SAA7165WP [NXP]
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型号: | SAA7165WP |
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INTEGRATED CIRCUITS
DATA SHEET
SAA7165
Video Enhancement and
Digital-to-Analog processor
(VEDA2)
1996 Aug 20
Product specification
Supersedes data of May 1995
File under Integrated Circuits, IC22
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
FEATURES
• CMOS circuit to enhance video data and to convert
luminance and colour-difference signals from
digital-to-analog
• Digital Colour Transient Improvement block (DCTI) to
increase the sharpness of colour transitions.
The improved pin-compatible SAA7165 can supersede
the SAA9065
• Controllable peaking of luminance signal
• Coring stage with controllable threshold to eliminate
noise in luminance signal
• 16-bit parallel input for 4 : 1 : 1 and 4 : 2 : 2 YUV data
• Data clock input LLC (Line-Locked Clock) for a data rate
up to 36 MHz
• Interpolation filter suitable for both formats to increase
the data rate in chrominance path
• 8-bit luminance and 8-bit multiplexed colour-difference
formats (7-bit formats optional)
• Polarity of colour-difference signals selectable
• All functions controlled via I2C-bus
• MC input to support various clock and pixel rates
• Separate digital-to-analog converters (9-bit resolution
for Y; 8-bit for colour-difference signals)
• Formatting YUV input data; 4 : 2 : 2 format,
4 : 1 : 1 format and filter characteristics selectable
• 1 V (p-p)/75 Ω outputs realized by two resistors
• No external adjustments.
• HREF input to determine the active line (number of
pixels)
QUICK REFERENCE DATA
SYMBOL
VDDD
PARAMETER
MIN.
4.5
TYP.
MAX.
5.5
UNIT
digital supply voltage
analog supply voltage
total supply current
5
5
V
V
VDDA
IDD(tot)
VIL
4.75
−
5.25
tbf
−
−
mA
V
LOW-level input voltage on YUV-bus
HIGH-level input voltage on YUV-bus
input data rate
−0.5
2
+0.8
VIH
−
VDDD + 0.5
V
fLLC
−
−
36
−
MHz
V
Vo(p-p)
RL
output signals Y, (R − Y) and (B − Y) (peak-to-peak value)
output load resistance
−
2
125
−
−
−
Ω
ILE
DC integral linearity error in output signal (8-bit data)
DC differential error in output signal (8-bit data)
operating ambient temperature range
−
1
LSB
LSB
°C
DLE
Tamb
−
−
0.5
70
0
−
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
NUMBER
NAME
VERSION
SOT187-2
SAA7165WP PLCC44 plastic leaded chip carrier; 44 leads
1996 Aug 20
2
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V
V
V
V
V
V
DDD1
12
DDD2
31
DDA1
32
DDA2
DDA3 CUR
DDA4
42
37
40
41
2
39
1
Y7 to Y0
21 to 14
C
Y
Y
PEAKING
AND
CORING
Y
25 Ω
Y
8
8
DAC 3
FORMATTER
REFL
Y
YUV-bus
DATA
SWITCH
data clock
UV7 to
UV0
25 Ω
U
V
11 to 4
36
44
(B − Y)
UV
INTERPOLATION
FILTER
DAC 2
DAC 1
DCTI
FORMATTER
REFL
UV
24
43
33
MC
C
UV
25
26
TIMING
CONTROL
LLC
HREF
25 Ω
(R − Y)
27
28
RESET
SCL
SAA7165
2
I C-BUS
TEST
2
I C-bus
SDA 29
CONTROL
CONTROL
13
30
22
23
SP
3
34
35
V
38
V
MEH464
V
V
AP
SUB
V
SSD1
SSD2
SSA1
SSA2
SSA3
Fig.1 Block diagram.
