SAA7710T [NXP]

Dolby* Pro Logic Surround; Incredible Sound; *杜比定向逻辑环绕声;令人难以置信的声音
SAA7710T
型号: SAA7710T
厂家: NXP    NXP
描述:

Dolby* Pro Logic Surround; Incredible Sound
*杜比定向逻辑环绕声;令人难以置信的声音

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INTEGRATED CIRCUITS  
DATA SHEET  
SAA7710T  
Dolby* Pro Logic Surround;  
Incredible Sound  
1998 Mar 13  
Product specification  
Supersedes data of 1997 Oct 03  
File under Integrated Circuits, IC01  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
FEATURES  
Two stereo I2S-bus digital input channels  
Three stereo I2S-bus digital output channels  
I2C-bus mode control  
Up to 45 ms on-chip delay-line (fs = 44.1 kHz)  
Optional clock divider for crystal oscillator  
Package: SO32L  
Hall/matrix surround sound functions  
Incredible sound functions  
Operating supply voltage range: 4.5 to 5.5 V.  
5-band parametric equalizer on main channels left,  
centre, right (fs = 32 kHz)  
Functions  
Tone control (bass/treble) on all four output channels  
(fs = 44.1 kHz).  
4-channel active surround, 20 Hz to 20 kHz  
(maximum 12fs)  
Adaptive matrix  
GENERAL DESCRIPTION  
7 kHz low-pass filters  
This data sheet describes the 104 ROM-code version of  
the SAA7710T chip. The SAA7710T chip is a high quality  
audio-performance digital add-on processor for digital  
sound systems. It provides all the necessary features for  
complete Dolby Pro Logic surround sound on chip.  
In addition to the Dolby Pro Logic surround function, this  
device also incorporates a 5-band parametric equalizer, a  
tone control section and a volume control. Instead of Dolby  
Pro Logic surround, the Hall/matrix surround and  
Incredible sound functions can be used together with the  
equalizer or tone control.  
Adjustable delay for surround channel  
Modified Dolby B noise reduction  
Noise sequencer  
Variable output matrix  
Sub woofer  
Centre mode control: on/off, normal, phantom, wide  
Output volume control  
Automatic balance and master level control with  
DC-offset filter  
QUICK REFERENCE DATA  
SYMBOL  
VDD  
PARAMETER  
MIN.  
0.5  
MAX.  
+6.5  
550  
VDD + 0.5 V  
UNIT  
DC supply voltage  
V
VDD  
Vi  
voltage difference between two VDDx pins  
maximum input voltage  
DC supply current  
mV  
0.5  
IDD  
50  
mA  
ISS  
DC supply current  
50  
mA  
°C  
Tamb  
Tstg  
ambient operating temperature  
storage temperature range  
40  
65  
+85  
+150  
°C  
Remark Dolby*: Dolby’ and ‘Pro Logic’ are trademarks of Dolby Laboratories Licensing Corporation. They are available  
only to licensees of Dolby Laboratories Licensing Corporation, San Francisco, CA94111, USA, from whom licensing and  
application information must be obtained.  
ORDERING INFORMATION  
PACKAGE  
TYPE NUMBER  
NAME  
DESCRIPTION  
VERSION  
SAA7710T/N104  
1998 Mar 13  
SO32  
plastic small outline package; 32 leads; body width 7.5 mm  
SOT287-1  
2
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22  
23  
2
1
2
2
I S_BCKIN1  
I S_BCKOUT  
2
I S_WSOUT  
2
2
I S input 1  
I S_WSIN1  
SAA7710T  
S
24  
2
I S_DATAIN1  
SURROUND  
CHANNEL  
DELAY LINE  
2
I S outputs  
28  
29  
30  
2
2
2
I S_DATAOUT1  
I S  
I S OUT 1  
L
C
INPUT  
SWITCH  
CIRCUIT  
5-BAND  
PARAMETRIC  
EQUALIZER  
OR  
TONE  
CONTROL  
DOLBY PRO LOGIC  
OR  
DOLBY 3 STEREO  
OR  
HALL/MATRIX  
OR  
INCREDIBLE  
SOUND  
25  
27  
26  
2
I S_DATAIN2  
VARIABLE  
OUTPUT  
MATRIX  
data 1  
2
2
I S_DATAOUT2  
I S OUT 2  
R
2
2
I S input 2  
I S_BCKIN2  
SW  
2
I S_WSIN2  
2
2
I S_DATAOUT3  
I S OUT 3  
17  
DSP_RESET  
5
12  
32  
V
DD1  
13  
3
AUTO BALANCE  
FUNCTION  
V
TSCAN  
RTCB  
DD2  
+
TEST  
+
V
DD3  
19  
18  
V
DD_XTAL  
2
I C BUS  
FLAG TEST  
CONTROL  
OSCILLATOR  
TRANSCEIVER  
V
SS_XTAL  
6
V
SS1  
11  
31  
V
SS2  
V
SS3  
7
8
9
10  
15  
16  
14  
21  
20  
4
MGE751  
DSP_IN1  
DSP_IN2  
SDA  
DSP_OUT1  
SCL  
A0  
OSC  
XTAL  
SHTCB  
DSP_OUT2  
Fig.1 Block diagram.  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
I2S_WSOUT  
1
I2S-bus slave word-select  
output  
I2S_BCKOUT  
RTCB  
2
3
I2S-bus slave bit-clock output  
asynchronous reset test control  
block input (active LOW)  
SHTCB  
4
clock divider switch enable  
input (LOW = divide)  
handbook, halfpage  
VDD1  
5
6
7
8
9
positive power supply  
ground power supply  
flag input 1  
2
I S_WSOUT  
V
V
1
2
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
