TDA8541T/N1/02,118_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TDA8541

1 W BTL audio amplifier

Product specification

1998 Apr 01

Supersedes data of 1997 Feb 19

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

FEATURES

GENERAL DESCRIPTION

• Flexibility in use

The TDA8541(T) is a one channel audio power amplifier

for an output power of 1 W with an 8 Ω load at a 5 V

supply. The circuit contains a BTL amplifier with a

complementary PNP-NPN output stage and standby/mute

logic. The TDA8541T comes in an 8 pin SO package and

the TDA8541 in an 8 pin DIP package.

• Few external components

• Low saturation voltage of output stage

• Gain can be fixed with external resistors

• Standby mode controlled by CMOS compatible levels

• Low standby current

APPLICATIONS

• No switch-on/switch-off plops

• Portable consumer products

• Personal computers

• Telephony.

• High supply voltage ripple rejection

• Protected against electrostatic discharge

• Outputs short-circuit safe to ground, V_CCand across the

load

• Thermally protected.

QUICK REFERENCE DATA

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN.

2.2

TYP. MAX. UNIT

5

18

12

10

−

V

I_q

quiescent current

V_CC= 5 V

−

8

mA

μA

W

I_stb

standby current

−

P_o

output power

THD = 10%; R_L= 8 Ω; V_CC= 5 V

1

1.2

0.15

−

THD

SVRR

total harmonic distortion

supply voltage ripple rejection

P_o= 0.5 W

−

%

50

−

dB

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

TDA8541T

TDA8541

SO8

plastic small outline package; 8 leads; body width 3.9 mm

plastic dual in-line package; 8 leads (300 mil)

SOT96-1

SOT97-1

DIP8

1998 Apr 01

2

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

BLOCK DIAGRAM

PINNING

SYMBOL

DESCRIPTION

MODE

1

operating mode select (standby,

mute, operating)

handbook, halfpage

SVR

2

half supply voltage, decoupling

ripple rejection

TDA8541

−

5

4

OUT−

IN−

IN+

−

+

IN+

3

4

5

6

7

8

positive input

3

IN−

negative input

R

6

OUT−

V_CC

negative loudspeaker terminal

supply voltage

V

R

CC

GND

OUT+

ground

−

+

positive loudspeaker terminal

8

20 kΩ

OUT+

2

1

SVR

20 kΩ

handbook, halfpage

MODE

1

2

3

4

8

7

6

5

OUT+

SVR

IN+

GND

MODE

STANDBY/MUTE LOGIC

TDA8541

7

V

CC

GND

OUT−

IN−

MGB972

MGB971

Fig.2 Pin configuration.

Fig.1 Block diagram.

FUNCTIONAL DESCRIPTION

Mode select pin

The TDA8541(T) is a BTL audio power amplifier capable

of delivering 1 W output power to an 8 Ω load at

THD = 10% using a 5 V power supply. Using the MODE

pin the device can be switched to standby and mute

condition. The device is protected by an internal thermal

shutdown protection mechanism. The gain can be set

within a range from 6 dB to 30 dB by external feedback

resistors.

The device is in standby mode (with a very low current

consumption) if the voltage at the MODE pin is

>(V_CC− 0.5 V), or if this pin is floating. At a MODE voltage

level of less than 0.5 V the amplifier is fully operational.

In the range between 1.5 V and V_CC− 1.5 V the amplifier

is in mute condition. The mute condition is useful to

suppress plop noise at the output, caused by charging of

the input capacitor.

Power amplifier

The power amplifier is a Bridge Tied Load (BTL) amplifier

with a complementary PNP-NPN output stage.

The voltage loss on the positive supply line is the

saturation voltage of a PNP power transistor, on the

negative side the saturation voltage of an NPN power

transistor. The total voltage loss is <1 V and with a 5 V

supply voltage and an 8 Ω loudspeaker an output power of

1 W can be delivered.

1998 Apr 01

3

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN.

−0.3

MAX.

+18

UNIT

operating

V

V_I

input voltage

−0.3

−

V_CC+ 0.3

1

V

I_ORM

T_stg

T_amb

V_psc

P_tot

repetitive peak output current

storage temperature

A

non-operating

−55

−40

−

+150

+85

10

°C

V

operating ambient temperature

AC and DC short-circuit safe voltage

total power dissipation

SO8

−

0.8

W

DIP8

−

1.2

QUALITY SPECIFICATION

In accordance with “SNW-FQ-611-E”. The number of the quality specification can be found in the “Quality Reference

Handbook”. The handbook can be ordered using the code 9397 750 00192.

