TDA8547TS [NXP]
2 x 0.7 W BTL audio amplifier with output channel switching; 2 ×0.7 W¯¯ BTL音频放大器,输出通道切换型号: | TDA8547TS |
厂家: | NXP |
描述: | 2 x 0.7 W BTL audio amplifier with output channel switching |
文件: | 总20页 (文件大小:163K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8547TS
2 × 0.7 W BTL audio amplifier with
output channel switching
1998 Apr 01
Product specification
Supersedes data of 1997 Oct 14
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
FEATURES
GENERAL DESCRIPTION
• Selection between output channels
• Flexibility in use
The TDA8547TS is a two channel audio power amplifier
for an output power of 2 × 0.7 W with a 16 Ω load at a 5 V
supply. At a low supply voltage of 3.3 V an output power of
0.6 W with an 8 Ω load can be obtained. The circuit
contains two BTL amplifiers with a complementary
PNP-NPN output stage and standby/mute logic.
The operating condition of all channels of the device
(standby, mute or on) is externally controlled by the
MODE pin. With the SELECT pin one of the output
channels can be switched in the standby condition. This
feature can be used for loudspeaker selection and also
reduces the quiescent current consumption.
• Few external components
• Low saturation voltage of output stage
• Gain can be fixed with external resistors
• Standby mode controlled by CMOS compatible levels
• Low standby current
• No switch-on/switch-off plops
• High supply voltage ripple rejection
• Protected against electrostatic discharge
When only one channel is used the maximum output
power is 1.2 W.
• Outputs short-circuit safe to ground, VCC and across the
load
• Thermally protected.
APPLICATIONS
• Telecommunication equipment
• Portable consumer products
• Personal computers
• Motor-driver (servo).
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
2.2
TYP. MAX. UNIT
5
18
22
12
10
V
Iq
quiescent current
VCC = 5 V; 2 channels
VCC = 5 V; 1 channel
−
−
−
15
8
mA
mA
µA
Istb
Po
standby current
output power
two channels
−
THD = 10%; RL = 8 Ω; VCC = 3.3 V 0.5
THD = 10%; RL = 16 Ω; VCC = 5 V 0.6
0.6
0.7
1.2
1.2
0.15
−
−
−
−
−
−
−
W
W
W
W
%
one channel
THD = 10%; RL = 8 Ω; VCC = 5 V
THD = 10%; RL = 4 Ω; VCC = 3.3 V
Po = 0.4 W
1
1
THD
total harmonic distortion
−
SVRR
supply voltage ripple rejection
50
dB
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8547TS SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
1998 Apr 01
2
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
BLOCK DIAGRAM
V
V
CC1
20
CC2
11
−
18
17
OUT1−
IN1−
IN1+
−
+
16
R
V
CC1
R
−
−
+
3
20 kΩ
OUT1+
20 kΩ
STANDBY/MUTE LOGIC
TDA8547TS
−
13
14
15
OUT2−
IN2−
IN2+
−
+
R
V
CC2
R
−
−
+
8
20 kΩ
OUT2+
5
SVRR
20 kΩ
4
6
MODE
STANDBY/MUTE LOGIC
SELECT
2, 7, 9, 12, 19
5
n.c.
1
10
MGK984
GND1 GND2
Fig.1 Block diagram.
3
1998 Apr 01
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
PINNING
SYMBOL PIN
DESCRIPTION
ground, channel 1
GND1
n.c.
1
2
3
not connected
OUT1+
positive loudspeaker terminal,
channel 1
MODE
SVRR
4
5
operating mode select (standby, mute,
operating)
handbook, halfpage
GND1
n.c.
20
V
1
2
CC1
19
n.c.
half supply voltage, decoupling ripple
rejection
OUT1+
MODE
SVRR
3
18 OUT1−
17
SELECT
n.c.
6
7
8
input for selection of operating channel
not connected
IN1−
4
16 IN1+
15 IN2+
5
OUT2+
positive loudspeaker terminal,
channel 2
TDA8547TS
SELECT
n.c.
