TDA8575 [NXP]
Ground noise isolation amplifier; 地面的噪音隔离放大器器
| 型号： | TDA8575 |
| 厂家： | 
NXP |
| 描述： | Ground noise isolation amplifier |
| 文件： | 总16页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8575
Ground noise isolation amplifier
1996 Jul 29
Preliminary specification
File under Integrated Circuits, IC01
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
FEATURES
GENERAL DESCRIPTION
• High common mode rejection up to high frequencies
The TDA8575(T) is a two channel amplifier with differential
input and single-ended output for use in car audio
applications. The differential amplifier has a gain of 0 dB,
a low distortion and a high common mode rejection. The
TDA8575T comes in a 16 pin SO package and TDA8575
comes in a 16 pin DIP package.
• Reduced dependency of common mode rejection on
source resistance
• Low distortion
• Low noise
• AC and DC short-circuit safe
• Few external components
• ESD protected on all pins.
The TDA8575(T) is developed for those car audio
applications where long connections between signal
sources and amplifiers (or boosters) are necessary and
ground noise has to be eliminated.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
8.5
MAX.
18
UNIT
5
V
ICC
supply current
VCC = 8.5 V
−
12.6
0
15
+0.5
−
mA
dB
V
Gv
voltage gain
−0.5
−
Vo(rms)(max)
SVRR
CMRR
THD
Vno
maximum output voltage (RMS value)
supply voltage ripple rejection
common mode rejection ratio
total harmonic distortion
noise output voltage
THD = 0.1%
1.7
60
55
−
−
dB
dB
%
Rs = 0 Ω
80
−
Vo(rms) = 1 V; f = 1 kHz −
0.005
3.7
108
−
−
−
−
−
5
µV
kΩ
Ω
Zi
input impedance
−
Zo
output impedance
10
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT109-1
SOT38-1
TDA8575T
TDA8575
SO16
DIP16
plastic small outline package; 16 leads; body width 3.9 mm
plastic dual in-line package; 16 leads (300 mil); long body
1996 Jul 29
2
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
BLOCK DIAGRAM
12
1
OUTL
INL+
108
kΩ
V
I
I V
5
INL−
360 kΩ
0.5(V
− 0.7) + 0.7
CC
V
CC
16
8
0.68(V
− 0.7) + 0.7
V
CC
CC
SVRR
GND
TDA8575(T)
REFERENCE
9
0.68(V
− 0.7) + 0.7
CC
0.5(V
− 0.7) + 0.7
CC
360 kΩ
6
7
INR−
INR+
V
I
I V
108
kΩ
11
OUTR
MGE829
Fig.1 Block diagram.
3
1996 Jul 29
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
PINNING
SYMBOL
INL+
PIN
DESCRIPTION
1
2
positive input left
not connected
n.c.
n.c.
3
not connected
n.c.
4
not connected
INL−
INR−
INR+
SVRR
GND
n.c.
5
negative input left
negative input right
positive input right
supply voltage ripple rejection
ground
6
7
8
9
10
11
12
13
14
15
16
not connected
OUTR
OUTL
n.c.
output voltage right channel
output voltage left channel
not connected
n.c.
not connected
n.c.
not connected
VCC
supply voltage
handbook, halfpage
handbook, halfpage
INL+
n.c.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
INL+
n.c.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
CC
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
TDA8575T
TDA8575
INL−
INR−
INR+
SVRR
OUTL
OUTR
n.c.
INL−
INR−
INR+
SVRR
OUTL
OUTR
n.c.
GND
GND
MGE828
MGE827
Fig.2 Pin configuration TDA8575T.
Fig.3 Pin configuration TDA8575.
1996 Jul 29
4
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
This is inconvenient for most applications and therefore
the TDA8575(T) is equipped with a quick charge circuit.
On power-on the quick charge circuit charges the
capacitor C2 connected to the IN- pins. The quick charge
circuit consists of a voltage buffer and a control circuit
(referred to as ‘reference and power check’ in Fig.6) that
monitors the supply voltage VCC. If the supply voltage rises
more than ≈ 2 V the voltage buffer is switched on.
After charging C2 the voltage buffer is switched off.
The charge time of C2 will equal the charge time of C4, the
SVRR capacitor.
FUNCTIONAL DESCRIPTION
System description
To enable a high common mode rejection a new system
setup is used. The voltage to current converter, referred to
as V → I in the block diagram of Fig.1, replaces the
resistors that can be seen in the conventional system
solution.