ahdnbok,uflapegwidt
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
PINNING
SYMBOL PIN
DESCRIPTION
REFLY
CY
1
low reference of luminance DAC (connected to VSSA1
)
2
capacitor for luminance DAC (high reference)
SUB
UV0
UV1
UV2
UV3
UV4
UV5
UV6
UV7
VDDD1
VSSD1
Y0
3
substrate (connected to VSSA1)
4
UV signal input bit UV7 (digital colour-difference signal)
UV signal input bit UV6 (digital colour-difference signal)
UV signal input bit UV5 (digital colour-difference signal)
UV signal input bit UV4 (digital colour-difference signal)
UV signal input bit UV3 (digital colour-difference signal)
UV signal input bit UV2 (digital colour-difference signal)
UV signal input bit UV1 (digital colour-difference signal)
UV signal input bit UV0 (digital colour-difference signal)
+5 V digital supply voltage 1
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
digital ground 1 (0 V)
Y signal input bit Y7 (digital luminance signal)
Y signal input bit Y6 (digital luminance signal)
Y signal input bit Y5 (digital luminance signal)
Y signal input bit Y4 (digital luminance signal)
Y signal input bit Y3 (digital luminance signal)
Y signal input bit Y2 (digital luminance signal)
Y signal input bit Y1 (digital luminance signal)
Y signal input bit Y0 (digital luminance signal)
connected to ground (action pin for testing)
connected to ground (shift pin for testing)
Y1
Y2
Y3
Y4
Y5
Y6
Y7
AP
SP
MC
data clock CREF (e.g. 13.5 MHz); at MC = HIGH, the LLC divider-by-two is inactive
line-locked clock signal (LL27 = 27 MHz)
data clock for YUV data inputs (for active line 768Y or 640Y long)
reset input (active LOW)
I2C-bus clock line
I2C-bus data line
LLC
HREF
RESET
SCL
SDA
VSSD2
VDDD2
VDDA1
(R − Y)
VSSA1
VSSA2
(B − Y)
VDDA2
VSSA3
Y
digital ground 2 (0 V)
+5 V digital supply voltage 2
+5 V analog supply voltage for buffer of DAC 1
±(R − Y) output signal (analog signal)
analog ground 1 (0 V)
analog ground 2 (0 V)
±(B − Y) output signal (analog colour-difference signal)
+5 V analog supply voltage for buffer of DAC 2
analog ground 3 (0 V)
Y output signal (analog luminance signal)
+5 V analog supply voltage for buffer of DAC 3
VDDA3
1996 Aug 20
4
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
SYMBOL PIN
DESCRIPTION
CUR
41
42
43
44
current input for analog output buffers
VDDA4
CUV
supply and reference voltage for the three DACs
capacitor for chrominance DACs (high reference)
low reference of chrominance DACs (connected to VSSA1
REFLUV
)
UV3
UV4
UV5
7
8
9
39
38
37
36
35
34
33
32
31
30
29
Y
V
SSA3
DDA2
V
UV6 10
UV7 11
(B − Y)
V
SSA2
SAA7165
V
V
12
13
DDD1
SSA1
V
(R − Y)
SSD1
V
Y0 14
Y1 15
DDA1
V
DDD2
V
16
Y2
SSD2
SDA
Y3 17
MEH465
Fig.2 Pin configuration.
5
1996 Aug 20
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
FUNCTIONAL DESCRIPTION
Formatting Y and UV
The CMOS circuit SAA7165 processes digital YUV-bus
data up to a data rate of 36 MHz. The data inputs Y7 to Y0
and UV7 to UV0 (see Fig.1) are provided with 8-bit data.
The data of digital colour-difference signals U and V are in
a multiplexed state (serial in 4 : 2 : 2 or 4 : 1 : 1 format;
Tables 2 and 3).
The input data formats are formatted into the internally
used processing formats (separate for 4 : 2 : 2 and
4 : 1 : 1 formats). The IFF, IFC and IFL bits control the
input data format and determine the right interpolation filter
(see Figs 10 to 13).
Peaking and coring
Data is read with the rising edge of LLC (Line-Locked
Clock) to achieve a data rate of LLC at MC = HIGH only. If
MC is supplied with the frequency CREF (1⁄2LLC for
example), data is read only at every second rising edge
(see Fig.3).
Peaking is applied to the Y signal to compensate several
bandwidth reductions of the external pre-processing.
Y signals can be improved to obtain a better sharpness.
There are the two switchable bandpass filters
BF1 and BF2 controlled via the I2C-bus by the bits BP1,
BP0 and BFB. Thus, a frequency response is achieved in
combination with the peaking factor K (Figs 5 to 9;
K is determined by the bits BFB, WG1 and WG0).
The 7-bit YUV input data are also supported by means of
bit R78 (R78 = 0). Additionally, the luminance data format
is converted for internal use into a two´s complement
format by inverting the MSB. The Y input byte
(bits Y7 to Y0) represents luminance information; the UV
input byte (bits UV7 to UV0) represents one of the two
digital colour-difference signals in 4 : 2 : 2 format
(Table 2).
