SSL21084AT/1,118 [NXP]
Dimmable LED driver IC SOP 12-Pin;型号: | SSL21084AT/1,118 |
厂家: | NXP |
描述: | Dimmable LED driver IC SOP 12-Pin |
文件: | 总23页 (文件大小:725K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SSL2108 series
GreenChip drivers for LED lighting
Rev. 4 — 8 May 2012
Product data sheet
1. General description
The SSL2108 series is a range of high-voltage Integrated Circuits (ICs) for driving LED
lamps in general lighting applications.
The main benefits of the product family are:
• Small Printed-Circuit Board (PCB) footprint, and compact solution
• High efficiency (up to 95 %)
• Ease of integration
• Low electronic Bill Of Material (BOM)
The product family is made of ICs with a range of internal HV switches for easy power
scaling.
The ICs work as boundary conduction mode converters, typically in buck configuration.
The IC range has been designed to start up directly from the HV supply by an internal
high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling
from the drain, or any other auxiliary supply. This functionality provides full flexibility in the
application design. The IC consumes 1.3 mA of supply current with an internal clamp
limiting the supply voltage.
The ICs provide accurate output current control with LED current accuracy within 5 %.
The ICs can be operated using Pulse-Width Modulation (PWM) dimming and has many
protection features including easy LED temperature feedback.
Remark: This data sheet covers the both the T and AT versions of the SSL21081,
SSL21082, SSL21083 and SSL21084. Unless the version is explicitly stated, SSL2108XT
refers to all T versions.
2. Features and benefits
LED driver IC family driving strings of LEDs from a rectified mains supply
High-efficiency switch mode buck driver product family:
Drivers with integrated 300 V (DC) (SSL21081 and SSL21082) or 600 V (DC)
(SSL21083 and SSL21084) power switches
Controller with power-efficient boundary conduction mode of operation with:
No reverse recovery losses in freewheel diode
Zero Current Switching (ZCS) for turn-on of switch
Zero voltage or valley switching for turn-on of switch
Minimal required inductance value and size
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
Direct PWM dimming possible
Fast transient response through cycle-by-cycle current control:
Negligible AC mains ripple at LED current and minimal total capacitor value
No over or undershoots in the LED current
No binning on LED forward voltage required
Internal Protections:
UnderVoltage LockOut (UVLO)
Leading-Edge Blanking (LEB)
OverCurrent Protection (OCP)
Short-Winding Protection (SWP) SSL2108XT only
Internal OverTemperature Protection (OTP)
Brownout protection
Output Short Protection (OSP)
Low component count (see Figure 4) LED driver solution:
No Schottky diode required due to ZCS
No dim switch and high-side driver required for PWM dimming
Easy external temperature protection with a single NTC resistor
Option for soft-start function
Compatible with wall switches with built-in indication light during standby1
IC lifetime easily matches or surpasses LED lamp lifetime
3. Applications
SSL2108 series products are intended for compact LED lighting applications with
accurate fixed current output for single mains input voltages. Mains input voltages include
100 V (AC), 120 V (AC) and 230 V (AC). The output signal can be modulated using a
PWM signal.
1. The Hotaru switch is a well known wall switch with built-in light
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
2 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
4. Quick reference data
Table 1.
Symbol
VCC
Quick reference data
Parameter
Conditions
Min
8
Typ
Max
14
6
Unit
V
[1]
supply voltage
operating range
-
RDSon
drain-source on-state
resistance
SSL21083T/AT;
SSL21084T/AT;
Tj = 25 C
4
5
SSL21083T/AT;
SSL21084T/AT;
Tj = 125 C
6
7.5
9
SSL21081T/AT;
SSL21082T/AT;
Tj = 25 C
2.05
3.05
2.3
2.55
3.85
SSL21081T/AT;
SSL21082T/AT;
Tj = 125 C
3.45
fconv
conversion frequency
current on pin DRAIN
-
-
-
200
1
kHz
A
IDRAIN
SSL21083T/AT;
SSL21084T/AT
1
SSL21081T/AT;
SSL21082T/AT
2
-
-
-
2
A
V
V
VDRAIN
voltage on pin DRAIN
SSL21083T/AT;
SSL21084T/AT
0.4
0.4
600
300
SSL21081T/AT;
SSL21082T/AT
[1] The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the DVDT
supply.
5. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
SSL21081T
SSL21083T
SSL21081AT
SSL21083AT
SSL21082T
SSL21084T
SSL21082AT
SSL21084AT
SO8
plastic small package outline body; 8 leads; body width SOT96-1
3.9 mm
SO12
plastic small package outline body; 12 leads; body width SOT1196-1
3.9 mm
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
3 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
5.1 Ordering options
Remark: All voltages are in V (AC) unless otherwise specified.
Table 3. Ordering options
SSL2108 series Input voltage
variants
Internal MOSFET Package
characteristics
Brownout
protection
selectable
SSL21081T
SSL21081AT
SSL21082T
SSL21082AT
SSL21083T
SSL21083AT
SSL21084T
SSL21084AT
100 V; 120 V
300 V (DC); 2
SO8
no
SO12
SO8
yes
no
100 V; 120 V;
230 V
600 V (DC); 5
SO12
yes
[1] The SO12 package variants have more so called fused leads than the SO8 variants and can be used when
higher output power is required.
6. Block diagram
1 (1)
3 (4)
HV
JFET
5 (9)
dV/dT
DVDT
SUPPLY
SUPPLY:
INTERNAL
REGULATOR
AND
VCC
BANDGAP
8 (12)
(8)
VALLEY
DETECTION
DRAIN
LOGIC
TOFFMAX
TONMAX
4 (5)
NTC
NTC
FUNCTION
TONMAX
LOGIC
CONTROL
AND
THERMAL
SHUTDOWN
BLANK
2 (3)
SOURCE
PROTECTION
POR
1.5 V
GND
6, 7
(2, 6, 7, 10, 11)
0.5 V < >0.25 V
001aan694
Fig 1. SSL2108 series block diagram
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
4 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
7. Pinning information
7.1 Pinning
1
12
HV
DRAIN
1
2
3
4
8
7
6
5
HV
SOURCE
VCC
DRAIN
GND
2
3
4
5
6
11
10
9
GND
SOURCE
VCC
GND
SSL2108X
SSL2108X
GND
GND
DVDT
TONMAX
GND
NTC
DVDT
8
NTC
001aan702
7
GND
001aan703
Fig 2. Pin configuration for SSL2108
series (SO8)
Fig 3. Pin configuration for SSL2108
series (SO12)
7.2 Pin description
Table 4.
Pin description
Symbol
HV
Pin (SO8)
Pin (SO12)
Description
1
1
high-voltage supply pin
low-side internal switch
supply voltage
SOURCE
VCC
2
3
3
4
NTC
4
5
LED temperature protection input
ground
GND
6,7
5
2,6,7,10,11
DVDT
TONMAX
DRAIN
9
AC supply pin
-
8
brownout protection timer input
high-side internal switch
8
12
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
5 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8. Functional description
8.1 Converter operation
The converter in the SSL2108 series is a Boundary Conduction Mode (BCM), peak
current controlled system. For the basic application diagram see Figure 4, for the
waveforms see Figure 5. This converter type operates at the boundary between
continuous and discontinuous mode. Energy is stored in inductor L each period that the
switch is on. The inductor current IL is zero when the internal MOSFET switch is switched
on. Thereafter, the amplitude of the current build-up in L is proportional to VIN VOUT and
the time that the internal MOSFET switch is on. When the internal MOSFET switch is
switched off, the current continues to flow through the freewheel diode and the output
capacitor. The current then falls at a rate proportional to the value of VOUT. The LED
current ILED is almost equal to half the peak switch current. A new cycle is started, as soon
as the inductor current IL is zero.