DD3  
SS3  
VSS1  
2
I S_BCKOUT  
DSP_IN1  
DSP_IN2  
DSP_OUT1  
DSP_OUT2  
VSS2  
2
RTCB  
I S_DATAOUT3  
3
flag input 2  
2
SHTCB  
I S_DATAOUT2  
4
flag output 1  
2
V
I S_DATAOUT1  
5
10 flag output 2  
DD1  
2
11 ground power supply  
12 positive power supply  
13 scan control input  
14 I2C-bus slave address  
selection input  
15 I2C-bus serial data input/output  
16 I2C-bus serial clock input  
V
I S_BCKIN2  
6
SS1  
VDD2  
2
DSP_IN1  
DSP_IN2  
I S_WSIN2  
7
TSCAN  
A0  
2
I S_DATAIN2  
8
SAA7710T  
2
DSP_OUT1  
DSP_OUT2  
I S_DATAIN1  
9
2
I S_WSIN1  
10  
11  
12  
13  
14  
15  
16  
SDA  
2
SCL  
V
I S_BCKIN1  
SS2  
DSP_RESET  
VSS_XTAL  
17 chip reset input (active LOW)  
V
OSC  
DD2  
18 ground power supply crystal  
oscillator  
TSCAN  
A0  
XTAL  
V
DD_XTAL  
VDD_XTAL  
19 positive power supply crystal  
oscillator  
V
SDA  
SCL  
SS_XTAL  
XTAL  
20 crystal oscillator output  
21 crystal oscillator input  
DSP_RESET  
OSC  
MGE750  
I2S_BCKIN1  
I2S_WSIN1  
22 I2S-bus master bit-clock input 1  
23 I2S-bus master word-select  
input 1  
I2S_DATAIN1  
I2S_DATAIN2  
I2S_WSIN2  
24 I2S-bus master data input 1  
25 I2S-bus master data input 2  
26 I2S-bus master word-select  
input 2  
I2S_BCKIN2  
I2S_DATAOUT1  
I2S_DATAOUT2  
I2S_DATAOUT3  
VSS3  
27 I2S-bus master bit-clock input 2  
28 I2S-bus slave data output 1  
29 I2S-bus slave data output 2  
30 I2S-bus slave data output 3  
31 ground power supply  
Fig.2 Pin configuration.  
VDD3  
32 positive power supply  
1998 Mar 13  
4
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
Equalizer (3- or 5-band on L, C and R) or tone control  
(L, C, R and S); fixed output matrix(1); volume control  
FUNCTIONAL DESCRIPTION  
Figure 1 shows the block diagram of the SAA7710T.  
The SAA7710T consists of a Dolby Pro Logic decoder  
together with equalizer or tone control. The Dolby Pro  
Logic part of the IC may be used to decode audio  
soundtracks (Dolby surround movies or Dolby surround  
video productions) from for example, a video recorder  
(VCR) or a CD laser disc into four channels Left, Centre,  
Right and Surround (L, C, R and S).  
If desired, post-processing with either an equalizer or a  
tone control section is possible. In addition to this, a Sub  
Woofer (SW) channel, digital volume control and a  
user-programmable variable output matrix are  
implemented.  
Equalizer (5-band on L, C and R); variable output  
matrix(1); volume control  
Extra sub woofer(1).  
THE DOLBY 3 STEREO MODE  
In Dolby 3 stereo mode, several blocks must be initialized  
and controlled during operation:  
Noise generator and noise sequencer  
Centre channel mode(1) (normal, phantom, wide and off)  
Combining network coefficients  
Incredible Sound widening of the stereo base on two  
Hall/matrix surround sound functions are implemented for  
material not encoded using Dolby Surround. These  
features can be used as an alternative to Dolby Pro Logic  
and can also be combined with the equalizer or tone  
control sections.  
speakers  
Effect is user adjustable.  
THE HALL/MATRIX SURROUND MODE  
In hall/matrix surround mode, the blocks listed below must  
be initialized and controlled during operation:  
Incredible sound is a Philips patented technology which  
substantially improves the stereo effect of a television or  
audio system. Using advanced signal processing,  
speakers that are positioned close together can imitate the  
sound produced by speakers that are far apart.  
Input balance control  
Hall or matrix surround Mode setting  
All-pass and filter transfer characteristics(1)  
7 kHz low-pass filter in surround channel(1)  
Surround channel delay(1).  
Functional modes  
The device thus supports three main modes, Dolby Pro  
Logic/Dolby 3 stereo or hall/matrix surround or Incredible  
sound mode. All modes can be combined with equalizing  
(3-band or 5-band) or tone control depending on fs and  
available cycle budget.  
Possible post-processing modes for hall/matrix surround  
are as above:  
Volume control only  
Equalizer (5-band on L, C and R) or tone control  
(L, C, R and S); fixed output matrix(1); volume control  
Equalizer (5-band on L,C,R); variable output matrix(1);  
volume control  
THE DOLBY PRO LOGIC MODE  
In Dolby Pro Logic mode, several blocks must be initialized  
and controlled during operation:  
Extra sub woofer(1).  