The coring stage with controllable threshold (4 states
controlled by CO1 and CO0 bits) reduces noise
disturbances (generated by the bandpass gain) by
suppressing the amplitude of small high-frequent signal
components. The remaining high-frequent peaking
component is available for a weighted addition after
coring.
The HREF input signal (HREF = HIGH) determines the
start and the end of an active line (see Fig.3) and the
number of pixels respectively. The analog output Y is
blanked at HREF = LOW, the (B − Y) and (R − Y) outputs
are in a colourless state. The blanking level can be set with
bit BLV. The SAA7165 is controllable via the I2C-bus.
Table 1 LLC and MC configuration modes in DMSD applications (note 1)
PIN INPUT SIGNAL
LLC (LL27)
DESCRIPTION
LLC
MC
LLC
MC
LLC
MC
The data rate on YUV-bus is half the clock rate on pin LLC, e.g. in
SAA7151B, SAA7191 and SAA7191B single scan operation.
CREF
LLC (LL27)
MC = HIGH
LLC (LL27)
MC = HIGH
The data rate on YUV-bus must be identical to the clock rate on pin LLC,
e.g. in double scan applications.
The data rate on YUV-bus must be identical to the clock rate on pin LLC,
e.g. SAA9051 single scan operation.
Note
1. YUV data are only latched with the rising edge of LCC at MC = HIGH.
1996 Aug 20
6
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
Table 2 Data format 4 : 2 : 2
INPUT
Y0 (LSB)
PIXEL BYTE SEQUENCE (4 : 2 : 2 FORMAT)
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
U0
U1
U2
U3
U4
U5
U6
U7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
V0
V1
V2
V3
V4
V5
V6
V7
1
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
U0
U1
U2
U3
U4
U5
U6
U7
2
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
V0
V1
V2
V3
V4
V5
V6
V7
3
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
U0
U1
U2
U3
U4
U5
U6
U7
4
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
V0
V1
V2
V3
V4
V5
V6
V7
5
Y1
Y2
Y3
Y4
Y5
Y6
Y7 (MSB)
UV0 (LSB)
UV1
UV2
UV3
UV4
UV5
UV6
UV7 (MSB)
Y frame
UV frame
0
2
4
Table 3 Data format 4 : 1 : 1
INPUT
PIXEL BYTE SEQUENCE (4 : 1 : 1 FORMAT)
Y0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
UV0
UV1
UV2
UV3
UV4
UV5
UV6
UV7
Y frame
UV frame
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
V6
V7
U6
U7
0
V4
V5
U4
U5
1
V2
V3
U2
U3
2
V0
V1
U0
U1
3
V6
V7
U6
U7
4
V4
V5
U4
U5
5
V2
V3
U2
U3
6
V0
V1
U0
U1
7
0
4
1996 Aug 20
7
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
LL27
(LLC)
CREF
internal
bus clock
(LLC2)
HREF
start of
active line
Byte number for pixels:
0
1
2
3
4
5
6
7
Y signal
50 Hz
U and V signal
U0
V0
U2
V2
U4
V4
U6
V6
0
1
2
3
4
5
6
7
Y signal
60 Hz
U and V signal
U0
V0
U2
V2
U4
V4
U6
V6
MEH268
a. Start of active line.
LL27
(LLC)
CREF
internal
bus clock
(LLC2)
HREF
end of
active line
Byte number for pixels:
714
715
716
717
718
719
Y signal
50 Hz
U and V signal
U714
V714
U716
V716
U718
V718
Y signal
714
715
716
717
718
719
60 Hz
U and V signal
U714
V714
U716
V716
U718
V718
MEH269
b. End of active line.
Fig.3 Line control by HREF for 4 : 2 : 2 format, CREF = 13.5 MHz; HREF = 720 pixel; 50 and 60 Hz field.
1996 Aug 20
8
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
In order to obtain the point of inflection, the second
derivative of the signal is calculated. The improved
transition is centred with respect to the point of inflection of
the original signal. Thus, there is no horizontal shift of the
resulting signal.
Interpolation
The chrominance interpolation filter consists of various
filter stages, multiplexers and de-multiplexers to increase
the data rate of the colour-difference signals by a factor of
2 or 4. The switching of the filters by the bits IFF, IFC and
IFL is described previously. Additional signal samples with
significant amplitudes between two consecutive signal
samples of the low data rate are generated.