R
inrush
V
sec
LEDs
L
DVDT
DRAIN
8
5
HV
1
3
SSL2108X
VCC
6, 7
GND
4
2
NTC
NTC
SOURCE
R
sense
001aan693
Fig 4. Basic application diagram SSL2108 series (SO8 variant)
8.2 Conversion frequency
The conversion frequency must be limited to below 200 kHz. Therefore, select an
inductance value so that the conversion frequency is always within limits, given the supply
voltage, LED voltage and component spread.
8.3 Valley detection
A new cycle is started when the primary switch is switched on (see Figure 5). Following
time t1, when the peak current is detected on the SOURCE pin, the switch is turned off
and the secondary stroke starts (3). When the secondary stroke is complete and the coil
current at t3 equals zero, the drain voltage starts to oscillate around the VIN VOUT level.
The amplitude equals VOUT. A special feature, called valley detection is an integrated part
of the SSL2108 series circuitry. Dedicated built-in circuitry connected to the DRAIN pin,
senses when the voltage on the drain of the switch has reached its lowest value. The next
cycle is then started and as a result the capacitive switching losses are reduced.
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
6 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
A valley is detected and accepted if both the frequency of the oscillations and the voltage
swing are within the range specified (fring and ∆Vvrec(min)) for detection. If a valid valley is
not detected, the secondary stroke is continued until the maximum off-time (toff(high)) is
reached, then the next cycle is started.
V
GATE
internal MOSFET switch
V
OUT
V
D
V
IN
valley
0
magnetization
demagnetization
I
L
0
2
1
3
4
t
00
t
0
t
t
2
t
3
1
T
001aan699
Fig 5. Buck waveforms and valley detection
8.4 Protective features
The IC has the following protective features:
• UnderVoltage LockOut (UVLO)
• Leading-Edge Blanking (LEB)
• OverCurrent Protection (OCP)
• Internal OverTemperature Protection (OTP)
• Brownout protection
• Short-Winding Protection (SWP) SSL2108XT only
• Output Short Protection (OSP)
• LED overtemperature control and protection
The SWP and the OSP are latched protections. These protections cause the IC to halt
until a reset (a result of power cycling) is executed. When VCC drops lower than VCC(rst)
the IC resets the latch protection mode. The internal OTP and LED over temperature
protections are safe-restart protections. The IC halts, causing VCC to fall lower than
VCC(stop), and instigates start-up. Switching starts only when no fault condition exists.
,
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
7 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.4.1 UnderVoltage LockOut (UVLO)
When the voltage on the VCC pin drops lower than VCC(stop), the IC stops switching. An
attempt is then made to restart by supplying VCC from the HV pin voltage.
8.4.2 Leading-Edge Blanking (LEB)
To prevent false detection of the short-winding or overcurrent, a blanking time following
switch-on is implemented. When the internal MOSFET switch turns on there can be a
short current spike due to capacitive discharge of voltage over the drain and source.
During the LEB time (tleb), the spike is disregarded.
8.4.3 OverCurrent Protection (OCP)
The SSL2108 series contains a highly accurate peak current detector. It triggers when the
voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through
the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is
activated following LEB time tleb. As the LED current is half the peak current (by design), it
automatically provides protection for maximum LED current during operation. There is a
propagation delay between overcurrent detection and the actual closure of the switch
td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level
set by the resistor in series to the SOURCE pin.
8.4.4 OverTemperature Protection (OTP)
When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the
converter stops operating. The safe-restart protection is triggered and the IC restarts
again with switching resuming when the IC temperature drops lower than Tth(rel)otp
.
