TDA8792M [NXP]
3.3 V, 25 MHz 8-bit analog-to-digital converter ADC; 3.3V， 25MHz的8位模 - 数转换器ADC
| 型号： | TDA8792M |
| 厂家： | 
NXP |
| 描述： | 3.3 V, 25 MHz 8-bit analog-to-digital converter ADC |
| 文件： | 总20页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8792
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
1996 Feb 21
Product specification
Supersedes data of 1995 Apr 26
File under Integrated Circuits, IC02
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
FEATURES
APPLICATIONS
• 8-bit resolution
Analog-to-digital conversion for:
• General purpose
• Sampling rate up to 25 MHz
• 30 MHz input signal bandwidth (full scale)
• Hand-held equipment
• Mobile telecommunication
• Instrumentation
• High signal-to-noise ratio over a large analog input
frequency range (7.3 effective bits at 4.43 MHz
full-scale input at fclk = 25 MHz)
• Video.
• CMOS compatible digital inputs
• External reference voltage regulator
• Power dissipation only 53 mW (typical)
• Standby mode (only 1.2 mW typical)
GENERAL DESCRIPTION
The TDA8792 is a 8-bit analog-to-digital converter (ADC)
for low-voltage, portable applications. It operates at 3.3 V
and converts the analog input signal into 8-bit
binary-coded digital words at a maximum sampling rate of
25 MHz. The output data is valid after a delay of 6 clock
cycles.
• Low analog input capacitance, no buffer amplifier
required
• No sample-and-hold circuit required.
QUICK REFERENCE DATA
SYMBOL
VDDA
PARAMETER
analog supply voltage
digital supply voltage
CONDITIONS
MIN.
2.85
TYP.
3.3
MAX.
3.6
UNIT
V
VDDD
VDDO
IDDA
2.70
2.5
−
3.3
3.3
12
3
3.6
3.6
20
6
V
output stages supply voltage
analog supply current
digital supply current
V
mA
mA
mA
IDDD
IDDO
−
output stages supply current
fclk = 25 MHz; CL = 15 pF;
ramp input
−
1
2
INL
integral non-linearity
f
clk = 25 MHz; ramp input
−
±0.4
±0.3
−
±0.8
±0.75
−
LSB
LSB
MHz
mW
DNL
fclk(max)
Ptot
differential non-linearity
maximum clock frequency
total power dissipation
fclk = 25 MHz; ramp input
−
25
−
fclk = 25 MHz; CL = 15 pF;
ramp input
53
100
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TDA8792M
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
1996 Feb 21
2
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
BLOCK DIAGRAM
n
STDBY
1
2
24
23
CLK
V
SSO
V
DDD
TDA8792
22
V
DDO
V
SSD2
3
MSB
V
21 D7
20 D6
SSA1
4
V
I
5
7 x 8
OFFSET
COMPENSATED
COMPARATORS
8
DECODER
LATCHES
19 D5
18 D4
17 D3
16 D2
15 D1
V
DDA
6
I
bias
7
OUTPUT
BUFFER
data outputs
V
RT
8
V
9
RM
REFERENCE
LADDER
V
10
RB
DAC
14 D0
13 OE
LSB
V
SSA2 12
MLD119 - 1
Fig.1 Block diagram.
1996 Feb 21
3
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
PINNING
SYMBOL PIN
DESCRIPTION
standby input
STDBY
VDDD
VSSD2
VSSA1
VI
1
2
3
4
5
6
7
8
9
digital supply voltage (+3.3 V)
digital ground 2
analog ground 1
handbook, halfpage
1
2
STDBY
24 CLK
analog input voltage
V
23
22
21
20
V
V
VDDA
Ibias
analog supply voltage (+3.3 V)
bias current input
SSO
DDO
DDD
3
V
SSD2
VRT
reference voltage TOP input
reference voltage MIDDLE
V
4
D7
D6
SSA1
VRM
V
I
5
VRB
10 reference voltage BOTTOM input
11 not connected
6
19 D5
V
DDA
TDA8792
n.c.
