TDA8574 [NXP]
Class-H high-output voltage level line driver; H级高输出电压电平线路驱动器
| 型号： | TDA8574 |
| 厂家： | 
NXP |
| 描述： | Class-H high-output voltage level line driver |
| 文件： | 总16页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8574
Class-H high-output voltage level
line driver
1998 Oct 16
Product specification
Supersedes data of 1997 Feb 26
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
The TDA8574 is available in a DIP16 package and the
TDA8574T in a SO16 package.
FEATURES
• Output voltage swing larger than supply voltage
• High supply voltage ripple rejection
• Low distortion
Line drivers are necessary in car audio systems in which
the power amplifiers are driven by long cables.
The signal-to-noise ratio of these car audio systems is
improved by using the TDA8574(T) class-H high-output
level line driver. The high-output level of TDA8574(T)
enables a reduction of the gain of the power amplifier
resulting in an improvement of the power amplifier
performance.
• Low noise
• ESD protected on all pins.
GENERAL DESCRIPTION
The TDA8574(T) is a two channel class-H high-output
voltage line driver for use in car audio applications.
The line driver behaves as a non-inverting amplifier with a
gain of 8 dB and a single-ended output. Due to the class-H
voltage lifting principle the voltage swing over the load is
more than the supply voltage. With a supply voltage of 9 V
the output voltage swing over the load will be
14 V (peak-to-peak).
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
MAX.
12
UNIT
6
9
8
8
V
ICC
supply current
voltage gain
VCC = 9 V
−
13
8.5
−
mA
dB
V
Gv
7.5
5.0
50
−
Vo(rms)
SVRR
THD
Vno
maximal output voltage (RMS value) THD = 0.1%
supply voltage ripple rejection
5.2
65
−
dB
%
total harmonic distortion
noise output voltage
output impedance
Vo(rms) = 3 V; f = 1 kHz
0.003
5
−
−
−
µV
Ω
Zo
−
−
10
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8574T
TDA8574
SO16
DIP16
plastic small outline package; 16 leads; body width 7.5 mm
plastic dual in-line package; 16 leads (300 mil)
SOT162-1
SOT38-4
1998 Oct 16
2
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
BLOCK DIAGRAM
1
V
CCL
36 kΩ
16
15
V
BUFFER
CL+
CL−
CCL
24 kΩ
−
+
3
SVRL
LIFT
AMP.
BUFFER
30 kΩ
SIGNAL
AMP.
13
+
−
OUTL
REFERENCE
V
CCL
2
INL
4
14
11
LGND
RGND
INML
5 Ω
TDA8574(T)
5
7
INMR
INR
V
CCR
REFERENCE
−
+
12
OUTR
SIGNAL
AMP.
30 kΩ
24 kΩ
BUFFER
LIFT
AMP.
6
8
+
−
10
9
SVRR
CR−
CR+
V
CCR
BUFFER
36 kΩ
V
CCR
MGE668
Fig.1 Block diagram.
3
1998 Oct 16
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
PINNING
SYMBOL
VCCL
PIN
DESCRIPTION
1
2
supply voltage left channel
input voltage left channel
SVRR left channel
INL
handbook, halfpage
V
1
2
3
4
5
6
7
8
16
CL+
CCL
INL
SVRL
INML
INMR
SVRR
INR
3
15
14
13
12
11
10
9
CL−
4
inverting input left channel
inverting input right channel
SVRR right channel
5
SVRL
INML
INMR
SVRR
INR
LGND
OUTL
OUTR
RGND
CR−
6
TDA8574
TDA8574T
7
input voltage right channel
supply voltage right channel
lift capacitor (+) right channel
lift capacitor (−) right channel
ground right channel
VCCR
CR+
8
9
CR−
10
11
12
13
14
15
16
CR+
V
CCR
RGND
OUTR
OUTL
LGND
CL−
MGE667
output voltage right channel
output voltage left channel
ground left channel
lift capacitor (−) left channel
lift capacitor (+) left channel
Fig.2 Pin configuration.
CL+
The DC output level is set to ≈0.87 × VCC. The maximum
peak-to-peak output voltage of the signal amplifier is
calculated with the formula:
FUNCTIONAL DESCRIPTION
Lift amplifier
The lift amplifier, referred to as LIFT AMP. in Fig.1, is used
as a non-inverting amplifier with a voltage gain of 8 dB set
by an internal feedback network. If the output voltage of
the signal amplifier is low, the external lift capacitor is
recharged by the lift amplifier. As soon as the output
voltage of the signal amplifier increases above 0.87 × VCC
the lift amplifier switches the voltage of the lift capacitor in
series with the supply voltage VCC. The voltage at the
positive side of the lift capacitor is referred to as lifted
supply voltage.