8.4.5 Brownout protection
Brownout protection is designed to limit the lamp power when the input voltage drops
close to the output voltage level. Since the input power has to remain constant, the input
current would otherwise increase to a level that is too large for the input circuitry. For the
SSL2108 series, there is a maximum limit on the on-time of the switch ton(high). The rate of
current rise in the coil during the on-phase is proportional to the difference between input
voltage and output voltage. Therefore, the peak current cannot be reached before ton(high)
and as a result the average output current to the LEDs is reduced.
Using the SO12 package, the ton(high) can be lowered by connecting a capacitor to the
TONMAX pin. The external capacitor is charged during the primary stroke with ITONMAX. If
V
TONMAX level is reached before the ton(high) time, the switch is turned off and the
secondary stroke starts. When no capacitor is connected to the pin, VTONMAX is reached
quickly, shorter than the minimum limit of one microsecond. In this case, or in case the
TONMAX pin is grounded, the internal time constant, ton(high) determines the maximum
on-time.
8.4.6 Short-Winding Protection (SWP) SSL2108XT only
SWP activates if there is a steep rising current through the MOSFET and thus through the
external resistor connected to the SOURCE pin. This current can occur when there is a
short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor
between the input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater
than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if VCC drops
lower than VCC(rst) the IC resets the latched protection mode.
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
8 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.4.7 Output Short Protection (OSP)
During the second stroke (switch-of time), if a valley is not detected within the off-time limit
(toff(high)), then typically the output voltage is less than the minimum limit allowed in the
application. This condition can occur either during starting up or due to a short. A timer is
started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in
one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real
short-circuit exists and not start-up. The IC enters latched protection. If VCC drops lower
than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP
timer is paused during the off-cycle of the PWM signal.
8.5 VCC supply
The SSL2108 series can be supplied using three methods:
• Under normal operation, the voltage swing on the DVDT pin is rectified within the IC
providing current towards the VCC pin
• At start-up, there is an internal current source connected to the HV pin. The current
source provides internal power until either the dV/dt supply or an external current on
the VCC pin provides the supply
• An external voltage source can be connected to the VCC pin
The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks
out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The
hysteresis between the start and stop levels allows the IC to be supplied by a buffer
capacitor until the dV/dt supply is settled. The SSL2108 series has an internal VCC clamp,
which is an internal active Zener (or shunt regulator). This internal active Zener limits the
voltage on the supply VCC pin to the maximum value of VCC. If the maximum current of
the dV/dt supply minus the current consumption of the IC (determined by the load on the
gate drivers), is lower than the maximum value of IDD no external Zener diode is needed in
the dV/dt supply circuit.
8.6 DVDT supply
The DVDT pin is connected to an internal single-sided rectification stage. When an
alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered
without any other external power connection. This solution provides an effective method
to prevent the additional high-power losses, which would result if a regulator were used for
continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are
not needed.
8.7 VCC regulator
During supply dips, the input voltage can drop too low to supply the required IC current
through the DVDT pin. Under these conditions, if the VCC voltage drops lower than
V
CC(swon)reg level, another regulator with a current capability of up to Isup(high)HV is started.
The job of the regulator is to fill in the required supply current, which the DVDT supply
does not deliver, thus preventing the IC going into UVLO. When the VCC voltage is higher
than VCC(swon)reg level, the regulator is turned off.
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
9 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.8 NTC functionality and PWM dimming
The NTC pin can be used as a control method for LED thermal protection. Alternatively,
the pin can be used as an input to disable/enable light output using a digital signal (PWM
dimming). The pin has an internal current source that generates the current of Ioffset(NTC)
An NTC resistor to monitor the LED temperature can be directly connected to the NTC
pin. Depending on the resistance value and the corresponding voltage on the NTC pin,
the converter reacts as shown in Figure 6.
.
