TDA8511 [NXP]
4 x 13 W single-ended power amplifiers; 4 ×13 W单端功率放大器
| 型号： | TDA8511 |
| 厂家： | 
NXP |
| 描述： | 4 x 13 W single-ended power amplifiers |
| 文件： | 总16页 (文件大小：84K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8511J
4 × 13 W single-ended power
amplifiers
Preliminary specification
2000 Mar 10
Supersedes data of 1999 Jun 14
File under Integrated Circuits, IC01
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
FEATURES
APPLICATIONS
The device is primarily developed for multi-media
• Requires very few external components
• High output power
applications and active speaker systems.
• Fixed gain
GENERAL DESCRIPTION
• Diagnostic facility (distortion, short-circuit and
temperature detection)
The TDA8511J is an integrated class-B output amplifier in
a 17-lead DIL-bent-SIL power package. It contains
4 × 13 W single-ended amplifiers.
• Good ripple rejection
• Mode select switch (operating, mute and standby)
• AC and DC short-circuit safe to ground and to VP
• Low power dissipation in any short-circuit condition
• Thermally protected
• Reverse polarity safe
• Electrostatic discharge protection
• No switch-on/switch-off plop
• Flexible leads
• Low thermal resistance
• Identical inputs.
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
15
MAX.
18
UNIT
6
−
−
−
V
IORM
Iq(tot)
Istb
repetitive peak output current
total quiescent current
standby current
−
4
A
80
0.1
−
mA
µA
100
Po
output power
THD = 10%
RL = 4 Ω
RL = 2 Ω
−
−
7
−
−
−
−
−
W
13
−
W
SVRR
Vn(o)
Zi
supply voltage ripple rejection
noise output voltage
input impedance
46
−
dB
µV
kΩ
Rs = 0 Ω
50
−
50
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8511J
DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
2000 Mar 10
2
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
BLOCK DIAGRAM
V
V
P1
P2
13
1
5
mute switch
C
input 1
m
60
kΩ
TDA8511J
6
VA
output 1
2
kΩ
18 kΩ
power stage
mute switch
C
m
60
kΩ
3
input 2
8
VA
output 2
2
kΩ
18 kΩ
power stage
V
P
mode
select
switch
14
stand-by
switch
stand-by
reference
voltage
VA
PROTECTIONS
thermal
short-circuit
mute
switch
15 kΩ
x1
16
diagnostic
output
4
supply voltage
ripple rejection
15 kΩ
mute
reference
voltage
15
C
input 3
mute switch
m
60
kΩ
10
VA
output 3
2
kΩ
18 kΩ
power stage
mute switch
C
m
60
kΩ
17
input 4
12
VA
output 4
2
kΩ
18 kΩ
power stage
input
reference
voltage
2
9
7
GND1
11
GND2
MGL497
ground
(signal)
not connected
power ground (substrate)
Fig.1 Block diagram.
3
2000 Mar 10
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
PINNING
SYMBOL
IN1
PIN
DESCRIPTION
1
2
3
4
5
6
7
8
9
input 1
handbook, halfpage
IN1
SGND
IN2
1
2
3
4
5
6
7
8
9
SGND
IN2
signal ground
input 2
RR
supply voltage ripple rejection
supply voltage
output 1
VP1
RR
OUT1
GND1
OUT2
n.c.
V
P1
power ground 1
output 2
OUT1
GND1
OUT2
n.c.
not connected
OUT3
GND2
OUT4
VP2
10 output 3
TDA8511J
11 power ground 2
12 output 4
OUT3 10
GND2 11
OUT4 12
13 supply voltage
14 mode select switch input
15 input 3
MODE
IN3
V
13
P2
VDIAG
IN4
16 diagnostic output
17 input 4
MODE 14
IN3 15
V
16
DIAG
IN4 17
MGL498
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
This can be achieved by:
• Microprocessor control
The TDA8511J contains four identical amplifiers and can
be used for single-ended applications. The gain of each
amplifier is fixed at 20 dB. Special features of the device
are:
• External timing circuit (see Fig.7).
Diagnostic output (pin 16)
• Mode select switch (pin 14)
• Diagnostic output (pin 16).