Noise generator and noise sequencer  
Centre channel mode(1) (normal, phantom, wide, off)  
Combining network coefficients  
7 kHz low-pass filter in surround channel(1)  
Surround channel delay time(1)  
THE INCREDIBLE SOUND MODE  
In the Incredible sound mode the blocks listed below must  
be initialized and controlled during operation:  
Incredible sound coefficients  
Modified Dolby B noise reduction must be on.  
Combining network coefficients.  
Possible post-processing modes for Dolby Pro Logic are:  
Possible post-processing modes for incredible sound are  
as follows:  
Volume control only  
Volume control only  
Equalizer (5-band on L and R) or tone control (L and R);  
(1) The coefficient set used to initialize and control the operation  
of the Dolby Pro Logic mode depends upon the selected  
sampling frequency fs = 32, 44.1 or 48 kHz.  
variable output matrix(1), volume control  
Extra sub-woofer(1).  
1998 Mar 13  
5
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
The slave oscillator mode: in this mode (see Fig.4),  
the oscillator circuit acts as a slave driven by a master  
system clock. The clock divider can be switched on or off  
using pin SHTCB. When the divider is not used, the duty  
cycle of the clock will depend on the master system  
clock duty cycle and the rising and falling edge times.  
This places a tolerance of 5% on the 50% duty cycle of  
the master system clock (see Chapter “AC  
ADDITIONAL INFORMATION  
The possible modes of operation are discussed in more  
detail in the “SAA7710T Dolby Pro Logic Programming  
Guide, Application Note AN95063”. This also includes  
which features are available for a given system clock  
frequency and sample frequency and the possible input  
configurations.  
characteristics”).  
Clock circuit and oscillator  
In order to be able to control the phase of the clock signal  
during testing the divider is skipped and the signal is  
directly fed to the circuit via the multiplexer in the TEST  
position.  
The chip has an on board crystal clock oscillator. The block  
schematic of this Pierce oscillator is shown in  
Figs 3 and 4. The active element needed to compensate  
for the loss resistance of the crystal is the amplifier Gm.  
This amplifier is placed between the XTAL (output) pin and  
the OSC (sense) pin. The gain of the oscillator is internally  
controlled by the automatic gain control. This prevents too  
much power loss in the crystal. The higher harmonics are  
then as low as possible. The signals on the OSC and XTAL  
pin are differentially amplified.  
SUPPLY OF THE CRYSTAL OSCILLATOR  
The power supply connections to the oscillator are  
separated from the other supply lines to minimise  
feedback from on-chip ground bounce to the oscillator  
circuit. Noise on the power supply affects the AGC  
operation so the power supply should be decoupled.  
The VSS_XTAL pin is used as ground supply and the  
VDD_XTAL as positive supply.  
The oscillator has these two modes of operation:  
The crystal oscillator mode: in this mode (see Fig.3),  
a quartz crystal oscillator is used to generate a clock  
signal which is subsequently divided by 2 to ensure that  
the final clock signal has a 50% duty cycle.  
The oscillator circuit components Rbias and C1, C2  
depend on the crystal. In the case of an overtone  
oscillator, the ground harmonic is filtered out by L1 and  
C3. Pin SHTCB is held low so that the divided signal is  
selected. Only a quartz crystal should be used in this  
mode.  
1998 Mar 13  
6
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
CLOCK  
BUFFER  
0
1
DIVIDE  
BY 2  
Gm  
AGC  
TEST  
4
ON CHIP  
21  
20  
19  
V
18  
MGE752  
OSC  
XTAL  
V
SHTCB  
= 0  
DD_XTAL  
SS_XTAL  
OFF CHIP  
100 kΩ  
L1  
4.7 µH  
R
bias  
C3  
1 nF  
C1  
10 pF  
C2  
10 pF  
Fig.3 Block diagram crystal oscillator circuit.  
CLOCK  
BUFFER  
0
1
DIVIDE  
BY 2  
Gm  
AGC  
TEST  
4
ON CHIP  
21  
20  
19  
V
18  
MGE753  
OSC  
XTAL  
V
SHTCB  
= 1  
DD_XTAL  
SS_XTAL  
OFF CHIP  
100 kΩ  
40 pF  
10 pF  
10 nF  
slave  
input  
Fig.4 Block diagram slave oscillator circuit.  
7
1998 Mar 13  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
I2S-bus Interfaces and system clock  
I2S-BUS BASICS  
T
cy  
t
0.35 T  
HC  
t
0.35 T  
0.2 T  
LC  
V
(70%)  
(20%)  
IH  
SCK  
V
IL  
t
t
0  
hr  
sr  
V
(70%)  
(20%)  
IH  
SD WS  
V
IL  
SCK  
WS  
MSB  
LEFT  
MSB  
RIGHT  
SD  
MBH173  
Fig.5 I2S-bus timing and format.  
I2S-BUS INPUT CIRCUIT  
For communication with external digital sources and or  
additional external processors the I2S-bus digital interface  
bus is used. It is a serial 3-line bus, with one line for data,  
one line for clock and one line for the word select.  
The I2S-bus input circuits can be configured in the  
following way using the SEL-IN1/IN2 bit (see Table 4):  
1. I2S input 1 is master  
(SEL-IN1/IN2 bit = logic 0(default))  
2. I2S input 2 is master (SEL-IN1/IN2 bit = logic 1).  
Figure 5 shows an excerpt of the Philips I2S-bus  
specification interface report regarding the general timing  
and format of I2S-bus. Word Select (WS) logic 0 means left  
channel word, logic 1 means right channel word.  
The incoming bit-clock frequency defines the accuracy in  
terms of number of bits of the incoming data samples.  