The transition area length to be improved is controlled via
I2C-bus by the bits LI1 and LI0 (Table 5); the sensitivity of
the DCTI block is controlled by the bits GA1 and GA0.
The CMO bit controls the colour detail sensitivity. It should
be set to logic 1 (ON) if the video signal contains fine
colour details (recommended operation mode).
The time-multiplexed U and V samples are stored in
parallel for converting.
Data switch
Digital-to-Analog Converters (DACs)
The digital signals are adapted to the conversation range.
U and V data have 8-bit formats again; Y can have 9 bits
dependent on peaking. Blanking and switching to
colourless level is applied here. Bits can be inverted by
INV-bit to change the polarity of colour-difference output
signals.
Conversion is separate for Y, U and V. The converters use
resistor chains with low-impedance output buffers.
The minimum output voltage is 200 mV to reduce integral
non-linearity errors. The analog signal, without load on
output pin, is between 0.2 and 2.2 V floating.
An application for 1 V/75 Ω on outputs is shown in Fig.14.
Digital Colour Transient Improvement (DCTI)
Each digital-to-analog converter has its own supply and
ground pins suitable for decoupling. The reference
voltage, supplying the resistor chain of all three DACs, is
the supply voltage VDDA4. The current into pin 41 is
0.3 mA; a larger current improves the bandwidth but
increases the integral non-linearity.
The DCTI circuit improves the transition behaviour of the
UV colour-difference signals. As the CVBS signal allows
for a 4 : 1 : 1 bandwidth representation only, the DCTI
improves the transients to the same performance as
signals coming from a 4 : 2 : 2 source, or even more.
I2C-bus format
Table 4 I2C-bus format; see notes 1 to 7
S
slave address
A
subaddress
A
data 0
A
...
data n
A
P
Notes
1. S = START condition.
2. Slave address = 1011 111X.
3. A = acknowledge; generated by the slave.
4. Subaddress = subaddress byte (Table 5);
If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed.
5. Data = data byte (Table 5).
6. P = STOP condition.
7. X = R/W control bit:
a) X = 0; order to write (the circuit is slave receiver).
b) X = 1; order to read (the circuit is slave transmitter).
1996 Aug 20
9
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
Table 5 I2C-bus transmission
DATA BITS
SUBADDRESS
FUNCTION
D7
D6
D5
D4
D3
D2
D1
D0
01
02
03
peaking and coring
AFB
IFF
0
CO1
IFC
0
CO0
IFL
BP1
CMO
DC0
BP0
LI1
BFB
LI0
WG1
GA1
R78
WG0
GA0
INV
input formats; interpolation
input/output setting
DC1
DRP
BLV
Table 6 Bit functions in data bytes
BIT
DESCRIPTION
CO1 and CO0
AFB, BP1, BP0, BFB
BFB, WG1 and WG0
IFF, IFC and IFL
CMO
control of coring threshold; see Table 7
bandpass filter selection; see Table 8
peaking factor K; see Table 9
input format and filter control at 13.5 MHz data rate; see Table 10
choice modification; 0 = modification off; 1 = modification on.
