TDA8596TH/N1S,118 [NXP]

TDA8596 - I2C-bus controlled 4 x 45 W power amplifier with symmetrical inputs SOIC 36-Pin;
TDA8596TH/N1S,118
型号: TDA8596TH/N1S,118
厂家: NXP    NXP
描述:

TDA8596 - I2C-bus controlled 4 x 45 W power amplifier with symmetrical inputs SOIC 36-Pin

放大器 光电二极管 商用集成电路
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TDA8596  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical  
inputs  
Rev. 02 — 8 November 2007  
Product data sheet  
1. General description  
The TDA8596 is a quad Bridge Tied Load (BTL) audio power amplifier with symmetrical  
inputs, made in BCDMOS technology. It contains four independent amplifier channels in  
BTL configuration with complementary (PMOST/NMOST) output stages. Temperature  
warning and output signal clipping diagnosis is possible via the I2C-bus and via the  
diagnostic pins (DIAG and STB pin). The temperature pre-warning level and clip detection  
levels can be programmed via the I2C-bus. The status of each amplifier channel (i.e.  
output offset, load connected or not, short circuit condition at the output pins) can be read  
out separately.  
2. Features  
2.1 General  
I Operates in legacy mode (non I2C-bus) and I2C-bus mode (3.3 V and 5 V compliant)  
I Three hardware-programmable I2C-bus addresses  
I Drives 4 or 2 loads  
I Balanced/symmetrical inputs  
I Speaker fault detection  
I Programmable gain (26 dB and 16 dB) also available in legacy mode  
I Independent short circuit protection per channel  
I Loss of ground and loss of VP safe (with 300 mseries impedance and a maximum  
supply decoupling capacitor of 2200 µF)  
I All outputs are short-circuit proof to ground, supply voltage and across the load  
I All pins are short circuit proof to ground  
I Temperature-controlled gain reduction to prevent audio holes at high junction  
temperatures  
I Low battery voltage detection  
I Qualified in accordance with AEC-Q100  
2.2 I2C-bus mode  
I DC load detection: open (no load), normal load, line-driver load  
I AC load (tweeter) detection  
I Detect which load is connected during start-up to allow the system to be configured to  
select the gain accordingly (e.g. line-driver mode or normal mode).  
I Independently selectable soft mute of front (channel 1 and channel 3) and rear  
channels (channel 2 and channel 4)  
 
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
I Independently programmable gain (26 dB and 16 dB) of front (channel 1 and channel  
3) and rear (channel 2 and channel 4) channels  
I Flexible programmable diagnostic levels:  
N Programmable clip detect: 2 %, 5 % or 10 %  
N Programmable thermal pre-warning  
I Selectable information on the DIAG or STB pin:  
N The STB pin can be programmed/multiplexed with second clip detection  
N Clip information of each channel separately can be directed to the DIAG pin or the  
STB pin  
N Independent enabling of thermal-, clip- or load fault (short across the load, to VP or  
to ground) available on the DIAG pin  
I Offset detection  
3. Quick reference data  
Table 1.  
Quick reference data  
Symbol  
Parameter  
Conditions  
RL = 4 Ω  
no load  
Min Typ Max Unit  
VP  
Iq  
supply voltage  
quiescent current  
output power  
8
14.4 18  
V
-
270  
40  
400  
mA  
W
Po  
RL = 4 ; VP = 14.4 V;  
maximum power; Vi = 2 V  
(RMS) square wave  
37  
-
RL = 4 ; VP = 14.4 V;  
THD = 0.5 %  
18  
23  
58  
20  
25  
64  
-
-
-
W
W
W
RL = 4 ; VP = 14.4 V;  
THD = 10 %  
RL = 2 ; VP = 14.4 V;  
maximum power; Vi = 2 V  
(RMS) square wave  
THD  
Vn(o)  
total harmonic  
distortion  
RL = 4 ; f = 1 kHz;  
Po = 1 W to 12 W  
-
0.01 0.1  
%
noise output voltage  
filter 20 Hz to 22 kHz;  
RS = 1 kΩ  
normal mode;  
Tamb = 25 °C to 105 °C  
-
-
-
45  
45  
22  
65  
µV  
µV  
µV  
normal mode;  
Tamb = 20 °C to 25 °C  
110  
29  
line driver mode  
4. Ordering information  
Table 2.  
Ordering information  
Type number Package  
Name  
Description  
Version  
TDA8596TH  
HSOP36 plastic, heatsink small outline package; 36 leads; low  
stand-off height  
SOT851-2  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
2 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
5. Block diagram  
ADSEL SDA  
28 26  
SCL  
21  
V
V
P1  
19, 20  
P2  
34, 35  
33  
DIAG  
29  
STANDBY/  
FAST MUTE  
SELECT DIAGNOSTIC/  
CLIP DETECT  
2
STB  
I C-BUS  
13  
14  
IN3+  
18  
17  
OUT3+  
26 dB/  
16 dB  
MUTE  
MUTE  
MUTE  
MUTE  
OUT3−  
IN3−  
PROTECTION/  
DIAGNOSTIC  
7
6
IN1+  
4
2
OUT1+  
26 dB/  
16 dB  
OUT1−  
IN1−  
PROTECTION/  
DIAGNOSTIC  
11  
12  
IN4+  
25  
23  
OUT4+  
26 dB/  
16 dB  
OUT4−  
IN4−  
PROTECTION/  
DIAGNOSTIC  
9
8
IN2+  
30  
32  
OUT2+  
26 dB/  
16 dB  
OUT2−  
IN2−  
PROTECTION/  
DIAGNOSTIC  
V
P
36  
TAB  
TDA8596  
27  
10  
SGND  
22  
GAINSEL  
3
31  
16  
24  
001aaf998  
SVR  
PGND1 PGND2 PGND3  
PGND4  
Fig 1. Block diagram  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
3 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
6. Pinning information  
6.1 Pinning  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
1
2
TAB  
n.c.  
V
V
OUT1−  
PGND1  
OUT1+  
n.c.  
P2  
P2  
3
4
DIAG  
OUT2−  
PGND2  
OUT2+  
STB  
5
6
IN1−  
7
IN1+  
8
IN2−  
9
ADSEL  
SVR  
IN2+  
TDA8596TH  
10  
11  
12  
13  
14  
15  
16  
17  
18  
SGND  
IN4+  
SDA  
OUT4+  
PGND4  
OUT4−  
GAINSEL  
SCL  
IN4−  
IN3+  
IN3−  
n.c.  
PGND3  
OUT3−  
OUT3+  
V
P1  
P1  
V
001aaf999  
Fig 2. Pin configuration  
6.2 Pin description  
Table 3.  
Symbol  
n.c.  
Pin description  
Pin  
1
Description  
not connected  
OUT1−  
PGND1  
OUT1+  
n.c.  
2
channel 1 negative output  
power ground channel 1  
channel 1 positive output  
not connected  
3
4
5
IN1−  
6
channel 1 negative input  
channel 1 positive input  
channel 2 negative input  
channel 2 positive input  
signal ground  
IN1+  
7
IN2−  
8
IN2+  
9
SGND  
IN4+  
10  
11  
12  
13  
14  
15  
channel 4 positive input  
channel 4 negative input  
channel 3 positive input  
channel 3 negative input  
not connected  
IN4−  
IN3+  
IN3−  
n.c.  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
4 of 48  
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 3.  
Pin description …continued  
Symbol  
PGND3  
OUT3−  
OUT3+  
VP1  
Pin  
16  
Description  
power ground channel 3  
channel 3 negative output  
channel 3 positive output  
supply voltage 1  
17  
18  
19 and 20  
21  
SCL  
I2C-bus clock input  
GAINSEL  
OUT4−  
PGND4  
OUT4+  
SDA  
22  
gain select input (legacy mode only)  
channel 4 negative output  
power ground channel 4  
channel 4 positive output  
I2C-bus data input/output  
half supply filter capacitor  
I2C-bus address select  
23  
24  
25  
26  
SVR  
27  
ADSEL  
STB  
28  
29  
standby (I2C-bus mode) or mode pin (legacy mode);  
programmable second clip indicator  
OUT2+  
PGND2  
OUT2−  
DIAG  
VP2  
30  
channel 2 positive output  
31  
power ground channel 2  
32  
channel 2 negative output  
33  
diagnostic/clip detection output  
supply voltage 2  
34 and 35  
36  
TAB  
heatsink connection; must be connected to ground  
7. Functional description  
The TDA8596 is a quad BTL audio power amplifier with symmetrical inputs, made in  
BCDMOS technology. It contains four independent amplifier channels in BTL configuration  
with complementary (PMOST/NMOST) output stages (see Figure 1). The status of each  
amplifier channel (output offset, connected load, short circuit condition at output pins) can  
be read out separately via the I2C-bus. The TDA8596 is protected against overvoltage on  
the supply pins, short circuits at the output pins, overheating and loss-of-ground or  
loss-of-VP conditions.  