Peak current
I
V
= 500 mV
= 250 mV
pk
th(ocp)SOURCE
th(ocp)SOURCE
V
I
pk
/ 2
1
2
3
4
5
V
NTC
001aan700
Fig 6. NTC control curve
When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter
delivers nominal output current. When the voltage is lower than this level, the peak current
is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now
half the peak current of nominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a
timer starts to run to distinguish between the following situations:
• If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED
overtemperature is detected. The IC stops switching and attempts to restart from the
HV pin voltage. Restart takes place when the voltage on NTC pin is higher than
V
th(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not
result in a lower NTC temperature and LED OTP is activated.
• If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is
assumed that the pin is pulled down externally. The restart function is not triggered.
Instead, the output current is reduced to zero. PWM dimming can be implemented this
way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC
.
8.8.1 Soft-start function
The NTC pin can be used to make a soft start function. During switch-on, the level on the
NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time
constant can be defined. The time constant causes the level on the NTC pin to increase
slowly. When passing level Vth(low)NTC Figure 6 (3), the convertor starts with half of the
maximum current. The output current slowly increases to maximum when Vth(high)NTC
Figure 6 (4) is reached.
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
10 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
8.9 Heat sink
For SSL2108 series applications, the copper of the PCB acts as the heat sink. The
SSL2108 series (SO12) uses thermal leads (pins 2, 6, 10 and 11) for enhanced heat
transfer from die to the PCB copper heat sink. The thermal lead connection can drastically
reduce thermal resistance.
Equation 1 shows the relation between the maximum allowable power dissipation P and
the thermal resistance from junction to ambient.
Rthj – a = Tjmax – Tamb P
(1)
Where:
Rth(j-a) = thermal resistance from junction to ambient
Tj(max) = maximum junction temperature
Tamb = ambient temperature
P = power dissipation
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
11 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
General
SR
Parameter
Conditions
Min
Max
Unit
slew rate
on pin DRAIN
5
-
+5
V/ns
kHz
W
fconv
conversion frequency
total power dissipation
200
0.6
Ptot
SO8 package
SO12 package
-
-
1
W
Tamb
Tj
ambient temperature
junction temperature
storage temperature
40
40
55
+125
+150
+150
C
C
Tstg
C
Voltages
VCC
[1]
supply voltage
continuous
0.4
0.4
0.4
0.4
0.4
0.4
0.4
+14
V
V
V
V
V
V
V
VDRAIN
voltage on pin DRAIN
600 V (DC) version
300 V (DC) version
current limited
current limited
current limited
current limited
+600
+300
+600
+5.2
+5.2
+5.2
VHV
voltage on pin HV
VSOURCE
VNTC
voltage on pin SOURCE
voltage on pin NTC
VTONMAX
Currents
IDD
voltage on pin TONMAX
[1]
supply current
at pin VCC
-
20
+1
+2
+1
+2
1.3
mA
A
IDRAIN
current on pin DRAIN
600 V (DC) version
300 V (DC) version
600 V (DC) version
300 V (DC) version
1
2
1
2
-
A
ISOURCE
current on pin SOURCE
current on pin DVDT
A
A
IDVDT
VESD
duration 20 s
maximum
A
[2]
[3]
electrostatic discharge
voltage
human body model;
(for all pins except
DRAIN and HV)
2
+2
KV
human body model
for DRAIN and HV
1
+1
KV
V
charged device
500
+500
[1] An internal clamp sets the supply voltage and current limits.
[2] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each
pin down to 0 V over a 1 resistor.
SSL2108_SER
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 4 — 8 May 2012
12 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
10. Thermal characteristics
Table 6.
Thermal characteristics
Symbol Parameter
Conditions
Typ
Unit
Rth(j-a)
thermal resistance from junction to ambient in free air; SO8 package, PCB: 2 cm 3 cm,
2-layer, 35 m Cu per layer
142
K/W
in free air; SO12 package; PCB: 2 cm 3 cm,
2-layer, 35 m Cu per layer
121
K/W
in free air; SO8 package; PCB: JEDEC 2s2p
in free air; SO12 package; PCB: JEDEC 2s2p
72
53
3.4
K/W
K/W
K/W
j-top
thermal resistance from junction to top
top package temperature measured at the
warmest point on top of the case; SO8 package
top package temperature measured at the
warmest point on top of the case; SO12
package
4.7
K/W
11. Characteristics
Table 7.
