TDA8578 [NXP]
Dual common-mode rejection differential line receiver; 双共模抑制差分线路接收机型号: | TDA8578 |
厂家: | NXP |
描述: | Dual common-mode rejection differential line receiver |
文件: | 总13页 (文件大小:57K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8578
Dual common-mode rejection
differential line receiver
1995 Dec 15
Product specification
Supersedes data of November 1993
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
FEATURES
APPLICATIONS
• Excellent common-mode rejection up to high
• Audio
frequencies
• Car radio.
• Elimination of source resistance in the common-mode
rejection
GENERAL DESCRIPTION
• Few external components
• High supply voltage ripple rejection
• Low noise
The TDA8578 is a two-channel differential amplifier in a
16 pin DIL or SO package intended to receive line inputs
in audio applications requiring a high-level of
common-mode rejection. The amplifier has a gain of 0 dB
and a low distortion. The device is primarily developed for
those car radio applications where long connections
between signal sources and amplifiers (or boosters) are
necessary and ground noise has to be eliminated.
• Low distortion
• Protected against electrostatic discharge
• AC and DC short circuit safe to ground and VCC
• Fast DC settling.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
TYP.
8.5
MAX.
18
UNIT
5
V
ICC
supply current
VCC = 8.5 V
−
11
14
+0.5
−
mA
dB
dB
µV
kΩ
dB
Gv
voltage gain
−0.5
−55
−
0
SVRR
Vno
supply voltage ripple rejection
noise output voltage
input impedance
−60
3.7
240
80
5
Zi
100
−
−
CMRR
common-mode rejection ratio
Rs = 0 Ω
−
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8578
DIP16
SO16
plastic dual in-line package; 16 leads (300 mil); long body
plastic small outline package; 16 leads; body width 3.9 mm
SOT38-1
TDA8578T
SOT109-1
1995 Dec 15
2
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
BLOCK DIAGRAM
FUNCTIONAL DESCRIPTION
The TDA8578 contains two identical differential amplifiers
with a voltage gain of 0 dB. The device is intended to
receive line input signals. The device has a very high-level
of common-mode rejection and it eliminates ground noise.
The common-mode rejection keeps constant up to high
frequencies. The gain of the amplifiers is fixed at 0 dB. The
inputs have a high-input impedance and the output stage
is a class AB stage with a low-output impedance. For a
large common-mode rejection also at low frequencies, an
electrolytic input capacitor at the negative input pin is
advised. The input impedance is relative high, this would
result in a large settling time of the DC input voltage.
Therefore a quick charge circuit is included that charges
the input capacitor within 0.2 s.
V
CC
16
1
5
INL
INL
12
OUTL
SVRR
OUTR
V
CC
8
TDA8578
6
7
INR
INR
11
9
All input and output pins are protected against high
MBD209
electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).
GND
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
positive input left
INL+
n.c.
1
2
not connected
not connected
not connected
negative input left
negative input right
positive input right
half supply voltage
ground
V
INL
n.c.
1
2
3
4
5
6
7
8
16
CC
n.c.
3
15 n.c.
n.c.
4
n.c.
n.c.
n.c.
14
13
12
11
INL−
INR−
INR+
SVRR
GND
n.c.
5
6
n.c.
TDA8578
7
OUTL
INL
8
INR
INR
OUTR
9
10 n.c.
GND
10
11
12
13
14
15
16
not connected
output right
SVRR
9
OUTR
OUTL
n.c.
MBD210
output left
not connected
not connected
not connected
supply voltage
n.c.
n.c.
Fig.2 Pin configuration.
VCC
1995 Dec 15
3
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
IORM
Vsc
PARAMETER
supply voltage
CONDITIONS
operating
MIN.
MAX.
18
UNIT
−
−
−
V
repetitive peak output current
AC and DC short-circuit safe voltage
storage temperature
40
mA
V
18
Tstg
Tamb
Tj
−55
−40
−
+150
+85
+150
°C
°C
°C
operating ambient temperature
junction temperature
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TDA8578 (DIP16)
75
K/W
K/W
TDA8578T (SO16)
120
DC CHARACTERISTICS
CC = 8.5 V; Tamb = 25 °C; in accordance with test circuit (see Fig.3); unless otherwise specified.
V
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX.
VCC supply voltage 8.5 18
UNIT
5
−
−
−
V
ICC
VO
tset
supply current
11
14
−
mA
V
DC output voltage
note 1
4.3
0.2
DC input voltage settling time
−
s
Note
1. The DC output voltage with respect to ground is approximately 0.5VCC
.
