TDA8551TD-T [NXP]
IC 1 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO8, Audio Control IC;
| 型号： | TDA8551TD-T |
| 厂家： | 
NXP |
| 描述： | IC 1 CHANNEL(S), VOLUME CONTROL CIRCUIT, PDSO8, Audio Control IC 商用集成电路 音频放大器 光电二极管 |
| 文件： | 总20页 (文件大小：167K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8551
1 W BTL audio amplifier with digital
volume control
1998 Feb 23
Product specification
Supersedes data of 1997 May 07
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
FEATURES
GENERAL DESCRIPTION
• One pin digital volume control
• Volume setting with UP/DOWN pulses
• Flexibility in use
The TDA8551; TDA8551T is a one channel 1 W
Bridge-Tied Load (BTL) audio power amplifier capable of
delivering 1 W output power to an 8 Ω load at THD = 10%
using a 5 V power supply. The circuit contains a BTL
power amplifier, a digital volume control and standby/mute
logic. The TDA8551T comes in an 8 pin SO package and
the TDA8551 in a 8 pin DIP package.
• Few external components
• Low saturation voltage of output stage
• standby mode controlled by CMOS compatible levels
• Low standby current
APPLICATIONS
• No switch-on/switch-off plops
• Portable consumer products
• Personal computers
• Telephony.
• High supply voltage ripple rejection
• Protected against electrostatic discharge
• Outputs short circuit safe to ground, VP and across the
load
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
2.7
TYP. MAX. UNIT
VP
Iq
5
5.5
10
10
−
V
quiescent current
VP = 5 V
−
6
mA
µA
W
Istb
Po
Gv
standby current
−
−
output power
THD = 10%; RL = 8 Ω; VP = 5 V
1
1.4
−
voltage gain
−60
−
+20
−
dB
nvol
number of volume steps
total harmonic distortion
supply voltage ripple rejection
64
0.15
−
THD
SVRR
Po = 0.5 W
−
−
%
48
−
dB
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8551T
TDA8551
SO8
plastic small outline package; 8 leads; body width 3.9 mm
plastic dual in-line package; 8 leads (300 mil)
SOT96-1
SOT97-1
DIP8
1998 Feb 23
2
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
BLOCK DIAGRAM
V
P
6
1
UP/DOWN
INTERFACE
up
down
TDA8551
UP/DOWN
COUNTER
MASTER
4
VOLUME
IN
8
CONTROL
OUT+
V
P
20 kΩ
5 kΩ
15 kΩ
15 kΩ
R
R
3
SVR
STANDBY/
MUTE/
OPERATING
5
OUT−
SLAVE
2
7
MGK363
MODE
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
UP/DOWN
1
2
3
digital trinary input for volume
control
handbook, halfpage
MODE
SVR
digital trinary input for mode
selection (standby, mute, operating)
UP/DOWN
MODE
SVR
1
2
8
OUT+
7
6
5
GND
half supply voltage, decoupling
ripple rejection
TDA8551
3
4
V
P
IN
4
5
audio input
OUT−
IN
OUT−
negative loudspeaker output
terminal
MGK362
VP
6
7
8
supply voltage
ground
GND
OUT+
positive loudspeaker output
terminal
Fig.2 Pin configuration.
1998 Feb 23
3
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
Each pulse on the UP/DOWN pin results in a change in
gain of 80/64 = 1.25 dB (typical value). In the basic
application the UP/DOWN pin is switched to ground or VP
by a double push-button. When the supply voltage is
initially connected, after a complete removal of the supply,
the initial state of the volume control is an attenuation of
40 dB (low volume), so the gain of the total amplifier is
−20 dB. After powering-up, some positive pulses have to
be applied to the UP/DOWN pin for turning up to listening
volume. When the device is switched with the MODE
select pin to the mute or the standby condition, the volume
control attenuation setting remains on its value, assumed
that the voltage on pin VP does not fall below the minimum
supply voltage. After switching the device back to the
operation mode, the previous volume setting is
FUNCTIONAL DESCRIPTION
The TDA8551; TDA8551T is a 1 W BTL audio power
amplifier capable of delivering 1 W output power to an 8 Ω
load at THD = 10% using a 5 V power supply. The gain of
the amplifier can be set by the digital volume control. In the
maximum volume setting the gain is 20 dB. Using the
MODE pin the device can be switched to the standby
condition, the mute condition and the normal operating
condition. The device is protected by an internal thermal
shutdown protection mechanism.
Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary CMOS output stage. The total
voltage loss for both output power MOS transistors is
within 1 V and with a 5 V supply and an 8 Ω loudspeaker
an output power of 1 W can be delivered. The total gain of
this power amplifier is internally fixed at 20 dB.
maintained.
Mode select pin
The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between VP
and VP − 0.5 V. At a mode select voltage level of less than
0.5 V the amplifier is fully operational. In the range
between 1 V and VP − 1.4 V the amplifier is in the mute
condition. The mute condition is useful for using it as a ‘fast
mute’; in this mode output signal is suppressed, while the
volume setting remains at its value. It is advised to keep
the device in the mute condition while the input capacitor
is being charged. This can be done by holding the MODE
pin at a level of 0.5VP, or by waiting approximately 100 ms
before giving the first volume-UP pulses.
Volume control
The volume control operates as a digital controlled
attenuator between the audio input pin and the power
amplifier. In the maximum volume control setting the
attenuation is 0 dB and in the minimum volume control
setting the typical attenuation is 80 dB. The attenuation
can be set in 64 steps by the UP/DOWN pin.
This UP/DOWN pin is a trinary input:
• Floating UP/DOWN pin: volume remains unchanged
• Negative pulses: setting volume towards minimum
• Positive pulses: setting volume towards maximum.
1998 Feb 23
4
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.3
MAX.
+5.5
UNIT
V
VI
input voltage
−0.3
−
VP + 0.3
1
V
IORM
Tstg
Tamb
Vsc
repetitive peak output current
storage temperature
A
−55
−40
−
+150
+85
5.5
°C
°C
V
operating temperature
AC and DC short-circuit safe voltage
maximum power dissipation
Ptot
SO8
−
0.8
W
W
DIP8
−
1.2
QUALITY SPECIFICATION
Quality according to “SNW-FQ-611 part E”, if this type is used as an audio amplifier. Quality specifications are listed in
the “Quality reference handbook”, order number 9397 750 00192.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
SO8
160
100
K/W
K/W
DIP8
1998 Feb 23
5
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; total gain setting at +7 dB (unless otherwise specified); measured in
test circuit of Fig.4.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC characteristics
VP
Iq
supply voltage
2.7
5
5.5
V
quiescent current
standby current
RL = ∞; note 1
VMODE = VP
note 2
−
−
−
−
6
10
10
−
mA
µA
V
Istb
VO
−
DC output voltage
differential output offset
2.5
−
VOUT+ − VOUT−
50
mV
Mode select pin
VMODE
input voltage
standby mode
mute mode
VP − 0.5
−
VP
V
1
−
VP − 1.4
0.5
V
operating mode
0 < VMODE < VP
note 3
0
−
V
IMODE
input current
−
−
100
−
nA
dB
α
mute attenuation
80
90
Volume control
trep
pulse repetition time
100
4.2
−
−
−
ns
V
Vth(UP)
Vfloat(max)
Vfloat(min
UP/DOWN pin up threshold level
UP/DOWN pin floating high level
UP/DOWN pin floating low level
UP/DOWN pin down threshold level
input current UP/DOWN pin
−
VP
3.4
−
−
V
)
1.0
0
−
V
Vth(DOWN)
IUP/DOWN
Gv(max)
−
0.6
200
21
V
0 < VUP/DOWN < VP
−
−
µA
dB
maximum voltage gain (including
power amplifier)
19
20
Gv(min)
minimum voltage gain (including
power amplifier)
−62
−60
−58
dB
nvol
number of volume steps
−
64
1.25
20
−
−
∆Gv
voltage gain variation per step
input impedance
−
−
dB
kΩ
V
Zi
14
−
−
Vi(rms)(max)
maximum input voltage (RMS value)
2.0
AC characteristics (f = 1 kHz)
Po
output power
THD = 10%
THD = 0.5%
Po = 0.5 W; note 4
note 5
1
1.4
1.0
0.15
60
−
W
W
%
0.6
−
−
THD
total harmonic distortion
0.5
100
−
Vn(o)
noise output voltage
−
µV
dB
V
SVRR
Vi(IN)(max)
supply voltage ripple rejection
maximum input voltage on pin IN
note 6
48
−
53
THD = 1%;
Gv = −50 dB
to 0 dB
−
2.0
1998 Feb 23
6
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
Notes to the Characteristics
1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VP.