Symbol
Characteristics
Parameter
Conditions
Min
Typ
Max Unit
High-voltage
Ileak(DRAIN)
leakage current on pin DRAIN
leakage current on pin HV
VDRAIN = 600 V (DC)
VDRAIN = 300 V (DC)
VHV = 600 V (DC)
VHV = 300 V (DC)
-
-
-
-
-
-
-
-
10
10
30
30
A
A
A
A
Ileak(HV)
Supply
VCC
[1]
supply voltage
operating range
8
-
14
13
10
-
V
V
V
V
V
V
VCC(startup)
VCC(stop)
VCC(hys)
VCC(rst)
start-up supply voltage
stop supply voltage
hysteresis of supply voltage
reset supply voltage
11
8
12
9
between VCC(startup) and VCC(stop)
2
-
4.5
8.75
5
5.5
9.75
VCC(swon)reg
regulator switch-on supply
voltage
insufficient dV/dt supply
insufficient dV/dt supply
VCC(swoff)reg VCC(swon)reg
VCC(swon)reg VCC(stop)
9.25
VCC(swoff)reg
VCC(reg)hys
regulator switch-off supply
voltage
9.5
0.3
0.3
10
-
10.5
V
V
V
regulator supply voltage
hysteresis
-
-
VCC(regswon-stop) supply voltage difference
between regulator switch-on and
stop
-
Consumption
Istb(HV)
standby current on pin HV
supply current
during start-up or in protection;
VHV = 100 V
300
-
350
1.3
400
-
A
ICC
normal operation
mA
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GreenChip drivers for LED lighting
Table 7.
Characteristics …continued
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Capability
Isup(high)HV
high supply current on pin HV
Standby: VHV = 40 V;
VCC < VCC(stop)
1
2
1.3
2.3
1.6
2.6
mA
mA
Regulator On: VHV = 40 V;
VCC < VCC(swon)reg after start-up
Current and SWP
Vth(ocp)SOURCE overcurrent protection threshold V/t = 0.1 V/s
480
230
-
500
250
75
520
270
100
mV
mV
ns
voltage on pin SOURCE
V/t = 0.1 V/s; VNTC = 0.325 V
V/t = 0.1 V/s
td(ocp-swoff)
tleb
delay time from overcurrent
protection to switch-off
leading edge blanking time
overcurrent protection
short-winding protection
260
210
30
300
250
50
340
290
-
ns
ns
ns
tleb
leading edge blanking time
difference
between tleb for overcurrent
protection and short-winding
protection
Vth(swp)SOURCE short-winding protection
threshold voltage on pin
SOURCE
SSL2108XT only
1.4
1.5
1.6
V
Valley detection
(V/t)vrec
valley recognition voltage change on pin DRAIN
with time
30
20
10
V/s
[2]
fring
ringing frequency
200
15
550
20
1000 kHz
Vvrec(min)
minimum valley recognition
voltage difference
voltage drop on pin DRAIN
25
V
td(vrec-swon)
valley recognition to switch-on
delay time
-
100
4
-
ns
Brownout detection
Vth(TONMAX)
threshold voltage on pin
3.75
4.25
V
TONMAX
Ioffset(TONMAX)
ton(high)
offset current on pin TONMAX
high on-time
37
43
48
A
12.5
15
17.5 s
MOSFET output stage
VBR(DRAIN)
breakdown voltage on pin DRAIN 600 V (DC) version; Tj > 0 C
300 V (DC) version; Tj > 0 C
600
300
4
-
-
V
-
-
V
RDSon
drain-source on-state resistance 600 V (DC) version; Tj = 25 C
600 V (DC) version; Tj = 125 C
5
6
6
7.5
2.3
3.45
1.2
9
300 V (DC) version; Tj = 25 C
2.05
3.05
-
2.55
3.85
-
300 V (DC) version; Tj = 125 C
[2]
dV/dt)f(DRAIN)
fall rate of change of voltage on
pin DRAIN
300 V (DC) version;
CDRAIN = 150 pF, RSOURCE = 2.2
V/ns
600 V (DC) version;
-
1.5
-
V/ns
C
DRAIN = 75 pF; RSOURCE = 1.2
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Product data sheet
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GreenChip drivers for LED lighting
Table 7.
