TDA1517/N3 [NXP]
IC 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9, PLASTIC, SOT-110-1, SILMPF-9, Audio/Video Amplifier;
| 型号： | TDA1517/N3 |
| 厂家： | 
NXP |
| 描述： | IC 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9, PLASTIC, SOT-110-1, SILMPF-9, Audio/Video Amplifier 局域网 放大器 商用集成电路 |
| 文件： | 总15页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1517; TDA1517P
2 x 6 W stereo power amplifier
Product specification
2004 Feb 18
Supersedes data of 2002 Jan 17
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
FEATURES
GENERAL DESCRIPTION
• Requires very few external components
• High output power
The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF), a plastic rectangular-bent single in-line
medium power package with fin (RBS9MPF) or a plastic
heat-dissipating dual in-line package (HDIP18). The
device is primarily developed for multi-media applications.
• Fixed gain
• Good ripple rejection
• Mute/standby switch
• AC and DC short-circuit safe to ground and VP
• Thermally protected
• Reverse polarity safe
• Capability to handle high energy on outputs (VP = 0 V)
• No switch-on/switch-off plop
• Electrostatic discharge protection.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
6.0
TYP.
14.4
MAX.
18.0
UNIT
VP
V
A
IORM
Iq(tot)
Isb
repetitive peak output current
total quiescent current
standby current
−
−
2.5
80
100
40
−
−
40
0.1
−
mA
μA
μA
kΩ
W
−
Isw
switch-on current
−
|ZI|
input impedance
50
−
−
Po
output power
RL = 4 Ω; THD = 0.5%
RL = 4 Ω; THD = 10%
fi = 100 Hz to 10 kHz
5
−
−
6
−
W
SVRR
αcs
supply voltage ripple rejection
channel separation
48
40
19
−
−
−
dB
dB
dB
μV
°C
−
−
Gv
closed loop voltage gain
noise output voltage (RMS value)
crystal temperature
20
50
−
21
−
Vno(rms)
Tc
−
150
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA1517/N3
SIL9MPF
plastic single in-line medium power package with fin; 9 leads
SOT110-1
SOT352-1
TDA1517/N3/S5
RBS9MPF plastic rectangular-bent single in-line medium power package with
fin; 9 leads
TDA1517P
HDIP18
plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
2004 Feb 18
2
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
BLOCK DIAGRAM
non-inverting
input 1
1
mute switch
C
m
60
kΩ
4
output 1
VA
2
kΩ
power stage
18 kΩ
V
P
8
mute/stand-by
switch input
stand-by
switch
stand-by
reference
voltage
VA
15 kΩ
x 1
mute
supply voltage
ripple rejection
output
switch
3
15 kΩ
mute
reference
voltage
TDA1517
18 kΩ
2
kΩ
6
VA
output 2
non-inverting
input 2
9
60
kΩ
C
7
m
mute switch
input
reference
voltage
power stage
signal
ground
power
ground
(substrate)
2
5
MLC351
V
SGND
PGND
P
Fig.1 Block diagram.
3
2004 Feb 18
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
PINNING
SYMBOL
PIN
DESCRIPTION
−INV1
SGND
SVRR
OUT1
PGND
OUT2
VP
1
2
3
4
5
6
7
8
9
non-inverting input 1
signal ground
supply voltage ripple rejection output
output 1
power ground
output 2
supply voltage
M/SS
−INV2
mute/standby switch input
non-inverting input 2
handbook, halfpage
handbook, halfpage
INV1
SGND
SVRR
OUT1
PGND
OUT2
1
2
3
4
5
6
7
8
9
INV1
SGND
SVRR
OUT1
PGND
OUT2
1
2
3
4
5
6
7
8
9
18
17
16
15
TDA1517
TDA1517P 14
13
12
11
V
P
V
P
M/SS
INV2
M/SS
INV2
10
MLC352
MLC353
Pins 10 to 18 should be connected to GND or floating.
Fig.2 Pin configuration for SOT110-1 and
SOT352-1.
Fig.3 Pin configuration for SOT398-1.
FUNCTIONAL DESCRIPTION
The TDA1517 contains two identical amplifiers with
differential input stages. The gain of each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:
• Low standby current (<100 μA)
• Low mute/standby switching current
(low cost supply switch)
• Mute condition.
2004 Feb 18
4
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
18
UNIT
operating
no signal
−
−
−
−
−
−
−
−
V
V
V
V
20
VP(sc)
VP(r)
ERGO
IOSM
IORM
Ptot
AC and DC short-circuit safe voltage
reverse polarity
18
6
energy handling capability at outputs
non-repetitive peak output current
repetitive peak output current
total power dissipation
VP = 0 V
see Fig.4
200
4
mJ
A
2.5
15
A
W
°C
°C
°C
Tstg
storage temperature
−55
−40
−
+150
+85
150
Tamb
Tc
operating ambient temperature
crystal temperature
THERMAL RESISTANCE
SYMBOL
Rth(j-c)
TYPE NUMBER
TDA1517/N3; TDA1517/N3/S5 thermal resistance from junction to case
TDA1517P thermal resistance from junction to pins
TDA1517/N3;TDA1517/N3/S5; thermal resistance from junction to
TDA1517P ambient
PARAMETER
VALUE
UNIT
K/W
K/W
K/W
8
Rth(j-p)
15
50
Rth(j-a)
MLC354
18
handbook, halfpage
P
(W)
12
(1)
(2)
6
0
25
0
50
100
150
o
T
( C)
amb
(1) Rth j-c = 8 K/W.