The temperature pre-warning level and the clip detection levels can be programmed via  
the I2C-bus. Further, the information that will be available on the diagnostic pins (i.e. DIAG  
or STB) can be programmed. Three different I2C-bus addresses can be selected by  
connecting a resistor to the ADSEL pin. In case the ADSEL pin is shorted to ground, the  
TDA8596 operates in legacy mode. In this mode no I2C-bus is needed and the STB pin  
will change from a two level pin (Standby mode and Operating mode) to a three level pin  
(Standby, Mute operating and Normal operating mode).  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
5 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
7.1 Output stage  
The output stage of each amplifier channel consists of two PMOS power transistors and  
two NMOS transistors in BTL configuration. The TDA8596 is manufactured in a BCDMOS  
process on an isolated substrate Silicon On Insulator (SOI). Due to the absence of a  
doped (bulk) substrate, this process is insensitive to latch-up induced by substrate  
coupled parasitic paths.  
7.2 Gain selection  
The gain of the TDA8596 can be programmed at 16 dB (line driver mode) or 26 dB  
(Normal operating mode). This can be done either in I2C-bus mode by means of a bus  
command or in legacy mode by using the GAINSEL pin. To allow this, the device must first  
be put in legacy mode by connecting the ADSEL pin to ground. In case the GAINSEL pin  
is connected to ground the 26 dB mode is selected. By leaving the GAINSEL pin open the  
16 dB mode is selected. The GAINSEL pin will be ignored in I2C-bus mode.  
7.3 Distortion (clip-) detection  
If the output of an amplifier channel starts clipping to either the supply voltage or to ground  
the output signal will become distorted. When the Total Harmonic Distortion (THD) per  
channel exceeds a preselected threshold (2 %, 5 % or 10 %), one of the two diagnostic  
pins (DIAG or STB) will be pulled LOW. The clip information of each channel can be  
directed separately to one specific diagnostic pin. This way, it is possible to distinguish  
between clipping on the front or rear channels. Redirection of temperature and load  
information to the diagnostic pins can be disabled to allow only the clip information to be  
present on these pins. In this mode, the temperature and load information is still available  
but can only be read out through the I2C-bus.  
Note: during mute-to-on or on-to-mute transitions, the clip detection may be activated  
even when no output clipping occurs.  
7.4 Output protection and short circuit operation  
When a short circuit to ground, to VP or across the load occurs, the concerning amplifier  
channel will switch off. After 16 ms of non-operation it will switch on again. If the short  
circuit condition is still present the amplifier channel will again return to 16 ms of  
non-operation. The 16 ms cycle will reduce the dissipation.  
The other amplifier channels (without short circuit condition) will retain functionality. To  
prevent audible distortion, the amplifier channel with the short circuit condition can be  
disabled via the I2C-bus.  
In case the diagnostic pin is selected for load fault information (IB2[D4] = 0), it will be  
pulled LOW. Via the I2C-bus it can be read out which channel is shorted by what type of  
short circuit (to ground, to VP or across the load).  
In order to detect a shorted load, a signal should be applied to the inputs of the amplifier.  
A shorted load is only detected when the output current level on the related output  
crosses the defined Safe Operating ARea (SOAR) protection threshold.  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
6 of 48  
 
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
7.4.1 SOAR protection  
The output transistors are protected by a Safe Operating ARea (SOAR) protection. The  
TDA8596 has a two-stage SOAR protection:  
If the differential output voltage across the load (Vo) is less than 1 V, and the current  
through the load (IL) exceeds 4 A, the amplifier channel will be switched off during  
16 ms. To prevent spurious switch-off events (which may occur for instance in case of  
inductive loads or very high input signals), the fault condition (Vo < 1 V and IL > 4 A)  
must exist for more than 300 µs.  
If the differential output voltage across the load (Vo) is more than 1 V, and the current  
through the load (IL) exceeds 8 A, the amplifier channel will be switched off during  
16 ms.  
7.4.2 Speaker protection  
To prevent damage of the speaker when one side of the speaker is connected to ground, a  
missing-current protection is implemented. When the current in the high side power  
transistor of one amplifier channel is not equal to the current through the corresponding  
low side power transistor, a fault condition is assumed and the concerning channel will be  
switched off. The boundary conditions for the activation of this speaker protection are:  
Vo < 1.55 V and Imissing > 1 A for 80 µs  
Vo > 1.55 V and Imissing > 3 A for 80 µs  
7.5 Standby and mute operation  
The functionality of the STB pin depends on the mode of operation of the device (i.e.  
legacy- or I2C-bus mode).  
7.5.1 I2C-bus mode  
When the STB pin is LOW (< 1 V), the device is in standby condition. The I2C-bus lines  
will not be loaded and the quiescent current will be low. When the STB pin is switched  
HIGH (> 2.5 V) the TDA8596 switches to operating condition and performs a Power-On  
Reset (POR). This will cause the DIAG pin to be pulled LOW. The TDA8596 will start-up  
when bit D0 of instruction byte IB1 is set. Bit D0 will also reset the ‘power-on reset  
occurred’ bit (DB2[D7]) and releases the DIAG pin.  
The soft- and fast-mute functions can be activated by means of I2C-bus instructions. The  
soft mute can be activated independently for the front (1 and 3) and rear (2 and 4)  
channels, and mutes the audio in 20 ms. The fast mute is activated for all channels  
simultaneously and mutes the audio in 0.1 ms. Releasing the mute will always occur via a  
soft mute and will take 20 ms.  
When the STB pin is switched LOW and the amplifier is in Operating mode, the fast mute  
will be activated prior to shut-down. This enables the option to fast mute the amplifier by  
means of the STB pin in case of, for instance an engine start, thus preventing audible pop  
noise.  
7.5.2 Legacy mode (pin ADSEL connected to ground)  
In legacy mode, the function of the STB pin changes into a three level (standby, mute and  
operating) enable pin and the amplifier will directly start-up when the STB pin is put into  
Mute or Normal operating mode. Mute operation is controlled through an internal timer  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
7 of 48  
 
 
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
(20 ms) to minimize mute-to-operating pops. When the STB pins directly switched from  
Normal operating to Standby mode, the fast mute (mutes in 0.1 ms) will be activated prior  
to shut-down.  
7.6 Start-up and shut-down sequence  
To prevent the amplifier from producing switch-on and switch-off pop noise, the capacitor  
on the SVR pin is used for smooth start-up and shut-down sequences. Larger capacitors  
will lead to longer (smoother) start-up and shut-down sequences. Initially the amplifier  
outputs are charged to Half Supply Voltage (HVP) minus 1.4 V in mute condition. This is  
independent of the I2C-bus mute settings in I2C-bus mode or the pin STB voltage in  
legacy mode. The remaining 1.4 V before the outputs reach HVP, is used for mute release  
in case the I2C-bus bits (IB2[D2:D0] = 000) have been programmed to mute-off (or  
VSTB > 6.5 V in legacy mode). In case the I2C-bus bits have been programmed to maintain  
mute condition (IB2[D2:D0] = 111) (or 2.5 V < VSTB < 6.5 V in legacy mode) the amplifier  
will stay in mute.  
When the STB pin is switched LOW (< 1 V), a fast mute is performed prior to discharging  
the capacitor on pin SVR. With a capacitor of 22 µF the device goes into Standby mode  
(low quiescent current) within 1 s after switching STB to LOW (see also Figure 3 and  
Figure 6).  
Start-up and shut-down pop noise can be further reduced by activating the low pop mode.  
When this mode is selected (IB2[D3] = 0), the output voltage rising slope will decrease  
(resulting in a longer start-up time).  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
8 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
V
P
DIAG  
DB2 bit D7  
POR  
IB1 bit D0  
start enable  
t
wake  
STB  
SVR  
t
t
off  
amp_on  
fast  
mute  
amplifier  
output  
t
t
t
d(fast_mute)  
d(mute_off)  
d(soft_mute)  
001aad168  
Fig 3. Start-up and shut-down timing in I2C-bus mode  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
9 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
V
P
DIAG  
DB2 bit D7  
POR  
IB1 bit D0  
start enable  
t
wake  
STB  
SVR  
t
load  
t
t
off  
amp_on  
fast  
mute  
amplifier  
output  
t
t
t
d(fast_mute)  
d(mute_off)  
d(soft_mute)  
001aad169  
Fig 4. Start-up and shut-down timing with DC load active in I2C-bus mode  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
10 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
V
P
DIAG  
DB2 bit D7  
POR  
IB1 bit D0  
start enable  
t
wake  
STB  
SVR  
t
load  
t
t
off  
amp_on  
fast  
mute  
amplifier  
output  
t
t
t
d(fast_mute)  
d(mute_off)  
d(soft_mute)  
001aad170  
Fig 5. Start-up and shut-down timing with low pop and DC load activated  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
11 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
V
P
DIAG  
STB  
on  
mute  
standby  
SVR  
t
t
off  
amp_on  
soft  
mute  
fast  
mute  
amplifier  
output  
t
d(mute_off)  
t
t
t
d(fast_mute)  
d(soft_mute)  
d(mute_on)  
001aad171  
Fig 6. Start-up and shut-down timing in legacy mode  
7.7 Power-on reset and supply voltage spikes  
If the supply voltage drops below 5 V in I2C-bus mode (see Figure 8 and 9), the content of  
the I2C-bus latches cannot be guaranteed and a power-on reset will be performed. This  
will cause all latches to be reset, the amplifier to be switched off and the DIAG pin to be  
pulled LOW, indicating that a power-on reset has occurred (see DB2[D7]). When bit  
IB1[D0] is set, the power-on flag is reset, the DIAG pin is released and the amplifier will  
start-up.  