DCTI timing range; see Table 11
LI1 and LI0
GA1 and GA0
DC1 and DC0
DRP
DCTI gain factor; see Table 12
delay compensation of luminance signal; see Table 13
UV input data code; 0 = two’s complement; 1 = offset binary
blanking level on Y output; 0 = 16 LSB; 1 = 0 LSB
YUV input data solution; 0 = 7-bit data; 1 = 8-bit data
polarity of colour-difference output signals:
0 = normal polarity equal to input signal
BLV
R78
INV
1 = inverted polarity
Table 7 Logic levels and function of CO1 and CO0
DATA BITS
FUNCTION
CO1
CO0
0
0
1
1
0
1
0
1
coring off
small noise reduction
medium noise reduction
high noise reduction
Table 8 Logic levels and function of AFB, BP1, BP0 and BFB
DATA BITS
FUNCTION
AFB
BP1
BP0
BFB
X
X
X
X
0
0
0
1
1
X
X
0
1
0
1
X
X
0
0
0
0
1
1
characteristic (see Fig.5)
characteristic (see Fig.6)
characteristic (see Fig.7)
characteristic (see Fig.8)
BF1 filter bypassed (see Fig.9a)
BF1 filter bypassed (see Fig.9b)
1
1996 Aug 20
10
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
Table 9 Logic levels and function of BFB, WG1 and WG0
DATA BITS
FUNCTION
BFB
WG1
WG0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
K = 1⁄8; minimum peaking
K = 1⁄4
K = 1⁄2
K = 1; maximum peaking
K = 0; peaking off
K = 1⁄4; minimum peaking
K = 1⁄2
K = 1; maximum peaking
Table 10 Logic levels and function of IFF, IFC and IFL
DATA BITS
FUNCTION
IFF
IFC
IFL
0
0
0
1
1
1
0
0
1
0
0
1
0
1
X
0
1
X
4 : 1 : 1 format; −3 dB attenuation at 1.6 MHz video frequency; (see Fig.10)
4 : 1 : 1 format; −3 dB attenuation at 600 kHz video frequency; (see Fig.11)
4 : 1 : 1 format; −3 dB attenuation at 1.2 MHz video frequency; (see Fig.12)
4 : 2 : 2 format; −3 dB attenuation at 1.6 MHz video frequency; (see Fig.10)
4 : 2 : 2 format; −3 dB attenuation at 600 kHz video frequency; (see Fig.11)
4 : 2 : 2 format; −3 dB attenuation at 2.5 MHz video frequency; (see Fig.13)
Table 11 Logic levels and function of LI1 and LI0
Table 13 Logic levels and function of DC1 and DC0
DATA BITS
RANGE
DATA BITS
DELAYED CLOCK
CYCLES
LI1
LI0
DC1
DC0
0
0
1
1
0
1
0
1
+4 to −4
+6 to −6
+8 to −8
+12 to −12
0
0
1
1
0
1
0
1
0
+1
−2
−1
Table 12 Logic levels and function of GA1 and GA0
DATA BITS
FACTOR
GA1
GA0
0
0
1
1
0
1
0
1
off
1
⁄
4
1
⁄
2
1
1996 Aug 20
11
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
SYMBOL
VDDD1
PARAMETER
digital supply voltage 1 (pin 12)
digital supply voltage 2 (pin 31)
analog supply voltage 1 (pin 32)
analog supply voltage 2 (pin 37)
analog supply voltage 3 (pin 40)
analog supply voltage 4 (pin 42)
digital supply voltage
MIN.
MAX.
UNIT
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.5
−
+7
+7
+7
+7
+7
+7
+7
V
VDDD2
VDDA1
VDDA2
VDDA3
VDDA4
VDDD
∆VGND
VI
V
V
V
V
V
V
difference voltage VSSD − VSSA
voltage on all input pins 4 to 11, 14 to 27 and 41
voltage on analog output pins 33, 36 and 39
electrostatic handling for all pins
total power dissipation
±100
VDDD
VDDD
−
mV
V
−0.3
−0.3
VO
V
VESD
Ptot
±2000
V
0
tbf
mW
°C
°C
Tstg
storage temperature
−55
0
+150
70
Tamb
operating ambient temperature
Note
1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
46
UNIT
thermal resistance from junction to ambient in free air
K/W
1996 Aug 20
12
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
CHARACTERISTICS
VDDD = 4.5 to 5.5 V; VDDA = 4.75 to 5.25 V; LLC = LL27; MC = CREF = 13.5 MHz; Tamb = 0 to 70 °C; measurements
taken in Fig.14; unless otherwise specified.
