SSL21083 [NXP]
IC LED DISPLAY DRIVER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Display Driver;
| 型号： | SSL21083 |
| 厂家： | 
NXP |
| 描述： | IC LED DISPLAY DRIVER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Display Driver 驱动 光电二极管 接口集成电路 |
| 文件： | 总18页 (文件大小：1507K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UM10501
SSL21083 reference board user manual
Rev. 2 — 16 November 2011
User manual
Document information
Info
Content
Keywords
SSL21083, buck converter, reference board, LED driver, LED retrofit
lamp, low power
Abstract
This document describes the performance, technical data and the
connection of the SSL21083 reference board. The SSL2108 series is an
NXP Semiconductors driver IC intended to provide a low cost, small form
factor LED driver. This board is intended to operate at 230 V (AC), using
an output voltage of 30 V or more.
UM10501
NXP Semiconductors
SSL21083 reference board user manual
Revision history
Rev
Date
Description
v.2
20111116
second issue
Modifications:
• Section 9 “Active bypass” on page 11: minor text changes
• Section 10 “Known issues” on page 12: section added.
v.1
20110908
first issue
Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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User manual
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1. Introduction
WARNING
Lethal voltage and fire ignition hazard
The non-insulated high voltages that are present when operating this product, constitute a
risk of electric shock, personal injury, death and/or ignition of fire.
This product is intended for evaluation purposes only. It shall be operated in a designated test
area by personnel qualified according to local requirements and labor laws to work with
non-insulated mains voltages and high-voltage circuits. This product shall never be operated
unattended.
The SSL21083 is a highly integrated switching mode LED driver which enables constant
current driving from the mains input. It is a solution for small LED retrofit lamp application,
especially for low-power factor design.
The SSL21083 is a buck converter controller suitable for non-isolated, non-dimmable LED
retrofit lamps. It can drive long LED strings with, typically 70 V forward voltage. The
SSL2108 series is intended to operate with higher output voltages, as present in modern
LED modules.
Remark: Unless otherwise stated all voltages are in V (AC).
2. Safety warning
This demo board is connected to a high AC voltage. Avoid touching the reference board
during operation. An isolated housing is mandatory when used in uncontrolled,
non-laboratory environments. Galvanic isolation of the mains phase using a fixed or
variable transformer (Variac) is always recommended. These devices are recognized by
the symbols shown in Figure 1.
019aab173
019aab174
a. Isolated
Fig 1. Variac isolation symbols
b. Not isolated
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3. Connecting to the board
The board is optimized for a 230 V (AC, 50 Hz) mains supply. In addition to the mains
voltage optimization, the board is designed to work with multiple LEDs or an LED module
with a high forward voltage.
Mains connection of this reference board is different from other general evaluation/demo
boards. Connect the mains to the screw connector J6.
Remark: The maximum rated voltage of the board is 280 V (limited by the value of
electrolytic capacitor C1) or 400 V (DC).
The anode of the LED load is connected to positive positions 1 to 3 of connector J5. The
cathode is connected to negative 4 to 6 of connector J5.
Use an LED string with a VF greater than 20 volt on this board. Under the expected
conditions, the output current is 96 mA. If the rated current of the LED does not meet this
specification, the current can be adjusted. See Section 6 for instructions.
J5 (1 to 3)
J6
J5 (4 to 6)
aaa-000495
(1) J6: connect the L of the AC mains supply.
(2) J6: connect the N of the AC mains supply.
(3) J5 (1 to 3): Positive anode positions.
(4) J5 (4 to 6): Negative cathode positions.
Fig 2. Board connection diagram
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4. Specification
Table 1.
