SC18IM700IPW_技术文档

SC18IM700

Master I²C-bus controller with UART interface

Rev. 01 — 28 February 2006

Product data sheet

1. General description

The SC18IM700 is designed to serve as an interface between the standard UART port of

a microcontroller or microprocessor and the serial I²C-bus; this allows the microcontroller

or microprocessor to communicate directly with other I²C-bus devices. The SC18IM700

can operate as an I²C-bus master. The SC18IM700 controls all the I²C-bus speciﬁc

sequences, protocol, arbitration and timing. The host communicates with SC18IM700 with

ASCII messages protocol; this makes the control sequences from the host to the

SC18IM700 become very simple.

2. Features

■ UART host interface

■ I²C-bus controller

■ Eight programmable I/O pins

■ High-speed UART: baud rate up to 460.8 kbit/s

■ High-speed I²C-bus: 400 kbit/s

■ 16-byte TXFIFO

■ 16-byte RXFIFO

■ Programmable baud rate generator

■ 2.3 V and 3.6 V operation

■ Sleep mode (power-down)

■ UART message format resembles I²C-bus transaction format

■ I²C-bus master functions

■ Multi-master capability

■ 5 V tolerance on the input pins

■ 8 N 1 UART format (8 data bits, no parity bit, 1 stop bit)

■ Available in very small TSSOP16 package

3. Applications

■ Enable I²C-bus master support in a system

■ I²C-bus instrumentation and control

■ Industrial control

■ Medical equipment

■ Cellular telephones

■ Handheld computers

SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

4. Ordering information

Table 1:

Ordering information

Type number

Package

Name

Description

Version

SC18IM700IPW

TSSOP16

plastic thin shrink small outline package; 16 leads; SOT403-1

body width 4.4 mm

5. Block diagram

V

SS

DD

SC18IM700

RX

TX

2

SDA

SCL

I C-BUS

CONTROLLER

UART

8

RESET

GPIO

GPIOs

REGISTER

WAKEUP

002aab743

Fig 1. Block diagram of SC18IM700

SC18IM700_1

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

6. Pinning information

6.1 Pinning

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

GPIO0

GPIO1

RESET

GPIO7

GPIO4

GPIO5

V

WAKEUP

SS

SC18IM700IPW

GPIO2

GPIO3

SDA

V

DD

GPIO6

TX

SCL

RX

002aab798

Fig 2. Pin conﬁguration for TSSOP16

6.2 Pin description

Table 2:

Symbol

Pin description

1

Type

I/O

I

Description

GPIO0

GPIO1

RESET

V_SS

programmable I/O pin

hardware reset input

ground

2

3

4

-

GPIO2

GPIO3

SDA

5

I/O

O

programmable I/O pin

I²C-bus data pin

I²C-bus clock output

RS-232 receive input

RS-232 transmit input

programmable I/O pin

power supply

6

7

SCL

8

RX

9

I

TX

10

11

12

O

GPIO6

V_DD

I/O

-

WAKEUP 13

I

Wake up SC18IM700 from Power-down mode. Pulling LOW by the

host to wake up the device. A 1 kΩ resistor must be connected

between V_DDand this pin.

GPIO5

GPIO4

GPIO7

14

15

16

I/O

O

programmable I/O pin

O

SC18IM700_1

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

7. Functional description

The SC18IM700 is a bridge between a UART port and I²C-bus. The UART interface

consists of a full-functional advanced UART. The UART communicates with the host

through the TX and RX pins. The serial data format is ﬁxed: one start bit, 8 data bits, and

one stop bit. After reset the baud rate defaults to 9600 bit/s, and can be changed through

the Baud Rate Generator (BRG) registers.

After a power-up sequence or a hardware reset, the SC18IM700 will send two continuous

bytes to the host to indicate a start-up condition. These two bytes are 0x4F and 0x4B;

‘OK’ in ASCII.

7.1 UART message format

The host initiates an I²C-bus data transfer, reads from and writes to SC18IM700 internal

registers through a series of ASCII commands. Table 3 lists the ASCII commands

supported by SC18IM700, and also their hexadecimal value representation.

Unrecognized commands are ignored by the device.

To prevent the host from handing the SC18IM700 due to an unﬁnished command

sequence, the SC18IM700 has a time-out feature. The delay between any two bytes of

data coming from the host should be less than 655 ms. If this condition is not met, the

SC18IM700 will time-out and clear the receive buffer. The SC18IM700 then starts to wait

for the next command from the host.

