TDA7000N [NXP]
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| 型号： | TDA7000N |
| 厂家： | 
NXP |
| 描述： | 暂无描述 |
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| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA7000
FM radio circuit
May 1992
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
GENERAL DESCRIPTION
The TDA7000 is a monolithic integrated circuit for mono FM portable radios, where a minimum on peripheral components
is important (small dimensions and low costs).
The IC has an FLL (Frequency-Locked-Loop) system with an intermediate frequency of 70 kHz. The i.f. selectivity is
obtained by active RC filters. The only function which needs alignment is the resonant circuit for the oscillator, thus
selecting the reception frequency. Spurious reception is avoided by means of a mute circuit, which also eliminates too
noisy input signals. Special precautions are taken to meet the radiation requirements.
The TDA7000 includes the following functions:
• R.F. input stage
• Mixer
• Local oscillator
• I.F. amplifier/limiter
• Phase demodulator
• Mute detector
• Mute switch
QUICK REFERENCE DATA
Supply voltage range (pin 5)
V
2,7 to 10 V
typ. 8 mA
1,5 to 110 MHz
P
Supply current at V = 4,5 V
I
f
P
P
R.F. input frequency range
Sensitivity for -3 dB limiting
(e.m.f. voltage)
rf
(source impedance: 75 Ω; mute disabled)
Signal handling (e.m.f. voltage)
(source impedance: 75 Ω)
EMF typ. 1,5 µV
EMF typ. 200 mV
A.F. output voltage at R = 22 kΩ
V
typ.
75 mV
L
o
PACKAGE OUTLINE
18-lead DIL; plastic (SOT102HE); SOT102-1; 1996 July 24.
May 1992
2
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.1 Block diagram.
3
May 1992
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 5)
V
V
max.
12 V
P
Oscillator voltage (pin 6)
V −0,5 to V + 0,5 V
P P
6-5
Total power dissipation
see derating curve Fig.2
Storage temperature range
Operating ambient temperature range
T
T
−55 to +150 °C
0 to + 60 °C
stg
amb
Fig.2 Power derating curve.
D.C. CHARACTERISTICS
V = 4,5 V; T
= 25 °C; measured in Fig.4; unless otherwise specified
amb
P
PARAMETER
SYMBOL
MIN.
TYP.
4,5
MAX.
UNIT
Supply voltage (pin 5)
Supply current
V
2,7
10
V
P
at V = 4,5 V
I
I
−
−
−
−
−
8
−
−
−
−
−
mA
µA
V
P
P
Oscillator current (pin 6)
Voltage at pin 14
280
1,35
60
6
V
14-16
Output current at pin 2
I
µA
V
2
Voltage at pin 2; R = 22 kΩ
V
1,3
L
2-16
May 1992
4
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
A.C. CHARACTERISTICS
V = 4,5 V; T
= 25 °C; measured in Fig.4 (mute switch open, enabled); f = 96 MHz (tuned to max. signal
rf
P
amb
at 5 µV e.m.f.) modulated with ∆f = ± 22,5 kHz; f = 1 kHz; EMF = 0,2 mV (e.m.f. voltage at a source impedance of
m
75 Ω); r.m.s. noise voltage measured unweighted (f = 300 Hz to 20 kHz); unless otherwise specified.
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Sensitivity (see Fig.3)
(e.m.f. voltage)
for −3 dB limiting;
muting disabled
for −3 dB muting
for S/N = 26 dB
EMF
EMF
EMF
−
−
−
1,5
−
−
−
µV
6
µV
µV
5,5
Signal handling (e.m.f. voltage)
for THD < 10%; ∆f = ± 75 kHz
Signal-to-noise ratio
EMF
S/N
−
−
200
60
−
−
mV
dB
Total harmonic distortion
at ∆f = ± 22,5 kHz
THD
THD
−
−
0,7
2,3
−
−
%
%
at ∆f = ± 75 kHz
AM suppression of output voltage
(ratio of the AM output signal
referred to the FM output signal)
FM signal: f = 1 kHz; ∆f = ± 75 kHz
m
AM signal: f = 1 kHz; m = 80%
AMS
RR
−
−
−
50
−
−
−
dB
dB
mV
m
Ripple rejection (∆V = 100 mV;
P
f = 1 kHz)
10
Oscillator voltage (r.m.s. value)
at pin 6
V
250
6-5(rms)
Variation of oscillator frequency
with supply voltage (∆V = 1 V)
∆f
−
−
−
−
60
−
−
−
−
kHz/V
dB
P
osc
Selectivity
S
S
45
+300
−300
35
dB
A.F.C. range
∆f
± 300
kHz
rf
Audio bandwidth at ∆V = 3 dB
o
measured with pre-emphasis (t = 50 µs)
B
−
−
10
75
−
−
kHz
mV
A.F. output voltage (r.m.s. value)
at R = 22 kΩ
V
o(rms)
L
Load resistance
at V = 4,5 V
R
R
−
−
−
−
22
47
kΩ
kΩ
P
L
at V = 9,0 V
P
L
May 1992
5
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.3 A.F output voltage (V ) and total harmonic distortion (THD) as a function of the e.m.f. input voltage (EMF)
o
with a source impedance (R ) of 75 Ω: (1) muting system enabled; (2) muting system disabled.
S
Conditions:
0 dB = 75 mV; f = 96 MHz.
rf
for S + N curve: ∆f = ± 22,5 kHz; f = 1 kHz.
m
for THD curve; ∆f = ± 75 kHz; f = 1 kHz.
m
Notes
1. The muting system can be disabled by feeding a current of about 20 µA into pin 1.
2. The interstation noise level can be decreased by choosing a low-value capacitor at pin 3. Silent tuning can be
achieved by omitting this capacitor.
May 1992
6
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.4 Test circuit; for printed-circuit boards see Figs 5 and 6.
7
May 1992
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
Fig.5 Track side of printed-circuit board used for the circuit of Fig.4.
Fig.6 Component side of printed-circuit board showing component layout used for the circuit of Fig.4.
May 1992
8
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
18
10
M
H
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
0.85
0.055 0.021 0.055 0.013
0.044 0.015 0.044 0.009
0.86
0.84
0.26
0.24
0.15
0.13
0.32
0.31
0.37
0.33
inches
0.19
0.020
0.15
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-10-14
95-01-23
SOT102-1
May 1992
9
Philips Semiconductors
Product specification
FM radio circuit
TDA7000
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
SOLDERING
Introduction
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 1992
10
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NXP
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