I
D4
D3
7
18
17
bias
VSSA2
OE
12 analog ground 2
8
V
RT
output enable input (CMOS level
input, active LOW)
13
V
9
16 D2
15 D1
14 D0
13 OE
RM
D0
D1
D2
D3
D4
D5
D6
D7
VDDO
14 data output; bit 0 (LSB)
15 data output; bit 1
16 data output; bit 2
17 data output; bit 3
18 data output; bit 4
19 data output; bit 5
20 data output; bit 6
21 data output; bit 7 (MSB)
V
10
RB
n.c. 11
12
V
SSA2
MLD120 - 1
positive supply voltage for output
stage (+3.3 V)
22
VSSO
CLK
23 output ground
24 clock input
Fig.2 Pin configuration.
1996 Feb 21
4
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VDDA
PARAMETER
analog supply voltage
CONDITIONS
MIN.
−0.5
MAX.
+5.0
UNIT
note 1
note 1
note 1
V
V
V
V
VDDD
VDDO
∆VDD1
digital supply voltage
−0.5
−0.5
−0.3
+5.0
+5.0
+0.3
output stages supply voltage
supply voltage differences between
∆VDD1 = VDDA − VDDD
∆VDD2
∆VDD3
supply voltage differences between
∆VDD2 = VDDD − VDDO
−1.0
−1.0
+1.0
+1.0
V
V
supply voltage differences between
∆VDD3 = VDDA − VDDO
VI
input voltage
referenced to VSSA
referenced to VSSD
−0.5
+5.0
V
V
Vclk(p-p)
AC input voltage for switching
(peak-to-peak value)
−
VDDD
IO
output current
−
10
mA
°C
°C
°C
Tstg
Tamb
Tj
storage temperature
operating ambient temperature
junction temperature
−55
−20
−
+150
+75
+125
Note
1. The supply voltages VDDA, VDDD and VDDO may have any value between −0.5 V and +5.0 V provided that the
differences ∆VDD1, ∆VDD2 and ∆VDD3 are respected.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
119
K/W
1996 Feb 21
5
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
CHARACTERISTICS
VDDA = V6 to V4,12 = 2.85 to 3.6 V; VDDD = V2 to V3 and V1 = 2.7 to 3.6 V; VDDO = V22 to V23 = 2.5 to 3.6 V;
VSSA, VSSD and VSSO shorted together; VDDA to VDDD = −0.15 to +0.15 V; fclk = 25 MHz; 50% duty factor; VIL = 0 V;
VIH = VDDD; CL = 15 pF; Tamb = 0 to +70 °C; typical values measured at VDDA = VDDD = VDDO = 3.3 V and Tamb = 25 °C;
unless otherwise specified.
SYMBOL
Supply
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
VDDA
VDDD
VDDO
IDDA
analog supply voltage
2.85
3.3
3.3
3.3
12
3
3.6
3.6
3.6
20
6
V
digital supply voltage
2.7
2.5
−
V
output stages supply voltage
analog supply current
V
mA
mA
mA
IDDD
digital supply current
−
IDDO
output stages supply current
CL = 15 pF; ramp input
−
1
2
Inputs
CLOCK INPUT CLK (REFERENCED TO VSSD); note 1
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
input capacitance
0
−
0.8
VDDD
−
V
2.0
−10
−
−
V
Vclk = 0.4 V
Vclk = 2.7 V
−
µA
µA
pF
IIH
CI
−
10
−
−
10
INPUTS OE AND STDBY (REFERENCED TO VSSD); see Tables 2 and 3
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
0
−
−
−
−
0.8
VDDD
−
V
2.0
−10
−
V
VIL = 0.4 V
VIH = 2.7 V
µA
µA
IIH
+10
VI (ANALOG INPUT VOLTAGE REFERENCED TO VSSA
)
IIL
IIH
ZI
LOW level input current
HIGH level input current
input impedance
VI = 0 V
−20
−
−
−
µA
µA
kΩ
pF
VI = 1.5 V
−
+20
−
fi = 4.43 MHz
fi = 4.43 MHz
−
35
5
CI
input capacitance
−
−
Reference voltages for the resistor ladder; see Table 1
VRB
reference voltage BOTTOM
reference voltage TOP