6
n.c.
9
not connected
IN2−
7
14
GND2
VCC2
n.c.
10 ground, channel 2
11 supply voltage, channel 2
12 not connected
OUT2+
n.c.
8
13 OUT2−
n.c.
V
9
12
11
GND2
10
CC2
OUT2−
13 negative loudspeaker terminal,
channel 2
MGK998
IN2−
14 negative input, channel 2
15 positive input, channel 2
16 positive input, channel 1
17 negative input, channel 1
IN2+
IN1+
IN1−
OUT1−
18 negative loudspeaker terminal,
channel 1
n.c.
19 not connected
Fig.2 Pin configuration.
VCC1
20 supply voltage, channel 1
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and a 16 Ω loudspeaker an output power of
0.7 W can be delivered, when two channels are operating.
If only one channel is operating then an output power of
1.2 W can be delivered (5 V, 8 Ω).
FUNCTIONAL DESCRIPTION
The TDA8547TS is a 2 × 0.7 W BTL audio power amplifier
capable of delivering 2 × 0.7 W output power to a 16 Ω
load at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.
MODE pin
The whole device (both channels) is in the standby mode
(with a very low current consumption) if the voltage at the
MODE pin is >(VCC − 0.5 V), or if this pin is floating. At a
MODE voltage level of less than 0.5 V the amplifier is fully
operational. In the range between 1.5 V and VCC − 1.5 V
the amplifier is in mute condition. The mute condition is
useful to suppress plop noise at the output caused by
charging of the input capacitor.
Power amplifier
The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the
negative side the saturation voltage of a NPN power
1998 Apr 01
4
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
a HIGH voltage results in a reduction of quiescent current
consumption by a factor of approximately 2.
SELECT pin
If the voltage at the SELECT pin is in the range between
1.5 V and VCC − 1.5 V, or if it is kept floating, then both
channels can be operational. If the SELECT pin is set to a
LOW voltage or grounded, then only channel 2 can
operate and the power amplifier of channel 1 will be in the
standby mode. In this case only the loudspeaker at
channel 2 can operate and the loudspeaker at channel 1
will be switched off. If the SELECT pin is set to a
HIGH level or connected to VCC, then only channel 1 can
operate and the power amplifier of channel 2 will be in the
standby mode. In this case only the loudspeaker at
channel 1 can operate and the loudspeaker at channel 2
will be switched off. Setting the SELECT pin to a LOW or
Switching with the SELECT pin during operating is not
plop-free, because the input capacitor of the channel
which is coming out of standby needs to be charged first.
For plop-free channel selecting the device has first to be
set in mute condition with the MODE pin (between 1.5 V
and VCC − 1.5 V), then set the SELECT pin to the new
level, after a delay set the MODE pin to a LOW level.
The delay needed depends on the values of the input
capacitor and the feedback resistors. Time needed is
approx. 10 × C1 × (R1 + R2), so approximately 0.6 s. for
the values in Fig.4.
Table 1 Control pins MODE and SELECT versus status of output channels
Voltage levels at control pins at VP = 5 V; for other supply voltages see Figs. 14 and 15.
STATUS OF OUTPUT
CONTROL PIN
TYP. Iq
(mA)
CHANNEL
MODE
SELECT
CHANNEL 1 CHANNEL 2
HIGH(1)/NC(2)
HVP(4)
X(3)
standby
mute
standby
mute
0
15
15
8
HVP(4)/NC(2)
HVP(4)/NC(2)
HIGH(1)
HVP(4)/NC(2)
LOW(5)
LOW(5)
on
on
HVP(4)/LOW(5)
HVP(4)/LOW(5)
HVP(4)/LOW(5)
mute/on
mute/on
standby
standby
mute/on
mute/on
15
8
Notes
1. HIGH = Vpin > VCC − 0.5 V.
2. NC = not connected or floating.
3. X = don’t care.
4. HVP = 1.5 V < Vpin < VCC − 1.5 V.
5. LOW = Vpin < 0.5 V.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
operating
MIN.