Table 3:

ASCII commands supported by SC18IM700

ASCII command

Hex value

0x53

Command function

I²C-bus START

I²C-bus STOP

S

P

R

W

I

0x50

0x52

read SC18IM700 internal register

write to SC18IM700 internal register

read GPIO port

0x57

0x49

O

Z

0x4F

write to GPIO port

0x5A

power down

7.1.1 Write N bytes to slave device

The host issues the write command by sending an S character followed by an I²C-bus

slave device address, the total number of bytes to be sent, and I²C-bus data which begins

with the ﬁrst byte (DATA 0) and ends with the last byte (DATA N). The frame is then

terminated with a P character. Once the host issues this command, the SC18IM700 will

access the I²C-bus slave device and start sending the I²C-bus data bytes.

Note that the second byte sent is the I²C-bus device slave address. The least signiﬁcant

bit (W) of this byte must be set to 0 to indicate this is an I²C-bus write command.

SC18IM700_1

Product data sheet

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

host sends

S CHAR.

SLAVE ADR.

+ W

NUMBER

OF BYTES

DATA 0

DATA N

P CHAR.

002aac048

Fig 3. Write N bytes to slave device

7.1.2 Read N byte from slave device

The host issues the read command by sending an S character followed by an I²C-bus

slave device address, and the total number of bytes to be read from the addressed

I²C-bus slave. The frame is then terminated with a P character. Once the host issues this

command, the SC18IM700 will access the I²C-bus slave device, get the correct number of

bytes from the addressed I²C-bus slave, and then return the data to the host.

Note that the second byte sent is the I²C-bus device slave address. The least signiﬁcant

bit (R) of this byte must be set to 1 to indicate this is an I²C-bus write command.

host sends

SLAVE ADR.

+ R

NUMBER

S CHAR.

P CHAR.

002aac049

OF BYTES

18IM responds

DATA 0

DATA N

Fig 4. Read N byte from slave device

7.1.3 Write to 18IM internal register

The host issues the internal register write command by sending a W character followed by

the register and data pair. Each register to be written must be followed by the data byte.

The frame is then terminated with a P character.

W CHAR.

REGISTER 0

DATA 0

REGISTER N

DATA N

P CHAR.

002aac050

Fig 5. Write to 18IM internal register

Remark: Write and read from the internal 18IM register is processed immediately as soon

as the intended register is determined by 18IM.

SC18IM700_1

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

7.1.4 Read from 18IM internal register

The host issues the internal register read command by sending an R character followed

by the registers to be read. The frame is then terminated with a P character.

Once the command is issued, SC18IM700 will access its internal registers and returns the

contents of these registers to the host.

R CHAR.

REGISTER 0

REGISTER N

P CHAR.

002aac051

18IM responds

DATA 0

DATA N

Fig 6. Read from 18IM internal register

7.1.5 Write to GPIO port

The host issues the output port write command by sending an O character followed by the

data to be written to the output port. This command enables the host to quickly set any

GPIO pins programmed as output without having to write to the SC18IM700 internal

IOState register.

O CHAR.

DATA

P CHAR.

002aac052

Fig 7. Write to output port

7.1.6 Read from GPIO port

The host issues the input port read command by sending an I character. This command

enables the host to quickly read any GPIO pins programmed as input without having to

read the SC18IM700 internal IOState register.

Once the command is issued, SC18IM700 will read its internal IOState register and

returns its content to the host.

I CHAR. P CHAR.

18IM responds

DATA

002aac053

Fig 8. Read from output port

7.1.7 Repeated START: read after write

The SC18IM700 also supports ‘read after write’ command as speciﬁed in the Philips’

I²C-bus speciﬁcation. This allows a read command to be sent after a write command

without having to issue a STOP condition between the two commands.

The host issues a write command as normal, then immediately issues a read command

without sending a STOP (P) character after the write command.

SC18IM700_1

Product data sheet

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

SLAVE ADR.

+ W

NUMBER

DATA 0

S CHAR.

OF BYTES

NUMBER

OF BYTES

DATA N

S CHAR. SLAVE ADR. + R

P CHAR.

002aac054

18IM responds

DATA 0

DATA N

Fig 9. Repeated START: read after write

7.1.8 Repeated START: write after write

The SC18IM700 also supports ‘write after write’ command as speciﬁed in the Philips’

I²C-bus speciﬁcation. This allows a write command to be sent after a write command

without having to issue a STOP condition between the two commands.