In legacy mode a supply voltage drop below 5 V will switch off the amplifier without pulling  
the DIAG pin LOW.  
7.8 Engine start and low voltage operation  
In steady state, the DC output voltage of an amplifier channel VO equals half the supply  
voltage (HVP). This voltage is related to the voltage on the SVR pin (refer to Figure 7:  
VO = VSVR 1.4 V). An external capacitor has been connected to the SVR pin to suppress  
coupling of power supply ripple to the amplifier outputs.  
The headroom voltage Vhr is defined as the difference between the supply voltage VP and  
the DC output voltage VO, i.e. Vhr = VP VO (refer to Figure 7). If the supply voltage drops,  
e.g. during an engine start, the outputs will follow slowly due to the capacitor on pin SVR.  
However, if the headroom voltage Vhr drops below the headroom protection threshold of  
1.6 V, the headroom protection will be activated to prevent pop noise at the output. This  
protection will first activate the fast mute and will subsequently discharge the capacitor on  
pin SVR to generate more headroom for the amplifier (refer to Figure 8 and 9).  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
12 of 48  
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
When the SVR capacitor has discharged, the amplifier will only start-up again when the  
supply voltage VP increases above the low VP mute threshold, typically 7.5 V. Below this  
threshold, the outputs of the amplifier remain low. In I2C-bus mode, a supply voltage drop  
below VP(reset), typically 5 V will result in setting bit DB2[D7]. In this condition the amplifier  
will wait for an I2C-bus command in order to start-up.  
The TDA8596 prevents internally induced output pops during engine start. In order to  
prevent pops on the output caused by the application (e.g. due to the tuner supply going  
out of regulation), the STB pin can be pulled LOW when an engine start is detected. The  
STB pin will activate the fast mute within 0.1 ms and consequently all disturbances at the  
amplifier inputs will be suppressed.  
V
(V)  
V
V
P
14  
SVR  
(1)  
V
hr  
8.4  
7
(2)  
O
V
1.6 V  
t (s)  
headroom protection  
(3)  
threshold  
001aad172  
(1) Headroom voltage Vhr = VP VO.  
(2) Steady state output voltage VO = VSVR 1.4 V.  
(3) Headroom protection threshold = VO + 1.6 V.  
Fig 7. Low-headroom protection  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
13 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
2
V
legacy and I C-bus mode  
O
(V)  
V
P
14.4  
output  
voltage  
(1)  
8.8  
V
hr  
8.6  
7.2  
(3)  
(2)  
V
SVR  
3.5  
output voltage  
(3)  
t (s)  
t
(start-Vo(off))  
001aad173  
t
(start-SVRoff)  
(1) Headroom protection activated:  
a) Fast mute.  
b) Discharge of SVR.  
(2) Low VP mute activated.  
(3) Low VP mute released.  
Fig 8. Low VP behavior; legacy and I2C-bus modes  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
14 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
2
V
I C-bus mode only  
O
(V)  
V
P
14.4  
8.8  
8.6  
7.2  
(1)  
(2)  
5.0  
3.5  
V
SVR  
output voltage  
0
POR  
IB1 bit D0  
DIAG  
t (s)  
001aad185  
(1) Low VP mute activated.  
(2) VPOR: VP level at which POR is activated.  
Fig 9. Low VP behavior; I2C-bus mode only  
7.9 Overvoltage and load dump protection  
When the supply voltage VP exceeds 22 V, all amplifier output stages will be switched to  
high-impedance. The TDA8596 is protected against load dump transients up to 50 V.  
7.10 Thermal pre-warning and thermal protection  
If the average junction temperature reaches the (I2C-bus programmable) pre-warning  
level, a thermal pre-warning will be generated, which can be read out on the I2C-bus. If the  
TDA8596 is programmed to send thermal warning information to the DIAG pin, the DIAG  
pin will be pulled LOW. The default thermal pre-warning detection level (IB3[D4] = 0) is  
145 °C typical. In case IB3[D4] = 1, the detection level is modified to 122 °C typical.  
In legacy mode the thermal pre-warning level is fixed at 145 °C typical.  
If the junction temperature increases further, the temperature controlled gain reduction will  
be activated for all four channels to reduce the output power (see Figure 10). If this still  
does not reduce the average junction temperature, all channels will be switched off at the  
absolute maximum temperature Toff, typical 175 °C.  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
15 of 48  
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aad174  
30  
G
v
(dB)  
20  
10  
0
145  
155  
165  
175  
T (°C)  
j
Fig 10. Temperature controlled amplifier gain  
7.11 Diagnostics  
Diagnostic information can be read via the I2C-bus and it can also be made available on  
the DIAG pin or STB pin. The information on the DIAG pin is partly fixed, i.e. power-on  
reset occurred and low or high battery events. Through I2C-bus commands selectable  
information (i.e. load faults, temperature alarms and clip detection) can be made available.  
This information will be directed to the DIAG pin through a logical OR function. In case of  
any of the above mentioned failures, the DIAG pin will remain LOW so the microcontroller  
is triggered to read out the failure information via the I2C-bus (the DIAG pin can be used  
as microcontroller interrupt to minimize I2C-bus traffic). As soon as the failure is removed,  
the DIAG pin will be released.  
The STB pin can be configured as a second clip detection pin. The clip detection level is  
equal for all channels. It is possible to redirect the clip information of all separate channels  
to each of the two diagnostic pins DIAG or STB. This option can be used to distinguish  
between for instance clipping on the front and rear side channels (i.e. by redirecting the  
front channels to one diagnostic output and the rear channels to the second diagnostic  
output).  
Table 4 shows the diagnostic options for the DIAG pin and STB pin for both I2C-bus and  
legacy mode:  
Table 4.  
Diagnostic information per pin for various modes  
I2C-bus mode  
Diagnostic  
Legacy mode  
Pin DIAG  
no  
information  
Pin DIAG  
Pin STB  
Power-on reset  
after power-on reset;  
pin DIAG will remain  
LOW until amplifier has  
been started  
no  
Low battery  
yes  
no  
yes  
Clip detection  
can be enabled per  
channel  
can be enabled per  
channel  
yes; fixed level for all  
channels on 2 %  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
16 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 4.  
Diagnostic information per pin for various modes …continued  
Diagnostic  
information  
I2C-bus mode  
Legacy mode  
Pin DIAG  
Pin DIAG  
Pin STB  
Temperature pre-  
warning  
can be enabled  
no  
yes; pre-warning level  
is 145 °C  
Short  
can be enabled  
can be enabled  
no  
no  
yes  
yes  
Speaker protection  
(missing current)  
Offset detection  
Load detection  
Overvoltage  
no  
no  
no  
no  
no  
no  
no  
yes  
yes  
7.12 Offset detection  
Offset detection can be performed either with or without input signal (for instance when  
the DSP is in mute after a start-up). Assume the amplifier is in I2C-bus mode. When an  
I2C-bus read of the output offset is performed the DBx[D2] latch will be set. When the  
amplifier BTL output voltage crosses the 1.55 V window threshold within 1 s after a read is  
performed, the DBx[D2] latch is reset and setting is disabled. After a certain delay, the  
next read can be performed.  
Example: in case the offset bits are still set when a successive read is performed more  
than 1 s after the previous read, the output signal has not been within the offset window  
thresholds for at least 1 s. This could either indicate an output signal with a frequency  
below 1 Hz or the presence of an output offset above 1.55 V (see Figure 11).  
2
V
= V  
V  
OUT+ OUT−  
O
I C-bus mode only  
offset  
threshold  
t
reset:  
t = 1 s:  
setting  
disabled  
read = no offset  
DB1 bit D2 reset  
V
= V  
V  
OUT+ OUT−  
O
offset  
threshold  
t
read = set bit  
t = 1 s:  
read = offset  
DB1 bit D2 set  
001aad175  
Fig 11. Offset detection  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
17 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
7.13 DC load detection  
When the DC load detection is enabled (IB1[D1] = 1), a DC offset is slowly applied at the  
outputs of the amplifiers during the start-up sequence (see Figure 4 and Figure 5) and the  
load currents as a result of the applied offset are measured. Based on this measurement  
the load impedance can be determined to differentiate between normal, line driver and no  
load (see Figure 12).  