The input circuit is designed to accept any number of bits  
per channel up to a maximum of 18 bits. The accepted  
data format is MSB-first.  
The serial data is transmitted in two’s complement with the  
MSB first. One clock period after the negative edge of the  
word select line the MSB of the left channel is transmitted.  
Data is synchronised with the negative edge of the clock  
and latched at the positive edge.  
1998 Mar 13  
8
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
Table 1 Data Accuracy in I2S-bus Interface  
INCOMING DATA WIDTH  
I2S-BUS IN DATA WIDTH  
I2S-BUS OUT DATA WIDTH  
A < 18  
A
A
B 18  
18  
18  
interface: I2S_WSOUT, I2S_BCKOUT. These two output  
signals can be 3-stated by setting the DIS_BCKWS bit  
(see Table 4). The 3-state output of the I2S_DATAOUT3  
signal can be enabled by setting the ENA_I2S3 bit (see  
Table 4).  
THE I2S-BUS OUTPUT INTERFACE  
The I2S-bus data output interfaces (see Fig.1) I2S OUT 1,  
I2S OUT 2 and I2S OUT 3 use the same I2S-bus data  
signals which are selected by the input switch circuit. The  
I2S-bus WS and BCK output signals remain in phase with  
the external input signals at all times. The output data is  
1/fs cycle delayed relative to the input data. The selected  
word-select and bit-clock are included as part of the output  
The timing diagram of the I2S-bus outputs is shown in  
Fig.6. The timing details can be found in Chapter “AC  
characteristics”.  
t
CL  
LC  
2
I S_BCKIN1, 2  
2
t
I S_BCKOUT  
HC  
t
t
t
d1  
f
r
t
r
t
f
2
I S_WSIN1, 2  
WS  
2
I S_WSOUT  
t
d2  
t
s2  
2
DATA (in)  
I S_DATAIN1, 2  
MSB  
DATA VALID  
t
d3  
t
t
t
r
f
acc  
2
DATA (out)  
I S_DATAOUT1, 2, 3  
MSB  
MGE755  
Fig.6 Timing diagram of I2S-bus output interface.  
1998 Mar 13  
9
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
I2C-bus control and commands  
DATA TRANSFER  
CHARACTERISTICS OF THE I2C-BUS  
A device generating a message is a ‘transmitter’, a device  
receiving a message is the ‘receiver’. The device that  
controls the message is the ‘master’ and the devices which  
are controlled by the master are the ‘slaves’ (see Fig.9).  
The I2C-bus is for 2-way, 2-line communication between  
different ICs or modules. The two lines are a serial data  
line (SDA) and a serial clock line (SCL). Both lines must be  
connected to the VDDX via a pull-up resistor when  
connected to the output stages of a microprocessor.  
Data transfer can only be initiated when the bus is not  
busy.  
ACKNOWLEDGE  
The number of data bytes transferred between the START  
and STOP conditions from transmitter to receiver is not  
limited. Each byte of eight bits is followed by one  
acknowledge bit. The acknowledge bit is a HIGH level put  
on the bus by the transmitter whereas the master  
generates an extra acknowledge related clock pulse.  
A slave receiver which is addressed must generate an  
acknowledge after the reception of each byte. Also a  
master must generate an acknowledge after the reception  
of each byte that has been clocked out of the slave  
transmitter. The device that acknowledges has to pull  
down the SDA line during the acknowledge clock pulse, so  
that the SDA line is stable LOW during the HIGH period of  
the acknowledge related clock pulse, set up and hold times  
must be taken into account. A master receiver must signal  
an end of data to the transmitter by not generating an  
acknowledge on the last byte that has been clocked out of  
the slave. In this event the transmitter must leave the data  
line HIGH to enable the master to generate a STOP  
condition (see Fig.10).  
BIT TRANSFER  
One data bit is transferred during each clock pulse.  
The data on the SDA line must remain stable during the  
HIGH period of the clock pulse as changes in the data line  
at this time will be interpreted as control signals.  
The maximum clock frequency is 100 kHz (see Fig.7).  
START AND STOP CONDITIONS  
Both data and clock lines remain HIGH when the bus is not  
busy. A HIGH-to-LOW transition of the data line, while the  
clock is HIGH is defined as the START condition (S).  
A LOW-to-HIGH transition of the data line while the clock  
is HIGH is defined as the STOP condition (P) (see Fig.8).  
SDA  
SCL  
MLC160  
data line  
stable  
change  
of data  
data valid  
allowed  
Fig.7 Bit transfer on the I2C-bus.  
10  
1998 Mar 13  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
a
SDA  
SCL  
S
P
START condition  
STOP condition  
MLC161  
Fig.8 START and STOP conditions.  
SDA  
MSB  
acknowledgement  
signal from receiver  
acknowledgement  
signal from receiver  
byte complete  
interrupt within receiver  
clock line held LOW while  
interrupts are serviced  
SCL  
1
2
7
8
9
1
2
3 to 8  
9
ACK  
S
START condition  
P
STOP condition  
MLC162  
Fig.9 Data transfer on the I2C-bus.  
11  
1998 Mar 13  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
data output  
from transmitter  
not acknowledge  
data output  
from receiver  
acknowledge  
SCL from  
master  
1
2
7
8
9
MLC163  
S
clock pulse for  
START condition  
acknowledgement  
Fig.10 Acknowledge on the I2C-bus.  
Write cycles  
I2C-BUS FORMAT  
Addressing  
The I2C-bus configuration for a write cycle is shown in  
Fig 12. The write cycle is used to write in the input selector  
control register and to initialise or update coefficient  
values.  
