TDA8551T/N1/N,112 [NXP]
TDA8551_T - 1 W BTL audio amplifier with digital volume control SOIC 8-Pin;
| 型号： | TDA8551T/N1/N,112 |
| 厂家： | 
NXP |
| 描述： | TDA8551_T - 1 W BTL audio amplifier with digital volume control SOIC 8-Pin |
| 文件： | 总18页 (文件大小：149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8551
1 W BTL audio amplifier with digital
volume control
Product specification
1998 Feb 23
Supersedes data of 1997 May 07
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
FEATURES
GENERAL DESCRIPTION
The TDA8551; TDA8551T is a one channel 1 W
Bridge-Tied Load (BTL) audio power amplifier capable of
delivering 1 W output power to an 8 Ω load at THD = 10%
using a 5 V power supply. The circuit contains a BTL
power amplifier, a digital volume control and standby/mute
logic. The TDA8551T comes in an 8 pin SO package and
the TDA8551 in a 8 pin DIP package.
• One pin digital volume control
• Volume setting with UP/DOWN pulses
• Flexibility in use
• Few external components
• Low saturation voltage of output stage
• Standby mode controlled by CMOS compatible levels
• Low standby current
APPLICATIONS
• No switch-on/switch-off plops
• Portable consumer products
• Personal computers
• Telephony.
• High supply voltage ripple rejection
• Protected against electrostatic discharge
• Outputs short circuit safe to ground, VP and across the
load
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
supply voltage
CONDITIONS
MIN.
2.7
TYP. MAX. UNIT
VP
Iq
5
5.5
10
10
−
V
quiescent current
VP = 5 V
−
6
mA
μA
W
Istb
Po
Gv
standby current
−
−
output power
THD = 10%; RL = 8 Ω; VP = 5 V
1
1.4
−
voltage gain
−60
−
+20
−
dB
nvol
number of volume steps
total harmonic distortion
supply voltage ripple rejection
64
0.15
−
THD
SVRR
Po = 0.5 W
−
−
%
48
−
dB
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT96-1
SOT97-1
TDA8551T
TDA8551
SO8
plastic small outline package; 8 leads; body width 3.9 mm
plastic dual in-line package; 8 leads (300 mil)
DIP8
1998 Feb 23
2
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
BLOCK DIAGRAM
V
P
6
1
UP/DOWN
INTERFACE
up
down
TDA8551
UP/DOWN
COUNTER
MASTER
4
VOLUME
IN
8
CONTROL
OUT+
V
P
20 kΩ
5 kΩ
15 kΩ
15 kΩ
R
R
3
SVR
STANDBY/
MUTE/
OPERATING
5
OUT−
SLAVE
2
7
MGK363
MODE
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
UP/DOWN
1
digital trinary input for volume
control
handbook, halfpage
MODE
SVR
2
3
digital trinary input for mode
selection (standby, mute, operating)
UP/DOWN
MODE
SVR
1
2
8
OUT+
7
6
5
GND
half supply voltage, decoupling
ripple rejection
TDA8551
3
4
V
P
IN
4
5
audio input
OUT−
IN
OUT−
negative loudspeaker output
terminal
MGK362
VP
6
7
8
supply voltage
ground
GND
OUT+
positive loudspeaker output
terminal
Fig.2 Pin configuration.
1998 Feb 23
3
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
FUNCTIONAL DESCRIPTION
Each pulse on the UP/DOWN pin results in a change in
gain of 80/64 = 1.25 dB (typical value). In the basic
application the UP/DOWN pin is switched to ground or VP
by a double push-button. When the supply voltage is
initially connected, after a complete removal of the supply,
the initial state of the volume control is an attenuation of
40 dB (low volume), so the gain of the total amplifier is
−20 dB. After powering-up, some positive pulses have to
be applied to the UP/DOWN pin for turning up to listening
volume. When the device is switched with the MODE
select pin to the mute or the standby condition, the volume
control attenuation setting remains on its value, assumed
that the voltage on pin VP does not fall below the minimum
supply voltage. After switching the device back to the
operation mode, the previous volume setting is
The TDA8551; TDA8551T is a 1 W BTL audio power
amplifier capable of delivering 1 W output power to an 8 Ω
load at THD = 10% using a 5 V power supply. The gain of
the amplifier can be set by the digital volume control. In the
maximum volume setting the gain is 20 dB. Using the
MODE pin the device can be switched to the standby
condition, the mute condition and the normal operating
condition. The device is protected by an internal thermal
shutdown protection mechanism.
Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier
with a complementary CMOS output stage. The total
voltage loss for both output power MOS transistors is
within 1 V and with a 5 V supply and an 8 Ω loudspeaker
an output power of 1 W can be delivered. The total gain of
this power amplifier is internally fixed at 20 dB.
maintained.
Mode select pin
The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between VP
and VP − 0.5 V. At a mode select voltage level of less than
0.5 V the amplifier is fully operational. In the range
between 1 V and VP − 1.4 V the amplifier is in the mute
condition. The mute condition is useful for using it as a ‘fast
mute’; in this mode output signal is suppressed, while the
volume setting remains at its value. It is advised to keep
the device in the mute condition while the input capacitor
is being charged. This can be done by holding the MODE
pin at a level of 0.5VP, or by waiting approximately 100 ms
before giving the first volume-UP pulses.
Volume control
The volume control operates as a digital controlled
attenuator between the audio input pin and the power
amplifier. In the maximum volume control setting the
attenuation is 0 dB and in the minimum volume control
setting the typical attenuation is 80 dB. The attenuation
can be set in 64 steps by the UP/DOWN pin.
This UP/DOWN pin is a trinary input:
• Floating UP/DOWN pin: volume remains unchanged
• Negative pulses: setting volume towards minimum
• Positive pulses: setting volume towards maximum.
1998 Feb 23
4
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.3
MAX.
+5.5
UNIT
V
VI
input voltage
−0.3
−
VP + 0.3
1
V
IORM
Tstg
Tamb
Vsc
repetitive peak output current
storage temperature
A
−55
−40
−
+150
+85
5.5
°C
°C
V
operating temperature
AC and DC short-circuit safe voltage
maximum power dissipation
Ptot
SO8
−
0.8
W
W
DIP8
−
1.2
QUALITY SPECIFICATION
Quality according to “SNW-FQ-611 part E”, if this type is used as an audio amplifier. Quality specifications are listed in
the “Quality reference handbook”, order number 9397 750 00192.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
in free air
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient
SO8
160
100
K/W
K/W
DIP8
1998 Feb 23
5
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; RL = 8 Ω; VMODE = 0 V; total gain setting at +7 dB (unless otherwise specified); measured in
test circuit of Fig.4.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
DC characteristics
VP
Iq
supply voltage
2.7
5
5.5
V
quiescent current
standby current
RL = ∞; note 1
VMODE = VP
note 2
−
−
−
−
6
10
10
−
mA
μA
V
Istb
VO
−
DC output voltage
differential output offset
2.5
−
⎪VOUT+ − VOUT−
⎪
50
mV
Mode select pin
VMODE
input voltage
standby mode
mute mode
VP − 0.5
−
VP
V
1
−
VP − 1.4
0.5
V
operating mode
0 < VMODE < VP
note 3
0
−
V
IMODE
input current
−
−
100
−
nA
dB
α
mute attenuation
80
90
Volume control
trep
pulse repetition time
100
4.2
−
−
−
ns
V
Vth(UP)
UP/DOWN pin up threshold level
UP/DOWN pin floating high level
UP/DOWN pin floating low level
UP/DOWN pin down threshold level
input current UP/DOWN pin
−
VP
3.4
−
Vfloat(max)
−
V
Vfloat(min
)
1.0
0
−
V
Vth(DOWN)
IUP/DOWN
Gv(max)
−
0.6
200
21
V
0 < VUP/DOWN < VP
−
−
μA
dB
maximum voltage gain (including
power amplifier)
19
20
Gv(min)
minimum voltage gain (including
power amplifier)
−62
−60
−58
dB
nvol
number of volume steps
−
64
1.25
20
−
−
ΔGv
voltage gain variation per step
input impedance
−
−
dB
kΩ
V
Zi
14
−
−
Vi(rms)(max)
maximum input voltage (RMS value)
2.0
AC characteristics (f = 1 kHz)
Po
output power
THD = 10%
THD = 0.5%
Po = 0.5 W; note 4
note 5
1
1.4
1.0
0.15
60
−
W
W
%
0.6
−
−
THD
total harmonic distortion
0.5
100
−
Vn(o)
noise output voltage
−
μV
dB
V
SVRR
Vi(IN)(max)
supply voltage ripple rejection
maximum input voltage on pin IN
note 6
48
−
53
THD = 1%;
Gv = −50 dB
to 0 dB
−
2.0
1998 Feb 23
6
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
Notes to the Characteristics
1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal
to the DC output offset voltage divided by RL.