Parameter
Specifications for the reference board
Value
Comment
AC line input voltage
170 V (AC) to 260 V (AC)
the board is optimized for
230 V (AC), 50 Hz
output voltage
output current
20 V (DC) to 130 V (DC)
96 mA at VO = 92 V (DC)
-
4 % VO = 60 V (DC) to
120 V (DC)
Maximum power in to LED load 12.5 W
(PO(load)
-
)
efficiency
> 94 %
0.6
96 mA
power factor
at 10 W; 70 V; 96 mA output
at 3 W; 70 V; 96 mA output
0.5
board dimensions
17.5 mm 53.5 mm 17.5 mm length width height
(internal)
40 mm 83 mm
40 C to +100 C
60 C
length width (external)
operating temperature
-
NTC threshold temperature
onboard NTC activates above
(Tth(NTC)
)
60 C
IEC61000-3-2 compliant
IEC55015 compliant
yes
yes
Po > 8.5 W
see Figure 7 and Figure 8
5. Performance data
aaa-000496
110
106
102
98
l
o
(mA)
94
90
30
50
70
90
110
130
V
(V (DC))
out
Fig 3. Load regulation: output current as a function of output voltage
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aaa-000497
97
96
l
o
(mA)
95
94
93
92
91
90
170
190
210
230
250
270
V (V)
i
Fig 4. Line regulation: output current as a function of input voltage
aaa-000498
100
η
(%)
98
96
94
92
90
170
190
210
230
250
270
V (V)
i
Fig 5. Line regulation: efficiency as a function of input voltage
aaa-000499
100
1
(1)
η
(%)
PF
80
0.8
0.6
0.4
(2)
60
40
30
50
70
90
110
130
(V (DC))
V
OUT
(1) Efficiency
(2) Power factor
Fig 6. Load regulation: efficiency and power factor as a function of output voltage
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NXP Semiconductors
15.Jun 11 15:30
RBW
MT
9 kHz
15 ms
Marker
1
[T2 ]
50.97 dBµV
Att 10 dB
100 kHz
PREAMP OFF
9.000000000 kHz
10 MHz
dBµV
100
EN55015Q
1
MHz
90
80
70
60
SGL
TDF
1
MAXH
PK
2
AV
CLRWR
1
EN55015A
50
40
30
20
6DB
10
0
9
kHz
30 MHz
aaa-000500
Fig 7. SSL21083 EMC measurement L-phase according to EN55015 norm
NXP Semiconductors
15.Jun 11 15:34
RBW
MT
9 kHz
15 ms
Marker
1
[T2 ]
49.86 dBµV
Att 10 dB
100 kHz
PREAMP OFF
9.000000000 kHz
10 MHz
dBµV
100
EN55015Q
1
MHz
90
80
70
60
SGL
TDF
1
MAXH
PK
2
AV
CLRWR
EN55015A
1
50
40
30
20
6DB
10
0
9
kHz
30 MHz
aaa-000501
Fig 8. SSL21083 EMC measurement N-phase according to EN55015 norm
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6. Changing the output current
The SSL21083 monitors the charging current in the inductor using the sense resistors R5
and R6. It controls a MOSFET to retain a constant peak current. In addition, the IC
supports valley switching.
These features enable a driver to operate in Boundary Conduction Mode (BCM) with
valley switching where the average current in the inductor is the output current.
The SSL21083 turns off the MOSFET when the voltage on pin SOURCE reaches 500 mV.
If the value of R5 in parallel with R6 is 2 , the peak current is limited to 250 mA.
0.5 R5 + R6
--------------------------------------
Ipeak
=
(1)
R5 R6
When the MOSFET is turned off, inductor L2 is discharged and the current flowing
through the inductor decreases. When the current in the inductor reaches 0 mA, the
voltage on the DRAIN pin starts to oscillate because of the stray capacitance (ringing).
SSL21083 waits for a valley of this oscillation.
The charge time of the inductor is calculated using Equation 2:
2 ILED
Vi – VLED
-----------------------
tch = L2
(2)
(3)
The discharge time of the inductor is calculated using Equation 3:
2 ILED
--------------------
tdch = L2
VLED
When the inductor is charging/discharging, a current flows through it. However, there is
also an effective current when ringing. Consider the oscillation frequency when adjusting
the output current. It is calculated using Equation 4:
1
--------------------------------------------------------------------
fring
=
(4)
(5)
(6)
2 L2 CFET C5
The time from the start of oscillation to the first valley is calculated using Equation 5:
1
-------------------
tring
=
2 fring
The output current is calculated using Equation 6. The resulting output current is:
tch + tdch
1
2
--
--------------------------------------
tch + tdch + tring
ILED
=
Ipeak
Therefore by changing Ipeak we can change ILED
.