1995 Dec 15
4
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
AC CHARACTERISTICS
V
CC = 8.5 V; f = 1 kHz; Tamb = 25 °C; in accordance with test circuit (see Fig.3); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Gv voltage gain −0.5 +0.5 dB
αcs
∆Gv
0
channel separation
channel unbalance
low frequency roll-off
high frequency roll-off
input impedance
Rs = 5 kΩ
70
−
80
−
−
dB
dB
Hz
kHz
kΩ
Ω
0.5
−
fL
−1 dB; note 1
−1 dB
20
20
100
−
−
fH
−
−
Zi
240
−
−
Zo
output impedance
10
−
Vi(max)
Vno
maximum input voltage
noise output voltage
THD = 1%
−
2
V
Rs = 0 Ω; note 2
−
3.7
−
5
µV
V
VCM(rms)
common-mode input voltage
(RMS value)
−
1
CMRR
SVRR
THD
common-mode rejection ratio
supply voltage ripple rejection
total harmonic distortion
Rs = 5 kΩ
Rs = 0 Ω; note 3
note 4
66
−
70
80
65
60
0.02
−
−
dB
dB
dB
dB
%
−
55
−
−
note 5
−
Vi = 1 V
−
−
Vi = 1 V;
−
0.1
%
f = 20 Hz to 20 kHz
THDmax
total harmonic distortion at
maximum output current
Vi = 1 V; RL = 150 Ω
−
−
1
%
Notes
1. Frequency response externally fixed by the input coupling capacitors.
2. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
3. The common-mode rejection ratio is measured at the output, with a voltage source of 1 V (RMS), in accordance with
test circuit (see Fig.3), while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz.
4. Ripple rejection is measured at the output, with Rs = 2 kΩ; f = 1 kHz and a ripple amplitude of 2 V (p-p).
5. Ripple rejection is measured at the output, with Rs = 0 Ω up to 2 kΩ and f = 100 Hz to 20 kHz; maximum ripple
amplitude of 2 V (p-p).
1995 Dec 15
5
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
8.5 V
100 nF
220 nF
R
s
16
V
2.2 µ
47 µ
F
F
F
1
5
INL
5 k
Ω
12
OUTL
V
CC
22 µ
F
TDA8578
8
SVRR
6
7
V
V
2.2 µ
INR
CM
11
OUTR
220 nF
R
s
R
R
L
L
9
5 kΩ
10 k
10 k
Ω
Ω
MBD218
Fig.3 Test circuit.
MBD215
1
10
THD
(%)
2
10
3
10
2
3
4
5
10
10
10
10
10
f (Hz)
Fig.4 Total harmonic distortion as a function of frequency; Vi = 1.0 V (RMS).
6
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD216
0
CMR
(dB)
20
40
60
(1)
(2)
80
(3)
100
2
3
4
5
10
10
10
10
10
f (Hz)
(1) Rs = 5 kΩ.
(2) Rs = 2 kΩ.
(3) Rs = 0 Ω.
Fig.5 Common-mode rejection as function of frequency; VCM = 1.0 V (RMS).
MBD213
1
THD
(%)
1
10
2
10
3
10
2
3
4
10
10
10
10
V
(mV)
i (rms)
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
7
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD214
40
CMR
(dB)
50
60
70
80
90
100
300
500
700
900
1100
1300
V
(mV)
CM (rms)
Fig.7 Common-mode rejection as a function of common-mode input voltage; f = 1 kHz; Rs = 0 Ω.
MBD211
0
CMR
(dB)
20
40
60
(1)
(2)
(3)
80
100
2
3
4
5
10
10
10
10
10
f (Hz)
(1) C2 = 22 µF.
(2) C2 = 47 µF.
(3) C2 = 100 µF.
Fig.8 Common-mode rejection as a function of frequency; VCM = 1.0 V.
8
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
MBD212
30
SVR
(dB)
40
50
60
70
2
3
4
10
10
10
10
f (Hz)
Vripple = 2 V (p-p); Rs = 2 kΩ.
Fig.9 Supply voltage ripple rejection as a function of frequency.
APPLICATION INFORMATION
8.5 V
100 nF
220 nF
R
s
16
V
2.2 µ
47 µ
F
F
F
1
5
INL
5 k
Ω
12
OUTL
V
CC
10 µF
10 µF
TDA8578
8
SVRR
6
7
V
2.2 µ
INR
11
OUTR
220 nF
R
s
R
R
L
L
9
5 kΩ
10 k
10 k
Ω
Ω
MBD217
Fig.10 Application circuit balanced signal source.
9
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1995 Dec 15
10
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT109-1
076E07S
MS-012AC
1995 Dec 15
11
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Dec 15
12
Philips Semiconductors
Product specification
Dual common-mode rejection differential
line receiver
TDA8578
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Dec 15
13
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