LOAD  
NORMAL  
LINE DRIVER MODE  
OPEN-CIRCUIT  
DETECTION  
LEVEL  
20 100 Ω  
800 5 kΩ  
001aad176  
Fig 12. DC load detection levels  
When the amplifier is used in line driver mode and the external booster has an input  
impedance between 100 and 800 (DC-coupled), the DC load bits will be set at  
DBx[D5:D4] = 10 independent of the selected gain setting (see Table 5).  
Table 5.  
DC load detection translation table  
DC load bits  
Load indication[1]  
DBx[D5]  
DBx[D4]  
0
1
1
0
0
0
1
1
normal load  
line driver load  
open load  
not valid  
[1] Only when IB1[D2] = 0.  
By reading the I2C-bus bits the microprocessor can determine after the start-up of the  
amplifier whether a speaker or an external booster is connected and initiate the proper  
selection of the amplifier gain, i.e. 26 dB for normal mode or 16 dB for line driver mode.  
Gain selection will occur without audible pop noise when the amplifier is in mute.  
The DC load bit DBx[D4] is shared with the AC load detection. This implies that Table 5 is  
only valid when AC load detection is disabled (IB1[D2] = 0). When the AC load detection is  
enabled (IB1[D2] = 1) the bits DBx[D4] will show the result of the AC load detection. After  
disabling the AC load detection data bit DBx[D4] will show the result of the DC load  
measurement, which was stored during the AC load measurement.  
7.14 AC load detection  
When AC load detection is enabled (IB1[D2] = 1), AC coupled speakers (e.g. tweeters)  
can be detected during the assembly process. The detection is performed by means of  
applying an audible input sine wave (e.g. 19 kHz) to the inputs of the amplifier. The AC  
current into the load is measured with a 460 mA peak current detector to detect the  
presence of an AC load. In order to prevent spurious AC load detection (e.g. due to  
amplifier on/off switching), the AC load detection bit will only be set when the peak current  
threshold is triggered at least three times. Besides the 460 mA peak current threshold, a  
secondary threshold level at 230 mA is present. In case this level is not triggered, a high  
ohmic DC load (e.g. line driver) is assumed (also refer to Figure 13).  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
18 of 48  
 
 
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Example: at an AC output voltage of 2 V peak the total impedance must be less than 4 Ω  
to detect an AC coupled load or above 9 to guarantee the detection of a DC load. Refer  
to Table 6 for the interpretation AC load detection bits.  
Table 6.  
AC load detection translation table  
Normal DC load bit  
DBx[D5]  
Line driver DC load bit  
DBx[D4]  
Load indication  
Don’t care  
Don’t care  
0
1
no AC load detected  
AC load detected  
The AC load detection can only be performed when the amplifier has completed its  
start-up sequence. Consequently it will not conflict with the DC load detection.  
001aad177  
20  
|Z  
|
th(load)  
()  
16  
12  
8
(1)  
(2)  
4
0
0
1
2
3
4
5
V
(V)  
oM  
(1) IoM < 230 mA (no load detection level).  
(2) IoM > 460 mA (load detection level).  
Fig 13. AC load impedance versus output signal  
7.15 I2C-bus diagnostic bits read out  
The diagnostic information of the amplifier can be read out via the I2C-bus. The I2C-bus  
data bits are set in case a failure event occurs and are not reset until an I2C-bus read  
command is given. This implies that even when the failure mode is removed before  
reading out the I2C-bus, the microcontroller will still be able to read out what kind of failure  
has occurred. A consequence of this procedure is that during the I2C-bus read cycle old  
information is read. When actual information is required, it is recommended to perform  
two successive read actions.  
The DIAG pin will give actual diagnostic information (when selected), however it does not  
distinguish between the various failure modes. The DIAG pin can be used to trigger an  
I2C-bus read out of the data bits to retrieve actual diagnostic information. When a failure is  
no longer present, the DIAG pin will be released instantly, independently of the I2C-bus  
latches.  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
19 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
8. I2C-bus specification  
Table 7.  
Pin ADSEL  
Open  
TDA8596 ADDRESS with hardware address select  
A6  
A5  
A4  
A3  
A2  
A1  
A0  
R/W  
1
1
0
1
1
0
0
0 = write to TDA8596  
1 = read from TDA8596  
0 = write to TDA8596  
1 = read from TDA8596  
0 = write to TDA8596  
1 = read from TDA8596  
51 kto ground  
10 kto ground  
Ground  
1
1
1
1
0
0
1
1
1
1
0
1
1
1
no I2C-bus; legacy mode  
SDA  
SCL  
SDA  
SCL  
S
P
STOP condition  
START condition  
mba608  
Fig 14. START and STOP conditions  
SDA  
SCL  
data line  
stable;  
data valid  
change  
of data  
allowed  
mba607  
Fig 15. Bit transfer  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
20 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
2
I C-BUS WRITE  
SCL  
1
2
7
8
9
1
2
7
8
9
MSB 1  
MSB MSB 1  
LSB + 1  
LSB  
MSB  
LSB + 1  
ACK  
ACK  
SDA  
S
A
A
P
ADDRESS  
WRITE DATA  
W
To stop the transfer, after the last acknowledge (A)  
a STOP condition (P) must be generated  
2
I C-BUS READ  
SCL  
SDA  
1
2
7
8
9
1
2
7
8
9
MSB MSB 1  
LSB + 1  
MSB MSB 1  
LSB + 1  
LSB  
ACK  
A
ACK  
NA  
P
S
R
READ DATA  
ADDRESS  
To stop the transfer, the last byte must not be acknowledged  
and a STOP condition (P) must be generated  
: generated by master (microcontroller)  
: generated by slave  
: START  
001aac649  
S
P
: STOP  
A
: acknowledge  
NA  
: not acknowledge  
R/W : read / write  
Fig 16. I2C-bus read and write modes  
8.1 Instruction bytes  
I2C-bus mode:  
If R/W bit = 0, the TDA8596 expects 3 instruction bytes: IB1, IB2 and IB3  
After a power-on reset, all instruction bits are set to logic 0  
Legacy mode:  
The settings are equal to the condition with all instruction bits set to logic 0 (see  
Table 8), with the exception of IB1[D0] bit that is ignored in legacy mode.  
Table 8.  
Bit  
Instruction byte IB1  
Description  
D7  
don’t care  
D6  
channel 3 clip information on DIAG or STB pin  
0 = clip information on DIAG pin  
1 = clip information on STB pin  
channel 1 clip information on DIAG or STB pin  
0 = clip information on DIAG pin  
1 = clip information on STB pin  
D5  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
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TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 8.  
Instruction byte IB1 …continued  
Bit  
Description  
D4  
channel 4 clip information on DIAG or STB pin  
0 = clip information on DIAG pin  
1 = clip information on STB pin  
D3  
D2  
D1  
D0  
channel 2 clip information on DIAG or STB pin  
0 = clip information on DIAG pin  
1 = clip information on STB pin  
AC load detection enable  
0 = AC load detection disabled  
1 = AC load detection enabled; DBx[D4] bits not available for DC load detection  
DC load detection enable  
0 = DC load detection disabled  
1 = DC load will be detected  
amplifier start enable; (clear power-on reset flag, DB2[D7])  
0 = amplifier not enabled, DIAG pin will remain LOW  
1 = amplifier will start-up, power-on occurred (DB2[D7]) will be reset and DIAG  
pin will be released  
Table 9.  
Bit  
Instruction byte IB2  
Description  
D7 and D6  
clip detection level  
00 = clip detection level 2 %  
01 = clip detection level 5 %  
10 = clip detection level 10 %  
11 = clip detection level disabled  
temperature information on DIAG pin  
0 = temperature information on DIAG pin  
1 = no temperature information on DIAG pin  
load fault information (shorts, missing current) on DIAG pin  
0 = fault information on DIAG pin  
1 = no fault information on DIAG pin  
low pop (slow start) enable  
0 = low pop enabled  
D5  
D4  
D3  
D2  
D1  
1 = low pop disabled  
soft mute channel 1 and channel 3 (mute delay 20 ms)  
0 = no mute  
1 = mute  
soft mute channel 2 and channel 4 (mute delay 20 ms)  
0 = no mute  
1 = mute  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
22 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 9.  