differential reference voltage VRT − VRB
reference current
0
−
0.15
1.6
1.6
−
V
VRT
1.4
1.25
−
−
V
Vdiff
1.5
1.3
1250
1
V
Iref
mA
Ω
RLAD
TCRLAD
resistor ladder
−
−
temperature coefficient of the resistor
ladder
−
−
Ω/K
1996 Feb 21
6
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
SYMBOL
Outputs
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
DIGITAL OUTPUTS D7 TO D0 (REFERENCED TO VSSO
)
VOL
VOH
IOZ
LOW level output voltage
HIGH level output voltage
output current in 3-state mode
IO = 1 mA
0
−
0.4
V
IO = −1 mA
V
DDO − 0.4 −
VDDO
+10
V
0.4 V < VO < VDDO
−10
−
µA
Switching characteristics
CLOCK INPUT CLK (VDDA = 3.15 TO 3.45 V; VDDD = 3.15 TO 3.45 V); see Fig.3 and note 1
fclk(max)
fclk(min)
tCPH
maximum clock frequency
minimum clock frequency
clock pulse width HIGH
clock pulse width LOW
25
0.5
16
16
−
−
−
−
−
−
−
−
MHz
MHz
ns
tCPL
ns
Analog signal processing
LINEARITY
INL
integral non-linearity
ramp input
ramp input
−
−
±0.4
±0.3
±0.8
LSB
DNL
differential non-linearity
±0.75 LSB
BANDWIDTH (VDDA = 3.15 TO 3.45 V; VDDD = 3.15 TO 3.45 V); TAMB = 25 °C
B
analog bandwidth
full-scale sine wave;
note 2
20
30
35
−
−
MHz
MHz
small signal at mid-scale;
Vi = ±10 LSB at
−
code 128; note 2
tSTLH
tSTHL
analog input settling time LOW-to-HIGH full-scale square wave;
Fig.5; note 3
−
−
8
8
12
12
ns
ns
analog input settling time HIGH-to-LOW full-scale square wave;
Fig.5; note 3
HARMONICS
h1
fundamental harmonics (full scale)
harmonics (full scale); all components
second harmonics
fi = 4.43 MHz
fi = 4.43 MHz
−
−
0
dB
hall
−
−
−
−61
−61
−58
−
−
−
dB
dB
dB
third harmonics
THD
total harmonic distortion
fi = 4.43 MHz
SIGNAL-TO-NOISE RATIO; see Figs 6 and 11; note 4
S/N
signal-to-noise ratio (full scale)
without harmonics;
fclk = 25 MHz;
−
46
−
dB
fi = 4.43 MHz
1996 Feb 21
7
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
SYMBOL
EFFECTIVE BITS; see Figs 6 and 11; note 4
EB effective bits
PARAMETER
CONDITIONS
MIN.
TYP. MAX. UNIT
fclk = 25 MHz
fi = 2.0 MHz
fi = 4.43 MHz
fi = 7.5 MHz
fi = 10 MHz
−
−
−
−
7.4
7.3
7.2
7.0
−
−
−
−
bits
bits
bits
bits
DIFFERENTIAL GAIN; see note 5
Gdiff
differential gain
fclk = 25 MHz;
PAL modulated ramp
−
−
1.5
0.5
−
−
%
DIFFERENTIAL PHASE; see note 5
ϕdiff
differential phase
fclk = 25 MHz;
deg
PAL modulated ramp
Timing (fclk = 25 MHz); see Fig.3 and note 6
tds
th
sampling delay time
output hold time
−
6
8
−
2
ns
ns
ns
−
−
td
output delay time
13
25
3-state output delay times; see Fig.4
tdZH
tdZL
tdHZ
tdLZ
enable HIGH
enable LOW
disable HIGH
disable LOW
−
−
−
−
17
22
20
22
28
30
28
30
ns
ns
ns
ns
Standby mode output delay times
tdSTBLH standby (LOW-to-HIGH transition)
tdSTBHL start-up (HIGH-to-LOW transition)
−
−
−
−
200
ns
note 7 ns
Notes
1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock
must not be less than 1 ns.
2. The analog bandwidth is defined as the maximum full-scale input sine wave frequency which can be applied to the
device. No glitches greater than 8 LSBs are observed in the reconstructed signal neither is there any significant
attenuation.
3. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square-wave signal) in order to sample the signal and obtain correct output data.
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
5. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a
digital-to-analog converter.
6. Output data acquisition: the output data is available after the maximum delay time of td. In the event of 25 MHz clock
operation, the hardware design must be taken into account the td and th limits with respect to the input characteristics
of the acquisition circuit.
7000
------------------------
clk(MHz)
7. Maximum value standby mode start-up output delay time (HIGH-to-LOW transition): 100 +
.
f
1996 Feb 21
8
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
Table 1 Output coding and input voltage (typical values; referenced to VSSA
)
BINARY OUTPUT BITS
STEP
VI(p-p) (V)
D7
D6
D5
D4
D3
D2
D1
D0
Underflow
<0
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
0
1
.
.
.
.
.
.
.
.
.
.
.
.
.
254
.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
255
1.5
>1.5
Overflow
Table 2 Mode selection
Table 3 Standby selection
OE
1
D7 TO D0
STDBY
D7 TO D0
IDDA + IDDD (typ.)
0.4 mA
high impedance
active; binary
1
0
LOW
0
active
15 mA
t
CPL
t
CPH
1.4 V
CLK
sample N
1
sample N
2
sample N 6
V
l
t
t
ds
h
V
0.4 V
DDO
DATA
D0 to D7
DATA
DATA
DATA
N 1
DATA
N
50%
N
6
N
5
0.4 V
t
d
MLD121
Fig.3 Timing diagram.
9
1996 Feb 21
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
V
DDD
OE
50 %
dZH
t
t
dHZ
HIGH
90 %
output
data
50 %
LOW
t
t
dZL
dLZ
HIGH
output
data
50 %
LOW
10 %
TEST
S1
V
DDD
t
t
t
t
V
DDD
dLZ
dZL
dHZ
dZH
3.3 kΩ
15 pF
V
DDD
GND
GND
S1
TDA8792
OE
MLD122
fOE = 100 kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
1996 Feb 21
10
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
t
t
STLH
STHL
50 %
code 255
V
I
50 %
code 0
2 ns
2 ns
CLK
50 %
50 %
MLD123
2 ns
2 ns
Fig.5 Analog input settling-time diagram.
MLD118
0
A
(dB)
20
40
60
80
100
120
0
1.56
3.13
4.69
6.25
7.82
9.38
10.9
12.5
f (MHz)
Effective bits: 7.42; THD = −57.27 dB;
Harmonic levels (dB): 2nd = −60.76; 3rd = −60.96; 4th = −76.17; 5th = −80.63; 6th = −66.96.
Fig.6 Typical Fast Fourier Transform (fclk = 25 MHz; fi = 4.43 MHz).
11
1996 Feb 21
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
INTERNAL PIN CONFIGURATIONS
V
V
DDA
D7 to D0
V
I
SSA
MLD124
MLD125
Fig.8 Analog inputs.
Fig.7 Digital data outputs.
handbook, halfpage
V
DDA
handbook, halfpage
V
DDD
V
V
RT
OE,
R
LAD
RM
CLK or STDBY
V
RB
V
SSD
V
MLD126 - 1
SSA
MLC859
Fig.9 Digital inputs.
Fig.10 VRB, VRM and VRT.
V
DDA
I
bias
V
SSA
MLD127
Fig.11 Bias current input.
1996 Feb 21
12
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
APPLICATION INFORMATION
STDBY
CLK
V
1
2
24
23
22
21
20
19
18
17
16
15
14
13
V
DDD
SSO
3.3 V
V
V
SSD2
DDO
3
3.3 V
100 nF
V
D7
D6
D5
D4
D3
D2
SSA1
4
V
I
5
V
DDA
bias
6
3.3 V
100 nF
TDA8792
I
7
22 kΩ
(1)
RT
V
3.3 V
8
100 nF
(1)
RM
100 nF
100 nF
V
9
(1)
V
RB
D1
D0
10
11
12
100 nF
(2)
n.c.
V
SSA2
OE
MLD128 - 1
The analog and digital supplies should be separated and decoupled.
The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. The reference
ladder voltages can also be derived from a well regulated VDDA supply through a resistor bridge and a decoupled capacitor.
