TDA1516CQ [NXP]
24 W BTL car radio power amplifier; 24瓦BTL汽车收音机电源放大器器
| 型号： | TDA1516CQ |
| 厂家： | 
NXP |
| 描述： | 24 W BTL car radio power amplifier |
| 文件： | 总10页 (文件大小：72K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1516CQ
24 W BTL car radio power amplifier
July 1994
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
• Capability to handle high energy on outputs (VP = 0)
• Protected against electrostatic discharge
• No switch-on/switch-off plop
FEATURES
• Requires very few external components for Bridge-Tied-
Load (BTL)
• High output power (without bootstrap)
• Low offset voltage at output (important for BTL)
• Fixed gain
• Flexible leads
• Low thermal resistance
• Identical inputs (inverting and non-inverting).
• Good ripple rejection
• Mute/stand-by switch
GENERAL DESCRIPTION
• Load dump protection
The TDA1516CQ is a monolithic integrated class-B output
amplifier in a 13-lead single-in-line (SIL) plastic power
package. The device is primarily developed for car radio
applications.
• AC and DC short-circuit-safe to ground and VP
• Thermally protected
• Reverse polarity safe
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
VP
positive supply voltage range
operating
6.0
14.4
−
18
30
45
4
V
non-operating
load dump
−
V
−
−
V
IORM
IP
repetitive peak output current
total quiescent current
stand-by current
−
−
A
−
40
0.1
−
80
100
60
−
mA
µA
µA
kΩ
°C
W
Isb
−
Isw
switch-on current
−
ZI
input impedance BTL
crystal temperature
output power
25
−
−
TXTAL
PO
−
+150
−
THD = 10%; 4 Ω
RS = 0; f = 100 Hz
f = 1 to 10 kHz
−
22
−
SVRR
supply voltage ripple rejection
45
48
−
−
dB
dB
µV
mV
−
−
Vno
noise output voltage
70
−
−
∆Vos
DC output offset voltage
−
100
ORDERING INFORMATION
PACKAGE
EXTENDED TYPE
NUMBER
PINS
PIN POSITION
MATERIAL
CODE
SOT141(1)
TDA1516CQ
13
DIL
plastic
Note
1. SOT141-6; 1996 August 21.
July 1994
2
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
bootstrap switch
2
mute switch
C
m
100
Ω
60
kΩ
5
6
1
VA
18
2
kΩ
power stage
kΩ
V
P
bootstrap switch
11
stand-by
switch
stand-by
reference
voltage
VA
15
kΩ
x1
mute
switch
12
15
k Ω
mute
reference
voltage
TDA1516CQ
18 kΩ
power stage
2
kΩ
9
8
VA
13
4
60
kΩ
100
Ω
C
m
V
mute switch
input
reference
voltage
bootstrap switch
signal
ground
power
ground
P
(substrate)
3
10
7
MBC084
Fig.1 Block diagram.
3
July 1994
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
PINNING
FUNCTIONAL DESCRIPTION
The TDA1516CQ contains two identical amplifiers with
differential input stages. It can be used for bridge
applications. The gain of each amplifier is fixed at 20 dB.
A special feature of this device is the mute/stand-by
switch, which has the following features:
SYMBOL
PIN
DESCRIPTION
non-inverting input 1
−INV1
INV
1
2
inverting input
GND1
Vref
3
ground (signal)
reference voltage
output 1
• low stand-by current (< 100 µA)
4
OUT1
BS1
5
• low mute/stand-by switching current (low cost supply
switch)
6
bootstrap 1
• mute condition.
GND2
BS2
7
ground (substrate)
bootstrap 2
8
OUT2
VP
9
output 2
10
11
12
13
supply voltage
mute/stand-by switch
supply voltage ripple rejection
non-inverting input 2
M/SB
RR
−INV2
handbook, halfpage
INV1
1
2
3
INV
GND1
V
4
ref
OUT1
BS1
5
6
7
TDA1516CQ
GND2
BS2
8
9
OUT2
V
P
10
M/SS 11
RR 12
INV2 13
MLA704
Fig.2 Pin configuration.
July 1994
4
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
operating
−
−
−
18
V
non-operating
30
45
V
V
load dump protected; during
50 ms; rise time ≥ 2.5 ms
VPSC
VPR
AC and DC short-circuit safe voltage
reverse polarity
−
−
−
−
−
−
18
V
6
V
energy handling capability at outputs
non-repetitive peak output current
repetitive peak output current
total power dissipation
VP = 0
200
6
mJ
A
IOSM
IORM
Ptot
4
A
Tcase < 75 °C; (see Fig.3)
25
W
°C
°C
Tstg
Tvj
storage temperature range
virtual junction temperature
−55
+150
+150
−
Fig.3 Power derating curve.