MAX.
UNIT
VCC
VI
−0.3
+18
V
input voltage
−0.3
−
VCC + 0.3
1
V
IORM
Tstg
Tamb
VPsc
Ptot
repetitive peak output current
storage temperature
A
−55
−40
−
+150
+85
°C
°C
V
operating ambient temperature
AC and DC short-circuit safe voltage
power dissipation
10
−
1.1
W
1998 Apr 01
5
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
QUALITY SPECIFICATION
In accordance with “SNW-FQ-611-E”.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from junction to ambient in free air
110
K/W
MGK987
2.0
handbook, halfpage
P
(W)
1.6
1.2
0.8
0.4
0
0
40
80
120
T
160
(°C)
amb
Fig.3 Power derating curve.
Table 2 Maximum ambient temperature at different conditions
CONTINUOUS SINE WAVE DRIVEN
VCC
(V)
RL
(Ω)
Po
(W)(1)
APPLICATION
Pmax
(W)
Tamb(max)
(°C)
3.3
3.3
3.3
3.3
5
4
4
1 channel
2 channels
1 channels
2 channels
1 channel
2 channels
1 channel
2 channels
1.2
2 × 1.2
0.6
0.58
1.12
0.3
86
27
117
84
76
−
8
8
2 × 0.6
1.2
0.60
0.67
1.33
0.35
0.70
8
5
8
2 × 1.2
0.7
5
16
16
112
73
5
2 × 0.7
Note
1. At THD = 10%.
1998 Apr 01
6
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
DC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4; unless
otherwise specified.
SYMBOL
PARAMETER
supply voltage
CONDITIONS
operating
MIN.
2.2
TYP.
MAX.
18
UNIT
VCC
Iq
5
V
quiescent current
BTL 2 channels;
note 1
−
15
22
mA
BTL 1 channel;
note 1
−
8
12
mA
Istb
VO
standby current
VMODE = VCC
note 2
−
−
−
−
10
−
µA
V
DC output voltage
2.2
−
VOUT+ − VOUT− differential output voltage
50
mV
offset
I
IN+, IIN−
input bias current
input voltage MODE pin
−
−
−
−
500
0.5
nA
V
VMODE
operating
mute
0
1.5
VCC − 1.5 V
standby
V
CC − 0.5 −
VCC
20
1
V
IMODE
input current MODE pin
input voltage SELECT pin
0 V < VMODE < VCC
−
−
−
µA
V
VSELECT
channel 1 = standby; 0
channel 2 = on
channel 1 = on;
channel 2 = standby
V
CC − 1
−
−
VCC
100
V
ISELECT
input current SELECT pin
VSELECT = 0 V
−
µA
Notes
1. Measured with RL = ∞. With a load connected at the outputs the quiescent current will increase, the maximum of this
increase being equal to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VCC
.
1998 Apr 01
7
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
AC CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C; RL = 8 Ω; f = 1 kHz; VMODE = 0 V; gain = 20 dB; measured in BTL application circuit Fig.4;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
THD = 10%
MIN.
TYP.
1.2
MAX.
UNIT
Po
output power, one channel
1
−
W
THD = 0.5%
Po = 0.4 W
note 1
0.6
−
0.9
0.15
−
−
W
THD
Gv
total harmonic distortion
closed loop voltage gain
differential input impedance
noise output voltage
0.3
30
−
%
6
dB
kΩ
µV
dB
dB
µV
dB
Zi
−
100
−
Vno
note 2
note 3
note 4
note 5
−
100
−
SVRR
supply voltage ripple rejection
50
40
−
−
−
−
Vo
output voltage
−
200
−
αcs
channel separation
VSELECT = 0.5VCC; note 6 40
−
Notes
R2
R1
1. Gain of the amplifier is 2 ×
in BTL application circuit Fig.4.
-------
2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a
source impedance of RS = 0 Ω at the input.
3. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.