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7. External OverTemperature Protection (OTP)
The SSL21083 supports external OTP by adding an external Negative Temperature
Coefficient (NTC) resistor. This feature is delivered by detecting a voltage on pin NTC. Pin
NTC has an integrated current source. The Resistance of the NTC resistor is decreased
as the temperature is raised. When the NTC temperature rises and the voltage on pin
NTC falls below 0.5 V, the SSL21083 lowers the threshold level for detecting peak current
in the inductor. Decreasing the peak current in the inductor causes the power current to
decrease. The output current is regulated to the point where a balance between
temperature and output current can be retained (the so called thermal management).
If the temperature on NTC increases continuously and the voltage on the pin drops below
0.3 V, the SSL21083 starts the NTC time-out timer. If the voltage on pin NTC pin does not
drop below 0.2 V within the time-out, the SSL21083 detects an abnormal condition and
stops switching. If the voltage reaches 0.2 V within the time-out period, a PWM signal is
assumed.
An NTC resistor can be directly connected to pin NTC. It is also possible to tune the
protection temperature by adding a resistor in parallel or in series with the NTC. One NTC
and one resistor are installed on the reference board. The values of these components
can be changed depending on the protection temperature requirement and component
availability.
The NTC should be mounted in thermal contact with the LED string.
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8. Power factor adjustment
The SSL21083 IC and SSL21083 reference designs are designed for standard operation
with a power factor of 0.6 at 230 V (AC). This choice offers highest efficiency. It is possible
to tune the power factor to higher values using two methods.
Increasing the value of R1 raises the power factor above 0.7 with additional losses. (see
Table 2).
Table 2.
Power factor adjustment - increasing the value of resistor R1
VIN (V (AC)) Vo (Vavr
)
Io (mA)
94
R1 () Efficiency (%) Power factor THD (%)
230
230
230
230
230
101.5
102.9
98
10
10
22
95.2
94.7
91.6
94.4
85.2
0.59
0.6
109.2
94
127
46
0.52
0.6
150
107
84
100.6
100.8
94
22
270
94
0.71
A resistor value of 270 for R1 also results in operation with most available phase cut
dimmers without damaging the lamp or dimmer. This change is not intended to reach
stable operation without flicker or a good dimming range.
Dimension the power rating of R1 to handle peak powers that occur using leading-edge
dimmers. These powers range between 2 W to 4 W. Alternatively, make a thermal link
between the onboard NTC and R1, causing the board to turn off at overtemperature of R1.
The second option is to increase power factor is using a valley fill circuit. The basic
schematic for this circuit is shown in Figure 9. Table 3 shows the results when using a
4.7 F capacitor for C2X and C2Y.
Table 3.
Power factor adjustment - valley fill circuit
VIN (V (AC)) Vo (Vavr
)
Io (mA)
97
R1 () Efficiency (%) Power factor THD (%)
230
230
85
61
22
95.1
89.3
0.78
0.8
66
58
100
270
C2X
R1
C2Y
aaa-000502
Fig 9. Valley fill circuit
The valley fill circuit can only be employed, if the output voltage is below half the peak
input voltage. At 230 V (AC) input, it operates up to 85 V (DC) output voltage, otherwise
no power is delivered to the LEDs during the valley duration.
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9. Active bypass
An increased value for the inrush current resistor protects the board from damage with
phase-cut dimmers, but lowers the efficiency. If a higher power factor is not required, but
leading-edge dimmer resistance and high efficiency are important, the active bypass
option is available. In this circuit, the inrush current resistor is bypassed using a Silicon
Controlled Rectifier (SCR) (see Figure 10).
Table 4 shows the results when active bypass is used.
Table 4.
