SOD723 [NXP]
Package outline; 包装外形型号: | SOD723 |
厂家: | NXP |
描述: | Package outline |
文件: | 总1页 (文件大小:11K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PDF: 2002 Jul 08
Philips Semiconductors
Package outline
Plastic surface mounted package; 2 leads
SOD723
A
c
L
L
p
p
H
E
D
0
0.5
scale
1 mm
1
2
DIMENSIONS (mm are the original dimensions)
b
E
p
UNIT
mm
A
b
c
D
E
H
L
p
p
E
(1)
0.32 0.15
0.25 0.08
0.55
0.49
1.05 0.65 1.45 0.27
0.95 0.55 1.35 0.13
Note
1. The marking bar indicates the cathode.
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-07-05
SOD723
相关型号:
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