The host issues a write command as normal, then immediately issues a second write

command without sending a STOP (P) character after the ﬁrst write command.

SLAVE ADR.

+ W

NUMBER

OF BYTES

S CHAR.

DATA 0

NUMBER

OF BYTES

DATA N

S CHAR. SLAVE ADR. + W

DATA 0

DATA N

P CHAR.

002aac055

Fig 10. Repeated START: write after write

7.1.9 Power-down mode

The SC18IM700 can be placed in a low-power mode. In this mode the internal oscillator is

stopped and SC18IM700 will no longer respond to the host messages. Enter the

Power-down mode by sending the power-down character Z (0x5A) followed by the two

deﬁned bytes, which are 0x5A and followed by 0xA5. If the exact message is not received,

the device will not enter the power-down state.

Upon entering the power-down state, SC18IM700 places the WAKEUP pin in a HIGH

state. To have the device leave the power-down state, the WAKEUP pin should be brought

LOW. A 1 kΩ resistor must be connected between the WAKEUP pin and V_DD

.

Z CHAR.

0x5A

0xA5

P CHAR.

002aac056

Fig 11. Power-down mode

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

8. I²C-bus serial interface

The I²C-bus uses two wires (SDA and SCL) to transfer information between devices

connected to the bus, and it has the following features:

• Bidirectional data transfer between masters and slaves

• Multi-master bus (no central master)

• Arbitration between simultaneously transmitting masters without corruption of serial

data on the bus

• Serial clock synchronization allows devices with different bit rates to communicate via

one serial bus

• Serial clock synchronization can be used as a handshake mechanism to suspend and

resume serial transfer.

A typical I²C-bus conﬁguration is shown in Figure 12. The SC18IM700 device provides a

byte-oriented I²C-bus interface that supports data transfers up to 400 kHz.

V

DD

R

PU

R

PU

SDA

SCL

2

I C-bus

2

I C-BUS

DEVICE

I C-BUS

SC18IM700

DEVICE

002aab801

Fig 12. I²C-bus conﬁguration

9. Internal registers available

9.1 Register summary

Table 4:

Internal registers summary

Register Register

address

Bit 7

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0

R/W

General register set

0x00

0x01

0x02

0x03

0x04

0x05

0x06

0x07

0x08

0x09

0x0A

BRG0

bit 7

bit 6

bit 5

bit 4

bit 3

bit 2

bit 1

bit 0

R/W

BRG1

PortConf1

PortConf2

IOState

reserved

I2CAdr

GPIO3.1 GPIO3.0 GPIO2.1 GPIO2.0 GPIO1.1 GPIO1.0 GPIO0.1 GPIO0.0 R/W

GPIO7.1 GPIO7.0 GPIO6.1 GPIO6.0 GPIO5.1 GPIO5.0 GPIO4.1 GPIO4.0 R/W

GPIO7

bit 7

TO7

1

GPIO6

bit 6

TO6

1

GPIO5

bit 5

TO5

1

GPIO4

bit 4

TO4

1

GPIO3

bit 3

GPIO2

bit 2

GPIO1

bit 1

GPIO0

bit 0

TE

R/W

-

bit 3

bit 2

bit 1

R/W

I2CClkL

I2CClkH

I2CTO

bit 3

bit 2

bit 1

bit 3

bit 2

bit 1

TO3

TO2

TO1

I2CStat

I2CStat[3] I2CStat[2] I2CStat[1] I2CStat[0] R

SC18IM700_1

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

9.2 Register descriptions

9.2.1 Baud Rate Generator (BRG)

The baud rate generator is an 8-bit counter that generates the data rate for the transmitter

and the receiver. The rate is programmed through the BRG register and the baud rate can

be calculated as follows:

7.3728 × 10⁶

16 + (BRG1, BRG0)

Baud rate =

--------------------------------------------------

Remark: To calculate the baud rate the values in the BRG registers must ﬁrst be

converted from hex to decimal.

Remark: For the new baud rate to take effect, both BRG0 and BRG1 must be written in

sequence (BRG0, BRG1) with new values. The new baud rate will be in effect once BRG1

is written.