4. Supply voltage ripple rejection is measured at the output, with a source impedance of RS = 0 Ω at the input.
The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.
5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 Hz to 20 kHz,
so including noise.
6. Channel separation is measured at the output with a source impedance of RS = 0 Ω at the input and a frequency of
1 kHz. The output power in the operating channel is set to 0.5 W.
1998 Apr 01
8
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
The quiescent current has been measured without any
load impedance and both channels driven. When one
channel is active the quiescent current will be halved.
The total harmonic distortion as a function of frequency
was measured using a low-pass filter of 80 kHz.
The value of capacitor C3 influences the behaviour of the
SVRR at low frequencies: increasing the value of C3
increases the performance of the SVRR.
The figure of the MODE voltage (VMODE) as a function of
the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depend on the supply
voltage level. The figure of the SELECT voltage (VSELECT
as a function of the supply voltage shows the voltage
levels for switching the channels in the active, mute or
standby mode.
TEST AND APPLICATION INFORMATION
Test conditions
Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each
application are shown separately.
The thermal resistance = 110 K/W for the SSOP20; the
maximum sine wave power dissipation for Tamb = 25 °C
150 – 25
110
is:
= 1.14 W
----------------------
For Tamb = 60 °C the maximum total power dissipation is:
150 – 60
)
= 0.82 W
----------------------
110
Thermal Design Considerations
SE application
The ‘measured’ thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different Semiconductor manufacturers because the
application boards and test methods are not (yet)
standardized. Also, the thermal performance of packages
for a specific application may be different than presented
here, because the configuration of the application boards
(copper area!) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper
traces with solder coating.
Tamb = 25 °C if not specially mentioned, VCC = 7.5 V,
f = 1 kHz, RL = 4 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
The SE application circuit is illustrated in Fig.16.
Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive
output is not designed for high output current (2 × Io) at
low load impedance (≤16 Ω), the SE application with
output capacitors connected to ground is advised.
The capacitor value of C6/C7 in combination with the load
impedance determines the low frequency behaviour.
The THD as a function of frequency was measured using
a low-pass filter of 80 kHz. The value of capacitor C3
influences the behaviour of the SVRR at low frequencies:
increasing the value of C3 increases the performance of
the SVRR.
The SSOP package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.24) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to about 80 K/W.
For Tamb = 60 °C the maximum total power dissipation at
150 – 60
this PCB layout is:
= 1.12 W
----------------------
80
General remark
Please note that this two channel IC is mentioned for
application with only one channel active. For that reason
the curves for worst case power dissipation are given for
the condition of only one of the both channels driven with
a 1 kHz sine wave signal.
The frequency characteristic can be adapted by
connecting a small capacitor across the feedback
resistor. To improve the immunity to HF radiation in radio
circuit applications, a small capacitor can be connected in
parallel with the feedback resistor (56 kΩ); this creates a
low-pass filter.
BTL application
Tamb = 25 °C if not specially mentioned, VCC = 5 V,
f = 1 kHz, RL = 8 Ω, Gv = 20 dB, audio band-pass
22 Hz to 22 kHz.
The BTL application circuit is illustrated in Fig.4.
1998 Apr 01
9
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
BTL APPLICATION
C1
V
CC
C4
100 nF
C5
R2
R1
50 kΩ
1 µF
20
11
100 µF
IN1−
IN1+
17
16
OUT1−
OUT1+
18
3
10 kΩ
V
i1
C3
47 µF
R
L1
OUT2−
50 kΩ
C2
1 µF
R4
R3
TDA8547TS
IN2−
IN2+
14
15
10 kΩ
OUT2−
OUT2+
13
8
V
i2
SVRR
R
L2
5
4
6
MODE
SELECT
1
10
R2
Gain channel 1 = 2 × -------
R1
GND
MGK985
R4
Gain channel 2 = 2 × -------
R3
Fig.4 BTL application.