DYNAMIC DISTORTION DETECTOR (DDD)
At the onset of clipping of one or more output stages, the
dynamic distortion detector becomes active and pin 16
goes LOW. This information can be used to drive a sound
processor or DC volume control to attenuate the input
signal and thus limit the distortion. The output level of
pin 16 is independent of the number of channels that are
clipping (see Fig.3).
Mode select switch (pin 14)
• Low standby current (<100 µA)
• Low switching current (low cost supply switch)
• Mute facility.
To avoid switch-on plops, it is advised to keep the amplifier
in the mute mode during ≥100 ms (charging of the input
capacitors at pin 1, 3, 15 and pin 17).
2000 Mar 10
4
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
SHORT-CIRCUIT PROTECTION
When a short-circuit occurs at one or more outputs to
ground or to the supply voltage, the output stages are
switched off until the short-circuit is removed and the
device is switched on again, with a delay of approximately
20 ms, after removal of the short-circuit. During this
short-circuit condition, pin 16 is continuously LOW.
MGA706
V
handbook, halfpage
O
0
When a short-circuit across the load of one or more
channels occurs the output stages are switched off during
approximately 20 ms. After that time it is checked during
approximately 50 µs to see whether the short-circuit is still
present. Due to this duty cycle of 50 µs/20 ms the average
current consumption during this short-circuit condition is
very low (approximately 40 mA).
V
16
V
P
0
t
During this short-circuit condition, pin 16 is LOW for 20 ms
and HIGH for 50 µs (see Fig.4).
The power dissipation in any short-circuit condition is very
low.
Fig.3 Distortion detector waveform.
TEMPERATURE DETECTION
OPEN COLLECTOR OUTPUT
When the virtual junction temperature Tvj reaches 150 °C,
pin 16 will be active LOW.
Pin 16 is an open collector output, which allows that more
devices can be connected together (pins 16).
current
in
MGL508
output
stage
t
short-circuit over the load
V
16
20 ms
V
P
t
50 µs
Fig.4 Short-circuit waveform.
5
2000 Mar 10
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
LIMITING VALUES
In accordance with the absolute maximum system (IEC 134).
SYMBOL
VP
PARAMETER
CONDITIONS
operating
no signal
MIN.
MAX.
18
UNIT
supply voltage
−
−
−
−
−
−
−
V
V
A
A
V
V
W
20
6
IOSM
IORM
Vpsc
Vpr
non-repetitive peak output current
repetitive peak output current
AC and DC short-circuit safe voltage
reverse polarity
4
18
6
Ptot
total power dissipation
60
+150
+85
150
Tstg
Tamb
Tvj
storage temperature
−55
−40
−
°C
°C
°C
operating ambient temperature
virtual junction temperature
THERMAL CHARACTERISTICS
In accordance with IEC 747-1.
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
Rth(j-c)
thermal resistance from junction to ambient in free air
40
K/W
K/W
thermal resistance from junction to case
see Fig.5
1.3
virtual junction
handbook, halfpage
output 1 output 2
output 3 output 4
3.0 K/W
3.0 K/W
3.0 K/W
3.0 K/W
0.7 K/W
0.7 K/W
MEA860 - 2
0.2 K/W
case
Fig.5 Equivalent thermal resistance network.
2000 Mar 10
6
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
DC CHARACTERISTICS
VP = 15 V; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VP
IP
supply voltage
note 1
6
−
−
15
80
6.9
18
160
−
V
quiescent current
DC output voltage
mA
V
VO
Mode select switch
Von
switch-on voltage level
8.5
−
−
V
MUTE CONDITION
Vmute
VO
mute voltage
3.3
−
−
6.4
2
V
output voltage in mute position
Vi(max) = 1 V; f = 1 kHz
−
mV
STANDBY CONDITION
Vstb
Istb
standby voltage
standby current
switch-on current
0
−
−
−
2
V
−
100
40
µA
µA
Isw(on)
12
Diagnostic output (pin 16)
VDIAG
diagnostic output voltage
any short-circuit or clipping
−
−
0.6
V
Note
1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.