Before any data is transmitted on the I2C-bus, the device  
which should respond is addressed first. The addressing is  
always done with the first byte transmitted after the START  
procedure.  
The data length is 2 bytes or 3 bytes depending of the  
accessed memory. If the Y-memory is addressed the data  
length is 2 bytes, in case of the X-memory the length is  
3 bytes. The slave receiver detects the address and  
adjusts the bytes accordingly.  
Slave address (pin A0)  
The chip acts as a slave receiver or a slave transmitter.  
Therefore the clock signal SCL is only an input signal.  
The data signal SDA is a bidirectional line. The chip slave  
address is shown in Table 2.  
Read cycles  
The I2C-bus configuration for a Read cycle is shown in  
Fig 13. The read cycle is used to read data values from  
XRAM or YRAM.  
The sub address bit A0 corresponds to the hardware  
address pin A0 which allows the device to have 1 of 2  
different addresses.  
1998 Mar 13  
12  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
During the write cycle, the I2C-bus clock frequency must  
be reduced.  
I2C-BUS FUNCTION BITS  
Input selector control register  
The I2C-bus clock frequency has the following constraints:  
The write only, two byte, input selector control register is  
located on absolute address 0FFFH (4095) and consists  
of 16 bits, starting with bit 0 and ending with bit 15.  
fs > 2 × fIIC  
fs = I2S-bus sampling frequency  
fIIC = I2C-bus clock frequency.  
Deviation from the I2C-bus specification  
If this constraint cannot be met, a higher I2C-bus frequency  
can be obtained in the following way:  
By making the I2C-bus master insert a delay (td) after the  
acknowledge pulse (see Fig.11). The delay should be  
larger than or equal to 1/fs where fs is the I2S-bus  
sampling frequency.  
1. The data hold time (tHD;DAT) for this device (0 ns as  
stated in the I2C-bus specification) should be as  
follows:  
a) For the crystal oscillator mode (SHTCB = 0):  
6
---------  
fxtal  
By not using the auto-increment feature. This means  
that each data word must be preceded by its intended  
destination address.  
b) For the slave oscillator mode (SHTCB = 0):  
6
-------------  
fslave  
c) For the slave oscillator mode (SHTCB = 1):  
3
-------------  
fslave  
SCL  
SDA  
ACKNOWLEDGE AFTER WORD  
auto-increment address register  
MGE756  
t
d
Fig.11 Timing of reduced I2C-bus frequency.  
1998 Mar 13  
13  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
Table 2 Slave address  
MSB  
LSB  
0
0
1
1
1
1
A0  
R/W  
Table 3 Location of input selector control register bits in I2C-bus serial transmission; note 1  
MSB  
LSB  
DATAH  
DATAL  
15  
14  
13  
12  
11  
10  
9
8
A
7
6
5
4
3
2
1
0
A
P
Note  
1. Explanation for the contents of the register bits:  
a) A = standard I2C-bus acknowledge.  
b) Number = bit number according to Table 4.  
c) P = standard I2C-bus STOP condition.  
Table 4 Input selector control bits  
SYMBOL  
SEL-IN1/IN2  
DIS_BCKWS  
ENA-I2S3  
FUNCTION  
NUMBER OF BITS  
ON RESET  
IN1(0)  
BIT NO  
I2S input 1 or I2S input 2 input  
disable I2S_BCKOUT and I2S_WSOUT  
enable I2S_DATAOUT3  
1
1
1
1
5
7
enable(0)  
disable(0)  
resets(0)  
13  
15  
IMODE  
I flag resets/background tasking  
XRAM format  
The XRAM block consists of 256 18-bit RAM locations 0 to 255 and is located on the absolute address range of 0000H  
to 00FFH. The I2C-bus transfer consists of 18 useful bits out of 24 bits.  
Table 5 Format XRAM bits; note 1  
MSB  
LSB  
DATAH  
DATAM  
DATAL  
D
D
D
D
D
D
17 16  
A
15 14 13 12 11 10  
9
8
A
7
6
5
4
3
2
1
0
A
P
Note  
1. Explanation for the contents of the register bits:  
a) D = contents of I2C-bus data register bit is don’t care.  
b) A = standard I2C-bus acknowledge.  
c) Number = bit number being useful bit XRAM memory.  
d) P = standard I2C-bus STOP condition.  
1998 Mar 13  
14  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
YRAM format  
The YRAM block consists of 256 12-bit RAM locations 0 to 255 and is located on the absolute address range of  
0800H to 08FFH. The I2C-bus transfer consists of 12 useful bits out of 16 bits.  
Table 6 Format YRAM bits; note 1  
MSB  
LSB  
DATAH  
11  
DATAM  
D
D
D
D
10  
9
8
A
7
6
5
4
3
2
1
0
A
P
Note  
1. Explanation for the contents of the register bits:  
a) D = contents of I2C-bus data register bit is don’t care.  
b) A = standard I2C-bus acknowledge.  
c) Number = bit number being useful bit XRAM memory.  
d) P = standard I2C-bus STOP condition.  
Error processing  
If a read action is done without first initialising the memory address the acknowledge after the read command will not be  
generated by the chip. This should be treated as an error message:  
Table 7  
S Write ACK ADDRH ACK ADDRL ACK S Read  
S Read NEG ACK  
Correct read sequence  
Incorrect read sequence; address is not initialized  
1998 Mar 13  
15  
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A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
0
0
1
1
1
1 A  
0
ADDR H  
ADDR L  
DATA H  
DATA M  
P
DATA L  
S
0
auto increment if repeated n-groups of 3 (2) bytes  
address  
MBH529  
R/W  
Fig.12 Master transmitter writes to chip.  
