TDA1575T [NXP]

FM front end circuit for CENELEC EN 55020 applications; 对于CENELEC EN 55020的应用程序的FM前端电路


型号：	TDA1575T
厂家：	NXP
描述：	FM front end circuit for CENELEC EN 55020 applications 对于CENELEC EN 55020的应用程序的FM前端电路
文件：	总16页 (文件大小：190K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

INTEGRATED CIRCUITS

DATA SHEET

TDA1575T

FM front end circuit for

CENELEC EN 55020 applications

April 1993

Preliminary speciﬁcation

Supersedes data of October 1990

File under Integrated Circuits, IC01

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

FEATURES

• Bipolar integrated FM front end circuit, designed for use

in car radios and home receivers

• Fulfils CENELEC EN 55020 requirements

• Radio frequency range of

76 to 90 MHz (Japan) or

87.5 to 108 MHz (Europe, USA)

• Low noise oscillator, buffered oscillator output

• Double balanced mixer

• Internal buffered mixer driving

• Linear IF amplifier, suitable for ceramic IF filters

• Regulated reference voltage.

QUICK REFERENCE DATA

SYMBOL

V_P

PARAMETER

MIN.

TYP.

8.5

MAX.

UNIT

supply voltage

−

I_P

supply current, without mixer

reference voltage output

mixer input impedance

noise ﬁgure of mixer

−

V_REF

Z_I

4.2

Ω

dBµV

dBC

Ω

EMF1

V_OSC

THD

G_v

3rd order intermodulation

oscillator buffer output signal (RMS value)

total harmonic distortion

IF gain

115

−

−15

IF noise ﬁgure

6.5

300

Z_I

IF input impedance

Z_O

IF output impedance

Ω

EMF2

AGC wideband threshold (RMS value)

ORDERING INFORMATION

PACKAGE

EXTENDED

TYPE NUMBER

PINS

PIN POSITION

mini-pack

MATERIAL

CODE

SOT109A⁽¹⁾

TDA1575T

plastic

Note

1. SOT109-1; 1996 August 29.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

Coils TOKO

L1: MC-108 514 HNE-150023S14; L = 78 nH, N = 4 turns

L2: MC-111 E516 HNS-200057; L = 80 nH

L3: A119 ACS-17114 FTT

Fig.1 Block diagram and test circuit.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

PINNING

SYMBOL

DESCRIPTION

RF input 1 to mixer

MIXI1

MIXI2

AGCI

GND

V_REF

OSCO

OSCI1

OSCI2

RF input 2 to mixer

HF input to automatic gain control

ground (0 V)

reference voltage output

oscillator output

oscillator input 1

oscillator input 2

buffered oscillator output

IFO

10 linear FM IF output

11 FM IF input 1

IFI1

IFI2

12 FM IF input 2

V_P

13 supply voltage (+8.5 V)

14 mixer output 1

MIXO1

MIXO2

AGCO

15 mixer output 2

Fig.2 Pin configuration.

16 automatic gain control output

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL

V_P

PARAMETER

MIN.

MAX.

UNIT

supply voltage (pin 13)

voltage at mixer output

total power dissipation

V_P

V_{14, 15}

P_tot

380

°C

T_stg

storage temperature range

operating ambient temperature range

electrostatic handling (see note 1)

all pins except 3 and 10

pin 3

−55

−40

+150

+85

T_amb

V_ESD

°C

−

±2000

+2000

−1000

+1500

−2000

pin 10

Note to the limiting values

1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

CHARACTERISTICS

V_P= 8.5 V and T_amb= +25°C, measurements taken in Fig.1 with f₀= 98 MHz (EMF1) unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V_Psupply voltage (pin 13) 8.5 10

I_P

supply current

without mixer

V_REF

reference voltage (pin 5)

I₅≤ 3 mA

3.9

4.2

4.4

Mixer

I₁₄₊₁₅

V_1,2

mixer supply current (pins 14 and 15)

DC voltage input (pins 1 and 2)

input impedance

−

Z_1,2

−

Ω

V_14,15

C_14,15

G_P

DC output voltage (pins 14 and 15)

output capacitance

−

115

dBµV

conversion power gain

3rd order intercept point

noise ﬁgure

note 1

−

EMF1_IP3

−

total noise ﬁgure

including

−

transforming network

Oscillator

V_7,8

V₆

DC input voltage (pins 7 and 8)

DC output voltage (pin 6)

residual FM at pin 6

−

1.3

2.0

2.2

−

∆f

f = 300 to 15000 Hz;

de-emphasis 50 µs

Oscillator buffered output (pin 9)

V_O

V₉

output signal (RMS value)

DC output voltage

R_L= 500 Ω; C_L= 2 pF 75

−

R₉

DC output resistor

950

−15

−37

Ω

THD

f_S

total harmonic distortion

spurious frequencies

dBC

EMF1 = 2 V;

R_S= 50 Ω;

−

f_OSC= 108.7 MHz

Automatic gain control (AGC)

R₃

C₃

V₁₆

I₁₆

input resistance (pin 3)

input capacitance

−

kΩ

−

AGC output swing (DC)

output current at I₃= 0

output current at U₃= 2 V

threshold (RMS value)

Figs 3 and 4

V₁₆= ¹⁄₂V_P

0.5

−25

−

V_P− 0.3 V

−50

−

−150

µA

V₁₆= 7 to 10 V

I₁₆= 0; V₁₆= ¹⁄₂V_P;

EMF2

−

Figs 4 and 5

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

SYMBOL

PARAMETER

CONDITIONS

IF = 10.7 MHz

MIN.