2. The DC output voltage with respect to ground is approximately 0.5VP.
3. Output voltage in mute position is measured with an input of 1 V (RMS), including noise, in a bandwidth of 20 kHz.
4. Total gain setting at +20 dB.
5. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted), input
source impedance Rsource = 0 Ω.
6. Supply voltage ripple rejection is measured at the output, with a source impedance of Rsource = 0 Ω at the input.
The ripple voltage is a sine wave with frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the positive
supply rail.
t
t
t
w
r
rep
V
P
increasing volume
floating
V
th(UP)
float(max)
V
V
UP/DOWN
V
float(min)
V
th(DOWN)
0
decreasing volume
t
t
t
t
w
r
rep
MGK365
The rise time (tr) and the width of the pulse (tw) are not critical.
Fig.3 Timing UP/DOWN pin.
1998 Feb 23
7
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
TEST AND APPLICATION INFORMATION
V
P
UP
R1
volume
control
2.2 kΩ
DOWN
C5
100 nF
V
= 5 V
P
C3
100
nF
UP/DOWN
V
C4
220
μF
P
6
1
MASTER
C1
330 nF
4
IN
VOLUME
OUT+
8
CONTROL
V
P
20 kΩ
V
i
TDA8551
5 kΩ
15 kΩ
15 kΩ
R
R
SVR
3
8 Ω
C2
100
μF
STANDBY/
MUTE/
OUT−
5
OPERATING
V
P
SLAVE
2
7
standby
MODE
GND
mute
operating
MGM560
Fig.4 Test and application circuit.
Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not standardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. NXP Semiconductors uses
FR-4 type application boards with 1 oz. copper traces with
solder coating. The measurements have been carried out
with vertical placed boards.
The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filter between the buttons and the
UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ
and 100 nF.
The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.
1998 Feb 23
8
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
When a practical PCB layout is used with wider copper
tracks and some extra copper added both to the IC pin
connections and underneath the IC, the thermal resistance
from junction to ambient can be reduced. Without these
measures Rth j-a = 160 K/W for the SO8 package; see
MGM554
10
handbook, halfpage
I
P
(mA)
8
Chapter “Thermal characteristics”. The power dissipation
can be calculated as follows:
Tamb
P =
-------------
Rth j-a
6
4
2
For a maximum ambient temperature of 50 °C, VP = 5 V
and RL = 8 Ω this results in a worst case sine wave
dissipation of 0.63 W.
Figures 5 to 15 represent test results obtained while using
the test circuit given in Fig.4. The following test conditions
apply: Tamb = 25 °C; VP = 5 V; f = 1 kHz; RL = 8 Ω;
Gv = 20 dB; audio bandwidth from 22 Hz to 22 kHz
(except for Figs 8 and 9); unless otherwise specified.
0
0
2
4
6
V
(V)
P
Fig.5 Supply current as a function of supply
voltage.
MGM551
MGM552
10
10
handbook, halfpage
handbook, halfpage
THD
(%)
(1)
THD
(%)
1
1
(1)
(2)
(2)
(3)
−1
−1
10
10
(3)
−2
−2
10
10
−2
−1
−2
−1
10
10
10
1
10
10
1
10
P
(W)
P (W)
o
o
f = 1 kHz.
(1) Gv = 0 dB.
(2) Gv = 7 dB.
(3) Gv = 20 dB.
(1) f = 10 kHz.
(2) f = 1 kHz.
(3) f = 100 Hz.