SYMBOL
Supplies
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDDD1
VDDD2
VDDA1
VDDA2
VDDA3
VDDA4
IDDD
supply voltage range (pin 12)
supply voltage range (pin 31)
supply voltage range (pin 32)
supply voltage range (pin 37)
supply voltage range (pin 40)
supply voltage range (pin 42)
for digital part
4.5
5
5.5
V
for digital part
4.5
5
5.5
V
for buffer of DAC 1
for buffer of DAC 2
for buffer of DAC 3
4.75
4.75
4.75
5
5.25
5.25
5.25
5.25
tbf
V
5
V
5
V
DAC reference voltage 4.75
5
V
supply current (IDDD1 + IDDD2
)
for digital part
−
−
tbf
tbf
mA
mA
IDDA
supply current (IDDA1 + IDDA4
)
for DACs and buffers
tbf
YUV-bus inputs (pins 4 to 11 and 14 to 21) (see Figs 3 and 4)
VIL
VIH
CI
LOW-level input voltage
HIGH-level input voltage
input capacitance
−0.5
2.0
−
−
−
−
−
+0.8
V
VDDD + 0.5
10
V
VI = HIGH
pF
µA
ILI
input leakage current
−
4.5
Inputs AP, SP, MC, LLC, HREF and RESET (pins 22 to 27)
VIL
VIH
CI
LOW-level input voltage
HIGH-level input voltage
input capacitance
−0.5
2.0
−
−
−
−
−
−
−
+0.8
V
VDDD + 0.5
V
VI = HIGH
10
pF
µA
V
ILI
input leakage current
MC input voltage for LL27
CREF signal on MC input
−
4.5
V24
27 MHz data rate
2.0
−
VDDD + 0.5
CREF data rate; note 1
−
V
I2C-bus SCL and SDA (pins 28 and 29)
VIL
VIH
II
LOW-level input voltage
HIGH-level input voltage
input current
−0.5
3.0
−
−
−
−
−
+1.5
V
VDDD + 0.5
±10
V
VI = LOW or HIGH
I29 = 3 mA
µA
V
VACK
output voltage at acknowledge
(pin 29)
−
0.4
I29
output current
during acknowledge
3
−
−
mA
V
Digital-to-analog converters (pins 1, 2, 41, 42, 43 and 44)
VDAC
input reference voltage for internal
resistor chains (pin 42)
4.75
5
5.25
ICUR
V1,44
CL
input current (pin 41)
R41-42 = 15 kΩ
−
−
−
300
0
−
−
−
µA
V
reference voltage LOW
pin connected to VSSA1
external blocking capacitor to
VSSA1 for reference voltage HIGH
(pins 2 and 43)
0.1
µF
fLLC
data conversation rate (clock)
Fig.3
−
−
36
MHz
1996 Aug 20
13
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
RESDAC
resolution
luminance DAC
chrominance DACs
8-bit data
−
−
−
−
9
8
−
−
−
bits
−
bits
ILE
DC integral linearity error
DC differential error
1.0
0.5
LSB
LSB
DLE
8-bit data
Y, (R − Y) and (B − Y) analog outputs (pins 33, 36 and 39)
Vo(p-p)
output signal voltage
(peak to peak value)
without load
−
2
−
V
V33,36,39
V39
output voltage range
output blanking level
output no-colour level
without load; note 2
Y output; note 3
0.2
−
−
2.2
−
V
16
128
LSB
LSB
V33,36
±(R − Y), ±(B − Y);
−
−
note 4
R33,36,39
internal serial output resistance
−
25
−
−
−
−
−
Ω
RL33,36,39 output load resistance
external load
125
20
−
Ω
B
td
output signal bandwidth
−3 dB
−
MHz
ns
signal delay from input to Y output
tbf
LCC timing (pin 25) (see Fig.3)
TLLC
tp H
tr
cycle time
pulse width
rise time
27.7
40
−
37
50
−
41
60
5
ns
%
ns
ns
tf
fall time
−
−
6
YUV-bus timing (pins 4 to 11 and 14 to 21) (see Fig.5)
tSU;DAT
tHD;DAT
input data set-up time
input data hold time
10
3
−
−
−
−
ns
ns
MC timing (pin 24) (see Fig.5)
tSU;DAT
tHD;DAT
input data set-up time
input data hold time
10
3
−
−
−
−
ns
ns
RESET timing (pin 27)
tSU
set-up time after power-on or
failure
active LOW; note 5
4 × tLLC
−
−
ns
Notes
1. YUV-bus data is read at MC = HIGH (pin 24) clocked with LLC (see Fig.5); data is read only with every second rising
edge of LLC when CREF = 1⁄2LLC on pin 24.
2. 0.2 to 2.2 V output voltage range at 8-bit DAC input data; the data word can increase to 9-bit dependent on peaking
factor.
3. The luminance signal is set to the digital black level: 16 LSB for BLV-bit = 0; 0 LSB for BLV-bit = 1.
4. The chrominance amplitudes are set to the digital colourless level of 128 LSB.
5. The circuit is prepared for a new data initialization.
1996 Aug 20
14
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
t
t
r
f
2.4 V
input clock
LLC (LL27)
1.5 V
0.6 V
T
LLCH
t
T
LLC
t
HD;DAT(min)
SU;DAT(min)
HD;DAT
t
2.0 V
0.8 V
input data
YUV-bus,
CREF (MC)
MEH270
data valid
Fig.4 YUV-bus data and CREF timing.
