG 223/U  
50 Ω coax  
4 GHz DIGITAL  
OSCILLOSCOPE  
R
d
450 Ω  
10×  
ATTENUATOR  
C
s
50 Ω  
note 1  
D.U.T.  
(DEVICE  
UNDER  
TEST)  
Note 1: IEC 61000-4-2 network  
= 150 pF; R = 330 Ω  
C
s
d
vertical scale = 200 V/div  
horizontal scale = 50 ns/div  
vertical scale = 20 V/div  
horizontal scale = 50 ns/div  
PESD24VS1UL  
GND  
GND  
GND  
GND  
GND  
PESD15VS1UL  
PESD12VS1UL  
PESD5V0S1UL  
PESD3V3S1UL  
GND  
unclamped +1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
clamped +1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
GND  
GND  
vertical scale = 10 V/div  
horizontal scale = 50 ns/div  
vertical scale = 200 V/div  
horizontal scale = 50 ns/div  
unclamped −1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
clamped −1 kV ESD voltage waveform  
(IEC 61000-4-2 network)  
006aaa682  
Fig 9. ESD clamping test setup and waveforms  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
8 of 15  
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
7. Application information  
The PESDxS1UL series is designed for protection of one unidirectional data line from the  
damage caused by ESD and surge pulses. The PESDxS1UL series may be used on lines  
where the signal polarities are either positive or negative with respect to ground. The  
PESDxS1UL series provides a surge capability of 150 W for an 8/20 s waveform.  
line to be protected  
line to be protected  
(positive signal polarity)  
(negative signal polarity)  
PESDxS1UL  
PESDxS1UL  
ground  
ground  
unidirectional protection of one line  
006aaa681  
Fig 10. Application diagram  
Circuit board layout and protection device placement  
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)  
and surge transients. The following guidelines are recommended:  
1. Place the PESDxS1UL as close to the input terminal or connector as possible.  
2. The path length between the PESDxS1UL and the protected line should be  
minimized.  
3. Keep parallel signal paths to a minimum.  
4. Avoid running protected conductors in parallel with unprotected conductors.  
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and  
ground loops.  
6. Minimize the length of the transient return path to ground.  
7. Avoid using shared transient return paths to a common ground point.  
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground  
vias.  
8. Test information  
8.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is  
suitable for use in automotive applications.  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
9 of 15  
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
9. Package outline  
0.50  
0.46  
0.62  
0.55  
2
1
0.30  
0.22  
1.02  
0.95  
0.65  
0.30  
0.22  
0.55  
0.47  
cathode marking on top side (if applicable)  
03-04-17  
Dimensions in mm  
Fig 11. Package outline SOD882  
10. Packing information  
Table 9.  
Packing methods  
The indicated -xxx are the last three digits of the 12NC ordering code.[1]  
Type number  
Package  
Description  
Packing quantity  
10000  
PESD3V3S1UL SOD882  
PESD5V0S1UL  
4 mm pitch, 8 mm tape and reel  
-315  
PESD12VS1UL  
PESD15VS1UL  
PESD24VS1UL  
[1] For further information and the availability of packing methods, see Section 14.  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
10 of 15  
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
11. Soldering  
1.3  
0.7  
R0.05 (8×)  
solder lands  
solder resist  
0.6 0.7 0.8  
(2×) (2×) (2×)  
0.9  
solder paste  
occupied area  
0.3  
(2×)  
Dimensions in mm  
0.4  
(2×)  
0.5  
sod882_fr  
(2×)  
Reflow soldering is the only recommended soldering method.  
Fig 12. Reflow soldering footprint SOD882  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
11 of 15  
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
12. Revision history  
Table 10. Revision history  
Document ID  
Release date  
20111025  
Data sheet status  
Change notice  
Supersedes  
PESDXS1UL_SER v.3  
Modifications:  
Product data sheet  
-
PESDXS1UL_SER v.2  
• Section 1.2 “Features and benefits”: updated  
• Table 7: updated  
• Table 8: added pulse conditions for breakdown voltage VBR  
• Section 8 “Test information”: added  
• Section 11 “Soldering”: added  
• Section 13 “Legal information”: updated  
PESDXS1UL_SER v.2  
PESDXS1UL_SER v.1  
20090820  
Product data sheet  
-
-
PESDXS1UL_SER v.1  
-
20060331  
Product data sheet  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
12 of 15  
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
13. Legal information  
13.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
13.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
13.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
13 of 15  
 
 
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
13.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
14. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
PESDXS1UL_SER  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Product data sheet  
Rev. 3 — 25 October 2011  
14 of 15  
 
 
PESDxS1UL series  
NXP Semiconductors  
Unidirectional ESD protection diodes  
15. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits. . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . 1  
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Application information. . . . . . . . . . . . . . . . . . . 9  
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 9  
Quality information . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Packing information . . . . . . . . . . . . . . . . . . . . 10  
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
3
4
5
6
7
8
8.1  
9
10  
11  
12  
13  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
13.1  
13.2  
13.3  
13.4  
14  
15  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 25 October 2011  
Document identifier: PESDXS1UL_SER  
 

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