V
o (p – p) max ≈ 2 × (0.87VCC – 0.4)
Buffers
The buffers prevent loading of the internal voltage divider
network made by a series connection of resistors. For a
good supply voltage ripple rejection this internal voltage
divider network has to be decoupled by an external
capacitor.
Reference
Signal amplifier
This circuit supplies all currents needed in the device.
The signal amplifier, referred to as SIGNAL AMP. in Fig.1,
is used as a non-inverting amplifier. The voltage gain Gv is
set by the feedback resistors according to the formula:
R2
Gv = 1 +
------
R1
and should be set to 8 dB. The LIFT AMP. and SIG AMP.
must have equal voltage gain Gv. The rail-to-rail output
stage of the signal amplifier uses the lifted supply voltage
to increase the output voltage swing.
1998 Oct 16
4
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
operating
MIN.
MAX.
12
UNIT
−
−
V
IORM
Tstg
Tamb
Tj
repetitive peak output current
storage temperature
20
mA
°C
°C
°C
−55
−40
−
+150
+85
+150
operating ambient temperature
junction temperature
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TDA8574 (DIP16)
75
K/W
K/W
TDA8574T (SO16)
110
1998 Oct 16
5
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
DC CHARACTERISTICS
V
CC = 9 V; Tamb = 25 °C; RL = 10 kΩ; in accordance with application diagram (see Fig.3).
SYMBOL PARAMETER CONDITIONS MIN. TYP.
VCC Vin = 0 V
MAX.
12
UNIT
supply voltage
supply current
6
−
−
9
8
V
ICC
VO
13
mA
V
DC output voltage
note 1
7.8
−
Note
1. The DC output voltage with respect to ground is ≈0.87 × VCC.
AC CHARACTERISTICS
VCC = 9 V; f = 1 kHz; RL = 10 kΩ; Tamb = 25 °C; in accordance with test circuit (see Fig.3); note 1.
SYMBOL
Gv
∆Gv
αcs
PARAMETER
voltage gain
CONDITIONS
MIN.
7.5
TYP.
MAX.
8.5
UNIT
dB
dB
dB
Hz
kHz
kΩ
Ω
8
channel unbalance
channel separation
low frequency roll-off
high frequency roll-off
input impedance
−
−
0.5
−
Rs = 600 Ω; Vo(rms) = 1 V; note 1
−1 dB; note 2
80
−
90
−
flr
5
fhr
−1 dB
20
22
−
−
−
Zi
Zo
30
−
38
10
−
output impedance
Vo(max)(rms) maximum output voltage
(RMS value)
THD + N = 0.1%
5.0
5.2
V
Vno
noise output voltage
unweighted; note 3
A-weighted; note 4
−
7
9
µV
µV
%
−
5
−
THD + N
SVRR
total harmonic distortion plus f = 1 kHz; Vo = 3 V (RMS); note 5
noise
−
0.003
0.01
65
0.01
f = 17 Hz to 20 kHz; note 6
−
−
−
−
%
supply voltage ripple rejection note 7
f = 20 Hz to 20 kHz; note 8
50
−
dB
dB
55
Notes
1. The channel separation is determined by the parasitic capacitance between the inverting input left channel (pin 4)
and the inverting input right channel (pin 5). The PCB layout has a major contribution to the parasitic capacitance.
To obtain best results, the PCB tracks to pin 4 and pin 5 should be separated as much as possible.
2. The frequency response is externally fixed by the input coupling capacitors.
3. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz with a source resistor Rs = 600 Ω.
4. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz with an A-weighted filter with a source resistor
Rs = 600 Ω.
5. Distortion is measured at a frequency of 1 kHz using an A-weighted filter.
6. Distortion is measured at an output voltage of 3.0 V (RMS) at frequencies between 17 Hz and 20 kHz.
7. Ripple rejection is measured at the output, using a source resistor Rs = 600 Ω and a ripple amplitude of
100 mV (RMS) at a frequency of 1 kHz.
8. Ripple rejection is measured at the output, using a source resistor Rs = 600 Ω and a ripple amplitude of
100 mV (RMS) at frequencies between 20 Hz and 20 kHz.