9.2.2 Programmable port conﬁguration (PortConf1 and PortConf2)

GPIO port 0 to port 7 may be conﬁgured by software to one of four types. These are:

quasi-bidirectional, push-pull, open-drain, and input-only. Two bits are used to select the

desired conﬁguration for each port pin. PortConf1 is used to select the conﬁguration for

GPIO3 to GPIO0, and PortConf2 is used to select the conﬁguration for GPIO7 to GPIO4.

A port pin has Schmitt triggered input that also has a glitch suppression circuit.

Table 5:

Port conﬁgurations

GPIOx.1

GPIOx.0

Port conﬁguration

0

1

0

1

0

1

quasi-bidirectional output conﬁguration

input-only conﬁguration

push-pull output conﬁguration

open-drain output conﬁguration

9.2.2.1 Quasi-bidirectional output conﬁguration

Quasi-bidirectional output type can be used as both an input and output without the need

to reconﬁgure the port. This is possible because when the port outputs a logic HIGH, it is

weakly driven, allowing an external device to pull the pin LOW. When the pin is driven

LOW, it is driven strongly and able to sink a fairly large current. These features are

somewhat similar to an open-drain output except that there are three pull-up transistors in

the quasi-bidirectional output that serve different purposes.

The SC18IM700 is a 3 V device, but the pins are 5 V tolerant. In quasi-bidirectional mode,

if a user applies 5 V on the pin, there will be a current ﬂowing from the pin to V_DD, causing

extra power consumption. Therefore, applying 5 V in quasi-bidirectional mode is

discouraged.

A quasi-bidirectional port pin has a Schmitt triggered input that also has a glitch

suppression circuit.

SC18IM700_1

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

V

DD

2 SYSTEM

CLOCK

CYCLES

P

very

weak

strong

weak

GPIOn

pin latch data

V

SS

input data

glitch rejection

002aac076

Fig 13. Quasi-bidirectional output conﬁguration

9.2.2.2 Input-only conﬁguration

The input-only port conﬁguration has no output drivers. It is a Schmitt triggered input that

also has a glitch suppression circuit.

input data

GPIO pin

002aab884

glitch rejection

Fig 14. Input-only conﬁguration

9.2.2.3 Push-pull output conﬁguration

The push-pull output conﬁguration has the same pull-down structure as both the

open-drain and the quasi-bidirectional output modes, but provides a continuous strong

pull-up when the port latch contains a logic 1. The push-pull mode may be used when

more source current is needed from a port output. A push-pull port pin has a Schmitt

triggered input that also has a glitch suppression circuit.

V

DD

P

N

strong

GPIO pin

pin latch data

V

SS

input data

glitch rejection

002aab885

Fig 15. Push-pull output conﬁguration

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

9.2.2.4 Open-drain output conﬁguration

The open-drain output conﬁguration turns off all pull-ups and only drives the pull-down

transistor of the port driver when the port latch contains a logic 0. To be used as a logic

output, a port conﬁgured in this manner must have an external pull-up, typically a resistor

tied to V_DD

.

An open-drain port pin has a Schmitt triggered input that also has a glitch suppression

circuit.

GPIO pin

pin latch data

V

SS

input data

glitch rejection

002aab883

Fig 16. Open-drain output conﬁguration

9.2.3 Programmable I/O pins state register (IOState)

When read, this register returns the actual state of all I/O pins. When written, each

register bit will be transferred to the corresponding I/O pin programmed as output.

Table 6:

Bit

IOState - Programmable I/O pins state register (address 0x04h) bit description

Symbol

Description

7:0

IOLevel

Set the logic level on the output pins.

Write to this register:

logic 0 = set output pin to zero

logic 1 = set output pin to one

Read this register returns states of all pins.

9.2.4 I²C-bus address register (I2CAdr)

The contents of the register represents the device’s own I²C-bus address. The most

signiﬁcant bit corresponds to the ﬁrst bit received from the I²C-bus after a START

condition. A logic 1 in I2CAdr corresponds to a HIGH level on the I²C-bus, and a logic 0

corresponds to a LOW level on the I²C-bus. The least signiﬁcant bit is not used, but should

be programmed with a ‘0’.

I2CAdr is not needed for device operation, but should be conﬁgured so that its address

does not conﬂict with an I²C-bus device address used by the bus master.

9.2.5 I²C-bus clock rates (I2CClk)

This register determines the serial clock frequency. The various serial rates are shown in

Table 7. The frequency can be determined using the following formula:

7.3728 × 10⁶

2 × (I2CClkH + I2CClkL)

bit frequency =

---------------------------------------------------------------

I2CClkH determines the SCL HIGH period, and I2CClkL determines the SCL LOW period.

