PMEG2015EH_10 [NXP]
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers; 20 V ， 1.5 A非常低VF MEGA肖特基势垒整流器
| 型号： | PMEG2015EH_10 |
| 厂家： | 
NXP |
| 描述： | 20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers |
| 文件： | 总9页 (文件大小：108K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 03 — 15 January 2010
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small and flat SMD plastic
packages.
Table 1.
Product overview
Type number
Package
NXP
Configuration
JEITA
-
PMEG2015EH
PMEG2015EJ
SOD123F
SOD323F
single diode
single diode
SC-90
1.2 Features
Forward current: ≤ 1.5 A
Reverse voltage: ≤ 20 V
Very low forward voltage
Small and flat lead SMD plastic packages
1.3 Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Inverse polarity protection
Low and medium power general applications
1.4 Quick reference data
Table 2.
Symbol
IF
Quick reference data
Parameter
Conditions
Min
Typ
Max
1.5
20
Unit
A
forward current
reverse voltage
forward voltage
Tsp ≤ 55 °C
-
-
-
-
VR
-
V
[1]
VF
IF = 1.5 A
560
660
mV
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3.
Pinning
Pin
1
Description
cathode
Simplified outline
Symbol
[1]
1
2
2
anode
1
2
sym001
001aab540
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
-
Description
Version
PMEG2015EH
PMEG2015EJ
plastic surface mounted package; 2 leads
plastic surface mounted package; 2 leads
SOD123F
SOD323F
SC-90
4. Marking
Table 5.
Marking codes
Type number
PMEG2015EH
PMEG2015EJ
Marking code
AD
EL
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
20
Unit
V
VR
reverse voltage
forward current
-
-
-
-
IF
Tsp ≤ 55 °C
1.5
5.5
9
A
IFRM
IFSM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
A
[1]
non-repetitive peak forward
current
square wave;
tp = 8 ms
A
Ptot
total power dissipation
PMEG2015EH
Tamb ≤ 25 °C
[1]
[2]
[1]
[2]
-
375
830
360
830
150
+150
mW
mW
mW
mW
°C
-
PMEG2015EJ
-
-
Tj
junction temperature
ambient temperature
-
Tamb
−65
°C
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
2 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Tstg storage temperature
Conditions
Min
Max
Unit
−65
+150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1][2]
[2][3]
[1][2]
[2][3]
PMEG2015EH
-
-
-
-
-
-
-
-
330
150
350
150
K/W
K/W
K/W
K/W
PMEG2015EJ
Rth(j-sp)
thermal resistance from
junction to solder point
PMEG2015EH
PMEG2015EJ
-
-
-
-
60
55
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VF forward voltage
Min
Typ
240
300
400
480
560
5
Max
270
350
460
550
660
10
Unit
mV
mV
mV
mV
mV
μA
[1]
[1]
[1]
[1]
[1]
IF = 10 mA
IF = 100 mA
IF = 500 mA
IF = 1 A
-
-
-
-
-
-
-
-
-
-
-
IF = 1.5 A
VR = 5 V
IR
reverse current
VR = 8 V
7
20
μA
VR = 10 V
VR = 15 V
VR = 20 V
8
30
μA
10
50
μA
15
70
μA
Cd
diode capacitance VR = 1 V; f = 1 MHz
40
50
pF
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
3 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
006aaa402
006aaa403
4
5
10
F
(mA)
10
10
I
R
I
(1)
(2)
(μA)
4
3
2
10
10
10
3
(3)
2
10
(1)
(2) (3)
(4)
(5)
(4)
10
10
1
1
−1
10
(5)
−1
10
−2
10
10
−2
−3
10
0
0.1
0.2
0.3
0.4
0.5
V
0.6
(V)
0
5
10
15
20
V
R
(V)
F
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(1)
T
amb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
006aaa404
80
C
d
(pF)
60
40
20
0
0
5
10
15
20
V
R
(V)
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
4 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
8. Package outline
1.7
1.5
1.2
1.0
1.35
1.15
0.80
0.65
0.5
0.3
1
1
0.55
0.35
2.7 1.8
2.3 1.6
3.6 2.7
3.4 2.5
2
2
0.40
0.25
0.25
0.10
0.70
0.55
0.25
0.10
Dimensions in mm
04-11-29
Dimensions in mm
04-09-13
Fig 4. Package outline SOD123F
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 9.
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3000
10000
PMEG2015EH SOD123F
PMEG2015EJ SOD323F
4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
5 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65 0.95
0.50 0.60
occupied area
solder paste
0.50
(2×)
001aab169
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
6 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10. Revision history
Document ID
Release date
20100115
Data sheet status
Change notice
Supersedes
PMEG2015EH_EJ_3
Modifications:
Product data sheet
-
PMEG2015EH_EJ_2
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
PMEG2015EH_EJ_2
PMEG2015EJ_1
20050407
20050302
Product data sheet
Product data sheet
-
-
PMEG2015EJ_1
-
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
7 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMEG2015EH_EJ_3
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 15 January 2010
8 of 9
PMEG2015EH; PMEG2015EJ
NXP Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 January 2010
Document identifier: PMEG2015EH_EJ_3
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