Table 14 YUV-bus data processing delay
PROCESSING DELAY
LLC CYCLES
REMARKS
YUV digital input
66
at MC = 1
YUV analog output
132
at MC = 1⁄2LLC
1996 Aug 20
15
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
MEH271
16
Y
V
(dB)
14
(1)
12
10
(2)
8
6
(3)
4
(4)
2
0
2
0
1
3
4
5
6
7
f
(MHz)
Y
(1) K = 1
(3) K = 1
(4) K = 1
⁄
⁄
4
(2) K = 1
⁄
2
8
Fig.5 Peaking frequency response with I2C-bus control bits BP1 = 0; BP0 = 0 and BFB = 0.
MEH272
16
Y
V
(dB)
14
(1)
(2)
12
10
8
(3)
(4)
6
4
2
0
0
2
1
3
4
5
6
7
f
(MHz)
Y
(1) K = 1
(3) K = 1
(4) K = 1
⁄
⁄
4
(2) K = 1
⁄
2
8
Fig.6 Peaking frequency response with I2C-bus control bits BP1 = 0; BP0 = 1 and BFB = 0.
1996 Aug 20
16
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
MEH273
16
Y
V
(dB)
14
(1)
12
10
(2)
8
(3)
6
(4)
4
2
0
2
0
1
3
4
5
6
7
f
(MHz)
Y
(1) K = 1
(3) K = 1
(4) K = 1
⁄
⁄
4
(2) K = 1
⁄
2
8
Fig.7 Peaking frequency response with I2C-bus control bits BP1 = 1; BP0 = 0 and BFB = 0.
MEH274
16
Y
V
(dB)
14
(1)
(2)
12
10
8
6
4
2
(3)
(4)
0
0
2
1
3
4
5
6
7
f
(MHz)
Y
(1) K = 1
(3) K = 1
(4) K = 1
⁄
⁄
4
(2) K = 1
⁄
2
8
Fig.8 Peaking frequency response with I2C-bus control bits BP1 = 1; BP0 = 1 and BFB = 0.
1996 Aug 20
17
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
MEH470
10
V
Y
(dB)
8
6
4
(1)
(2)
2
(3)
(4)
0
−2
−4
2
0
1
3
4
5
6
7
f
(MHz)
Y
a. AFB = 0.
MEH471
10
V
Y
(dB)
8
(1)
(2)
6
4
2
0
(3)
(4)
−2
−4
2
0
1
3
4
5
6
7
f
(MHz)
Y
b. AFB = 1.
(1) K = 1
(3) K = 1
⁄
4
(2) K = 1
⁄
2
(4) K = 0
Fig.9 Peaking frequency response with I2C-bus control bits BP1 = 0; BP0 = 0 and BFB = 1; bandpass filter BF1
bypassed and peaking off.
1996 Aug 20
18
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
MEH474
0
V
U
(dB)
−4
−8
−12
−16
−20
−24
−28
−32
2
0
1
3
4
5
6
7
f
(MHz)
Y
Fig.10 Interpolation filter at DCTI off with I2C-bus control bits IFF = 0; IFC = 0 and IFL = 0 in 4 : 1 : 1 format and
control bits IFF = 1; IFC = 0 and IFL = 0 in 4 : 2 : 2 format; 13.5 MHz data rate.
MEH473
0
V
U
(dB)
−4
−8
−12
−16
−20
−24
−28
−32
2
0
1
3
4
5
6
7
f
(MHz)
Y
Fig.11 Interpolation filter at DCTI off with I2C-bus control bits IFF = 0; IFC = 0 and IFL = 1 in 4 : 1 : 1 format and
control bits IFF = 1; IFC = 0 and IFL = 1 in 4 : 2 : 2 format; 13.5 MHz data rate.