1998 Oct 16
6
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
APPLICATION INFORMATION
24 kΩ
36 kΩ
(1)
(1)
R1
R2
V
CC
V
CCL
1
3
V
CC
C5
1.5 nF
C6
100
nF
36 kΩ
CL+
16
BUFFER
BUFFER
V
CCL
C4
100
µF
24 kΩ
30 kΩ
−
+
15 CL−
SVRL
LIFT
AMP.
SIGNAL
AMP.
C3
13
+
−
OUTL
22 µF
REFERENCE
RL
10 kΩ
V
CCL
C1
2
4
INL
14 LGND
11 RGND
INML
22 µF
5 Ω
TDA8574(T)
INMR
INR
5
7
C1
22 µF
V
CCR
REFERENCE
C3
−
+
12 OUTR
R
V
R
s
s
SIGNAL
AMP.
22 µF
RL
10 kΩ
V
i(L)
i(R)
30 kΩ
24 kΩ
BUFFER
LIFT
AMP.
6
8
SVRR
+
−
10 CR−
C4
100
µF
C2
47 µF
9
CR+
V
CCR
BUFFER
C5
1.5 nF
36 kΩ
V
CCR
V
CC
24 kΩ
36 kΩ
MGE669
(1)
(1)
R1
R2
(1) R1 and R2 should have a tolerance of ≤ 1%.
Fig.3 Application diagram.
7
1998 Oct 16
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Printed-Circuit Board (PCB) layout
64
46.08
22 µF
22 µF
OUTR
SGND
INR
OUTL
SGND
INL
10 kΩ
22 µF
10 kΩ
SO16
22 µF
36 kΩ
36 kΩ
RL
24 kΩ
24 kΩ
47 µF
GND
V
CC
MBH883
Dimensions in mm.
IC mounted on track side, additional components mounted on component side.
Tracks viewed from component side.
Fig.4 Recommended PCB-layout.
8
1998 Oct 16
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Application characteristics
VCC = 9 V; RI = 10 kΩ; Tamb = 25 °C; 80 kHz filter.
MGD906
MGD907
1
1
handbook, halfpage
handbook, halfpage
THD + N
(%)
THD + N
(%)
−1
−1
10
10
V
= 5 V
4 V
o
f = 10 kHz
3 V
2 V
−2
−2
10
10
1 kHz
100 Hz
−3
−3
10
10
2
3
4
5
0
2
4
6
10
10
10
10
10
V
(V)
f (Hz)
o
Fig.5 Total harmonic distortion plus noise as a
function of Vo.
Fig.6 Total harmonic distortion plus noise as a
function of frequency.
MGD908
MGD909
10
−40
handbook, halfpage
handbook, halfpage
G
(dB)
SVRR
(dB)
8
6
4
2
−50
R
600 Ω
=
s
−60
0 Ω
−70
−80
2
3
4
5
6
2
3
4
5
10
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
Fig.8 Supply voltage ripple rejection as a function
of frequency.
Fig.7 Total circuit gain as a function of frequency.
1998 Oct 16
9
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
MGD910
MGD911
−60
−60
handbook, halfpage
handbook, halfpage
α
α
cs
cs
(dB)
(dB)
f = 10 kHz
−80
−80
1 V
1 kHz
3 V
5 V
100 Hz
−100
−100
−120
−120
2
3
4
5
10
10
10
10
10
0
1
2
3
4
5
f (Hz)
V
(V)
o
Fig.10 Channel separation as a function of
frequency.
Fig.9 Channel separation as a function of Vo.
1998 Oct 16
10
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
D
E
A
X
c
H
v
M
A
E
y
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
detail X
e
w
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
mm
2.65
1.27
0.050
1.4
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.41
0.014 0.009 0.40
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches 0.10
0.055
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-24
97-05-22
SOT162-1
075E03
MS-013AA
1998 Oct 16
11
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
b
2
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.30
0.53
0.38
1.25
0.85
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
0.76
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.030
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-01-14
SOT38-4
1998 Oct 16
12
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1998 Oct 16
13
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Oct 16
14
Philips Semiconductors
Product specification
Class-H high-output voltage level line
driver
TDA8574
NOTES
1998 Oct 16
15
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Slovakia: see Austria
Slovenia: see Italy
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Spain: Balmes 22, 08007 BARCELONA,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545102/25/03/pp16
Date of release: 1998 Oct 16
Document order number: 9397 750 04393
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