For applications where the input signal must remain well centred around middle scale, VRM must be decoupled and connected to analog input signal
(pin 5) through a resistor. The values must be defined in accordance with the input signal frequency in order to avoid direct coupling into the ADC ladder
(e.g. R = 5 kΩ and C = 100 nF).
(1) VRB, VRM and VRT are decoupled to VSSA
.
(2) Pin 11 should be connected to VSSA in order to prevent noise influence.
Fig.12 Application diagram.
1996 Feb 21
13
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
PACKAGE OUTLINE
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A
X
v
c
H
M
A
y
E
Z
24
13
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
12
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.8
0.4
mm
2.0
0.65
1.25
0.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
93-09-08
95-02-04
SOT340-1
MO-150AG
1996 Feb 21
14
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
If wave soldering cannot be avoided, the following
conditions must be observed:
SOLDERING SSOP
Introduction
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
cases reflow soldering is often used.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Reflow soldering
Reflow soldering techniques are suitable for all SSOP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from 215 to
250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds at between 270 and
320 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
1996 Feb 21
15
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 21
16
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
NOTES
1996 Feb 21
17
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
NOTES
1996 Feb 21
18
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit
analog-to-digital converter (ADC)
TDA8792
NOTES
1996 Feb 21
19
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
Portugal: PHILIPS PORTUGUESA, S.A.,
Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. (65)350 2000, Fax. (65)251 6500
South Africa: S.A. PHILIPS Pty Ltd.,
Tel. (31)40-2783749, Fax. (31)40-2788399
Brazil: Rua do Rocio 220 - 5th floor, Suite 51,
CEP: 04552-903-SÃO PAULO-SP, Brazil,
P.O. Box 7383 (01064-970),
195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494
Tel. (011)821-2333, Fax. (011)829-1849
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS:
Tel. (800) 234-7381, Fax. (708) 296-8556
Chile: Av. Santa Maria 0760, SANTIAGO,
Spain: Balmes 22, 08007 BARCELONA,
Tel. (03)301 6312, Fax. (03)301 42 43
Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,
Tel. (0)8-632 2000, Fax. (0)8-632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. (02)773 816, Fax. (02)777 6730
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. (852)2319 7888, Fax. (852)2319 7700
Tel. (01)488 2211, Fax. (01)481 77 30
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West
Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444
Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17,
77621 BOGOTA, Tel. (571)249 7624/(571)217 4609,
Fax. (571)217 4549
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (0212)279 27 70, Fax. (0212)282 67 07
Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,
Denmark: Prags Boulevard 80, PB 1919, DK-2300
COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. (358)0-615 800, Fax. (358)0-61580 920
France: 4 Rue du Port-aux-Vins, BP317,
92156 SURESNES Cedex,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: P.O. Box 10 51 40, 20035 HAMBURG,
252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991
United Kingdom: Philips Semiconductors LTD.,
276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181)730-5000, Fax. (0181)754-8421
United States:811 East Arques Avenue, SUNNYVALE,
CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (040)23 53 60, Fax. (040)23 53 63 00
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
India: Philips INDIA Ltd, Shivsagar Estate, A Block,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
Tel. (02)70-4044, Fax. (02)92 0601
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (01)7640 000, Fax. (01)7640 200
Italy: PHILIPS SEMICONDUCTORS S.r.l.,
Piazza IV Novembre 3, 20124 MILANO,
Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,
Tel. (03)3740 5130, Fax. (03)3740 5077
Korea: Philips House, 260-199 Itaewon-dong,
Internet: http://www.semiconductors.philips.com/ps/
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825
Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415
SCDS47
© Philips Electronics N.V. 1996
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,
Tel. 9-5(800)234-7381, Fax. (708)296-8556
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. (040)2783749, Fax. (040)2788399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Tel. (09)849-4160, Fax. (09)849-7811
Norway: Box 1, Manglerud 0612, OSLO,
Printed in The Netherlands
Tel. (022)74 8000, Fax. (022)74 8341
Pakistan: Philips Electrical Industries of Pakistan Ltd.,
Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546
537021/1100/02/pp20
Date of release: 1996 Feb 21
9397 750 00675
Document order number:
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