(2) Rth j-p = 15 K/W.
Fig.4 Power derating curve.
2004 Feb 18
5
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
DC CHARACTERISTICS
VP = 14.4 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VP
supply voltage
note 1
6.0
−
14.4
40
18.0
80
−
V
Iq(tot)
VO
total quiescent current
DC output voltage
mA
V
−
6.95
Mute/standby switch
V8
switch-on voltage level
see Fig.5
8.5
−
−
−
V
Mute condition
VO
output signal in mute position
VI(max) = 1 V; fi = 20 Hz to 15 kHz
−
2
mV
Standby condition
Isb
DC current in standby condition
switch-on current
−
−
−
100
40
μA
μA
Vsw
12
Note
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
2004 Feb 18
6
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
AC CHARACTERISTICS
VP = 14.4 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
PARAMETER
output power
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Po
THD = 0.5%; note 1
THD = 10%; note 1
Po = 1 W
4
5
−
−
−
−
−
W
5.5
−
6.0
0.1
45
−
W
THD
flr
total harmonic distortion
low frequency roll-off
high frequency roll-off
closed loop voltage gain
supply voltage ripple rejection
on
%
at −3 dB; note 2
at −1 dB
−
Hz
kHz
dB
fhr
20
19
Gv
20
21
SVRR
note 3
48
48
80
50
−
−
dB
dB
dB
kΩ
mute
−
−
standby
−
−
|Zi|
input impedance
noise output voltage
on
60
75
Vno
Rs = 0 Ω; note 4
Rs = 10 Ω; note 4
note 5
−
50
70
50
−
−
μV
μV
μV
dB
dB
on
−
100
−
mute
−
αcs
channel separation
channel unbalance
Rs = 10 Ω
40
−
−
|ΔGv|
0.1
1
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.
4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage independent of Rs (VI = 0 V).
2004 Feb 18
7
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
MLC355
handbook, halfpage
18
V
11
(V)
ON (I = 40 mA)
P
8.5
6.4
mute (I = 40 mA)
P
3.3
2
standby (I
100 μA)
P
0
Fig.5 Standby, mute and on conditions.
APPLICATION INFORMATION
standby switch
V
P
100
2200
μF
μF
100 nF
3
8
7
input
reference
voltage
internal
1/2 V
P
TDA1517
20 dB
20 dB
60 kΩ
60 kΩ
220 nF
220 nF
1
9
input 1
input 2
2
5
6
4
MLC356
1000 μF
1000 μF
signal
ground
power
ground
Fig.6 Application circuit diagram.
8
2004 Feb 18
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
PACKAGE OUTLINES
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25
1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-02-25
03-03-12
SOT110-1
2004 Feb 18
9
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
RBS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads
SOT352-1
D
L
1
9
b
e
Z
b
w
M
2
b
1
D
1
q
A
2
P
P
1
Q
A
3
q
2
q
1
A
E
pin 1 index
c
seating plane
v
M
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(2)
Z
max.
(1)
2
(2)
(2)
UNIT
A
A
b
b
b
c
D
D
E
e
L
P
P
Q
q
q
q
2
v
w
3
1
2
1
1
1
max.
14.45
13.95
8.7 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.8 2.75 3.4 1.75 15.1
3.3 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.6 0.25
1
Notes
1. Dimension is specified at seating plane.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
97-12-16
03-03-12
SOT352-1
2004 Feb 18
10
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
HDIP18: plastic heat-dissipating dual in-line package; 18 leads
SOT398-1
D
M
E
A
2
A
A
1
L
e
c
w
M
Z
b
1
(e )
1
b
b
2
10
M
H
18
pin 1 index
E
9
1
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
1
2
1
E
H
max.
min.
max.
max.
1.40
1.14
0.67
0.50
1.05
0.75
0.47
0.38
21.85
21.35
6.5
6.2
3.9
3.1
8.32
8.02
8.7
7.7
4.7
0.51
3.7
2.54
0.1
7.62
0.3
0.25
0.01
1
0.06
0.04
0.03
0.02
0.04
0.03
0.02
0.01
0.87
0.84
0.26
0.24
0.15
0.12
0.33
0.32
0.34
0.30
inches
0.19
0.02
0.15
0.04
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
95-01-25
03-02-13
SOT398-1
2004 Feb 18
11
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
SOLDERING
The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
Soldering by dipping or by solder wave
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
WAVE
CPGA, HCPGA
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP(2)
suitable
suitable(1)
−
not suitable
Notes
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2. For PMFP packages hot bar soldering or manual soldering is suitable.
2004 Feb 18
12
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
2004 Feb 18
13
NXP Semiconductors
Product specification
2 x 6 W stereo power amplifier
TDA1517; TDA1517P
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
2004 Feb 18
14
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R30/05/pp15
Date of release: 2004 Feb 18
Document order number: 9397 750 12926
相关型号：
TDA1517/N3/S5
IC 6 W, 2 CHANNEL, AUDIO AMPLIFIER, PSFM9, PLASTIC, SOT-352-1, RBSMPF-9, Audio/Video Amplifier
NXP
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