SC18IM700_1

Product data sheet

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

Table 7:

I2CClk

I²C-bus clock frequency

(I2CClkH + I2CClkL)

10 (minimum)

369 kHz

246 kHz

147 kHz

123 kHz

74 kHz

15

25

30

50

60

100

61 kHz

37 kHz

Remark: The numbers used in the formulas are in decimal, but the numbers to program

I2CClkH and I2CClkL are in hex.

9.2.6 I²C-bus time-out (I2CTO)

The time-out register is used to determine the maximum time that SCL is allowed to be

LOW before the I²C-bus state machine is reset.

When the I²C-bus interface is running, I2CTO is loaded after each I²C-bus state transition.

Table 8:

I2CTO - I²C-bus time-out register (address 0x09h) bit description

Bit

7:1

0

Symbol

TO[7:1]

TE

Description

time-out value

enable/disable time-out function

logic 0 = disable

logic 1 = enable

The least signiﬁcant bit of I2CTO (TE bit) is used as a time-out enable/disable. A logic 1

will enable the time-out function. The time-out period can be calculated as follows:

I2CTO[7:1] × 256

time-out period =

seconds

-------------------------------------------

57600

The time-out value may vary, and it is an approximate value.

9.2.7 I²C-bus status register (I2CStat)

This register reports the I²C-bus transmit and receive frame status, whether the frame

transmits correctly or not.

Table 9:

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 I²C-bus status description

I²C-bus status

1

0

1

0

1

0

1

0

I2C_OK

I2C_NACK_ON_ADDRESS

I2C_NACK_ON_DATA

I2C_TIME_OUT

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

10. Limiting values

Table 10: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). ^{[1] [2]}

Symbol

T_amb(bias)

T_stg

Parameter

Conditions

Min

−55

−65

−0.5

Max

Unit

bias ambient temperature

storage temperature

input voltage

+125 °C

+150 °C

V_I

referenced to V_SS

+5.5

V

I_OH(I/O)

HIGH-level output current

per input/output pin

GPIO3 to GPIO7

all other pins

-

20

8

mA

I_OL(I/O)

LOW-level output current

per input/output pin

20

I_{I/O(tot)(max)}maximum total I/O current

P_tot/pack total power dissipation per package

-

120

1.5

mA

W

[3]

[1] This product includes circuitry speciﬁcally designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maximum.

[2] Parameters are valid over operating temperature range unless otherwise speciﬁed. All voltages are with

respect to V_SSunless otherwise noted.

[3] Based on package heat transfer, not device power consumption.

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

11. Static characteristics

Table 11: Static characteristics

V_DD= 2.4 V to 3.6 V; T_amb= −40 °C to +85 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ ^[1]

Max

Unit

I_DD

supply current

V_DD= 3.6 V

Operating mode; f = 7.3728 MHz

Idle mode; f = 7.3728 MHz

-

9

15

5

mA

µA

3.25

50

Power-down mode (sleep);

GPIO0 to GPIO7 as inputs;

inputs at V_DD

70

V_POR

power-on reset voltage

-

0.2

-

V

V_th(HL)

negative-going threshold except SCL, SDA

voltage

0.22V_DD0.4V_DD

V_IL

LOW-level input voltage SCL, SDA only

−0.5

-

0.3V_DD

0.7V_DD

V

V_th(LH)

positive-going threshold except SCL, SDA

voltage

-

0.6V_DD

V_IH

HIGH-level input voltage SCL, SDA only

0.7V_DD

-

5.5

1.0

0.3

-

V

[2]

V_OL

LOW-level output

voltage

I_OL= 20 mA

I_OL= 3.2 mA

-

0.6

0.2

-

V_OH

HIGH-level output

voltage

I_OH= −20 mA; Push-pull mode;

GPIO3 to GPIO7

0.8V_DD

I_OH= −3.2 mA; Push-pull mode;

GPIO0 to GPIO2

V

_DD− 0.7 V_DD− 0.4 -

_DD− 0.3 V_DD− 0.2 -

V

I_OH= −20 mA; quasi-bidirectional

V

mode; all GPIOs

[3]

[4]

C_io

I_IL

input/output capacitance

-

15

pF

µA

LOW-level input current logical 0; all ports; V_I= 0.4 V

input leakage current all ports; V_I= V_ILor V_IH

negative-going transition logical 1-to-0; all ports; V_I= 2.0 V

current at V_DD= 3.6 V

-

−80

[5]

I_LI

-

−10

[6] [7]

I_T(HL)

−30

−450

R_{RESET_N(int)}internal pull-up

resistance on pin

RESET

10

-

30

kΩ

[1] Typical ratings are not guaranteed. The values listed are at room temperature, 3 V.

