TDA8442 [NXP]
I2C-bus interface for colour decoders; I2C总线接口，用于色解码器
| 型号： | TDA8442 |
| 厂家： | 
NXP |
| 描述： | I2C-bus interface for colour decoders |
| 文件： | 总10页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8442
2
I C-bus interface for colour
decoders
March 1991
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
GENERAL DESCRIPTION
The TDA8442 provides control of four analogue functions
and has one high-current and two switching outputs.
Control of the IC is performed via the two-line, bidirectional
2
I C-bus.
Features
PACKAGE OUTLINE
• Four analogue control outputs
16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 23.
• One high-current output port (npn open emitter)
• Two switching output ports (npn collector with internal
pull-up resistor)
2
• I C-bus slave receiver
• Power-down reset.
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
10.8
TYP.
12.0
MAX
13.2
UNIT
Supply voltage (pin 9)
Supply current
V
V
P
no outputs loaded
no outputs loaded
I
8
13
−
18
1
mA
W
P
Total power dissipation
P
−
tot
Operating ambient
temperature range
T
−20
−
+ 70
°C
amb
Fig.1 Block diagram.
2
March 1991
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
PINNING
PIN
SYMBOL
DAC1
DESCRIPTION
1
2
3
4
5
6
analogue output 1
analogue output 2
analogue output 3
DAC2
DAC3
SDA
SCL
P2
2
serial data line; I C-bus
2
serial clock line; I C-bus
Port 2 npn collector output
with internal pull-up
resistor
7
8
9
n.c.
not connected
GND
supply return (ground)
positive supply voltage
not connected
V
P
10
11
n.c.
P1
Port 1 open npn emitter
output
12
13
14
15
16
P2N
n.c.
inverted P2 output
not connected
n.c.
not connected
n.c.
not connected
Fig.2 Pinning diagram
DAC0
analogue output 0
FUNCTIONAL DESCRIPTION
Control
Analogue control is facilitated by four 6-bit digital-to-analogue converters (DAC0 to DAC3).
2
The values of the output voltages from the DACs are set via the I C-bus.
The high-current output port (P1) is suitable for switching between internal and external RGB signals.
It is an open npn emitter output capable of sourcing 14 mA (min.).
The two output ports (P2 and P2N) can be used for NTSC/PAL switching. These are npn collector outputs with internal
pull-up resistors of 10 kΩ (typ.). Both outputs are capable of sinking up to 2 mA with a voltage drop of less than 400 mV.
If one output is switched on (LOW), the other output is switched off, and vice versa.
Reset
The power-down-reset mode occurs whenever the positive supply voltage falls below 8.5 V (typ.) and resets all registers
to a defined state.
March 1991
3
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
OPERATION
Write
2
2
The TDA8442 is controlled via the I C-bus (specifications for the I C-bus will be supplied on request).
Programming of the TDA8442 is performed using the format shown in Fig.3.
Fig.3 TDA8442 programming format.
Acknowledge (A) is generated by the TDA8442 only when a valid address is received and the device is not in the
power-down-reset mode (V > 8.5 V (typ.)).
P
Control
Control is implemented by the instruction bytes POD (port output data) and DACX (digital-to-analogue converter control)
together with the corresponding data/control bytes (see Fig.4).
Fig.4 Control porgramming.
POD bit P1
If a logic 1 is programmed, the P1 output is switched on. If a logic 0 is programmed or after a power-down-reset, the P1
output is switched off (high-impedance state).
POD bit P2/P2N
If a logic 1 is programmed, the P2 output is switched off and the P2N output is switched on (LOW). If a logic 0 is
programmed or after a power-down-reset, the P2 output is switched on (LOW) and the P2N output is switched off.
DAX bits AX5 to AX0
The digital-to-analogue converter selected corresponds to the decimal equivalent of the two bits X1 and X0. The output
voltage of the selected DAC is programmed using bits AX5 to AX0, the lowest value being with all data AX5 to AX0 at
logic 0 or when power-down-reset has been activated.
March 1991
4
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETER
Supply voltage range (pin 9)
SYMBOL
MIN.
−0.3
MAX.