Active bypass
VIN (V (AC)) Vo (Vavr
)
Io (mA)
92
R1 () Efficiency (%) Power factor THD (%)
230
230
121
61
100
100
93.5
91.3
0.57
0.54
114
140
100
2 MΩ
470 nF
MCR22-6
100 Ω
aaa-000503
Fig 10. Active bypass
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10. Known issues
10.1 Latch up on fast mains toggle
It can be observed that the board latches up when the mains voltage is switched on, off,
and then on again within a 1.6 s time period.
The cause of this is a crossing of the ground trace between buffer capacitor C1 and
source resistors R5/R6. This causes a spike between the IC source and GND greater than
1.5 V. This in-turn activates SWP.
To overcome this problem, a modification can be implemented. Connect a wire bridge
between R5/R6, GND and the IC GND pin to bypass the crossed traces and reduce
switch on spike. See Figure 11 for a pictorial view of the modification.
Fig 11. Board modification
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11. Schematic
L1
J5 (1 to 3)
1.5 mH
LED+
C6
D2
0.47 ꢁF
250 V
C2
2.2 μF
400 V
C1
100 nF
400 V
U1
1
L2
J5 (4 to 6)
HV
SOURCE
VCC
DRAIN
GND
8
7
D1
1
4
3.3 mH
LED-
2
R1
J6-1
L
2
3
C5
SSL21083
GND
22 ꢀ
100 pF
630 V
3
4
6
5
R2
NTC
DVDT
13 J
300 V
J6-2
N
R5
4.3 ꢀ
R6
4.7 ꢀ
R4
NTC
100 ꢀ
C4
1 nF
250 V
C3
1 μF
16 V
R3
18 kꢀ
aaa-000504
Fig 12. Schematic
12. Bill of materials
Table 5.
Bill of materials
Component Values
Manufacturer/Part number
EPCOS; B32560J6104K
Panasonic; ECA2GHG2R2
AVX; 0603YC105KAT2A
AVX; 06031C102KAT2A
Yageo; CC1206JRNPOBBN101
EPCOS; B32561J3474K
Multicomp; DBLS105G
Taiwan Semiconductor; ES1JL
Phoenix; MKDSN 2,5/2-5.08
Fischer; BL 3.36Z
C1
C2
C3
C4
C5
C6
D1
D2
J6
capacitor; 100 nF; 10 %; 400 V
capacitor; 2.2 F; 105 C; 400 V
capacitor; 1 F; 10 %; 16 V; 0603
capacitor; 1 nF; 10 %; 100 V; 0603
capacitor; 100 pF; 5 %; 630 V; 1206
capacitor; 0.47 F; 250 V
bridge rectifier; 1 A; 600 V; SOIC-4
diode; 1 A; 600 V; SMA
connector; 2-pin male
J5
connector; 6-pin female
R1
R2
R3
R4
R5
R6
L1
fused resistor; 22 ; 2 W; 10 %; 500 V
variable resistor; 13 J; 300 V
resistor; 18 k; 0.25 W; 1 %; 0603
NTC; 100 k; 25 C
Welwyn Components; EMC2-22RKI
Multicomp; MCFT000228
free
Vishay; NTCLE100E3104JB0
free
resistor; 4.3 ; 0.25 W; 1 %; 1206
resistor; 4.7 ; 0.25 W; 1 %; 1206
inductor; 1.5 mH; 10 %
free
Murata; 22R155C
L2
inductor; 3.3 mH; 10 %
Würth Elektronik; 750312318
NXP Semiconductors; SSL21083
U1
IC; 600 V; SO8
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13. Inductor appearance and dimensions
A
part must insert fully to
(1)
surface A in recommended
grid 0.53 sq
2.54, 3.30
13.97 max
12.70 max
6
7
5
4
3
2
1
13.97 max
8
9
10
dot locates term. #1
10.16
lot code and
date code
term numbers
for reference only
1.20 Ø
2.54
2
4
wind 1
recommended
p.c. pattern, component side
dimensions in mm
dimension may be exceeded with solder only
(1)
note
aaa-000505
Electrical specifications at 25 C unless otherwise stated.
Fig 13. Inductor appearance and dimensions
Table 6.