MGD890
MGK988
30
10
handbook, halfpage
handbook, halfpage
I
q
THD
(%)
(mA)
(1)
1
20
−1
10
10
10
−2
0
−2
−1
10
10
1
10
0
4
8
12
16
V
20
(V)
P
(W)
o
CC
f = 1 kHz; Gv = 20 dB.
(1) VCC = 5 V; RL = 8 Ω.
RL = ∞.
Fig.5 Iq as a function of VCC
.
Fig.6 THD as a function of Po.
1998 Apr 01
10
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
MGK989
MGK699
10
−60
handbook, halfpage
andbook, halfpage
α
(dB)
cs
THD
(%)
(1)
(2)
−70
1
(1)
−80
−90
(3)
−1
10
−2
10
−100
2
3
4
5
2
3
5
4
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
VCC = 5 V; Vo = 2 V; RL = 8 Ω.
(1) Gv = 30 dB.
(2) Gv = 20 dB.
(3) Gv = 6 dB.
Po = 0.5 W; Gv = 20 dB.
(1) VCC = 5 V; RL = 8 Ω.
Fig.8 Channel separation as a function of
frequency.
Fig.7 THD as a function of frequency.
MGK990
MGD894
2
−20
handbook, halfpage
handbook, halfpage
P
o
(W)
SVRR
(dB)
1.5
(1)
(2)
−40
−60
(1)
(2)
(3)
1
0.5
−80
0
0
2
3
4
5
10
10
10
10
10
4
8
12
f (Hz)
V
(V)
CC
VCC = 5 V; RS = 0 Ω; Vr = 100 mV.
(1) Gv = 30 dB.
THD = 10%.
(2) Gv = 20 dB.
(1) RL = 8 Ω.
(2) RL = 16 Ω.
(3) Gv = 6 dB.
Fig.9 SVRR as a function of frequency.
Fig.10 Po as a function of VCC.
1998 Apr 01
11
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
MGK991
MGK992
1.5
1.5
handbook, halfpage
handbook, halfpage
P
P
(W)
(W)
1.0
1
(2)
(1)
(1)
0.5
0.5
0
0
0
0
4
8
12
0.5
1
1.5
V
(V)
P
(W)
CC
o
(1) RL = 8 Ω.
(2) RL = 16 Ω.
Sine wave of 1 kHz.
(1)
VCC = 5 V; RL = 8 Ω.
Fig.11 Worst case power dissipation as a function
of VCC (one channel active).
Fig.12 Power dissipation as a function of Po
(one channel active).
MGL210
MGL211
10
o
(V)
1
16
handbook, halfpage
handbook, halfpage
V
V
MODE
(V)
12
−1
10
standby
−2
10
8
(1)
(2) (3)
−3
10
10
mute
−4
4
−5
10
10
operating
12 16
−6
0
−1
2
10
1
10
10
0
4
8
V
(V)
V
(V)
MODE
P
Band-pass = 22 Hz to 22 kHz.
(1) VCC = 3 V.
(2) VCC = 5 V.
(3) VCC = 12 V.
Fig.13 Vo as a function of VMODE
.
Fig.14 VMODE as a function of VP.
1998 Apr 01
12
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
MGK700
20
V
SELECT
(V)
16
channel 2
standby
12
8
channel 1 + 2
on
V
P
channel 1
on
channel 2
on
4
0
channel 1
standby
0
2
4
6
8
10
12
14
16
18
20
V
(V)
P
Fig.15 VSELECT as a function of VP.
SE APPLICATION
V
CC
C1
1 µF
R2
R1
100 kΩ
C4
100 nF
C5
20
11
100 µF
IN1−
IN1+
17
16
C6
10 kΩ
OUT1−
18
V
i1
C3
47 µF
470 µF
R
L1
OUT1+
OUT2−
OUT2−
100 kΩ
3
13
8
C2
1 µF
R4
R3
TDA8547TS
IN2−
IN2+
14
15
5
C7
10 kΩ
V
i2
470 µF
SVRR
R
L2
MODE
SELECT
OUT2+
4
6
1
10
R2
Gain channel 1 =
Gain channel 2 =
-------
R1
GND
MGK986
R4
-------
R3
Fig.16 SE application.