THERMAL CHARACTERISTICS

SYMBOL

R_{th j-a}

PARAMETER

thermal resistance from junction to ambient

TDA8541T (SO8)

CONDITIONS

in free air

VALUE

UNIT

160

100

K/W

TDA8541 (DIP8)

DC CHARACTERISTICS

V_CC= 5 V; T_amb= 25 °C; R_L= 8 Ω; V_MODE= 0 V; measured in test circuit Fig.3; unless otherwise specified.

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

operating

MIN.

2.2

TYP.

MAX.

18

UNIT

5

8

−

V

I_q

quiescent current

standby current

DC output voltage

R_L= ∞; note 1

V_MODE= V_CC

note 2

−

12

10

−

mA

μA

V

I_stb

V_O

−

2.2

−

⎪V_OUT+− V_OUT−⎪ differential output voltage offset

−

50

500

0.5

mV

nA

V

I_IN+, I_IN−

V_MODE

input bias current

−

input voltage mode select

operating

mute

0

−

1.5

−

V_CC− 1.5 V

standby

V_CC− 0.5 −

V_CC

20

V

I_MODE

input current mode select

0 < V_MODE< V_CC

−

μA

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by R_L.

2. The DC output voltage with respect to ground is approximately 0.5 × V_CC

.

1998 Apr 01

4

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

AC CHARACTERISTICS

V_CC= 5 V; T_amb= 25 °C; R_L= 8 Ω; f = 1 kHz; V_MODE= 0 V; measured in test circuit Fig.3; unless otherwise specified.

SYMBOL

PARAMETER

output power

CONDITIONS

THD = 10%

THD = 0.5%

P_o= 0.5 W

note 1

MIN.

TYP.

1.2

MAX.

UNIT

P_o

1

−

W

%

0.6

−

0.9

0.15

−

THD

G_v

total harmonic distortion

closed loop voltage gain

differential input impedance

noise output voltage

0.3

30

−

6

dB

kΩ

μV

dB

μV

Z_i

−

100

−

V_no

note 2

note 3

note 4

note 5

−

100

−

SVRR

supply voltage ripple rejection

50

40

−

V_o

output voltage in mute condition

−

200

Notes

1. Gain of the amplifier is 2 × R2/R1 in test circuit of Fig.3.

2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a

source impedance of R_S= 0 Ω at the input.

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R_S= 0 Ω at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to

the positive supply rail.

4. Supply voltage ripple rejection is measured at the output, with a source impedance of R_S= 0 Ω at the input.

The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),

which is applied to the positive supply rail.

5. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including

noise.

1998 Apr 01

5

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

TEST AND APPLICATION INFORMATION

Test conditions

SE application

T_amb= 25 °C if not specially mentioned, V_CC= 7.5 V,

f = 1 kHz, R_L= 4 Ω, G_v= 20 dB, audio band-pass

22 Hz to 22 kHz.

Because the application can be either Bridge-Tied Load

(BTL) or Single-Ended (SE), the curves of each application

are shown separately.

The SE application diagram is shown in Fig.13.

The thermal resistance = 100 K/W for the DIP8 envelope;

the maximum sine wave power dissipation for

T_amb= 25 °C is:

The capacitor value of C3 in combination with the load

impedance determines the low frequency behaviour.

The total harmonic distortion as a function of frequency

was measured with low-pass filter of 80 kHz. The value of

capacitor C2 influences the behaviour of the SVRR at low

frequencies, increasing the value of C2 increases the

performance of the SVRR.

150 – 25

---------------------- = 1.25 W .

100

For T_amb= 60 °C the maximum total power dissipation is:

150 – 60

= 0.9 W .

----------------------

100

General remark

The frequency characteristic can be adapted by

connecting a small capacitor across the feedback resistor.

To improve the immunity of HF radiation in radio circuit

applications, a small capacitor can be connected in parallel

with the feedback resistor (56 kΩ); this creates a low-pass

filter.

BTL application

T_amb= 25 °C if not specially mentioned, V_CC= 5 V,

f = 1 kHz, R_L= 8 Ω, G_v= 20 dB, audio band-pass

22 Hz to 22 kHz.

The BTL application diagram is shown in Fig.3.

The quiescent current has been measured without any

load impedance. The total harmonic distortion as a

function of frequency was measured with a low-pass filter

of 80 kHz. The value of capacitor C2 influences the

behaviour of the SVRR at low frequencies, increasing the

value of C2 increases the performance of the SVRR.

The figure of the mode select voltage (V_ms) as a function

of the supply voltage shows three areas; operating, mute

and standby. It shows, that the DC-switching levels of the

mute and standby respectively depends on the supply

voltage level.