Inductor electrical specifications
Electrical specifications at 25 C unless otherwise stated.
Parameter
Comment
DC resistance at 20 C
dielectric rating
2 to 4; 2.13 10 %
500 V (AC) 60 s; tested by applying 625 V (AC) for 1 s between
pins 2 to core
inductance
3.3 H 10 %; 1- kHz 100 mV (AC); 0 mA (DC) 2 to 4; Ls
saturation current
330 mA saturation current causes 20 % roll-off from initial
inductance
operating temperature range
-40 C to +125 C
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14. Board layout
aaa-000507
aaa-000508
a. Bottom layer
b. Top silk
aaa-000509
aaa-000510
c. Bottom silk
d. Drill mask
Fig 14. Board layout
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15. Board photographs
aaa-000511
a. Front view
aaa-000512
b. Back view
Fig 15. Photographs of the board
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16. Legal information
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.2 Disclaimers
Evaluation products — This product is provided on an “as is” and “with all
faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
and their suppliers expressly disclaim all warranties, whether express, implied
or statutory, including but not limited to the implied warranties of
non-infringement, merchantability and fitness for a particular purpose. The
entire risk as to the quality, or arising out of the use or performance, of this
product remains with customer.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
In no event shall NXP Semiconductors, its affiliates or their suppliers be liable
to customer for any special, indirect, consequential, punitive or incidental
damages (including without limitation damages for loss of business, business
interruption, loss of use, loss of data or information, and the like) arising out
the use of or inability to use the product, whether or not based on tort
(including negligence), strict liability, breach of contract, breach of warranty or
any other theory, even if advised of the possibility of such damages.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Notwithstanding any damages that customer might incur for any reason
whatsoever (including without limitation, all damages referenced above and
all direct or general damages), the entire liability of NXP Semiconductors, its
affiliates and their suppliers and customer’s exclusive remedy for all of the
foregoing shall be limited to actual damages incurred by customer based on
reasonable reliance up to the greater of the amount actually paid by customer
for the product or five dollars (US$5.00). The foregoing limitations, exclusions
and disclaimers shall apply to the maximum extent permitted by applicable
law, even if any remedy fails of its essential purpose.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Safety of high-voltage evaluation products — The non-insulated high
voltages that are present when operating this product, constitute a risk of
electric shock, personal injury, death and/or ignition of fire. This product is
intended for evaluation purposes only. It shall be operated in a designated
test area by personnel that is qualified according to local requirements and
labor laws to work with non-insulated mains voltages and high-voltage
circuits.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
The product does not comply with IEC 60950 based national or regional
safety standards. NXP Semiconductors does not accept any liability for
damages incurred due to inappropriate use of this product or related to
non-insulated high voltages. Any use of this product is at customer’s own risk
and liability. The customer shall fully indemnify and hold harmless NXP
Semiconductors from any liability, damages and claims resulting from the use
of the product.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
16.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
UM10501
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
User manual
Rev. 2 — 16 November 2011
17 of 18
UM10501
NXP Semiconductors
SSL21083 reference board user manual
17. Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Safety warning . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Connecting to the board . . . . . . . . . . . . . . . . . . 4
Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Performance data. . . . . . . . . . . . . . . . . . . . . . . . 5
Changing the output current . . . . . . . . . . . . . . 8
External OverTemperature Protection (OTP) . 9
Power factor adjustment. . . . . . . . . . . . . . . . . 10
Active bypass. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Known issues. . . . . . . . . . . . . . . . . . . . . . . . . . 12
Latch up on fast mains toggle. . . . . . . . . . . . . 12
Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Bill of materials . . . . . . . . . . . . . . . . . . . . . . . . 13
Inductor appearance and dimensions . . . . . . 14
Board layout. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Board photographs . . . . . . . . . . . . . . . . . . . . . 16
3
4
5
6
7
8
9
10
10.1
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 November 2011
Document identifier: UM10501
相关型号：
SSL21084
IC LED DISPLAY DRIVER, PDSO12, 3.90 MM, PLASTIC, MS-012, SOT1196-1, SOP-12, Display Driver
NXP
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