PRTR5V0U4D,115 [NXP]
Trans Voltage Suppressor Diode, 3V V(RWM), Unidirectional, 1 Element, Silicon;
| 型号： | PRTR5V0U4D,115 |
| 厂家： | 
NXP |
| 描述： | Trans Voltage Suppressor Diode, 3V V(RWM), Unidirectional, 1 Element, Silicon |
| 文件： | 总10页 (文件大小：111K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PRTR5V0U4D
SOT457
Ultra low capacitance quadruple rail-to-rail ESD protection
Rev. 2 — 5 March 2012
Product data sheet
1. Product profile
1.1 General description
Ultra low capacitance quadruple rail-to-rail ElectroStatic Discharge (ESD) protection
device in an SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.
The device is designed to protect four high-speed data lines or high-frequency signal lines
from the damage caused by ESD and other transients.
PRTR5V0U4D integrates four ultra low capacitance rail-to-rail ESD protection channels
and one additional ESD protection diode to ensure signal line protection even if no supply
voltage is available.
1.2 Features and benefits
ESD protection of four high-speed data lines or high-frequency signal lines
Ultra low input/output to ground capacitance: C(I/O-GND) = 1 pF
ESD protection up to 8 kV
IEC 61000-4-2, level 4 (ESD)
Very low clamping voltage due to an integrated additional ESD protection diode
Very low reverse current
AEC-Q101 qualified
Small SMD plastic package
1.3 Applications
USB 2.0 interfaces
Digital Video Interface (DVI)
High-Definition Multimedia Interface (HDMI)
Mobile phones
Digital cameras
WAN/LAN systems
PC, notebooks, printers and other PC peripherals
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Per channel
[1]
[2]
C(I/O-GND) input/output to ground
capacitance
V(I/O-GND) = 0 V;
-
1.0
-
pF
VCC = 3 V;
f = 1 MHz
Zener diode
VI
input voltage
0
-
-
5.5
-
V
Csup
supply pin to ground
capacitance
V(I/O-GND) = 0 V;
40
pF
VCC = 3 V;
f = 1 MHz
[1] Measured from pins 1, 3, 4 and 6 to pin 2.
[2] Measured from pin 5 to pin 2.
2. Pinning information
Table 2.
Pinning
Pin
1
Symbol
I/O1
Description
input/output 1
ground
Simplified outline
Graphic symbol
6
5
4
6
5
4
2
GND
I/O2
3
input/output 2
input/output 3
supply voltage
input/output 4
4
I/O3
1
2
3
5
VCC
6
I/O4
1
2
3
001aag273
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
PRTR5V0U4D SC-74
Description
Version
plastic surface-mounted package (TSOP6); 6 leads
SOT457
4. Marking
Table 4.
Marking code
Type number
Marking code
PRTR5V0U4D
4D
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
2 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Per device
Tj
Parameter
Conditions
Min
Max
Unit
junction temperature
ambient temperature
storage temperature
-
150
C
C
C
Tamb
55
65
+150
+150
Tstg
Table 6.
ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol
Per channel
VESD
Parameter
Conditions
Min
Max
Unit
[1][2]
electrostatic discharge
voltage
IEC 61000-4-2
(contact discharge)
-
-
8
8
kV
kV
MIL-STD-883
(human body model)
[1] Device stressed with ten non-repetitive ESD pulses.
[2] Measured from pin 1, 3, 4 or 6 to pin 2 or 5.
Table 7.
ESD standards compliance
Standard
Conditions
Per channel
IEC 61000-4-2; level 4 (ESD)
MIL-STD-883; class 3B (human body model)
> 8 kV (contact)
> 8 kV
001aaa631
I
PP
100 %
90 %
10 %
t
t = 0.7 ns to 1 ns
r
30 ns
60 ns
Fig 1. ESD pulse waveform according to IEC 61000-4-2
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
3 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
6. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Per channel
[1]
[1]
IRM
reverse leakage current
VR = 3 V
-
-
-
100
-
nA
pF
C(I/O-GND) input/output to ground
capacitance
V(I/O-GND) = 0 V;
VCC = 3 V; f = 1 MHz
1.0
VF
forward voltage
-
0.7
-
V
Zener diode
VI
input voltage
0
6
-
-
5.5
9
V
VBR
Csup
breakdown voltage
II = 1 mA
-
V
[2]
supply pin to ground
capacitance
V(I/O-GND) = 0 V;
VCC = 3 V; f = 1 MHz
40
-
pF
[1] Measured from pins 1, 3, 4 and 6 to pin 2.
[2] Measured from pin 5 to pin 2.
7. Application information
The device is designed for the protection of for example, two USB 2.0 ports against ESD.
Each device is capable to protect both, USB data lines and the VBUS supply.
V
BUS
V
BUS
D+
D−
GND
4
5
6
3
2
1
USB 2.0
IEEE1394
CONTROLLER
V
BUS
D+
D−
GND
001aah387
Fig 2. Application diagram
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
4 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
9. Package outline
3.1
2.7
1.1
0.9
6
5
4
0.6
0.2
3.0 1.7
2.5 1.3
pin 1 index
1
2
3
0.26
0.10
0.40
0.25
0.95
1.9
Dimensions in mm
04-11-08
Fig 3. Package outline SOT457 (SC-74)
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
3000
10000
-135
[2]
[3]
PRTR5V0U4D SOT457 4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
-115
-125
-165
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
5 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
11. Soldering
3.45
1.95
0.55
(6×)
solder lands
solder resist
0.45
(6×)
0.95
0.95
3.3 2.825
solder paste
occupied area
0.7
Dimensions in mm
(6×)
0.8
(6×)
2.4
sot457_fr
Fig 4. Reflow soldering footprint SOT457 (SC-74)
5.3
1.5
(4×)
solder lands
solder resist
occupied area
1.475
1.475
0.45
(2×)
5.05
Dimensions in mm
preferred transport
direction during soldering
1.45
(6×)
2.85
sot457_fw
Fig 5. Wave soldering footprint SOT457 (SC-74)
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
6 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
12. Revision history
Table 10. Revision history
Document ID
PRTR5V0U4D v.2
Modifications:
Release date
20120305
Data sheet status
Change notice
Supersedes
Product data sheet
-
PRTR5V0U4D v.1
• Section 1 “Product profile”: reshaped
• Section 1.4 “Quick reference data”: added
• Section 2: updated
• Section 4 “Marking”: added
• Section 5 “Limiting values”: reshaped and updated; junction temperature Tj added; Table 6,
Table 7 and Figure 1 added
• Section 6 “Characteristics”: reshaped; ILR redefined to IRM
• Section 8 “Test information”: added
• Figure 3: replaced by minimized outline drawing
• Section 10 “Packing information”: added
• Section 11 “Soldering”: added
• Section 13 “Legal information”: updated
PRTR5V0U4D v.1
20080111
Product data sheet
-
-
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
7 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
13.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
8 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PRTR5V0U4D
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 2 — 5 March 2012
9 of 10
PRTR5V0U4D
NXP Semiconductors
Ultra low capacitance quadruple rail-to-rail ESD protection
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 4
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
Quality information . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 March 2012
Document identifier: PRTR5V0U4D
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