Instruction byte IB2 …continued  
Bit  
Description  
D0  
fast mute all amplifier channels (mute delay 100 µs)  
0 = no mute  
1 = mute  
Table 10. Instruction byte IB3  
Bit  
D7  
D6  
Description  
don’t care  
amplifier channel 1 and channel 3 gain select  
0 = 26 dB  
1 = 16 dB  
D5  
D4  
D3  
D2  
D1  
D0  
amplifier channel 2 and channel 4 gain select  
0 = 26 dB  
1 = 16 dB  
temperature pre-warning level  
0 = warning level on 145 °C  
1 = warning level on 122 °C  
disable channel 3  
0 = channel 3 enabled  
1 = channel 3 disabled  
disable channel 1  
0 = channel 1 enabled  
1 = channel 1 disabled  
disable channel 4  
0 = channel 4 enabled  
1 = channel 4 disabled  
disable channel 2  
0 = channel 2 enabled  
1 = channel 2 disabled  
8.2 Data bytes  
I2C-bus mode:  
If R/W = 1, the TDA8596 will send four data bytes to the microprocessor: DB1, DB2,  
DB3, and DB4  
All bits are latched  
All bits are reset after a read operation except D4 and D5. D2 is set after a read  
operation, refer to the offset detection described in Section 7.12  
For explanation of AC and DC load detection bits, refer to Section 7.13 and  
Section 7.14  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
23 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 11. Data byte DB1  
Bit  
Description  
D7  
temperature pre-warning  
0 = no warning  
1 = junction temperature too high  
speaker fault channel 2 (missing current)  
0 = no missing current  
D6  
1 = missing current  
D5 and D4  
channel 2 DC load or AC load detection  
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 and bit D4 are available for  
AC load detection  
00 = no AC load  
01 = AC load detected  
10 = no AC load  
11 = AC load detected  
if bit IB1[D2] = 0, DC load detection is enabled, bits D5 and bit D4 are available  
for DC load detection  
00 = normal load  
01 = not valid  
10 = line driver load  
11 = open load  
D3  
D2  
D1  
D0  
channel 2 shorted load  
0 = not shorted load  
1 = shorted load  
channel 2 output offset  
0 = no output offset  
1 = output offset  
channel 2 short to VP  
0 = no short to VP  
1 = short to VP  
channel 2 short to ground  
0 = no short to ground  
1 = short to ground  
Table 12. Data byte DB2  
Bit  
Description  
D7  
power-on reset occurred/amplifier status  
0 = amplifier on  
1 = power-on reset has occurred; amplifier off  
speaker fault channel 4 (missing current)  
0 = no missing current  
D6  
1 = missing current  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
24 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 12. Data byte DB2 …continued  
Bit  
Description  
D5 and D4  
channel 4 DC load or AC load detection  
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 and bit D4 are available for  
AC load detection  
00 = no AC load  
01 = AC load detected  
10 = no AC load  
11 = AC load detected  
if bit IB1[D2] = 0, DC load detection is enabled, bits D5 and bit D4 are available  
for DC load detection  
00 = normal load  
01 = not valid  
10 = line driver load  
11 = open load  
D3  
D2  
D1  
D0  
channel 4 shorted load  
0 = not shorted load  
1 = shorted load  
channel 4 output offset  
0 = no output offset  
1 = output offset  
channel 4 short to VP  
0 = no short to VP  
1 = short to VP  
channel 4 short to ground  
0 = no short to ground  
1 = short to ground  
Table 13. Data byte DB3  
Bit  
Description  
D7  
maximum temperature protection  
0 = no protection  
1 = maximum temperature protection  
speaker fault channel 1 (missing current)  
0 = no missing current  
D6  
1 = missing current  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
25 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 13. Data byte DB3 …continued  
Bit  
Description  
D5 and D4  
channel 1 DC load or AC load detection  
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 and bit D4 are available for  
AC load detection  
00 = no AC load  
01 = AC load detected  
10 = no AC load  
11 = AC load detected  
if bit IB1[D2] = 0, DC load detection is enabled, bits D5 and bit D4 are available  
for DC load detection  
00 = normal load  
01 = not valid  
10 = line driver load  
11 = open load  
D3  
D2  
D1  
D0  
channel 1 shorted load  
0 = not shorted load  
1 = shorted load  
channel 1 output offset  
0 = no output offset  
1 = output offset  
channel 1 short to VP  
0 = no short to VP  
1 = short to VP  
channel 1 short to ground  
0 = no short to ground  
1 = short to ground  
Table 14. Data byte DB4  
Bit  
D7  
D6  
Description  
reserved  
speaker fault channel 3 (missing current)  
0 = no missing current  
1 = missing current  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
26 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 14. Data byte DB4 …continued  
Bit  
Description  
D5 and D4  
channel 3 DC load or AC load detection  
if bit IB1[D2] = 1, AC load detection is enabled, bit D5 and bit D4 are available for  
AC load detection  
00 = no AC load  
01 = AC load detected  
10 = no AC load  
11 = AC load detected  
if bit IB1[D2] = 0, DC load detection is enabled, bits D5 and bit D4 are available  
for DC load detection  
00 = normal load  
01 = not valid  
10 = line driver load  
11 = open load  
D3  
D2  
D1  
D0  
channel 3 shorted load  
0 = not shorted load  
1 = shorted load  
channel 3 output offset  
0 = no output offset  
1 = output offset  
channel 3 short to VP  
0 = no short to VP  
1 = short to VP  
channel 3 short to ground  
0 = no short to ground  
1 = short to ground  
9. Limiting values  
Table 15. Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
operating  
Min  
Max  
18  
Unit  
V
VP  
supply voltage  
-
non operating  
1  
-
+50  
50  
V
load dump protection;  
duration 50 ms; rise time  
> 2.5 ms  
V
VP(r)  
IOSM  
reverse supply voltage  
10 minutes maximum  
-
-
2  
V
A
non-repetitive peak  
output current  
13  
IORM  
repetitive peak output  
current  
repetitive  
-
8
A
Tj  
junction temperature  
storage temperature  
-
150  
°C  
°C  
Tstg  
55  
+150  
TDA8596_2  
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Product data sheet  
Rev. 02 — 8 November 2007  
27 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 15. Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Tamb  
Parameter  
Conditions  
Min  
40  
-
Max  
+105  
VP  
Unit  
°C  
ambient temperature  
protection voltage  
V(prot)  
AC and DC short circuit  
voltage of output pins  
and across the load  
V
Vx  
voltage on pin x  
SCL and SDA  
0
0
0
-
6.5  
13  
V
V
V
W
V
inputs, SVR and DIAG  
STB  
[1]  
24  
Ptot  
total power dissipation  
Tcase = 70 °C  
80  
Vesd  
electrostatic discharge  
voltage  
human body model;  
C = 100 pF; Rs = 1.5 kΩ  
-
2000  
machine model;  
C = 200 pF; Rs = 10 ;  
L = 0.75 µH  
-
200  
V
[1] 10 kseries resistance if connected to VP.  
10. Thermal characteristics  
Table 16. Thermal characteristics  
Symbol  
Rth(j-c)  
Parameter  
Conditions  
Typ  
1
Unit  
thermal resistance from junction to case  
thermal resistance from junction to ambient  
K/W  
K/W  
Rth(j-a)  
35  
11. Characteristics  
Table 17. Characteristics  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Supply voltage behavior  
VP  
supply voltage  
RL = 4 Ω  
RL = 2 Ω  
no load  
8
14.4  
14.4  
270  
4
18  
16  
400  
15  
7.2  
8
V
[1]  
8
V
Iq  
quiescent current  
standby current  
output voltage  
-
mA  
µA  
V
Istb  
VSTB = 0.4 V  
-
VO  
6.7  
6.9  
6.3  
0.1  
7
VP(low)(mute)  
low supply voltage  
mute  
with rising supply voltage  
with falling supply voltage  
7.5  
6.8  
0.7  
V
7.4  
1
V
VP(low)(mute)  
Vth(ovp)  
Vhr  
low supply voltage  
mute hysteresis  
V
overvoltage protection  
threshold voltage  
18  
20  
22  
V
V
headroom voltage  
when headroom protection is activated;  
see Figure 7  
1.1  
1.6  
2.0  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