1996 Aug 20
19
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
MEH472
0
V
U
(dB)
−4
−8
−12
−16
−20
−24
−28
−32
2
0
1
3
4
5
6
7
f
(MHz)
Y
Fig.12 Interpolation filter at DCTI off with I2C-bus control bits IFF = 0; IFC = 1 and IFL = 0 in 4 : 1 : 1 format;
13.5 MHz data rate.
MEH475
0
V
U
(dB)
−3 dB
−8
−16
−24
−32
−40
−48
−56
−64
2
0
1
3
4
5
6
7
f
(MHz)
Y
Fig.13 Interpolation filter with I2C-bus control bits IFF = 1; IFC = 1 and IFL = X in 4 : 2 : 2 format;
13.5 MHz data rate.
1996 Aug 20
20
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0.1 µF
+5 V
15 kΩ
+5 V
+5 V
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
V
V
V
V
V
V
DDD1
DDD2
DDA1
DDA2
DDA3 CUR
DDA4
12
31
32
37
40
41
42
0.1 µF
C
2
39
1
Y
Y7 to Y0
21 to 14
1 V (p−p)
PEAKING
AND
CORING
Y
25 Ω
Y
8
8
DAC 3
Y
FORMATTER
REFL
(1)
Y
50 Ω
(1)
75 Ω
YUV-bus
DATA
SWITCH
data clock
UV7 to
UV0
25 Ω
U
V
1 V (p−p)
11 to 4
36
44
±(B − Y)
UV
INTERPOLATION
FILTER
(1)
DAC 2
DAC 1
DCTI
REFL
50 Ω
UV
FORMATTER
(1)
75 Ω
0.1 µF
MC 24
C
43
33
UV
CREF
LLC 25
26
TIMING
CONTROL
LL27
25 Ω
1 V (p−p)
±(R − Y)
HREF
(1)
50 Ω
27
(1)
RESET
SCL
75 Ω
28
SAA7165
2
I C-BUS
TEST
CONTROL
2
I C-bus
SDA 29
CONTROL
13
30
22
23
SP
3
34
35
V
38
V
MBH537
V
V
AP
SUB
V
SSD1
SSD2
SSA1
SSA2
SSA3
ahdnbok,uflapegwidt
(1) output amplitude determined by resistors (RL > 125 Ω).
Fig.14 Application diagram.
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
PACKAGE OUTLINE
PLCC44: plastic leaded chip carrier; 44 leads
SOT187-2
e
e
E
D
y
X
A
39
29
b
p
Z
E
28
40
b
1
w
M
44
1
H
E
E
pin 1 index
A
A
1
A
4
e
(A )
3
6
18
k
1
β
L
p
k
detail X
7
17
v
M
A
e
Z
D
D
B
H
v
M
B
D
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
(1)
(1)
A
min.
A
max.
k
1
max.
Z
Z
E
(1)
(1)
1
4
D
UNIT
mm
A
A
b
D
E
e
e
e
H
H
k
L
p
v
w
y
β
b
D
E
D
E
3
p
1
max. max.
4.57
4.19
0.81 16.66 16.66
0.66 16.51 16.51
16.00 16.00 17.65 17.65 1.22
14.99 14.99 17.40 17.40 1.07
1.44
1.02
0.53
0.33
0.51
0.51 0.25 3.05
0.020 0.01 0.12
1.27
0.05
0.18 0.18 0.10 2.16 2.16
o
45
0.180
0.165
0.032 0.656 0.656
0.026 0.650 0.650
0.630 0.630 0.695 0.695 0.048
0.590 0.590 0.685 0.685 0.042
0.057
0.040
0.021
0.013
inches
0.020
0.007 0.007 0.004 0.085 0.085
Note
1. Plastic or metal protrusions of 0.01 inches maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-25
97-12-16
SOT187-2
112E10
MO-047AC
1996 Aug 20
22
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
SOLDERING
Introduction
Wave soldering
Wave soldering techniques can be used for all PLCC
packages if the following conditions are observed:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream corners.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all PLCC
packages.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
The choice of heating method may be influenced by larger
PLCC packages (44 leads, or more). If infrared or vapour
phase heating is used and the large packages are not
absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our “Quality
Reference Handbook” (order code 9397 750 00192).
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
1996 Aug 20
23
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1996 Aug 20
24
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
NOTES
1996 Aug 20
25
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
NOTES
1996 Aug 20
26
Philips Semiconductors
Product specification
Video Enhancement and Digital-to-Analog
processor (VEDA2)
SAA7165
NOTES
1996 Aug 20
27
Philips Semiconductors – a worldwide company
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Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
657021/1200/02/pp28
Date of release: 1996 Aug 20
Document order number: 9397 750 01047
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