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
0
0
1
1
1
1 A  
0
ADDR H  
ADDR L  
0
S
0
1
1
1
1 A  
1
0
DATA H  
P
DATA M  
DATA L  
S
0
auto increment if repeated n-groups of 3 (2) bytes  
address  
MBH528  
R/W  
R/W  
Fig.13 Master transmitter reads from chip.  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
When the level on the DSP_RESET pin is HIGH, the DSP  
program starts to run.  
DSP_RESET  
The DSP_RESET pin is active LOW and has an internal  
pull-up resistor. To enable a proper switch-on of the supply  
voltage a capacitor should be connected between this pin  
and VSS. The capacitor value is such that the chip is in a  
reset state as long as the power supply is not stabilized.  
When the level on the DSP_RESET pin is low, the SDA pin  
is asynchronously set to a high-impedance state. In the  
absence of a clock and during the power-up reset, the SDA  
line is high-impedance.  
The DSP_RESET has the following functions:  
TEST MODE CONNECTIONS (TSCAN, RTCB AND SHTCB  
PINS)  
The bits of the input selector control register are set to  
logic 0 (see Table 4)  
The TSCAN, RTCB and SHTCB pins are used to put the  
chip in test mode and to test the internal connections.  
Each pin has an internal pull-down resistor to ground.  
In the application these pins can be left open-circuit or  
connected to ground.  
The program counter is set to address 0000H  
The I2C-bus interface is initialised; the SDA pin is  
guaranteed high-impedance.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC134).  
SYMBOL PARAMETER CONDITIONS  
VDD DC supply voltage  
MIN.  
0.5  
MAX.  
+6.5  
550  
VDD + 0.5 V  
UNIT  
V
VDD  
Vi(max)  
lIK  
voltage difference between two VDDx pins  
maximum input voltage  
mV  
0.5  
DC input clamp diode current  
Vi < 0.5 V or  
10  
20  
20  
20  
mA  
Vi > VDD + 0.5 V  
lOK  
lO  
DC output clamp diode current output  
type 4 mA  
Vo < 0.5 V or  
Vo > VDD + 0.5 V  
mA  
mA  
mA  
DC output source or sink current output  
type 4 mA  
0.5 V < Vo < VDD + 0.5 V  
0.5 V < Vo < VDD + 0.5 V  
lDD  
DC output source or sink current output  
type 4 mA  
lDD  
DC VDD supply current per pin  
DC VSS supply current per pin  
ESD sensitivity for all pins  
human body model  
50  
50  
mA  
mA  
lSS  
VESD  
100 pF; 1500 Ω  
3000  
300  
250  
100  
V
machine model all pins except pin OSC 200 pF; 2.5 µH; 0 Ω  
V
machine model pin OSC  
latch-up protection  
200 pF; 2.5 µH; 0 Ω  
V
LTCH  
Ptot  
CIC spec/test method  
mA  
mW  
°C  
°C  
total power dissipation  
operating ambient temperature  
storage temperature  
700  
+85  
+150  
Tamb  
Tstg  
40  
65  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
57  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
K/W  
1998 Mar 13  
17  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
DC CHARACTERISTICS  
VDD1 = VDD2 = VDD3 = VDD_XTAL = 4.5 to 5.5 V; Tamb = 40 to +85 °C; note 1; unless otherwise specified.  
SYMBOL  
VDDtot  
IDD(tot)  
PARAMETER  
total DC supply voltage  
total DC supply current  
CONDITIONS  
MIN.  
4.5  
TYP.  
MAX.  
5.5  
UNIT  
5
V
DSP frequency = 18 MHz;  
maximum activity DSP  
50  
55  
mA  
Ptot  
total power dissipation  
DSP frequency = 18 MHz;  
maximum activity DSP  
250  
300  
mW  
VIH  
HIGH level input voltage  
all digital inputs and I/Os  
pin types I1, I2 and I3  
pin type I4  
0.7VDDX  
V
V
V
V
V
V
0.8VDDX  
VIL  
LOW level input voltage  
all digital inputs and I/Os  
pin types I1, I2 and I3  
pin type I4  
0.3VDDX  
0.2VDDX  
Vhys  
VOH  
hysteresis voltage  
pin type I4  
0.33VDDX  
HIGH level output voltage VDDX = 4.5 V; Io = 4 mA;  
digital outputs pin type O1 and O2  
LOW level output voltage VDDX = 4.5 V; Io = 4 mA;  
4.0  
VOL  
ILI  
0.5  
1
V
digital outputs  
pin types I3, O1 and O2  
input leakage current  
Vi = 0 or VDDX voltage;  
pin type I1  
µA  
µA  
kΩ  
kΩ  
ILO  
output leakage current  
3-state outputs  
Vo = 0 or VDDX voltage;  
pin type I3 and O2  
5
Rpu(VDDX)(int) internal pull-up resistor to pin type I4  
VDDX  
17  
17  
134  
134  
Rpd(VSSD)(int) internal pull-down resistor pin type I2  
to VSSD  
Crystal oscillator  
VDDX  
positive supply voltage  
crystal oscillator  
4.5  
5
5.5  
V
Note  
1. VDDX = VDD_XTAL  
.