3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz.
4. Total gain setting at +20 dB.
5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input
source impedance Rsource = 0 Ω.
6. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input.
The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive
supply rail.
t
t
t
w
r
rep
V
P
increasing volume
floating
V
th(UP)
float(max)
V
V
UP/DOWN
V
float(min)
V
th(DOWN)
0
decreasing volume
t
t
t
t
w
r
rep
MGK365
The rise time (tr) and the width of the pulse (tw) are not critical.
Fig.3 Timing UP/DOWN pin.
1998 Feb 23
7
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
TEST AND APPLICATION INFORMATION
V
P
UP
R1
volume
control
2.2 kΩ
DOWN
C5
100 nF
V
= 5 V
P
C3
100
nF
UP/DOWN
V
C4
220
µF
P
6
1
MASTER
C1
330 nF
4
IN
VOLUME
OUT+
8
CONTROL
V
P
20 kΩ
V
i
TDA8551
5 kΩ
15 kΩ
15 kΩ
R
R
SVR
3
8 Ω
C2
100
µF
STANDBY/
MUTE/
OUT−
5
OPERATING
V
P
SLAVE
2
7
standby
MODE
GND
mute
operating
MGM560
Fig.4 Test and application circuit.
Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not standardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz. copper traces
with solder coating. The measurements have been carried
out with vertical placed boards.
The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filter between the buttons and the
UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ
and 100 nF.
The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.
1998 Feb 23
8
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
When a practical PCB layout is used with wider copper
tracks and some extra copper added both to the IC pin
connections and underneath the IC, the thermal resistance
from junction to ambient can be reduced. Without these
MGM554
10
measures Rth j-a = 160 K/W for the SO8 package; see
handbook, halfpage
I
P
(mA)
Chapter “Thermal characteristics”. The power dissipation
can be calculated as follows:
8
Tamb
P =
-------------
Rth j-a
6
4
2
0
For a maximum ambient temperature of 50 °C, VP = 5 V
and RL = 8 Ω this results in a worst case sine wave
dissipation of 0.63 W.
Figures 5 to 15 represent test results obtained while using
the test circuit given in Fig.4. The following test conditions
apply: Tamb = 25 °C; VP = 5 V; f = 1 kHz; RL = 8 Ω;
Gv = 20 dB; audio bandwidth from 22 Hz to 22 kHz
(except for Figs 8 and 9); unless otherwise specified.
0
2
4
6
V
(V)
P
Fig.5 Supply current as a function of supply
voltage.
MGM551
MGM552
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
(1)
THD
(%)
1
1
(1)
(2)
(2)
(3)
−1
−1
10
10
(3)
−2
−2
10
10
−2
−1
−2
−1
10
10
1
10
10
10
1
10
P
(W)
P (W)
o
o
f = 1 kHz.
(1) Gv = 0 dB.
(2) Gv = 7 dB.
(3) Gv = 20 dB.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
Fig.6 Total harmonic distortion as a function of
output power at different frequencies.
Fig.7 Total harmonic distortion as a function of
output power at different gains.