1998 Apr 01

6

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

BTL APPLICATION

handbook, full pagewidth

V

CC

R2

R1

56 kΩ

100 nF

100 μF

6

C1

−

+

IN

4

3

2

1

−

+

OUT

5

8

11 kΩ

1 μF

IN

R

V

TDA8541

L

SVR

in

MODE

C2

47 μF

7

GND

MBH881

R2

-------

Gain = 2 ×

R1

Fig.3 BTL application.

MGD876

MGD877

10

15

handbook, halfpage

I

q

THD

(%)

(mA)

(1)

(2)

10

1

−1

5

10

−2

0

−2

−1

4

8

12

16

20

(V)

10

1

10

P

(W)

V

o

CC

f = 1 kHz, G_v= 20 dB.

(1) V_CC= 5 V, R_L= 8 Ω.

(2) V_CC= 9 V, R_L= 16 Ω.

R_L= ∞.

Fig.4 I_qas a function of V_CC

.

Fig.5 THD as a function of P_o.

1998 Apr 01

7

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

MGD878

MGD879

10

−20

handbook, halfpage

SVRR

(dB)

THD

(%)

−40

−60

1

(1)

(2)

(3)

−1

10

−2

−80

2

3

5

4

2

3

4

5

10

f (Hz)

V_CC= 5 V, 8 Ω, R_s= 0 Ω, V_i= 100 mV.

(1) G_v= 30 dB.

P_o= 0.5 W, G_v= 20 dB.

(1) V_CC= 5 V, R_L= 8 Ω.

(2) V_CC= 9 V, R_L= 16 Ω.

(2) G_v= 20 dB.

(3) G_v= 6 dB.

Fig.6 THD as a function of frequency.

Fig.7 SVRR as a function of frequency.

MGD880

MGD881

2.5

2

handbook, halfpage

P

o

P

(W)

2

(W)

1.5

1

(1)

(2)

1.5

1

(1)

(2)

0.5

0

4

8

12

4

8

12

V

(V)

V

(V)

CC

(1) R_L= 8 Ω.

THD = 10%.

(2)

R_L= 16 Ω.

(1) R_L= 8 Ω.

(2) R_L= 16 Ω.

Fig.9 Worst case power dissipation as a function

of V_CC

Fig.8 P_oas a function of V_CC

.

1998 Apr 01

8

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

MGD882

MGD883

1.6

10

o

handbook, halfpage

V

P

(V)

1

(1)

(W)

1.2

−1

10

−2

10

(1)

(2) (3)

(2)

0.8

0.4

0

−3

10

−4

10

−5

10

−6

10

−1

2

10

1

10

0

0.5

1

1.5

2

2.5

V

(V)

P

(W)

ms

o

Band-pass = 22 Hz to 22 kHz.

(1) _CC= 3 V.

V

Sine wave of 1 kHz.

(2) V_CC= 5 V.

(3) V_CC= 12 V.

(1) V_CC= 9 V, R_L= 16 Ω.

(2) V_CC= 5 V, R_L= 8 Ω.

Fig.10 P as a function of P_o.

Fig.11 V_oas a function of V_ms.

MGL070

16

handbook, halfpage

V

ms

(V)

12

standby

8

4

mute

operating

12 16

0

4

8

V

(V)

P

Fig.12 V_msas a function of V_P.

1998 Apr 01

9

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

SE APPLICATION

handbook, full pagewidth

V

CC

100 μF

R2

R1

110 kΩ

100 nF

C3

6

C1

−

+

IN

4

3

2

1

11 kΩ

1 μF

−

+

OUT

IN

5

8

V

TDA8541

SVR

470 μF

in

R

L

MODE

C2

47 μF

7

GND

MBH882

R2

-------

Gain =

R1

Fig.13 SE application.

MGD885

MGD884

10

handbook, halfpage

THD

(%)

THD

(%)

1

(1)

(2)

(3)

−1

10

(2)

(3)

−2

10

−2

−1

2

3

4

5

10

1

10

f (Hz)

P

(W)

o

f = 1 kHz, G_v= 20 dB.

P_o= 0.5 W, G_v= 20 dB.

(1) V_CC= 7.5 V, R_L= 4 Ω.

(2) V_CC= 9 V, R_L= 8 Ω.

(3) V_CC= 12 V, R_L= 16 Ω.

(1) V_CC= 7.5 V, R_L= 4 Ω.

(2) V_CC= 9 V, R_L= 8 Ω.

(3) V_CC= 12 V, R_L= 16 Ω.

Fig.14 THD as a function of P_o.

Fig.15 THD as a function of frequency.