July 1994
5
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; unless otherwise specified. See note 1.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VP
positive supply voltage range
quiescent current
note 2
note 3
6.0
14.4
40
18
80
−
V
IP
−
−
−
mA
V
VO
∆Vos
DC output voltage
6.8
−
DC output offset voltage (pins 5 and 9)
100
mV
Mute/stand-by switch
Vsw
switch-on voltage level
8.5
−
−
V
MUTE CONDITION
Vmute
VO
mute voltage
3.3
−
−
6.4
2
V
output signal in mute position
VI = 1 V (max);
−
mV
f = 20 Hz to10 kHz
∆Vos
DC output offset voltage (pins 5 and 9)
−
−
100
mV
STAND-BY CONDITION
Vsb
Isb
stand-by voltage
0
−
−
−
−
−
2
V
DC standby current
V
11 ≤ 0.5 V
0.5 < V11 ≤ 2 V
11 ≤ V10; note 4
short-circuit to GND; note 5
−
100
500
60
−
µA
µA
µA
mA
−
Isw
IP
switch-on current
supply current
V
25
5.5
July 1994
6
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; unless otherwise specified. See note 1.
SYMBOL
PARAMETER
output power
CONDITIONS
THD = 0.5%
MIN.
15
TYP.
MAX. UNIT
PO
17
−
W
W
W
W
W
W
THD = 10%
20
21
−
22
−
−
−
−
−
THD = 10%; note 6
VP = 13.2 V; THD = 0.5%
VP = 13.2 V; THD = 10%
VP = 13.2 V; THD = 10%;
note 6
24
13.5
17
−
−
19
THD
B
total harmonic distortion
power bandwidth
PO = 1 W
−
−
0.05
20 to
15 000
25
−
−
%
THD = 0.5%; PO = −1 dB
with respect to 15 W
−3 dB; note 7
Hz
flow
low frequency roll-off
−
−
Hz
fhigh
Gv
high frequency roll-off
−1 dB
20
25
−
−
kHz
dB
closed loop voltage gain
supply voltage ripple rejection
26
27
SVRR
ON; notes 8 and 9
45
48
48
80
25
−
−
dB
dB
dB
dB
kΩ
ON; notes 8 and 10
MUTE; notes 8 to 10
stand-by; notes 8 to 10
−
−
−
−
−
−
ZI
input impedance
30
38
Vno
noise output voltage
ON; RS = 0; note 11
RS = 10 kΩ; note 12
MUTE; note 12
−
−
−
70
−
µV
µV
µV
100
60
200
−
Notes
1. All characteristics are measured using the circuit shown in Fig.4
2. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V
3. At 18 V < V < 30 V, the DC output voltage ≤ VP/2
4. If V11 > V10, then I11 must be ≤ 10 mA
5. Conditions: V11 = 0; short-circuit output to GND; switch V11 to mute or on condition (rise time V11 > 10 µs)
6. With bootstrap and a resistor of 100 kΩ from VP/2 to the positive supply voltage (VP). (Bootstrap capacitor of 47 µF)
7. Frequency response externally fixed
8. Ripple rejection measured at the output with a source-impedance of 0 Ω (max. ripple amplitude of 2 V)
9. Frequency = 100 Hz
10. Frequency = 1 to 10 kHz
11. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz
12. Noise output voltage independent of RS (Vin = 0)
July 1994
7
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
stand - by
switch
V
P
2200
µF
100
nF
4
12
11
10
input
reference
voltage
internal
1/2 V
P
2
TDA1516CQ
60
kΩ
60
kΩ
20 dB
20 dB
220 nF
1
13
input 2
to pin 13
to pin
2
3
7
6
5
9
8
MBC085
signal
ground ground
power to V
to V
P
P
R
= 4 Ω
L
Fig.4 Application diagram.
July 1994
8
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
non-concave
x
D
h
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
13
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.2 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
3.4
1.7 5.08
0.8
4.3
0.25 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-03-11
97-12-16
SOT141-6
July 1994
9
Philips Semiconductors
Product specification
24 W BTL car radio power amplifier
TDA1516CQ
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
10
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