13
1998 Apr 01
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
MGD899
MGD900
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
THD
(%)
1
1
(1)
(2)
−1
−1
(3)
10
10
(1)
(2)
(3)
−2
−2
10
10
−2
−1
2
3
4
5
10
10
1
10
10
10
10
10
10
f (Hz)
P
(W)
o
f = 1 kHz; Gv = 20 dB.
(1) CC = 7.5 V; RL = 4 Ω.
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
Po = 0.5 W; Gv = 20 dB.
(1) CC = 7.5 V; RL = 4 Ω.
V
V
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
Fig.17 THD as a function of Po.
Fig.18 THD as a function of frequency.
MGK993
MGD902
−40
−20
handbook, halfpage
handbook, halfpage
α
cs
SVRR
(dB)
(dB)
−40
−60
−60
(1)
(2)
(1)
(2)
(3)
(4)
−80
(3)
−80
−100
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Vo = 1 V; Gv = 20 dB.
(1) VCC = 7.5 V; RL = 4 Ω.
(2) VCC = 9 V; RL = 8 Ω.
(3) VCC = 12 V; RL = 16 Ω.
VCC = 7.5 V; RL = 4 Ω; RS = 0 Ω; Vr = 100 mV.
(1) Gv = 24 dB.
(4)
VCC = 5 V; RL = 32 Ω.
(2) Gv = 20 dB.
(3) Gv = 0 dB.
Fig.19 Channel separation as a function of
frequency.
Fig.20 SVRR as a function of frequency.
1998 Apr 01
14
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
MGK994
MGK995
2
1.5
handbook, halfpage
handbook, halfpage
P
o
(W)
1.6
P
(W)
1.0
0.5
1.2
(1)
(2)
(3)
(1)
(2)
(3)
0.8
0.4
0
0
0
0
4
8
12
16
4
8
12
16
V
(V)
V
(V)
CC
CC
(1) RL = 4 Ω.
(2) RL = 8 Ω.
(3) RL = 16 Ω.
THD = 10%.
(1) L = 4 Ω.
R
(2) RL = 8 Ω.
(3) RL = 16 Ω.
Fig.22 Worst case power dissipation as a function
of VCC (one channel active).
Fig.21 Po as a function of VCC
.
MGK996
1.2
handbook, halfpage
P
(W)
(1)
0.8
0.4
(2)
(3)
0
0
0.4
0.8
1.2
1.6
P
(W)
o
Sine wave of 1 kHz.
(1) VCC = 12 V; RL = 16 Ω.
(2) VCC = 7.5 V; RL = 4 Ω.
(3) VCC = 9 V; RL = 8 Ω.
Fig.23 Power dissipation as a function of Po
(one channel active).
1998 Apr 01
15
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
a. Top view copper layout.
+V
GND
CC
TDA
8542TS
8547TS
−OUT1
+OUT1
100 µF
10 kΩ
100 nF
56 kΩ
10 kΩ
IN1
1 µF
MODE
20
1
11 kΩ
11 kΩ
47 µF
11
10
TDA
8542/47TS
SELECT
IN2
56 kΩ
CIC
Nijmegen
1 µF
−OUT2
+OUT2
MGK997
b. Top view components layout.
Fig.24 Printed-circuit board layout (BTL).
16
1998 Apr 01
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
PACKAGE OUTLINE
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
D
E
A
X
c
y
H
v
M
A
E
Z
11
20
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
10o
0o
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.45
0.65
0.45
0.48
0.18
mm
1.5
0.25
0.65
1.0
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
90-04-05
95-02-25
SOT266-1
1998 Apr 01
17
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Apr 01
18
Philips Semiconductors
Product specification
2 × 0.7 W BTL audio amplifier with
output channel switching
TDA8547TS
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Apr 01
19
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Uruguay: see South America
Vietnam: see Singapore
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/00/02/pp20
Date of release: 1998 Apr 01
Document order number: 9397 750 03347
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