1998 Apr 01

10

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

MGD887

MGD886

−20

2

handbook, halfpage

P

o

(W)

1.6

SVRR

(dB)

−40

(3)

(1)

(2)

1.2

0.8

(1)

(2)

−60

(3)

0.4

−80

0

2

3

4

5

10

4

8

12

16

f (Hz)

V

(V)

CC

V_CC= 7.5 V, R_L= 4 Ω, R_s= 0 Ω, V_i= 100mV.

(1) G_v= 24 dB.

(1) THD = 10%, R_L= 4 Ω.

(2) THD = 10%, R_L= 8 Ω.

(3) THD = 10%, R_L= 16 Ω.

(2) G_v= 20 dB.

(3) G_v= 0 dB.

Fig.16 SVRR as a function of frequency.

Fig.17 P_oas a function of V_CC.

MGD888

MGD889

1.6

1.2

handbook, halfpage

P

(1)

(2)

P

(W)

1.2

0.8

0.4

0.8

0.4

(3)

(1)

(2)

(3)

0

4

8

12

16

0.4

0.8

1.2

1.6

V

(V)

P

(W)

CC

o

(1) R_L= 4 Ω.

(2) R_L= 8 Ω.

(1) V_CC= 7.5 V, R_L= 4 Ω.

(2) _CC= 12 V, R_L= 16 Ω.

(3) V_CC= 9 V, R_L= 8 Ω.

V

(3)

R_L= 16 Ω.

Fig.18 Worst case power dissipation as a function

of V_CC

Fig.19 Power dissipation as a function of P_o.

.

1998 Apr 01

11

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

handbook, full pagewidth

a. Top view.

6.8 kΩ

MS

1

8

5

+

−

OUT

TDA8541

IN

1 μF

11 kΩ

47 μF

4

56 kΩ

100 nF

100 μF

+

V

P

MBH920

b. Component side.

Fig.20 Printed-circuit board layout (BTL and SE).

12

1998 Apr 01

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

PACKAGE OUTLINES

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

1998 Apr 01

13

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

D

M

E

A

2

A

1

L

c

w M

Z

b

1

e

(e )

1

M

H

b

2

8

5

pin 1 index

E

1

4

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

Z

A

2

(1)

1

w

UNIT

mm

b

c

D

E

e

L

M

H

1

2

1

E

max.

min.

max.

1.73

1.14

0.53

0.38

1.07

0.89

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

8.25

7.80

10.0

8.3

4.2

0.51

3.2

2.54

0.1

7.62

0.3

0.254

0.01

1.15

0.068 0.021 0.042 0.014

0.045 0.015 0.035 0.009

0.39

0.36

0.26

0.24

0.14

0.12

0.32

0.31

0.39

0.33

inches

0.17

0.02

0.13

0.045

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-13

SOT97-1

050G01

MO-001

SC-504-8

1998 Apr 01

14

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

SOLDERING

Introduction

Several techniques exist for reflowing; for example,

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

WAVE SOLDERING

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

DIP

SOLDERING BY DIPPING OR BY WAVE

• The longitudinal axis of the package footprint must be

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

parallel to the solder flow.

• The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

REPAIRING SOLDERED JOINTS

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

SO

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

1998 Apr 01

15

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DISCLAIMERS

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliable.

However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as

for the planned application and use of customer’s third

party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks

associated with their applications and products.

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications

or products, or the application or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applications and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

1998 Apr 01

16

NXP Semiconductors

Product specification

1 W BTL audio amplifier

TDA8541

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions above those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is automotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor tested in accordance with automotive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified products in automotive equipment or

applications.

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subject to the general

terms and conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an

individual agreement is concluded only the terms and

conditions of the respective agreement shall apply. NXP

Semiconductors hereby expressly objects to applying the

customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own risk, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed

product claims resulting from customer design and use of

the product for automotive applications beyond NXP

Semiconductors’ standard warranty and NXP

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Semiconductors’ product specifications.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

1998 Apr 01

17

NXP Semiconductors

provides High Performance Mixed Signal and Standard Product

solutions that leverage its leading RF, Analog, Power Management,

Interface, Security and Digital Processing expertise

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimers. No changes were made to the technical content, except for package outline

drawings which were updated to the latest version.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

545102/00/05/pp18

Date of release: 1998 Apr 01

Document order number: 9397 750 03352


型号：	TDA8541T/N1/02,118
厂家：	NXP
描述：	TDA8541 - 1 W BTL audio amplifier SOIC 8-Pin 放大器光电二极管商用集成电路
文件：	总18页 (文件大小：176K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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