1998 Feb 23
9
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
MGM550
MGM549
10
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
THD
(%)
(1)
1
−20
−40
(2)
(3)
(1)
−1
10
(2)
(3)
(4)
(5)
(6)
−2
10
−60
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Vripple = 100 mV.
(3) C2 = 100 µF; Gv = 20 dB.
(4) C2 = 10 µF; Gv = −10 dB.
(5) C2 = 100 µF; Gv = 7 dB.
(6) C2 = 100 µF; Gv = −10 dB.
Rsource = 0 Ω.
Po = 0.1 W.
(2) Gv = 7 dB.
(3) Gv = 20 dB.
(1) C2 = 10 µF; Gv = 20 dB.
(2) C2 = 10 µF; Gv = 7 dB.
(1) Gv = 0 dB.
Fig.8 Total harmonic distortion as a function of
frequency at different gains.
Fig.9 Supply voltage ripple rejection as a function
of frequency.
MGM555
MGM559
1
2.4
handbook, halfpage
handbook, halfpage
V
o
V
i
(V)
2.0
(V)
−1
10
1.6
1.2
−2
10
−3
10
0.8
0.4
−4
10
(1)
(2)
−5
0
−60
10
−40
−20
0
20
0
1
2
3
4
5
G
(dB)
V
v
MODE
(1) VP = 3 V.
(2) VP = 5 V.
THD = 1 %.
Fig.10 Input voltage as a function of voltage gain.
Fig.11 Output voltage as a function of mode select
input voltage at different supply voltages.
1998 Feb 23
10
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
MGM553
MGM558
20
3
handbook, halfpage
handbook, halfpage
G
v
(dB)
0
P
o
(W)
2
−20
−40
(1)
(2)
1
−60
0
0
−80
0
20
40
60
80
2
4
6
n
V
(V)
vol
P
Po(max) is limited by Ptot and a
maximum available repetitive
peak output current of 1 A.
THD = 10 %.
(1) RL = 4 Ω.
(2) RL = 8 Ω.
Fig.12 Volume gain as a function of volume steps.
Fig.13 Output power as a function of supply
voltage.
MGM556
MGM557
1.5
1.5
handbook, halfpage
handbook, halfpage
P
(W)
P
(W)
(1)
(1)
1
1
(2)
(2)
(3)
(4)
0.5
0.5
(3)
(5)
0
0
0
2
4
6
0
0.4
0.8
1.2
1.6
2.0
(W)
V
(V)
P
P
o
(1) VP = 5 V; RL = 4 Ω.
(2) VP = 5 V; RL = 8 Ω.
(4) VP = 5 V; RL = 16 Ω.
(5) VP = 3.3 V; RL = 8 Ω.
(1) RL = 4 Ω.
(2) RL = 8 Ω.
(3) RL = 16 Ω.
(3) VP = 3.3 V; RL = 4 Ω.
Fig.14 Power dissipation as a function of supply
voltage.
Fig.15 Power dissipation as a function of output
power.
1998 Feb 23
11
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
51.2
51.1
top view
bottom view
+V
GND
P
VOLUME
CONTROL
DOWN
UP
S2
C4
S1
C3
8
C5
R1
C2
1
OUT+
OUT−
TDA8551
V
i
C1
AUDIO POWER
CIC NIJMEGEN
J1
stand-by
TDA
8551
operating
mute
MGM561
Dimensions in mm.
Fig.16 Layout of printed-circuit board.
12
1998 Feb 23
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
PACKAGE OUTLINES
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
1998 Feb 23
13
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
1998 Feb 23
14
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Feb 23
15
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Feb 23
16
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
NOTES
1998 Feb 23
17
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
NOTES
1998 Feb 23
18
Philips Semiconductors
Product specification
1 W BTL audio amplifier with digital volume control
TDA8551
NOTES
1998 Feb 23
19
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/02/pp20
Date of release: 1998 Feb 23
Document order number: 9397 750 03173
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