PSMN004-25B [NXP]
N-channel logic level TrenchMOS transistor; N沟道逻辑电平的TrenchMOS晶体管型号: | PSMN004-25B |
厂家: | NXP |
描述: | N-channel logic level TrenchMOS transistor |
文件: | 总9页 (文件大小:104K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor PSMN004-25B, PSMN004-25P
FEATURES
SYMBOL
QUICK REFERENCE DATA
d
• ’Trench’ technology
• Very low on-state resistance
• Fast switching
VDSS = 25 V
ID = 75 A
• Low thermal resistance
RDS(ON) ≤ 4.3 mΩ (VGS = 10 V)
g
RDS(ON) ≤ 5 mΩ (VGS = 5 V)
s
GENERAL DESCRIPTION
SiliconMAX products use the latest Philips Trench technology to achieve the lowest possible on-state resistance in
each package at each voltage rating.
Applications:-
• d.c. to d.c. converters
• switched mode power supplies
The PSMN004-25P is supplied in the SOT78 (TO220AB) conventional leaded package.
The PSMN004-25B is supplied in the SOT404 surface mounting package.
PINNING
SOT78 (TO220AB)
SOT404 (D2PAK)
PIN
DESCRIPTION
tab
tab
1
2
gate
drain1
3
source
drain
2
tab
1
3
1 2 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VDSS
VDGR
VGS
Drain-source voltage
Tj = 25 ˚C to 175˚C
Tj = 25 ˚C to 175˚C; RGS = 20 kΩ
-
-
-
25
25
± 15
V
V
V
Drain-gate voltage
Continuous gate-source
voltage
VGSM
ID
Peak pulsed gate-source
voltage
Continuous drain current
Tj ≤ 150 ˚C
-
± 20
V
Tmb = 25 ˚C; VGS = 5 V
Tmb = 100 ˚C; VGS = 5 V
Tmb = 25 ˚C
-
-
-
-
752
752
240
230
175
A
A
A
W
˚C
IDM
PD
Tj, Tstg
Pulsed drain current
Total power dissipation
Operating junction and
storage temperature
Tmb = 25 ˚C
- 55
1 It is not possible to make connection to pin:2 of the SOT404 package
2 maximum continuous current limited by package
October 1999
1
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
THERMAL RESISTANCES
SYMBOL PARAMETER
Rth j-mb Thermal resistance junction
to mounting base
Thermal resistance junction SOT78 package, vertical in still air
CONDITIONS
MIN. TYP. MAX. UNIT
-
-
0.65 K/W
Rth j-a
-
-
60
50
-
-
K/W
K/W
to ambient
SOT404 package, pcb mounted, minimum
footprint
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER
EAS Non-repetitive avalanche
CONDITIONS
MIN.
MAX.
UNIT
Unclamped inductive load, IAS = 75 A;
tp = 100 µs; Tj prior to avalanche = 25˚C;
-
120
mJ
energy
VDD ≤ 15 V; RGS = 50 Ω; VGS = 5 V
IAS
Non-repetitive avalanche
current
-
75
A
ELECTRICAL CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
V(BR)DSS
Drain-source breakdown
voltage
Gate threshold voltage
VGS = 0 V; ID = 0.25 mA;
25
22
1
0.5
-
-
-
-
-
-
-
-
-
-
-
2
V
V
V
V
V
mΩ
mΩ
mΩ
Tj = -55˚C
-
1.5
-
VGS(TO)
VDS = VGS; ID = 1 mA
Tj = 175˚C
Tj = -55˚C
-
-
2.3
4.3
5
5.4
9.25 mΩ
RDS(ON)
Drain-source on-state
resistance
VGS = 10 V; ID = 25 A
VGS = 5 V; ID = 25 A
VGS = 4.5 V; ID = 25 A
VGS = 5 V; ID = 25 A; Tj = 175˚C
3.5
4
-
-
IGSS
IDSS
Gate-source leakage current VGS = ± 10 V; VDS = 0 V;
Zero gate voltage drain
current
0.02 100
0.05
-
nA
µA
µA
VDS = 25 V; VGS = 0 V;
10
500
Tj = 175˚C
Qg(tot)
Qgs
Qgd
Total gate charge
Gate-source charge
Gate-drain (Miller) charge
ID = 75 A; VDD = 15 V; VGS = 5 V
-