Symbol
Characteristics …continued
Parameter
Conditions
Min
Typ
Max Unit
NTC functionality
Vth(high)NTC
high threshold voltage on pin
0.47
0.5
0.53
V
NTC
Vth(low)NTC
Vact(tmr)NTC
low threshold voltage on pin NTC
0.325 0.35
0.375
0.325
V
V
timer activation voltage on pin
NTC
0.26
0.17
33
0.29
0.2
46
Vdeact(tmr)NTC
tto(deact)NTC
timer deactivation voltage on pin
NTC
0.23
59
-
V
deactivation time-out time on pin
NTC
s
A
Ioffset(NTC)
OSP
offset current on pin NTC
-
47
tdet(sc)
short-circuit detection time
high off-time
16
30
20
36
24
42
ms
toff(high)
s
Temperature protections
Tth(act)otp overtemperature protection
160
90
170
100
180
110
C
C
activation threshold temperature
Tth(rel)otp
overtemperature protection
release threshold temperature
[1] The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the DVDT supply.
[2] This parameter is not tested during production, by design it is guaranteed.
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Product data sheet
Rev. 4 — 8 May 2012
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SSL2108 series
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GreenChip drivers for LED lighting
12. SSL2108 series buck configuration
L1
LED+
fuse
L1
10 Ω
D1
to
C1
RGND
C2
C3
LED1...n
mains
D2
D3
N
LED-
L2
IC1
HV
DRAIN
GND
1
2
3
4
8
7
6
5
R1
SOURCE
VCC
SSL21081
SSL21083
C4
GND
NTC
DVDT
RT1
NTC
C5
C6
RGND
001aan696
Fig 7. Buck configuration for SSL21081/SSL21083
L1
LED+
fuse
L1
10 Ω
D1
to
C1
RGND
C2
C3
LED1...n
mains
D3
D2
N
LED-
L2
IC1
HV
DRAIN
1
12
GND
GND
GND
DVDT
2
3
4
5
6
11
10
9
C4
R1
SOURCE
VCC
SSL21082
SSL21084
NTC
TONMAX
GND
8
GND
RT1
NTC
7
C5
C6
C7
RGND
001aan697
Fig 8. Buck configuration for SSL21082/SSL21084
Further application information can be found in the SSL2108 series application note.
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Rev. 4 — 8 May 2012
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 9. Package outline SOT96-1 (SOT8)
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Product data sheet
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17 of 23
SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
SO12: plastic small outline package; 12 leads; body width 3.9 mm
SOT1196-1
D
E
A
X
c
H
v
A
E
y
Z
12
7
A
2
A
A
3
A
1
pin 1 index
θ
L
p
L
1
6
e
e
2
1
w
detail X
b
p
0
1
2
2
3
4
5 mm
scale
Dimensions
Unit
(1)
(1)
(2)
A
A
1
A
2
A
b
c
D
E
e
1
e
H
L
L
p
Q
v
w
y
Z
θ
3
p
E
°
°
°
8
4
0
max 1.75 0.25 1.45
0.49 0.25 8.75 4.0
0.18 1.35 0.25 0.43 0.22 8.65 3.9 2.54 1.27 6.0 1.05 0.7 0.65 0.25 0.25 0.1 0.5
0.10 1.25 0.36 0.10 8.55 3.8 5.8 0.4 0.60 0.3
6.2
1.0 0.70
0.7
mm nom
min
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
sot1196-1_po
References
Outline
version
European
projection
Issue date
IEC
- - -
JEDEC
JEITA
- - -
11-02-15
11-02-16
SOT1196-1
MS-012 Compliant
Fig 10. Package outline SOT1196-1 (SOT12)
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Product data sheet
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SSL2108 series
NXP Semiconductors
GreenChip drivers for LED lighting
14. Abbreviations
Table 8.