28 of 48  
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 17. Characteristics …continued  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VPOR  
power-on reset  
voltage  
see Figure 9  
4.1  
5.0  
5.8  
V
VO(offset)  
output offset voltage  
amplifier on  
95  
25  
40  
0
0
0
+95  
+25  
+40  
mV  
mV  
mV  
amplifier mute  
line driver mode  
Mode select pin STB/second clip detection pin  
VSTB  
voltage on pin STB  
Standby mode  
I2C-bus mode  
-
-
-
-
1
1
V
V
legacy mode (I2C-bus off)  
Mute operating mode  
legacy mode (I2C-bus off)  
Operating mode  
2.5  
-
4.5  
V
I2C-bus mode  
legacy mode (I2C-bus off)  
2.5  
6.5  
-
-
VP  
VP  
V
V
[2]  
LOW voltage on pin STB when pulled  
down during clipping  
ISTB = 150 µA  
ISTB = 500 µA  
5.6  
6.1  
-
-
6.1  
7.4  
V
V
ISTB  
current on pin STB  
0 V < VSTB < 8.5 V  
clip detection not active; I2C-bus  
mode  
-
-
4
30  
70  
µA  
µA  
legacy mode  
10  
Start-up, shut-down and mute timing  
twake  
wake-up time  
time after wake-up via STB pin before  
first I2C-bus transmission is recognized;  
see Figure 3  
-
-
300  
-
500  
10  
µs  
ILO(SVR)  
output leakage  
µA  
current on pin SVR  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
29 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 17. Characteristics …continued  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
td(mute_off)  
mute off delay time  
mute to 10 % of output signal;  
ILO(SVR) = 0 µA  
[3]  
[3]  
[3]  
[3]  
I2C-bus mode (IB1[D0]); with  
295  
465  
795  
ms  
ILO(SVR) = 10 µA +15 ms; no  
DC load (IB1[D1] = 0); low pop  
disabled (IB2[D3] = 1); see Figure 3  
I2C-bus mode (IB1[D0]); with  
500  
640  
430  
640  
830  
650  
940  
ms  
ms  
ms  
ILO(SVR) = 10 µA +20 ms; DC load  
active (IB1[D1] = 1); low pop disabled  
(IB2[D3] = 1); see Figure 4  
I2C-bus mode (IB1[D0]); with  
1190  
1030  
ILO(SVR) = 10 µA +20 ms; DC load  
active (IB1[D1] = 0); low pop enabled  
(IB2[D3] = 0); see Figure 5  
legacy mode; with ILO(SVR) = 10 µA →  
+20 ms; VSTB = 7 V; RADSEL = 0 ;  
see Figure 6  
tamp_on  
amplifier on time  
amplifier from mute to 90 % of output  
signal; ILO(SVR) = 0 µA  
[3]  
[3]  
[3]  
[3]  
I2C-bus mode (IB1[D0]); with  
360  
565  
710  
510  
520  
695  
890  
720  
870  
ms  
ms  
ms  
ms  
ILO(SVR) = 10 µA +30 ms; no  
DC load (IB1[D1] = 0); low pop  
disabled (IB2[D3] = 1); see Figure 3  
I2C-bus mode (IB1[D0]); with  
1015  
1270  
1120  
ILO(SVR) = 10 µA +35 ms; DC load  
active (IB1[D1] = 1); low pop disabled  
(IB2[D3] = 1); see Figure 4  
I2C-bus mode (IB1[D0]); with  
ILO(SVR) = 10 µA +30 ms; DC load  
active (IB1[D1] = 0); low pop enabled  
(IB2[D3] = 0); see Figure 5  
legacy mode; with ILO(SVR) = 10 µA →  
+20 ms; VSTB = 7 V; RADSEL = 0 ;  
see Figure 6  
toff  
amplifier switch-off  
time  
time to DC output voltage < 0.1 V;  
I2C-bus mode (IB1[D0]); ILO(SVR) = 0 µA  
[3]  
[3]  
with ILO(SVR) = 10 µA +0 ms; low  
pop enabled (IB2[D3] = 0); see  
Figure 4  
120  
245  
280  
20  
530  
620  
40  
ms  
ms  
ms  
ms  
with ILO(SVR) = 10 µA +0 ms; low  
pop disabled (IB2[D3] = 1); see  
Figure 5  
140  
td(mute-on)  
mute to on delay time from 10 % to 90 % of output signal;  
IB2[D1] = 1 to 0; Vi = 50 mV; see  
Figure 6  
-
-
td(soft_mute)  
soft mute delay time  
from 10 % to 90 % of output signal;  
IB2[D1] = 0 to 1; Vi = 50 mV; see  
Figure 6  
20  
40  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
30 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 17. Characteristics …continued  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
td(fast_mute)  
fast mute delay time  
from 10 % to 90 % of output signal;  
-
0.1  
1
ms  
VSTB from 8 V to 1.3 V; Vi = 50 mV; see  
Figure 6  
t(start-Vo(off))  
t(start-SVRoff)  
engine start to output VP from 14.4 V to 7 V; Vo < 0.5 V; see  
-
-
0.1  
40  
1
ms  
ms  
off time  
Figure 8  
engine start to SVR  
off time  
VP from 14.4 V to 7 V; VSVR < 2 V; see  
Figure 8  
75  
I2C-bus interface[4]  
VIL  
LOW-level input  
voltage  
pins SCL and SDA  
pins SCL and SDA  
pin SDA; IL = 5 mA  
-
-
-
-
1.5  
5.5  
0.4  
V
V
V
VIH  
VOL  
HIGH-level input  
voltage  
2.3  
-
LOW-level output  
voltage  
fSCL  
SCL clock frequency  
-
400  
-
-
kHz  
kΩ  
kΩ  
kΩ  
kΩ  
RADSEL  
resistance on pin  
ADSEL  
I2C-bus address A[6:0] = 110 1100  
I2C-bus address A[6:0] = 110 1101  
I2C-bus address A[6:0] = 110 1111  
legacy mode  
155  
42  
7
-
51  
10  
-
57  
15  
0.5  
-
Gain select pin  
RGAINSEL  
resistance on pin  
GAINSEL  
legacy mode (I2C-bus off)  
26 dB gain; normal mode  
16 dB gain; line driver mode  
-
-
-
5
-
kΩ  
kΩ  
20  
Diagnostic  
VOL(DIAG)  
LOW-level output  
voltage on pin DIAG  
fault condition; IDIAG = 1 mA  
-
-
0.3  
V
V
VO(offset_det)  
THDclip  
output voltage at  
offset detection  
±1.3  
±1.55  
± 2.0  
total harmonic  
distortion clip  
detection level  
VP > 10 V  
IB2[D7:D6] = 10; level 10 %  
IB2[D7:D6] = 01; level 5 %  
5
3
10  
5
16  
7
%
%
IB2[D7:D6] = 00; level 2 %  
1
1
2
4
3
8
%
%
THDclip  
total harmonic  
distortion clip  
detection level  
variation  
between IB2[D7:D6] = 10 and  
IB2[D7:D6] = 01 (level between 10 %  
and 5 %)  
between IB2[D7:D6] = 01 and  
IB2[D7:D6] = 00 (level between 5 % and  
2 %)  
1
3.5  
6
%
Tj(AV)(pwarn)  
pre-warning average IB3[D4] = 0  
135  
112  
150  
145  
122  
155  
155  
132  
160  
°C  
°C  
°C  
junction temperature  
IB3[D4] = 1  
Tj(AV)(G(0.5dB)) average junction  
temperature for 0.5 dB  
gain reduction  
Vi = 0.05 V  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
31 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 17. Characteristics …continued  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tj(pw-G(0.5dB)) prewarning to 0.5 dB  
gain reduction  
7
10  
13  
°C  
junction temperature  
difference  
Tj(G(0.5dB)-of) junction temperature  
difference between  
10  
-
15  
20  
20  
-
°C  
0.5 dB gain reduction  
and off  
G(th_fold)  
gain reduction of  
thermal foldback  
dB  
Zth(load)  
load detection  
I2C-bus mode  
threshold impedance  
normal load detection  
line driver load detection  
I2C-bus mode  
-
-
-
-
20  
800  
-
100  
5000  
Zth(open)  
open load detection  
threshold impedance  
Ith(o)det(load)AC AC load detection  
output threshold  
I2C-bus mode  
AC load bit is set  
AC load bit is not set  
460  
-
-
-
-
mA  
mA  
current  
230  
Amplifier  
Po  
output power  
RL = 4 ; VP = 14.4 V; THD = 0.5 %  
RL = 4 ; VP = 14.4 V; THD = 10 %  
18  
23  
37  
20  
25  
40  
-
-
-
W
W
W
RL = 4 ; VP = 14.4 V; maximum power;  
Vi = 2 V (RMS) square wave  
RL = 4 ; VP = 15.2 V; maximum power;  
41  
45  
-
W
Vi = 2 V (RMS) square wave  
RL = 2 ; VP = 14.4 V; THD = 0.5 %  
RL = 2 ; VP = 14.4 V; THD = 10 %  
29  
37  
58  
32  
41  
64  
-
-
-
W
W
W
RL = 2 ; VP = 14.4 V; maximum power;  
Vi = 2 V (RMS) square wave  
THD  
total harmonic  
distortion  
Po = 1 W to 12 W; f = 1 kHz; RL = 4 Ω  
Po = 1 W to 12 W; f = 10 kHz  
-
-
-
-
0.01  
0.09  
0.14  
0.02  
0.1  
0.3  
%
%
%
%
Po = 1 W to 12 W; f = 20 kHz  
0.4  
line driver mode; Vo = 1 V (RMS) and  
5 V (RMS); f = 20 Hz to 20 kHz  
0.05  
αcs  
channel separation  
f = 1 kHz; RS = 1 kΩ  
f = 10 kHz; RS = 1 kΩ  
65  
60  
55  
80  
65  
70  
-
-
-
dB  
dB  
dB  
PSRR  
power supply rejection f = 100 Hz to 10 kHz; RS = 1 kΩ  
ratio  
CMRR  
common mode  
rejection ratio  
normal mode; Vcm = 0.3 V (p-p);  
f = 1 kHz to 3 kHz; RS = 1 kΩ  
45  
-
65  
-
-
dB  
V
Vcm(max)(rms)  
maximum common  
mode voltage (RMS  
value)  
f = 1 kHz  
0.6  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
32 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
Table 17. Characteristics …continued  
Refer to test circuit (see Figure 29) at VP = 14.4 V; RL = 4 ; f = 1 kHz; RS = 0 ; normal mode; unless otherwise specified.  