[2] See Table 10 “Limiting values” for steady state (non-transient) limits on I_OLor I_OH. If I_OL/I_OHexceeds the test condition, V_OL/V_OHmay

exceed the related speciﬁcation.

[3] Pin capacitance is characterized but not tested.

[4] Measured with GPIO in quasi-bidirectional mode.

[5] Measured with GPIO in high-impedance mode.

[6] GPIO in quasi-bidirectional mode with weak pull-up (applies to all GPIO pins with pull-ups). Does not apply to open-drain pins.

[7] GPIO pins source a transition current when used in quasi-bidirectional mode and externally driven from logic 1 to logic 0. This current is

highest when V_Iis approximately 2 V.

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

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Philips Semiconductors

Master I²C-bus controller with UART interface

12. Dynamic characteristics

Table 12: I²C-bus timing characteristics

All the timing limits are valid within the operating supply voltage and ambient temperature range; V_DD= 2.4 V to 3.6 V;

_amb= −40 °C to +85 °C; and refer to V_ILand V_IHwith an input voltage of V_SSto V_DD

T

.

Symbol

Parameter

Conditions

Standard mode

I²C-bus

Fast mode

I²C-bus

Unit

Min

0

Max

100

-

Min

Max

f_SCL

t_BUF

SCL clock frequency

0

400

-

kHz

bus free time between a STOP and START

condition

4.7

1.3

µs

t_HD;STA

t_SU;STA

t_SU;STO

t_HD;DAT

t_VD;ACK

t_VD;DAT

hold time (repeated) START condition

set-up time for a repeated START condition

set-up time for STOP condition

data hold time

4.0

4.7

4.0

0

-

0.6

0

-

µs

ns

µs

ns

µs

ns

-

data valid acknowledge time

data valid time

-

0.6

-

0.6

-

LOW-level

HIGH-level

-

t_SU;DAT

t_LOW

t_HIGH

t_f

data set-up time

250

4.7

4.0

-

100

1.3

0.6

-

LOW period of the SCL clock

HIGH period of the SCL clock

fall time of both SDA and SCL signals

rise time of both SDA and SCL signals

-

0.3

1

0.3

50

t_r

-

t_SP

pulse width of spikes that must be

suppressed by the input ﬁlter

-

50

-

SDA

t

BUF

t

LOW

t

SU;DAT

HD;STA

SP

t

f

t

r

t

r

t

f

SCL

t

SU;STO

HD;STA

SU;STA

t

HIGH

S

Sr

P

S

t

HD;DAT

002aab271

Fig 17. I²C-bus timing

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

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SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

13. Package outline

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

D

E

A

X

c

y

H

v

M

A

E

Z

9

16

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

8

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.40

0.06

mm

1.1

0.65

0.25

1

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT403-1

MO-153

Fig 18. Package outline SOT403-1 (TSSOP16)

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

16 of 21

SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of

soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne pitch

SMDs. In these situations reﬂow soldering is recommended.

14.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)

vary between 100 seconds and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 °C to 270 °C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward

pressure followed by a smooth laminar wave.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

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Philips Semiconductors

Master I²C-bus controller with UART interface

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle to

the transport direction of the printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C

or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in most

applications.

14.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low voltage

(24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time must be

limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 seconds to 5 seconds between 270 °C and 320 °C.

14.5 Package related soldering information

Table 13: Suitability of surface mount IC packages for wave and reﬂow soldering methods

Package ^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

not suitable^[4]

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^{[5] [6]}

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal or

external package cracks may occur due to vaporization of the moisture in them (the so called popcorn

effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must on no

account be processed through more than one soldering cycle or subjected to infrared reﬂow soldering with

peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow oven. The package

body peak temperature must be kept as low as possible.