1998 Mar 13  
18  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
AC CHARACTERISTICS  
V
DD1 = VDD2 = VDD3 = VDD_XTAL = 4.5 to 5.5 V; Tamb = 25 °C; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS MIN. TYP.  
crystal frequency see Fig.3  
MAX.  
36.864  
UNIT  
fxtal  
MHz  
dB  
αf  
spurious frequency attenuation  
current through crystal  
transconductance  
20  
Ixtal  
at input voltage swing 0.2 V  
at start-up  
500  
8
µA  
mS  
mV  
pF  
gm(XTAL)  
Vxtal  
CL(XTAL)  
Rxtal  
4
voltage across crystal  
load capacitance  
note 1  
500  
25  
20  
allowed loss resistor of crystal Cp = 5 pF; C1 = 10 pF;  
C2 = 10 pF  
60  
Slave oscillator  
fslave  
slave frequency  
no divider; see Fig.4  
see Fig.4  
18.432  
MHz  
V
SLVOLT  
slave drive voltage  
input rise times  
input fall times  
3.75  
tr  
tf  
0.1 to 0.9VDD_XTAL; note 2  
0.1 to 0.9VDD_XTAL; note 2  
20  
ns  
20  
ns  
Timing  
I2C-BUS INPUTS/OUTPUT  
tf  
fall time I2C-bus  
maximum input frequency  
0.1 to 0.9VDD  
SDA, SCL  
5.7  
ns  
fi(max)  
100  
kHz  
I2S-BUS INPUTS/OUTPUTS  
tr  
rise time I2S-bus (O2)  
CL = 30 pF; 0.1 to 0.9VDD  
CL = 30 pF; 0.1 to 0.9VDD  
7.3  
8.3  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tf  
fall time I2S-bus (O2)  
CL pulse width HIGH  
CL pulse width LOW  
WS out delay time  
data in hold time  
tHC  
tLC  
td1  
td2  
ts2  
td3  
tacc  
112  
112  
0
0
data in set-up time  
data out delay time  
data out access time  
25  
0
5
(3)  
5 + 0.5 × CL  
ALL OTHER OUTPUTS (O1)  
tr  
tf  
rise time  
fall time  
CL = 30 pF; 0.1 to 0.9VDD  
CL = 30 pF; 0.1 to 0.9VDD  
7.3  
8.3  
ns  
ns  
ALL OTHER INPUTS  
tr  
tf  
input rise times  
input fall times  
VDD = 5.5 V  
VDD = 5.5 V  
6
6
200  
200  
ns  
ns  
Notes  
1. The load capacitance is the sum of the series connection of C1 and C2 (see Fig.3) and the parasitic parallel capacitor  
of the crystal Cp.  
2. With a 50%, ±5% duty cycle on oscillator drive input (see Fig.4).  
3. The value for the capitative load CL is given in pF.  
1998 Mar 13  
19  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
INTERNAL CIRCUITRY  
DC VOLTAGE  
(V)  
PIN  
SYMBOL  
PIN TYPE  
INTERNAL CIRCUIT  
7
8
DSP_IN1  
DSP_IN2  
I1  
I1  
I1  
I1  
I1  
I1  
I1  
I1  
I1  
I4  
7, 8, 16, 22, 23,  
24, 25, 26, 27  
16 SCL  
22 I2S_BCKIN1  
23 I2S_WSIN1  
24 I2S_DATAIN1  
25 I2S_DATAIN2  
26 I2S_WSIN2  
27 I2S_BCKIN2  
17 DSP_RESET  
MGE758  
17  
+
MGE759  
3
4
RTCB  
I2  
I2  
I2  
I1  
SHTCB  
13 TSCAN  
14 A0  
3, 4, 13, 14  
MGE760  
1
2
9
I2S_WSOUT  
I2S_BCKOUT  
O2  
O2  
O2  
O2  
DSP_OUT1  
1, 2, 9, 30  
30 I2S_DATAOUT3  
MGE761  
1998 Mar 13  
20  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
DC VOLTAGE  
(V)  
PIN  
SYMBOL  
PIN TYPE  
INTERNAL CIRCUIT  
15 SDA  
I3  
15  
MGE762  
10 DSP_OUT2  
O1  
O1  
O1  
28 I2S_DATAOUT1  
29 I2S_DATAOUT2  
10, 28, 29  
MGE763  
5
6
VDD1  
VSS1  
tbf  
0
11 VSS2  
0
12 VDD2  
31 VSS3  
5
0
32 VDD3  
21 OSC  
20 XTAL  
19 VDD_XTAL  
18 VSS_XTAL  
5
tbf  
tbf  
5
19  
20  
21  
0
18  
MGE764  
1998 Mar 13  
21  
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ahdnbok,uflapegwidt  
220 Ω  
220 Ω  
220 Ω  
2
220 Ω  
220 Ω  
220 Ω  
2
I S_BCKIN1  
22  
23  
2
1
I S_BCKOUT  
220 pF  
220 pF  
220 Ω  
2
220 Ω  
2
I S_WSIN1  
I S_WSOUT  
2
I S input 1  
220 pF  
220 pF  
SAA7710T  
S
2
220 Ω  
220 Ω  
220 Ω  
220 Ω  
220 Ω  
I S_DATAIN1 24  
SURROUND  
CHANNEL  
DELAY LINE  
220 pF  
2
I S outputs  
2
220 Ω  
25  
27  
I S_DATAIN2  
220 Ω  
220 Ω  
220 Ω  
220 Ω  
2
28 I S_DATAOUT1  
2
I2S  
INPUT  
SWITCH  
CIRCUIT  
I S OUT 1  
220 pF  
L
C
220 pF  
5-BAND  
PARAMETRIC  
EQUALIZER  
OR  
TONE  
CONTROL  
220 Ω  
2
I S_BCKIN2  
DOLBY PRO LOGIC  
OR  
DOLBY 3 STEREO  
OR  
HALL/MATRIX  
OR  
INCREDIBLE  
SOUND  
2
VARIABLE  
OUTPUT  
MATRIX  
220 Ω  
2
I S input 2  
29 I S_DATAOUT2  
2
I S OUT 2  
220 pF  
R
data 1  
220 pF  
220 Ω  
SW  
2
220 Ω  
I S_DATAOUT3  
30  
5
2
2
I S OUT 3  
220 pF  
26  
I S_WSIN2  
220 pF  
V
DD1  
DSP_RESET 17  
470 pF  
100  
nF  
BLM32A07  
+5 V  
AUTO BALANCE  
FUNCTION  
V
TSCAN  
RTCB  
12  
32  
13  
3
DD2  
+
100  
nF  
TEST  
+
V
DD3  
100 µF  
(6.3 V)  
100  
nF  
BLM32A07  
+5 V  
V
DD_XTAL  
19  
100  
nF  
100 µF  
(6.3 V)  
2
FLAG TEST  
CONTROL  
I C BUS  
OSCILLATOR  
TRANSCEIVER  
V
SS_XTAL  
18  
6
V
V
SS1  
11 SS2  
V
31 SS3  
7
8
9
10  
15  
16  
14  
A0  
21  
20  
4
SDA  
SCL  
OSC  
XTAL  
SHTCB  
DSP_IN1  
DSP_OUT1  
DSP_OUT2  
220  
220  
10  
kΩ  
10  
kΩ  
DSP_IN2  
4.7 µH  
100 kΩ  
+5 V  
+5 V  
1
nF  
10  
pF  
10  
pF  
100  
pF  
100  
pF  
MGE757  
Fig.14 Application diagram.  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
PACKAGE OUTLINE  
SO32: plastic small outline package; 32 leads; body width 7.5 mm  