2000 Mar 10
7
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
AC CHARACTERISTICS
VP = 15 V; RL = 4 Ω; f = 1 kHz; Tamb = 25 °C; measured in Fig.6; unless otherwise specified.
SYMBOL
PO
PARAMETER
CONDITIONS
note 1
MIN. TYP. MAX. UNIT
output power
THD = 0.5%
THD = 10%
PO = 1 W
4
5.5
7
−
−
−
W
W
%
5.5
−
THD
PO
total harmonic distortion
output power
0.06
RL = 2 Ω; note 1
THD = 0.5%
THD = 10%
at −1 dB; note 2
at −1 dB
−
10
13
25
−
−
W
−
−
W
fl
low frequency roll-off
−
−
Hz
kHz
dB
fh
high frequency roll-off
20
19
−
Gv
closed loop voltage gain
supply voltage ripple rejection
20
21
SVRR
note 3
on
48
46
80
50
−
−
dB
dB
dB
kΩ
mute
standby
−
−
−
−
Zi
input impedance
60
75
Vn(o)
noise output voltage
on; Rs = 0 Ω; note 4
−
50
70
50
60
−
−
µV
µV
µV
dB
dB
on; Rs = 10 kΩ; note 4 −
100
−
mute; notes 4 and 5
−
αCS
channel separation
channel unbalance
Rs = 10 kΩ
40
−
−
∆Gv
1
Dynamic distortion detector
THD
total harmonic distortion
V16 ≤ 0.6 V;
−
10
−
%
no short-circuit
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source-impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
at a frequency between 100 Hz and 10 kHz.
4. Noise measured in a bandwidth of 20 Hz to 20 kHz.
5. Noise output voltage independent of Rs (Vi = 0 V).
2000 Mar 10
8
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
TEST/APPLICATION INFORMATION
V
P
mode
switch
2200
µF
100
nF
10
kΩ
diagnostic
14
16
5
13
TDA8511J
220 nF
1
input 1
6
8
1000 µF
R
L
60
kΩ
220 nF
3
2
input 2
1000 µF
60
kΩ
ground (signal)
R
L
reference
voltage
4
supply
voltage
ripple
100
µF
V
/2
p
9
60
kΩ
not connected
rejection
15
input 3
10
220 nF
220 nF
1000 µF
60
kΩ
R
L
12
17
input 4
1000 µF
R
L
7
11
MGL499
power ground (substrate)
Fig.6 Application diagram.
9
2000 Mar 10
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
Mode select switch
To avoid switch-on plops, it is advised to keep the amplifier
in the mute mode during >100 ms (charging of the input
capacitors at pins 1, 3, 15 and 17.
The circuit in Fig.7 slowly ramps up the voltage at the
mode select switch pin when switching on and results in
fast muting when switching off.
V
P
handbook, halfpage
10 kΩ
47 µF
100 Ω
mode
select
switch
100 kΩ
MGA708
Fig.7 Mode select switch circuitry.
2000 Mar 10
10
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
PACKAGE OUTLINE
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
SOT243-1
non-concave
D
h
x
D
E
h
view B: mounting base side
d
A
2
B
j
E
A
L
3
L
Q
c
2
v
M
1
17
e
e
m
w
M
1
Z
b
p
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
(1)
(1)
UNIT
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0
15.5 4.4 0.60 0.38 23.6 19.6
12.2
11.8
3.4 12.4 2.4
3.1 11.0 1.6
2.00
1.45
2.1
1.8
6
mm
10
2.54 1.27 5.08
0.8
4.3
0.4 0.03
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-12-16
99-12-17
SOT243-1
2000 Mar 10
11
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
SOLDERING
The total contact time of successive solder waves must not
exceed 5 seconds.
Introduction to soldering through-hole mount
packages
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
300 and 400 °C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Mar 10
12
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
NOTES
2000 Mar 10
13
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
NOTES
2000 Mar 10
14
Philips Semiconductors
Preliminary specification
4 × 13 W single-ended power amplifiers
TDA8511J
NOTES
2000 Mar 10
15
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69
SCA
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All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
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Printed in The Netherlands
753503/03/pp16
Date of release: 2000 Mar 10
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