Tested at Tamb = 25 °C; guaranteed for Tamb = 40 °C to +105 °C.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Vn(o)  
noise output voltage  
filter 20 Hz to 22 kHz; RS = 1 kΩ  
mute mode  
-
-
-
-
19  
22  
45  
45  
26  
µV  
µV  
µV  
µV  
line driver mode  
29  
normal mode; Tamb = 25 °C to 105 °C  
normal mode; Tamb = 20 °C to 25 °C  
differential in; differential out  
normal mode  
65  
110  
Gv  
Ri  
voltage gain  
25.5  
15.5  
44  
26  
16  
60  
26.5  
16.5  
100  
dB  
dB  
kΩ  
line driver mode  
[5]  
input resistance  
mute attenuation  
symmetrical input; Ci = 470 nF; see  
Figure 29  
αmute  
Vo / Vo(mute); Vi = 50 mV  
80  
-
92  
25  
-
-
dB  
Vo(mute)(RMS)  
RMS mute output  
voltage  
Vi = 1 V (RMS); filter 20 Hz to 22 kHz  
µV  
Bp  
power bandwidth  
1 dB  
-
20 to  
-
Hz  
20000  
[1] Operation above 16 V with a 2 reactive load can trigger the amplifier protection. The amplifier switches off and will restart after 16 ms  
resulting in an ‘audio hole’.  
[2] VSTB depends on the current into the STB pin: minimum = (1429 × ISTB) + 5.4 V, maximum = (3143 × ISTB) + 5.6 V.  
[3] The times are specified without a leakage current. For a leakage current of 10 µA on the SVR pin, the delta time is specified. If the  
capacitor value on the SVR pin changes with ±30 %, the specified time will also change with ±30 %. The specified time includes an ESR  
of the capacitor on the SVR pin of up to 15 .  
[4] Standard I2C-bus spec: maximum LOW level = 0.3 × VDD, minimum HIGH-level = 0.7 × VDD. To comply with 5 V and 3.3 V logic the  
maximum LOW level is defined with VDD = 5 V and the minimum HIGH-level with VDD = 3.3 V.  
[5] Ri is the total differential input resistance. f3dB cut-off frequency is defined as  
1
1
=
= 19 Hz assuming worst-case low input resistance and 20 % spread in Ci.  
------------------------------------  
2π × Ri × Ci 2  
------------------------------------------------------------------  
2π × 44 kΩ × 235 nF × 0.8  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
33 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
12. Performance diagrams  
001aad139  
2
10  
THD  
(%)  
10  
1
1  
10  
(1)  
2  
10  
(2)  
(3)  
3  
10  
2  
1  
2
10  
10  
1
10  
10  
P
(W)  
o
VP = 14.4 V.  
(1) f = 10 kHz.  
(2) f = 1 kHz.  
(3) f = 100 Hz.  
Fig 17. Total harmonic distortion as a function of output power; 4 load  
001aad140  
2
10  
THD  
(%)  
10  
1
(1)  
1  
10  
(2)  
(3)  
2  
10  
10  
3  
2  
1  
2
10  
10  
1
10  
10  
P
(W)  
o
VP = 14.4 V.  
(1) f = 10 kHz.  
(2) f = 1 kHz.  
(3) f = 100 Hz.  
Fig 18. Total harmonic distortion as a function of output power; 2 load  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
34 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aad141  
28  
(1)  
P
o
(W)  
26  
24  
22  
20  
18  
(2)  
2  
1  
2
10  
10  
1
10  
10  
f (kHz)  
VP = 14.4 V.  
(1) THD = 10 %.  
(2) THD = 0.5 %.  
Fig 19. Output power as a function of frequency; 4 load  
001aad142  
55  
P
o
(W)  
45  
(1)  
(2)  
35  
25  
2  
1  
2
10  
10  
1
10  
10  
f (kHz)  
VP = 14.4 V.  
(1) THD = 10 %.  
(2) THD = 0.5 %.  
Fig 20. Output power as a function of frequency; 2 load  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
35 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aad143  
60  
P
o
(W)  
(1)  
40  
(2)  
(3)  
20  
0
5
10  
15  
20  
V
(V)  
P
f = 1 kHz.  
(1) Po(max)  
.
(2) THD = 10 %.  
(3) THD = 0.5 %.  
Fig 21. Output power as a function of supply voltage; 4 load  
001aad144  
100  
P
o
(W)  
80  
(1)  
60  
40  
20  
0
(2)  
(3)  
5
10  
15  
20  
V
(V)  
P
f = 1 kHz.  
(1) Po(max)  
.
(2) THD = 10 %.  
(3) THD = 0.5 %.  
Fig 22. Output power as a function of supply voltage; 2 load  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
36 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aad145  
1
THD  
(%)  
1  
2  
3  
10  
10  
10  
(1)  
(2)  
2  
1  
2
10  
10  
1
10  
10  
f (kHz)  
VP = 14.4 V; RL = 4 .  
(1) Po = 1 W.  
(2) Po = 10 W.  
Fig 23. Total harmonic distortion as a function of frequency; normal mode  
001aag000  
1  
10  
THD  
(%)  
(1)  
2  
10  
(2)  
(3)  
3  
10  
2  
1  
2
10  
10  
1
10  
10  
f (kHz)  
VP = 14.4 V; RL = 600 .  
(1) Vo = 5 V; front channel.  
(2) Vo = 1 V.  
(3) Vo = 5 V; rear channel.  
Fig 24. Total harmonic distortion as a function of frequency; line driver mode  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
37 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aag001  
40  
PSRR  
(dB)  
50  
60  
70  
80  
90  
(1)  
(2)  
2
3
4
5
10  
10  
10  
10  
10  
f (Hz)  
VP = 14.4 V; RL = 4 ; Vripple = 2 V (p-p).  
(1) front channel.  
(2) rear channel.  
Fig 25. Powers supply ripple rejection ratio as a function of frequency  
001aag002  
50  
α
cs  
(dB)  
60  
70  
80  
90  
100  
2
3
4
5
10  
10  
10  
10  
10  
f (Hz)  
VP = 14.4 V; RL = 4 ; Po = 4 W.  
Fig 26. Channel separation as a function of frequency  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
38 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
001aag003  
50  
P
tot  
(W)  
40  
30  
20  
10  
0
0
10  
20  
30  
40  
P
(W)  
o
VP = 14.4 V; RL = 4 ; f = 1 kHz.  
Fig 27. Power dissipation as a function of output power; 4 load  
001aag004  
100  
P
tot  
(W)  
80  
60  
40  
20  
0
0
20  
40  
60  
80  
P
(W)  
o
VP = 14.4 V; RL = 2 ; f = 1 kHz.  
Fig 28. Power dissipation as a function of output power; 2 load  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
39 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
13. Application information  
(2)  
R
+8.5 V  
ADSEL  
SDA  
26  
SCL  
21  
V
V
P1  
19, 20  
P2  
ADSEL  
+5 V  
28  
34, 35  
10 kΩ  
10 kΩ  
STB 29  
33 DIAG  
STANDBY/  
FAST MUTE  
SELECT DIAGNOSTIC/  
CLIP DETECT  
2
I C-BUS  
C
i
R /2  
i
R
s
/ 2  
IN3+ 13  
V / 2  
i
(1)  
(1)  
(1)  
(1)  
18 OUT3+  
470 nF  
26 dB/  
16 dB  
MUTE  
MUTE  
MUTE  
MUTE  
17 OUT3−  
R /2  
i
C
i
IN314  
R
R
/ 2  
/ 2  
s
V / 2  
i
PROTECTION/  
DIAGNOSTIC  
470 nF  
C
i
R /2  
i
s
IN1+  
7
6
V / 2  
i
4
2
OUT1+  
470 nF  
26 dB/  
16 dB  
OUT1−  
R /2  
i
C
i
IN1−  
R
R
/ 2  
/ 2  
s
V / 2  
i
PROTECTION/  
DIAGNOSTIC  
470 nF  
C
i
R /2  
i
s
IN4+ 11  
V / 2  
i
25 OUT4+  
470 nF  
26 dB/  
16 dB  
23 OUT4−  
R /2  
i
C
i
IN412  
R
R
/ 2  
/ 2  
s
V / 2  
i
PROTECTION/  
DIAGNOSTIC  
470 nF  
C
i
R /2  
i
s
IN2+  
9
8
V / 2  
i
30 OUT2+  
470 nF  
26 dB/  
16 dB  
32 OUT2−  
R /2  
i
C
i
IN2−  
R
s
/ 2  
V / 2  
i
PROTECTION/  
DIAGNOSTIC  
470 nF  
V
cm  
V
P
36 TAB  
TDA8596  
27  
10  
SGND  
22  
GAINSEL  
3
31  
16  
24  
PGND4  
SVR  
(2)  
PGND1 PGND2 PGND3  
22 µF  
001aag005  
(1) A capacitor of 10 nF may be added between every amplifier output and ground for EMC reasons.  
(2) The SVR capacitor and RADSEL resistor should first be connected to SGND before connecting to PGND.  