UNIT
V
+13.2
V
P
Input/output voltage ranges
pin 4
V
V
V
V
V
V
P
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−
+13.2
+13.2
V
SDA
SCL
P2
pin 5
V
pin 6
V ; note 1
V
P
pin 11
V ; note 1
V
P1
P
pin 12
V ; note 1
V
P2N
DAX
tot
P
pin 1 to 3 and pin 16
Total power dissipation
Operating ambient temperature range
Storage temperature range
V ; note 1
V
P
1
W
°C
°C
T
T
−20
−55
+70
+150
amb
stg
Note
1. Pin voltage may exceed V if the current in that pin is limited to 10 mA.
P
CHARACTERISTICS
V = 12 V; T
= +25 °C; unless otherwise specified
amb
P
PARAMETER
Supplies
CONDITIONS
no outputs loaded
note 1
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply voltage (pin 9)
Supply current (pin 9)
V
10.8
12.0
13
13.2
18
V
P
I
8
mA
P
2
I C-bus inputs
SDA (pin 4); SCL (pin 5)
Input voltage HIGH
Input voltage LOW
Input current HIGH
Input current LOW
V
V
3.0
−0.3
−
−
−
−
−
V − 1
V
IH
P
1.5
10
10
V
IL
note 1
note 1
I
I
µA
µA
IH
IL
−
2
I C-bus output
SDA (pin 4)
open collector
Output voltage LOW
Maximum output sink current
I
= 3.0 mA
V
−
−
0.4
V
OL
OL
I
3
5
−
mA
OL
March 1991
5
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
PARAMETER
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Ports P2 and P2N
(pins 6 and 12)
npn collector output with
pull-up resistor to V
P
Internal pull-up resistor to V
R
5
10
15
kΩ
P
O
Output voltage switched
on (LOW)
I
= 2 mA
V
−
−
0.4
V
OL
OL
Maximum output sink current
I
2
5
−
mA
OL
Leakage current output
switched off
− I
−
−
25
µA
leak
open npn emitter output
V = 0 to 5 V
Port P1 (pin 11)
Output current switched on
I
14
−
−
−
mA
O
O
Leakage current switched off V = 0 to V
± I
−
100
µA
O
P
leak
note 2
Digital-to-analogue
outputs
DAC0 (pin 16)
Maximum output voltage
Minimum output voltage
unloaded; note 3
unloaded; note 3
V
V
V
3.0
0.15
16
−
−
−
4.25
1.0
72
V
O max
O min
O lsb
V
Positive value of smalles
step
I = 2 mA (1 lsb); note 3
mV
O
Deviation from linearity
Output impedance
I = 2 mA
∆V
−
−
2
−
−
−
45
30
6
mV
Ω
O
I = −2 to +2 mA
Z
O
O
Maximum output source
current
−I
mA
OH
Maximum output sink current
DAC1 (pin 1)
I
2
8
−
mA
OL
Maximum output voltage
Minimum output voltage
unloaded; note 3
unloaded; note 3
V
V
V
4.0
1.0
18
−
−
−
5.0
1.7
86
V
O max
O min
O lsb
V
Positive value of smallest
step
I = 2 mA (1 lsb); note 3
mV
O
Deviation from linearity
Output impedance
I = 2 mA
∆V
−
−
2
−
−
−
50
30
6
mV
Ω
O
I = −2 to +2 mA
Z
O
O
Maximum output source
current
−I
mA
OH
Maximum output sink current
I
2
8
−
mA
OL
March 1991
6
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
PARAMETER
DAC2 (pin 2)
CONDITIONS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Maximum output voltage
Minimum output voltage
unloaded; note 3
unloaded; note 3
V
V
V
4.0
−
−
−
5.0
V
V
O max
O min
O lsb
1.0
18
1.7
86
Positive value of smallest
step
I = 2 mA (1 lsb); note 3
mV
O
Deviation from linearity
Output impedance
I = 2 mA
∆V
−
−
2
−
−
−
50
30
6
mV
Ω
O
I = −2 to +2 mA
Z
O
O
Maximum output source
current
−I
mA
OH
Maximum output sink current
DAC3 (pin 3)
I
2
8
−
mA
OL
Maximum output voltage
Minimum output voltage
unloaded; note 3
unloaded; note 3
V
V
V
10.0
0.1
70
−
−
−
11.2
1.0
V
O max
O min
O lsb
V
Positive value of smallest
step
I = 2 mA (1 lsb); note 3
250
mV
O
Deviation from linearity
Output impedance
I = 2 mA
∆V
−
−
2
−
−
−
150
30
6
mV
Ω
O
I = −2 to +2 mA
Z
O
O
Maximum output source
current
−I
mA
OH
Maximum output sink current
I
2
6
8
−
mA
V
OL
Power-down reset
Maximum value of V at
V
−
10
P
PD
which power-down reset is
active
Rise time of V during
V rising from 0 V to V
t
r
5
−
−
µs
P
P
PD
power-on
Notes to the Characteristics
1. If V < 1 V, the input current is limited to 10 µA at input voltages up to 13.2 V.
P
2. Pure capacitive load should be avoided because of possible oscillations.
3. Values are proportional to V .
P
March 1991
7
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
2
I C-BUS TIMING
Bus loading conditions: 4kΩ pull-up resistor to +5 V; 200 pF capacitor to GND.
All values are referred to V = 3 V and V = 1.5 V.
IH
IL
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Bus free before start
t
t
t
t
t
t
t
t
t
4.0
4.0
4.0
4.0
4.0
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
µs
BUF
Start condition set-up time
Start condition hold time
LOW period SCL, SDA
HIGH period SCL
SU; STA
HD; STA
LOW
HIGH
Rise time SCL, SDA
Fall time SCL, SDA
1.0
0.30
−
r
−
f
Data set-up time (write)
Data hold time (write)
1
SU; DAT
HD; DAT
SU; ACK
HD; ACK
SU; STO
1
−
Acknowledge (from TDA8442) set-up time t
−
3.5
−
Acknowledge (from TDA8442) hold time
Stop condition set-up time
t
t
0
4.0
−
Reference levels are 10 and 90%.
2
Fig.5 I C-bus timing; TDA8442.
March 1991
8
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
March 1991
9
Philips Semiconductors
Product specification
2
TDA8442
I C-bus interface for colour decoders
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
). If the
stg max
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2
PURCHASE OF PHILIPS I C COMPONENTS
2
2
Purchase of Philips I C components conveys a license under the Philips’ I C patent to use the
2
2
components in the I C system provided the system conforms to the I C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
March 1991
10
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