Both systems are shown in Figs 4 and 5. In the
conventional system the common mode rejection is limited
by the matching properties of the resistors resulting in a
CMRR of 60 dB maximum. Using the new system setup a
CMRR of 80 dB is achieved.
Power on
In Fig.6 the preferred input capacitor values are shown.
If the capacitor C2 = 22 µF connected to the IN- inputs had
to be charged by the 0.5Vcc voltage source a charge time
360 kΩ
of 5τ = 5 ×
× 22 µF = 20s would be required.
-------------------
2
handbook, halfpage
handbook, halfpage
V
i
V
o
V
o
V
V
I
I V
i
0.5 V
0.5 V
CC
CC
MGE830
MGE831
Fig.4 Conventional system.
Fig.5 New system using V → I converters.
1996 Jul 29
5
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
C1
TDA8575(T)
INL+
INL−
1
5
220 nF
s
108
kΩ
V
I
R
VOLTAGE
BUFFER
5 kΩ
V
i(L)
360 kΩ
switch off
V
16
8
CC
C2
SVRR
GND
REFERENCE
AND
POWER CHECK
22 µF
C4
47 µF
V
cm
9
switch off
360 kΩ
V
i(R)
INR−
INR+
6
7
R
s
5 kΩ
VOLTAGE
BUFFER
V
I
108
kΩ
C1
220 nF
MGE832
Fig.6 Quick charge circuit.
1996 Jul 29
6
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
IORM
Vsc
PARAMETER
CONDITIONS
operating
MIN.
MAX.
18
UNIT
supply voltage
−
−
−
V
repetitive peak output current
AC and DC short-circuit safe voltage
storage temperature
40
mA
V
18
Tstg
Tamb
Tj
−55
−40
−
+150
+85
+150
°C
°C
°C
operating ambient temperature
junction temperature
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TDA8575 (DIP16)
75
K/W
K/W
TDA8575T (SO16)
110
QUALITY SPECIFICATION
Quality according to UZW-BO/FQ-0601, if this type is used as an audio amplifier.
DC CHARACTERISTICS
V
CC = 8.5 V; Tamb = 25 °C; RL = 10 kΩ; in accordance with application circuit (see Fig.9).
SYMBOL PARAMETER CONDITIONS MIN. TYP.
VCC supply voltage Vi = 0 V 8.5
MAX.
UNIT
5
−
−
18
15
−
V
ICC
VO
supply current
output voltage
12.6
4.7
mA
V
note 1
Note
1. The DC output voltage with respect to ground is approximately 0.5VCC
.
1996 Jul 29
7
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
AC CHARACTERISTICS
VCC = 8.5 V; f = 1 kHz; Rs = 0 kΩ; RL = 10 kΩ; Tamb = 25 °C; in accordance with application circuit (see Fig.9).
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.5
TYP.
MAX.
UNIT
dB
Gv
voltage gain
0
+0.5
−
αcs
∆Gv
fro(L)
fro(H)
Zi
channel separation
channel unbalance
low frequency roll-off
high frequency roll-off
input impedance
Rs = 5 kΩ; note 1
70
−
80
−
dB
dB
Hz
kHz
kΩ
Ω
0.5
20
−
−1 dB; note 2
−1 dB
−
−
20
80
−
−
108
−
123
10
−
Zo
output impedance
Vi(rms)(max) maximum input voltage (RMS value)
THD = 1%
−
1.7
3.7
V
Vno
noise output voltage
unweighted; note 3
Vi(rms) = 1 V
−
5
µV
%
THD
total harmonic distortion
−
0.005 0.01
Vi(rms) = 1 V;
−
0.01
−
%
f = 20 Hz to 20 kHz
THDmax
total harmonic distortion at maximum
output current
Vi(rms) = 1 V; RL = 150 Ω
−
−
1
%
Vi(cm)(rms) common-mode input voltage (RMS value)
−
−
1
−
−
V
CMRR
common-mode rejection ratio
Rs = 5 kΩ
66
−
80
80
dB
dB
Rs = 0 Ω; note 4
f = 100 Hz to 20 kHz
SVRR
supply voltage ripple rejection
Rs = 2 kΩ; note 5
55
−
−
−
dB
dB
Rs = 2 kΩ; note 5
−
60
f = 20 Hz to 20 kHz
Notes
1. The channel separation is dependent on the capacitor C2 connected to the IN- input. The channel separation for low
frequencies (<1 kHz) can be increased by using a larger capacitance for C2.