Abbreviations
Description
Acronym
BCM
Boundary Conduction Mode
Bill Of Materials
BOM
LED
Light Emitting Diode
Leading-Edge Blanking
LEB
MOSFET
OCP
Metal-Oxide Semiconductor Field-Effect Transistor
OverCurrent Protection
OSP
Output Short Protection
OTP
OverTemperature Protection
Printed-Circuit Board
PCB
PWM
SWP
UVLO
ZCS
Pulse-Width Modulation
Short-Winding Protection
UnderVoltage LockOut
Zero Current Switching
15. References
[1] AN11040 — Drivers for LED lighting - application note
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GreenChip drivers for LED lighting
16. Revision history
Table 9.
Revision history
Document ID
Release date Data sheet status
20120508 Product data sheet
Change notice Supersedes
- SSL21081T_2T_3T_4T v.3.1
SSL2108_SER v.4
Modifications:
• SSL21081AT, SSL21082AT, SSL21083AT and SSL21084AT added.
• Minor text changes throughout the data sheet.
SSL21081T_2T_3T_4T v.3.1 20120222
Product data sheet
Product data sheet
Preliminary data sheet
Preliminary data sheet
-
-
-
-
SSL21081T_2T_3T_4T v.3
SSL21081T_2T_3T_4T v.2
SSL2108X v.1
SSL21081T_2T_3T_4T v.3
SSL21081T_2T_3T_4T v.2
SSL2108X v.1
20120214
20111206
20110909
-
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NXP Semiconductors
GreenChip drivers for LED lighting
17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
17.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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NXP Semiconductors
GreenChip drivers for LED lighting
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
non-automotive qualified products in automotive equipment or applications.
GreenChip — is a trademark of NXP B.V.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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Rev. 4 — 8 May 2012
22 of 23
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NXP Semiconductors
GreenChip drivers for LED lighting
19. Contents
1
General description. . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information. . . . . . . . . . . . . . . . . . . . . 3
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
4
5
5.1
6
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
8.1
8.2
8.3
Functional description . . . . . . . . . . . . . . . . . . . 6
Converter operation . . . . . . . . . . . . . . . . . . . . . 6
Conversion frequency. . . . . . . . . . . . . . . . . . . . 6
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6
Protective features . . . . . . . . . . . . . . . . . . . . . . 7
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 8
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 8
Brownout protection . . . . . . . . . . . . . . . . . . . . . 8
Short-Winding Protection (SWP) SSL2108XT
only. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Output Short Protection (OSP). . . . . . . . . . . . . 9
VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DVDT supply . . . . . . . . . . . . . . . . . . . . . . . . . . 9
VCC regulator. . . . . . . . . . . . . . . . . . . . . . . . . . 9
NTC functionality and PWM dimming. . . . . . . 10
Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10
Heat sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.4
8.4.1
8.4.2
8.4.3
8.4.4
8.4.5
8.4.6
8.4.7
8.5
8.6
8.7
8.8
8.8.1
8.9
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
Thermal characteristics . . . . . . . . . . . . . . . . . 13
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13
SSL2108 series buck configuration . . . . . . . . 16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 19
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 20
10
11
12
13
14
15
16
17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
17.1
17.2
17.3
17.4
18
19
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 May 2012
Document identifier: SSL2108_SER
相关型号:
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