TDA2545A [NXP]

Quasi-split-sound circuit; 准分音电路


型号：	TDA2545A
厂家：	NXP
描述：	Quasi-split-sound circuit 准分音电路
文件：	总8页 (文件大小：79K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

INTEGRATED CIRCUITS

DATA SHEET

TDA2545A

Quasi-split-sound circuit

February 1985

Product speciﬁcation

File under Integrated Circuits, IC02

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

GENERAL DESCRIPTION

The TDA2545A is a monolithic integrated circuit for quasi-split-sound processing in television receivers.

Features

• 3-stage gain controlled i.f. amplifier

• A.G.C. circuit

• Reference amplifier and limiter amplifier for vision carrier (V.C.) processing

• Linear multiplier for quadrature demodulation

QUICK REFERENCE DATA

Supply voltage (pin 11)

V_P= V_11-13

I_P= I₁₁

typ.

Supply current (pin 11)

µV

Minimum i.f. vision carrier input voltage (r.m.s. value)

Output voltage; 5,5 MHz (r.m.s. value)

Output voltage; 5,742 MHz (r.m.s. value)

I.F. control range

V_VC1-16(rms)

V_12-13(rms)

∆G_v

150

100

Signal-to-weighted-noise (rel. to 1 kHz; 30 kHz deviation)

at 5,5 MHz

S + W/W

typ.

for 2T/20T pulses with white bars

at 5,742 MHz

PACKAGE OUTLINES

16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19.

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.).

Fig.1 Block diagram.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage (pin 11)

V_P= V_11-13max.

13,2

−25 to + 150 °C

0 to + 70 °C

Storage temperature range

Operating ambient temperature range

T_stg

T_amb

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

CHARACTERISTICS

V_P= V_11-13= 12 V; T_amb= 25 °C; measured at f_VC= 38,9 MHz, f_SC1= 33,4 MHz, f_SC2= 33,158 MHz:

Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%

residual carrier).

Vision carrier amplitude (r.m.s. value) is V_VC= 10 mV.

Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.

Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = ± 30 kHz.

For measuring circuit see Fig.2; unless otherwise speciﬁed.

PARAMETER

SYMBOL

MIN.

TYP. MAX. UNIT

Supply (pin 11)

Supply voltage

Supply current

V_P= V_11-13

10,8

13,2

I_P= I₁₁

I.F. ampliﬁer

Input voltage for start of gain control

(intercarrier signals −3 dB)

Input voltage for end of gain control

(intercarrier signals + 1 dB)

I.F. gain control range

V_VC1-16(rms)

−

150

200

µV

V_VC1-16(rms)

∆G_v

100

250

−

Control voltage range (see Fig.3)

Input resistance

V_3-13

−

V_p

−

R_1-16

−

2,5

1,5

kΩ

Input capacitance

C_1-16

−

Intercarrier generation

Output voltage; 5,5 MHz (r.m.s. value)

Output voltage; 5,742 MHz (r.m.s. value)

D.C. output voltage

V_12-13(rms)

V_12-13

−

100

5,9

−

140

−

Allowable d.c. load resistance at the output

Allowable output current

R_12-13

−

kΩ

−I₁₂

−

Intercarrier signal-to-noise (see note 1)

(measured behind the FM demodulators)

weighted according to CCIR 468-2, quasi-peak

a. 2T/20T pulses with white bars (see also Fig.4)

at 5,5 MHz

S+W/W

−

at 5,742 MHz

b. 6 kHz sinewave

at 5,5 MHz

S+W/W

−

at 5,742 MHz

c. black level (sync pulses only)

at 5,5 MHz

S+W/W

−

at 5,742 MHz

Note

1. Incidental phase on the vision carrier, caused by TV transmitter, has to be less than 0,5 degrees for black to white

transient (equivalent to S+W/W = 56 dB for 6 kHz sinewave).

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

Fig.2 Measuring circuit for TDA2545A.

Fig.3 Control voltage at pin 3 as a function of the input voltage V_VC1-16(rms).

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

Fig.4 Signal-to-weighted-noise ratio depending on video modulation.

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

w M

(e )

pin 1 index

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

min.

max.

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

8.25

7.80

9.5

8.3

4.7

0.51

3.7

2.54

0.10

7.62

0.30

0.254

0.01

2.2

0.021

0.015

0.013

0.009

0.86

0.84

0.32

0.31

0.055

0.045

0.26

0.24

0.15

0.13

0.37

0.33

inches

0.19

0.020

0.15

0.087

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-10-02

95-01-19

SOT38-1

050G09

MO-001AE

February 1985

Philips Semiconductors

Product speciﬁcation

Quasi-split-sound circuit

TDA2545A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and

surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for

surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often

used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the

joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the printed-circuit board has been pre-heated, forced cooling may

be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more

than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

February 1985

TDA2545A [NXP]

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