2. The frequency response is externally fixed by the input and output coupling capacitors.
3. The noise output voltage is measured in a bandwidth of 20 Hz up to 20 kHz, unweighted.
4. The common mode rejection ratio is measured at the output with a voltage source Vcm(rms) = 1 V and both
Vi(L) and Vi(R) short-circuited according to Fig.9. The common mode rejection is dependent on the capacitor C2
connected to the IN- input. The common mode rejection for low frequencies (<1 kHz) can be increased by using a
larger capacitance for C2.
5. Supply voltage ripple rejection is measured at the output using a ripple amplitude of 2 V (p-p).
The source resistance Rs = 2 kΩ.
1996 Jul 29
8
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
Due to wiring resistance and noise coming from various
electric devices in the automobile, performance loss will
appear in those car audio applications where long
connections between signal sources and amplifiers (or
boosters) are necessary. To solve these problems the
TDA8575(T) is developed (see Figs 7 and 8).
APPLICATION INFORMATION
General
The TDA8575(T) is a two channel amplifier with differential
input and single-ended output for use in car audio
applications. The differential amplifier has a gain of 0 dB,
a low distortion and a high common mode rejection.
V
V
bat
CC
speaker
V
+V
no
i
V
i
in
long cable
power
tuner
tape
CD
amplifier
V
no
car body noise
car body
car body
MGE833
Fig.7 A typical noise problem in car audio systems.
ground noise isolation amplifier
V
V
V
bat
CC
CC
V
+V
i
no
speaker
V
V +V / CMRR
no
i
i
+
−
in
long cables
tuner
tape
CD
power
amplifier
V
no
V
no
car body noise
MGE834
car body
car body
Fig.8 The TDA8575(T) eliminates noise problems in car audio systems.
1996 Jul 29
9
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
C3
2.2 µF
C1
12 OUTL
INL+
INL−
1
5
108
kΩ
220 nF
s
R
L
10 kΩ
V
I
I V
R
5 kΩ
360 kΩ
V
i(L)
V
CC
V
= 8.5 V
V
CC
16
8
CC
C2
SVRR
C5
100 nF
TDA8575(T)
REFERENCE
22 µF
C4
47 µF
V
9
GND
cm
V
i(R)
360 kΩ
INR−
INR+
6
7
R
s
5 kΩ
V
I
I V
108
kΩ
C1
C3
11 OUTR
220 nF
2.2 µF
R
L
10 kΩ
MGE835
Fig.9 Application circuit TDA8575(T).
10
1996 Jul 29
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
C3
2.2 µF
C1
12 OUTL
INL+
INL−
1
5
108
kΩ
220 nF
s
R
L
10 kΩ
V
I
I V
R
5 kΩ
360 kΩ
V
i(L)
C2
V
CC
V
= 8.5 V
V
CC
16
8
CC
10 µF
V
V
cm1
SVRR
C5
100 nF
TDA8575(T)
REFERENCE
C4
47 µF
9
GND
cm2
C2
10 µF
V
i(R)
360 kΩ
INR−
INR+
6
7
R
s
5 kΩ
V
I
I V
108
kΩ
C1
C3
11 OUTR
220 nF
2.2 µF
R
L
10 kΩ
MGE836
Fig.10 Application circuit TDA8575(T) with a balanced signal source.
11
1996 Jul 29
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.0098 0.057
0.0039 0.049
0.019 0.0098 0.39
0.014 0.0075 0.38
0.16
0.15
0.24
0.23
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
91-08-13
95-01-23
SOT109-1
076E07S
MS-012AC
1996 Jul 29
12
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1996 Jul 29
13
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1996 Jul 29
14
Philips Semiconductors
Preliminary specification
Ground noise isolation amplifier
TDA8575
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Jul 29
15
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Belgium: see The Netherlands
Brazil: see South America
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 926 5361, Fax. +7 095 564 8323
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Colombia: see South America
Czech Republic: see Austria
Slovakia: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 615 800, Fax. +358 615 80920
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 825 344, Fax.+381 11 635 777
Middle East: see Italy
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Internet: http://www.semiconductors.philips.com
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. 1996
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
517021/10/01/pp16
Date of release: 1996 Jul 29
Document order number: 9397 750 00985
相关型号：
TDA8576T-T
IC 2 CHANNEL, AUDIO AMPLIFIER, PDSO16, PLASTIC, SOT-108, SO-16, Audio/Video Amplifier
NXP
©2020 ICPDF网 联系我们和版权申明