TYP.

MAX.

UNIT

Linear IF ampliﬁer

V_11,12

Z_12-11

C_12-11

V₁₀

DC input voltage (pins 11 and 12)

input impedance

−

1.25

−

240

−

300

4.4

300

360

−

Ω

input capacitance

DC output voltage (pin 10)

output impedance

−

Z₁₀

240

−

360

−

Ω

C₁₀

output capacitance

V_O

output signal (RMS value)

IF voltage gain (20 log (V₁₀₋₄/ V₁₂₋₁₁))

IF voltage gain deviation

noise ﬁgure

−1 dB compression

−

650

−

G_v

−

∆G_v

T_amb= −40 to +85 °C

R_S= 300 Ω

−

6.5

−

Note

1. G_P= 10 log (4V_{o mix}×10.7 MHz) / (EMF2 × 98 MHz)²× (R_S1/ R_ML).

Fig.3 AGC output voltage V₁₆as a function of

V_i3RMS at I₁₆= 0, measured in test circuit

Fig.1.

Fig.4 AGC output current I₁₆as a function of

V_i3RMS at V₁₆= 8.5 V, measured in test

circuit Fig.1.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

APPLICATION INFORMATION

Operating characteristics

Measured in application circuit Fig.7, according to “CENELEC EN 55020, Chapter 4.1 (passive interference

suppression)”. Measurements are shown in Figs. 8 and 9.

SYMBOL

PARAMETER

supply voltage

CONDITIONS

MIN.

TYP.

MAX.

UNIT

V_S

8.5

−

I_S

total supply current

−

f_RF

V_tune

tuning range of RF input

tuning voltage of RF input

87.5

108

MHz

−

gain (20 log V_{O IF}/ V_ant

input sensitivity

)

−

µV

V_{i ant}

S/N = 26 dB;

−

R_ant= 150 Ω

image rejection

f = 98 MHz

f = 98 MHz;

−

RSS

repeat spot suppression

V_{i ant}= 10 µV

DBS

CBS

double beat suppression

f1 = 93 MHz;

f2 = 98 MHz

DBS1

_tune= 88 MHz

_tune= 103 MHz

−

DBS2

DBS3

f_tune= 90.15 MHz

continuous beat suppression

f1 = 90 MHz;

f2 = 100.7 MHz

f_tune= 95 MHz

SG1: Wanted carrier; modulated with f = 1 kHz, ∆f = ±40 kHz (for audio reference)

SG2: Unwanted carrier; modulated with f = 1 kHz, FM: ∆f = ±40 kHz (in band) or AM: m = 80% (out of band)

increase level of SG2 until S/N = 26 dB w.r.t. wanted modulation (for car radio, home radio S/N = 40 dB)

Fig.5 Set-up for CENELEC EN 55020 passive interference measurements.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

Fig.6 PCB layout of FM front end unit.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

Fig.8 Interference level as a function of detuning for S/N = 26 dB;

IN-BAND passive interference (CENELEC EN 55020).

Fig.9 Interference level as a function of detuning for S/N = 26 dB;

OUT-OF-BAND passive interference (CENELEC EN 55020).

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

Fig.10 Internal circuits.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

(A )

pin 1 index

detail X

2.5

scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

10.0

9.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.27

0.050

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.39

0.014 0.0075 0.38

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.020

0.028

0.012

inches

0.069

0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-01-23

97-05-22

SOT109-1

076E07S

MS-012AC

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

SOLDERING

Introduction

Wave soldering

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Reﬂow soldering

Reflow soldering techniques are suitable for all SO

packages.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

April 1993

Philips Semiconductors

Preliminary speciﬁcation

FM front end circuit for

CENELEC EN 55020 applications

TDA1575T

NOTES

April 1993

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

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Tel. +43 1 60 101, Fax. +43 1 60 101 1210

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Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Belgium: see The Netherlands

Brazil: see South America

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

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Romania: see Italy

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Tel. +1 800 234 7381

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Tel. +7 095 755 6918, Fax. +7 095 755 6919

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Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

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TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874

Indonesia: see Singapore

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Tel. +90 212 279 2770, Fax. +90 212 282 6707

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

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Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

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MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

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Tel. +1 800 234 7381

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

Middle East: see Italy

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Internet: http://www.semiconductors.philips.com

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA54

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

547027/00/03/pp16

Date of release: April 1993

Document order number: 9397 750 02439

TDA1575T [NXP]

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