Fig 29. Test and application information  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
40 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
8.5 V  
5.6 kΩ  
4.7 kΩ  
18 kΩ  
10 kΩ  
3.3 V  
MICRO-  
CONTROLLER  
STB  
29  
TDA8596  
switch  
001aag009  
Fig 30. Circuit for combined STB and clip detection function on pin STB  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
41 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
13.1 PCB schematic and layout  
2200 µF/  
16 V  
220  
nF  
220  
nF  
V
P
V
V
P2  
P1  
19, 20  
34, 35  
3 31 16 24 36  
470 nF  
470 nF  
IN1+  
n.c.  
n.c.  
n.c.  
7
1
IN1−  
5
6
15  
470 nF  
470 nF  
IN2+  
IN2−  
9
OUT1+  
OUT1−  
OUT2+  
OUT2−  
OUT3+  
OUT3−  
OUT4+  
OUT4−  
4
2
8
SGND  
10  
30  
32  
18  
17  
25  
23  
TDA8596  
470 nF  
470 nF  
IN3+  
13  
14  
IN3−  
470 nF  
470 nF  
IN4+  
IN4−  
SVR  
11  
12  
27  
4.7 kΩ  
28 29 33 21 26 22  
22 µF  
on/standby  
(SW1)  
16 dB gain  
open  
26 dB gain  
10 kΩ  
BC859  
1
2
3
4
SDA  
+5V  
GND  
SCL  
DZ  
8.2 V  
18 kΩ  
2 kΩ  
BAW62  
10 kΩ  
2
I C-bus  
supply  
unmute  
22 kΩ  
10 kΩ  
legacy  
mode  
clip 2  
1
2
3
4
8
7
6
5
V
p
SW2  
mute  
10 µF  
SW3  
TDA3664  
1 µF  
2
I C-bus  
2
1
address  
select  
dip switch  
3
4
12 kΩ  
51 kΩ  
diag  
001aag006  
Fig 31. Evaluation board; schematic  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
42 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
SVR  
Sense  
22 µF  
C13  
Vp  
Gnd  
top  
OUT1+ OUT2+  
+OUT4+OUT3−  
address  
TDA8596TH  
I2C  
select  
Clip2  
/stb  
J5  
D8 (00)  
I2C supply  
enable  
SCL  
Gnd  
+5V  
SDA  
C15 C14  
DA (01)  
DE (11)  
SW5  
mode  
1 µF  
10 µF  
2200 µF/16 V  
C2  
SW2  
on  
SW1  
stby  
C6 C5 C8 C7 C11 C12 C9 C10  
D1  
26 dB  
gain  
diag  
16 dB  
I2C  
mute  
SW3  
unmute  
8 x 470 nF  
IN2+ +IN4−  
Sgnd  
R6  
10 kΩ  
IN1+  
+IN3−  
Legacy  
DZ1  
8.2 V  
Vp Gnd  
SRK  
ver. 2  
NXP Semiconductors  
001aag007  
Fig 32. Evaluation board layout; top view  
bottom  
C3  
C1  
220 nF  
220 nF  
TDA8596TH  
ID  
IC1  
BC859  
2 kΩ  
R8 R6  
1
18  
R4  
R5  
R2  
4
1
10 kΩ  
10 kΩ  
TDA3664  
12 k51 kΩ  
R3  
R7  
18 kΩ  
22 kΩ  
R1  
4.7 kΩ  
001aag008  
Fig 33. Evaluation board layout; bottom view  
Rev. 02 — 8 November 2007  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
43 of 48  
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
14. Test information  
14.1 Quality information  
This product has been qualified in accordance with the Automotive Electronics Council  
(AEC) standard Q100 - Stress test qualification for integrated circuits, and is suitable for  
use in automotive applications.  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
44 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
15. Package outline  
HSOP36: plastic, heatsink small outline package; 36 leads; low stand-off height  
SOT851-2  
D
E
A
x
c
y
X
E
2
M
H
E
v
A
D
1
D
2
1
18  
pin 1 index  
Q
A
A
2
E
1
(A )  
3
A
4
θ
L
p
detail X  
36  
19  
z
M
w
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(2)  
UNIT  
mm  
A
A
A
4
b
c
D
D
1
D
E
E
E
e
H
L
p
Q
v
w
x
y
Z
θ
2
3
p
2
1
2
E
max.  
+0.08 0.38 0.32  
0.04 0.25 0.23  
3.5  
3.2  
16.0 13.0 1.1 11.1 6.2 2.9  
15.8 12.6 0.9 10.9 5.8 2.5  
14.5 1.1 1.7  
13.9 0.8 1.5  
2.55  
2.20  
8°  
0°  
0.65  
3.5  
0.35  
0.25 0.12 0.03 0.07  
Notes  
1. Limits per individual lead.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
SOT851-2  
04-05-04  
Fig 34. Package outline SOT851-2 (HSOP36)  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
45 of 48  
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
16. Abbreviations  
Table 18. Abbreviations  
Acronym  
Description  
BCDMOS  
CMOS  
DMOS  
DSP  
Bipolar CMOS/DMOS  
Complementary Metal-Oxide Semiconductor  
Double-diffused Metal-Oxide Semiconductor  
Digital Signal Processor  
ESR  
Equivalent Series Resistance  
NMOS  
NMOST  
PMOS  
PMOST  
SOAR  
Negative-channel Metal-Oxide Semiconductor  
Negative-channel Metal-Oxide Semiconductor Transistor  
Positive-channel Metal-Oxide Semiconductor  
Positive-channel Metal-Oxide Semiconductor Transistor  
Safe Operating ARea  
17. Revision history  
Table 19. Revision history  
Document ID  
TDA8596_2  
Release date  
20071108  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
TDA8596_1  
Modifications:  
Figure 30: Value of base-emitter resistor changed from 10 kto 5.6 kΩ  
Section 14: Quality information reference updated  
TDA8596_1  
20070705  
Preliminary data sheet  
-
-
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
46 of 48  
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
to result in personal injury, death or severe property or environmental  
18.2 Definitions  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
18.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
I2C-bus — logo is a trademark of NXP B.V.  
19. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
TDA8596_2  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 02 — 8 November 2007  
47 of 48  
 
 
 
 
 
 
TDA8596  
NXP Semiconductors  
I2C-bus controlled 4 × 45 W power amplifier with symmetrical inputs  
20. Contents  
1
General description . . . . . . . . . . . . . . . . . . . . . . 1  
18  
Legal information . . . . . . . . . . . . . . . . . . . . . . 47  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 47  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 47  
18.1  
18.2  
18.3  
18.4  
2
2.1  
2.2  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
I2C-bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
3
4
5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
19  
20  
Contact information . . . . . . . . . . . . . . . . . . . . 47  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
7
7.1  
7.2  
7.3  
Functional description . . . . . . . . . . . . . . . . . . . 5  
Output stage . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Gain selection. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Distortion (clip-) detection. . . . . . . . . . . . . . . . . 6  
Output protection and short circuit operation . . 6  
SOAR protection. . . . . . . . . . . . . . . . . . . . . . . . 7  
Speaker protection . . . . . . . . . . . . . . . . . . . . . . 7  
Standby and mute operation. . . . . . . . . . . . . . . 7  
I2C-bus mode . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Legacy mode  
7.4  
7.4.1  
7.4.2  
7.5  
7.5.1  
7.5.2  
(pin ADSEL connected to ground) . . . . . . . . . . 7  
Start-up and shut-down sequence . . . . . . . . . . 8  
Power-on reset and supply voltage spikes . . . 12  
Engine start and low voltage operation. . . . . . 12  
Overvoltage and load dump protection. . . . . . 15  
Thermal pre-warning and thermal protection . 15  
Diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Offset detection. . . . . . . . . . . . . . . . . . . . . . . . 17  
DC load detection . . . . . . . . . . . . . . . . . . . . . . 18  
AC load detection . . . . . . . . . . . . . . . . . . . . . . 18  
I2C-bus diagnostic bits read out . . . . . . . . . . . 19  
7.6  
7.7  
7.8  
7.9  
7.10  
7.11  
7.12  
7.13  
7.14  
7.15  
8
8.1  
8.2  
I2C-bus specification . . . . . . . . . . . . . . . . . . . . 20  
Instruction bytes . . . . . . . . . . . . . . . . . . . . . . . 21  
Data bytes. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 27  
Thermal characteristics. . . . . . . . . . . . . . . . . . 28  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 28  
Performance diagrams . . . . . . . . . . . . . . . . . . 34  
Application information. . . . . . . . . . . . . . . . . . 40  
PCB schematic and layout . . . . . . . . . . . . . . . 42  
Test information. . . . . . . . . . . . . . . . . . . . . . . . 44  
Quality information . . . . . . . . . . . . . . . . . . . . . 44  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 45  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 46  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 46  
10  
11  
12  
13  
13.1  
14  
14.1  
15  
16  
17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 8 November 2007  
Document identifier: TDA8596_2  
 

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