SOT287-1  
D
E
A
X
c
y
H
v
M
A
E
Z
17  
32  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
16  
1
w M  
detail X  
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
3
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
E
max.  
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.27 20.7  
0.18 20.3  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.2  
1.0  
0.95  
0.55  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25  
0.01  
0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.086  
0.02 0.011 0.81  
0.01 0.007 0.80  
0.30  
0.29  
0.419  
0.394  
0.043 0.047  
0.016 0.039  
0.037  
0.022  
inches 0.10  
0.004  
0.055  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-25  
97-05-22  
SOT287-1  
1998 Mar 13  
23  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
SOLDERING  
Introduction  
Wave soldering  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SO  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
1998 Mar 13  
24  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1998 Mar 13  
25  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
NOTES  
1998 Mar 13  
26  
Philips Semiconductors  
Product specification  
Dolby* Pro Logic Surround;  
Incredible Sound  
SAA7710T  
NOTES  
1998 Mar 13  
27  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,  
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466  
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,  
Tel. +64 9 849 4160, Fax. +64 9 849 7811  
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,  
Fax. +43 160 101 1210  
Norway: Box 1, Manglerud 0612, OSLO,  
Tel. +47 22 74 8000, Fax. +47 22 74 8341  
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,  
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773  
Philippines: Philips Semiconductors Philippines Inc.,  
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,  
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
Belgium: see The Netherlands  
Brazil: see South America  
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,  
Tel. +48 22 612 2831, Fax. +48 22 612 2327  
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,  
51 James Bourchier Blvd., 1407 SOFIA,  
Tel. +359 2 689 211, Fax. +359 2 689 102  
Portugal: see Spain  
Romania: see Italy  
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,  
Tel. +1 800 234 7381  
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,  
Tel. +7 095 755 6918, Fax. +7 095 755 6919  
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,  
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,  
Tel. +852 2319 7888, Fax. +852 2319 7700  
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,  
Tel. +65 350 2538, Fax. +65 251 6500  
Colombia: see South America  
Czech Republic: see Austria  
Slovakia: see Austria  
Slovenia: see Italy  
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,  
Tel. +45 32 88 2636, Fax. +45 31 57 0044  
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,  
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,  
Tel. +27 11 470 5911, Fax. +27 11 470 5494  
Finland: Sinikalliontie 3, FIN-02630 ESPOO,  
Tel. +358 9 615800, Fax. +358 9 61580920  
South America: Al. Vicente Pinzon, 173, 6th floor,  
04547-130 SÃO PAULO, SP, Brazil,  
Tel. +55 11 821 2333, Fax. +55 11 821 2382  
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,  
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 3 301 6312, Fax. +34 3 301 4107  
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,  
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,  
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2686, Fax. +41 1 488 3263  
Hungary: see Austria  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,  
Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,  
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874  
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,  
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,  
Tel. +66 2 745 4090, Fax. +66 2 398 0793  
Indonesia: see Singapore  
Ireland: Newstead, Clonskeagh, DUBLIN 14,  
Tel. +353 1 7640 000, Fax. +353 1 7640 200  
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,  
Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,  
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,  
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
Uruguay: see South America  
Vietnam: see Singapore  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 625 344, Fax.+381 11 635 777  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1998  
SCA57  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
545102/1200/04/pp28  
Date of release: 1998 Mar 13  
Document order number: 9397 750 03268  

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