Fig.6 Total harmonic distortion as a function of
output power at different frequencies.
Fig.7 Total harmonic distortion as a function of
output power at different gains.
1998 Feb 23
9
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
MGM550
MGM549
10
0
handbook, halfpage
handbook, halfpage
SVRR
(dB)
THD
(%)
(1)
1
−20
−40
(2)
(3)
(1)
−1
10
(2)
(3)
(4)
(5)
(6)
−2
10
−60
2
3
4
5
2
3
4
5
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Vripple = 100 mV.
(3) C2 = 100 μF; Gv = 20 dB.
(4) C2 = 10 μF; Gv = −10 dB.
(5) C2 = 100 μF; Gv = 7 dB.
(6) C2 = 100 μF; Gv = −10 dB.
Rsource = 0 Ω.
Po = 0.1 W.
(2) Gv = 7 dB.
(3) Gv = 20 dB.
(1) C2 = 10 μF; Gv = 20 dB.
(2) C2 = 10 μF; Gv = 7 dB.
(1) Gv = 0 dB.
Fig.8 Total harmonic distortion as a function of
frequency at different gains.
Fig.9 Supply voltage ripple rejection as a function
of frequency.
MGM555
MGM559
1
2.4
handbook, halfpage
handbook, halfpage
V
o
V
i
(V)
2.0
(V)
−1
10
1.6
1.2
−2
10
−3
10
0.8
0.4
−4
10
(1)
(2)
−5
0
−60
10
−40
−20
0
20
0
1
2
3
4
5
G
(dB)
V
v
MODE
(1) VP = 3 V.
(2) VP = 5 V.
THD = 1 %.
Fig.10 Input voltage as a function of voltage gain.
Fig.11 Output voltage as a function of mode select
input voltage at different supply voltages.
1998 Feb 23
10
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
MGM553
MGM558
20
3
handbook, halfpage
handbook, halfpage
G
v
(dB)
0
P
o
(W)
2
−20
−40
(1)
(2)
1
−60
0
0
−80
0
20
40
60
80
2
4
6
n
V
(V)
vol
P
Po(max) is limited by Ptot and a
maximum available repetitive
peak output current of 1 A.
THD = 10 %.
(1) RL = 4 Ω.
(2) RL = 8 Ω.
Fig.12 Volume gain as a function of volume steps.
Fig.13 Output power as a function of supply
voltage.
MGM556
MGM557
1.5
1.5
handbook, halfpage
handbook, halfpage
P
(W)
P
(W)
(1)
(1)
1
1
(2)
(2)
(3)
(4)
0.5
0.5
(3)
(5)
0
0
0
2
4
6
0
0.4
0.8
1.2
1.6
2.0
(W)
V
(V)
P
P
o
(1) VP = 5 V; RL = 4 Ω.
(2) VP = 5 V; RL = 8 Ω.
(4) VP = 5 V; RL = 16 Ω.
(5) VP = 3.3 V; RL = 8 Ω.
(1) RL = 4 Ω.
(2) RL = 8 Ω.
(3) RL = 16 Ω.
(3) VP = 3.3 V; RL = 4 Ω.
Fig.14 Power dissipation as a function of supply
voltage.
Fig.15 Power dissipation as a function of output
power.
1998 Feb 23
11
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
51.2
51.1
top view
bottom view
+V
GND
P
VOLUME
CONTROL
DOWN
UP
S2
C4
S1
C3
8
C5
R1
C2
1
OUT+
OUT−
TDA8551
V
i
C1
AUDIO POWER
CIC NIJMEGEN
J1
stand-by
TDA
8551
operating
mute
MGM561
Dimensions in mm.
Fig.16 Layout of printed-circuit board.
12
1998 Feb 23
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
PACKAGE OUTLINES
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
1998 Feb 23
13
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT97-1
050G01
MO-001
SC-504-8
1998 Feb 23
14
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
SOLDERING
Introduction
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Feb 23
15
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
1998 Feb 23
16
NXP Semiconductors
Product specification
1 W BTL audio amplifier with digital volume
control
TDA8551
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
1998 Feb 23
17
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/02/pp18
Date of release: 1998 Feb 23
Document order number: 9397 750 03173
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