-
-
97
20
39
-
-
-
nC
nC
nC
td on
tr
td off
tf
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
VDD = 15 V; RD = 1.2 Ω
VGS = 5 V; RG = 5.6 Ω
Resistive load
-
-
-
-
45
-
-
-
-
ns
ns
ns
ns
220
435
320
Ld
Ld
Internal drain inductance
Internal drain inductance
Measured tab to centre of die
Measured from drain lead to centre of die
(SOT78 package only)
-
-
3.5
4.5
-
-
nH
nH
Ls
Internal source inductance
Measured from source lead to source
bond pad
-
7.5
-
nH
Ciss
Coss
Crss
Input capacitance
Output capacitance
Feedback capacitance
VGS = 0 V; VDS = 20 V; f = 1 MHz
-
-
-
6000
1700
1400
-
-
-
pF
pF
pF
October 1999
2
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
IS
Continuous source current
(body diode)
Pulsed source current (body
diode)
Diode forward voltage
-
-
75
A
A
V
ISM
VSD
-
-
240
IF = 25 A; VGS = 0 V
IF = 75 A; VGS = 0 V
-
-
0.85
1.1
1.2
-
trr
Qrr
Reverse recovery time
Reverse recovery charge
IF = 20 A; -dIF/dt = 100 A/µs;
VGS = 0 V; VR = 25 V
-
-
400
1
-
-
ns
µC
October 1999
3
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
Transient thermal impedance, Zth j-mb (K/W)
Normalised Power Derating, PD (%)
100
1
0.1
D = 0.5
0.2
90
80
70
60
50
40
30
20
10
0.1
0.05
0.02
P
D = tp/T
D
tp
0.01
single pulse
1E-05
T
0.001
0
1E-06
1E-04
1E-03
1E-02
1E-01
1E+00
0
25
50
75
100
125
150
175
Pulse width, tp (s)
Mounting Base temperature, Tmb (C)
Fig.1. Normalised power dissipation.
PD% = 100 PD/PD 25 ˚C = f(Tmb)
Fig.4. Transient thermal impedance.
Zth j-mb = f(t); parameter D = tp/T
Drain Current, ID (A)
100
90
80
70
60
50
40
30
20
10
0
Normalised Current Derating, ID (%)
10 V
Tj = 25 C
2.8 V
100
90
80
70
60
50
40
30
20
10
0
4.5 V
5 V
VGS = 2.6 V
2.4 V
2.2 V
2 V
1.8 V
0
25
50
75
100
125
150
175
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Mounting Base temperature, Tmb (C)
Drain-Source Voltage, VDS (V)
Fig.2. Normalised continuous drain current.
ID% = 100 ID/ID 25 ˚C = f(Tmb)
Fig.5. Typical output characteristics, Tj = 25 ˚C.
ID = f(VDS)
Peak Pulsed Drain Current, IDM (A)
1000
Drain-Source On Resistance, RDS(on) (Ohms)
0.02
RDS(on) = VDS/ ID
2.4 V
2 V
2.2 V
2.6 V
0.018
0.016
0.014
0.012
0.01
tp = 10 us
100 us
100
10
1
1 ms
2.8 V
4.5 V
D.C.
10 ms
0.008
0.006
0.004
0.002
0
100 ms
5 V
VGS = 10V
Tj = 25 C
10
1
10
Drain-Source Voltage, VDS (V)
100
0
20
30
40
50
60
70
80
90 100
Drain Current, ID (A)
Fig.3. Safe operating area. Tmb = 25 ˚C
ID & IDM = f(VDS); IDM single pulse; parameter tp
Fig.6. Typical on-state resistance, Tj = 25 ˚C.
RDS(ON) = f(ID)
October 1999
4
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
Threshold Voltage, VGS(TO) (V)
Drain current, ID (A)
VDS > ID X RDS(ON)
2.25
2
100
90
80
70
60
50
40
30
20
10
0
maximum
typical
1.75
1.5
1.25
1
minimum
175 C
0.75
0.5
0.25
0
Tj = 25 C
0
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
-60
-40
-20
0
20
40
60
80
100 120 140 160 180
Gate-source voltage, VGS (V)
Junction Temperature, Tj (C)
Fig.7. Typical transfer characteristics.
ID = f(VGS)
Fig.10. Gate threshold voltage.
VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS
Drain current, ID (A)
Transconductance, gfs (S)
1.0E-01
140
120
100
80
Tj = 25 C
VDS = 5 V
VDS > ID X RDS(ON)
1.0E-02
1.0E-03
1.0E-04
1.0E-05
1.0E-06
175 C
minimum
typical
maximum
60
40
20
0
0
0.5
1
1.5
2
2.5
3
0
10
20
30
40
50
60
70
80
90
100
Drain current, ID (A)
Gate-source voltage, VGS (V)
Fig.8. Typical transconductance, Tj = 25 ˚C.
gfs = f(ID)
Fig.11. Sub-threshold drain current.
ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS
Normalised On-state Resistance
2
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1
Capacitances, Ciss, Coss, Crss (pF)
100000
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10000
1000
Ciss
Coss
Crss
-60
-40
-20
0
20
40
60
80
100 120 140 160 180
0.1
1
10
100
Junction temperature, Tj (C)
Drain-Source Voltage, VDS (V)
Fig.9. Normalised drain-source on-state resistance.
RDS(ON)/RDS(ON)25 ˚C = f(Tj)
Fig.12. Typical capacitances, Ciss, Coss, Crss.
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz
October 1999
5
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
Gate-source voltage, VGS (V)
15
Maximum Avalanche Current, IAS (A)
100
ID = 75 A
VDD = 15 V
Tj = 25 C
14
13
12
11
10
9
25 C
Tj prior to avalanche = 150 C
8
7
10
6
5
4
3
2
1
0
1
0.001
0
25
50
75
100 125 150 175 200 225 250
Gate charge, QG (nC)
0.01
0.1
1
10
Avalanche time, tAV (ms)
Fig.13. Typical turn-on gate-charge characteristics.
VGS = f(QG)
Fig.15. Maximum permissible non-repetitive
avalanche current (IAS) versus avalanche time (tAV);
unclamped inductive load
Source-Drain Diode Current, IF (A)
100
VGS = 0 V
90
80
70
60
50
40
175 C
30
Tj = 25 C
20
10
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Source-Drain Voltage, VSDS (V)
1
1.1 1.2
Fig.14. Typical reverse diode current.
IF = f(VSDS); conditions: VGS = 0 V; parameter Tj
October 1999
6
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
MECHANICAL DATA
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220
SOT78
E
P
A
A
1
q
D
1
D
(1)
L
L
1
2
Q
b
1
L
1
2
3
b
c
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
L
2
b
e
A
b
D
E
L
D
1
L
1
A
1
c
UNIT
P
q
Q
1
max.
4.5
4.1
1.39
1.27
0.9
0.7
1.3
1.0
0.7
0.4
15.8
15.2
6.4
5.9
10.3
9.7
15.0
13.5
3.30
2.79
3.8
3.6
3.0
2.7
2.6
2.2
mm
3.0
2.54
Note
1. Terminals in this zone are not tinned.
REFERENCES
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
JEDEC
EIAJ
97-06-11
SOT78
TO-220
Fig.16. SOT78 (TO220AB); pin 2 connected to mounting base (Net mass:2g)
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to mounting instructions for SOT78 (TO220AB) package.
3. Epoxy meets UL94 V0 at 1/8".
October 1999
7
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
MECHANICAL DATA
2
Plastic single-ended surface mounted package (Philips version of D -PAK); 3 leads
(one lead cropped)
SOT404
A
A
E
1
mounting
base
D
1
D
H
D
2
L
p
1
3
c
b
e
e
Q
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
D
E
A
A
b
UNIT
c
D
e
L
H
Q
1
1
p
D
max.
4.50
4.10
1.40
1.27
0.85
0.60
0.64
0.46
1.60
1.20
10.30
9.70
2.90 15.40 2.60
2.10 14.80 2.20
mm
11
2.54
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
98-12-14
99-06-25
SOT404
Fig.17. SOT404 surface mounting package. Centre pin connected to mounting base.
Notes
1. This product is supplied in anti-static packaging. The gate-source input must be protected against static
discharge during transport or handling.
2. Refer to SMD Footprint Design and Soldering Guidelines, Data Handbook SC18.
3. Epoxy meets UL94 V0 at 1/8".
October 1999
8
Rev 1.100
Philips Semiconductors
Product specification
N-channel logic level TrenchMOS transistor
PSMN004-25B, PSMN004-25P
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.18. SOT404 : soldering pattern for surface mounting.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
October 1999
9
Rev 1.100
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