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

18 of 21

SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the

solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink

on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is

deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger

than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex foil by

using a hot bar soldering process. The appropriate soldering proﬁle can be provided on request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

Table 14: Abbreviations

Acronym

ASCII

Description

American Standard Code for Information Interchange

First In, First Out

FIFO

GPIO

General Purpose Input/Output

Inter Integrated Circuit bus

Receive FIFO

I²C-bus

RXFIFO

TXFIFO

UART

Transmit FIFO

Universal Asynchronous Receiver/Transmitter

16. Revision history

Table 15: Revision history

Document ID

Release date Data sheet status

20060228 Product data sheet

Change notice Doc. number

Supersedes

SC18IM700_1

-

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

19 of 21

SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

17. Data sheet status

Level Data sheet status^[1]Product status^{[2] [3]}

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

18. Deﬁnitions

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

performance. When the product is in full production (status ‘Production’),

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

makes no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

20. Trademarks

Notice — All referenced brands, product names, service names and

trademarks are the property of their respective owners.

I²C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.

19. Disclaimers

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

21. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales ofﬁce addresses, send an email to: sales.addresses@www.semiconductors.philips.com

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

20 of 21

SC18IM700

Philips Semiconductors

Master I²C-bus controller with UART interface

22. Contents

1

2

3

4

5

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

14.4

14.5

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18

Package related soldering information. . . . . . 18

15

16

17

18

19

20

21

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 19

Revision history . . . . . . . . . . . . . . . . . . . . . . . 19

Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 20

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Contact information . . . . . . . . . . . . . . . . . . . . 20

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

7.1

Functional description . . . . . . . . . . . . . . . . . . . 4

UART message format . . . . . . . . . . . . . . . . . . . 4

Write N bytes to slave device . . . . . . . . . . . . . . 4

Read N byte from slave device. . . . . . . . . . . . . 5

Write to 18IM internal register . . . . . . . . . . . . . 5

Read from 18IM internal register . . . . . . . . . . . 6

Write to GPIO port . . . . . . . . . . . . . . . . . . . . . . 6

Read from GPIO port . . . . . . . . . . . . . . . . . . . . 6

Repeated START: read after write . . . . . . . . . . 6

Repeated START: write after write . . . . . . . . . . 7

Power-down mode . . . . . . . . . . . . . . . . . . . . . . 7

7.1.1

7.1.2

7.1.3

7.1.4

7.1.5

7.1.6

7.1.7

7.1.8

7.1.9

8

I²C-bus serial interface . . . . . . . . . . . . . . . . . . . 8

9

9.1

9.2

9.2.1

9.2.2

Internal registers available . . . . . . . . . . . . . . . . 8

Register summary . . . . . . . . . . . . . . . . . . . . . . 8

Register descriptions . . . . . . . . . . . . . . . . . . . . 9

Baud Rate Generator (BRG) . . . . . . . . . . . . . . 9

Programmable port conﬁguration

(PortConf1 and PortConf2). . . . . . . . . . . . . . . . 9

Quasi-bidirectional output conﬁguration . . . . . . 9

Input-only conﬁguration . . . . . . . . . . . . . . . . . 10

Push-pull output conﬁguration . . . . . . . . . . . . 10

Open-drain output conﬁguration . . . . . . . . . . . 11

Programmable I/O pins state register

9.2.2.1

9.2.2.2

9.2.2.3

9.2.2.4

9.2.3

(IOState) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

I²C-bus address register (I2CAdr) . . . . . . . . . 11

I²C-bus clock rates (I2CClk) . . . . . . . . . . . . . . 11

I²C-bus time-out (I2CTO) . . . . . . . . . . . . . . . . 12

I²C-bus status register (I2CStat). . . . . . . . . . . 12

9.2.4

9.2.5

9.2.6

9.2.7

10

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13

Static characteristics. . . . . . . . . . . . . . . . . . . . 14

Dynamic characteristics . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16

11

12

13

14

14.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Introduction to soldering surface mount

packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 17

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17

14.2

14.3

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner. The information presented in this document does

not form part of any quotation or contract, is believed to be accurate and reliable and may

be changed without notice. No liability will be accepted by the publisher for any

consequence of its use. Publication thereof does not convey nor imply any license under

patent- or other industrial or intellectual property rights.

Date of release: 28 February 2006

Document number: SC18IM700_1

Published in The Netherlands


型号：	SC18IM700IPW
厂家：	NXP
描述：	Master I-2C - bus controller with UART interface 主I- 2C - 通过UART接口总线控制器总线控制器微控制器和处理器外围集成电路光电二极管数据传输
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