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TEA1611T/N1,518 [NXP]

Zero-voltage-switching resonant LLC controller, extended feature set SOP 20-Pin;
TEA1611T/N1,518
型号： TEA1611T/N1,518
厂家： NXP    NXP
描述：

Zero-voltage-switching resonant LLC controller, extended feature set SOP 20-Pin
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TEA1611T  
Zero voltage switching resonant converter controller  
Rev. 01 — 7 September 2009  
Product data sheet  
1. General description  
The TEA1611T is a monolithic integrated circuit implemented in a high voltage Diffusion  
Metal Oxide Semiconductor (DMOS) process, which is a high voltage controller for a zero  
voltage switching resonant converter. The IC provides the drive function for two discrete  
power MOSFETs in a half-bridge configuration. It also includes a level-shift circuit, an  
oscillator with accurately programmable frequency range, a latched shut-down function  
and a transconductance error amplifier.  
To guarantee an accurate 50 % switching duty factor, the oscillator signal passes through  
a divide-by-two flip-flop before being fed to the output drivers.  
The circuit is very flexible and enables a broad range of applications for different mains  
voltages.  
V
hs  
bridge voltage  
VAUX  
supply  
(high side)  
MOSFET  
SWITCH  
HALF-  
BRIDGE  
CIRCUIT  
RESONANT  
CONVERTER  
TEA1611  
signal ground  
power ground  
014aaa681  
Fig 1. Basic configuration  
2. Features  
I Integrated high voltage level-shift function  
I Integrated high voltage bootstrap diode  
I Low start-up current (green function)  
I Adjustable non-overlap time  
I Internal OverTemperature Protection (OTP)  
I OverCurrent Protection (OCP) that activates a shut-down timer  
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
I Soft start timing pin  
I Transconductance error amplifier for ultra high-ohmic regulation feedback  
I Latched shut-down circuit for OverVoltage Protection (OVP)  
I Adjustable minimum and maximum frequencies  
I UnderVoltage LockOut (UVLO)  
I Fault latch reset input  
I Wide (max 20 V) supply voltage range  
3. Applications  
I TV and monitor power supplies  
I High voltage power supplies  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
TEA1611T  
SO20  
plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
2 of 18  
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
5. Block diagram  
VAUX  
V
DD  
BOOTSTRAP  
13 V  
VDD(FLOAT)  
LEVEL  
SHIFTER  
SUPPLY  
HIGH SIDE  
DRIVER  
GH  
TEA1611  
SH  
GL  
reset  
OVER  
LOW SIDE  
DRIVER  
TEMPERATURE  
PROTECTION  
PGND  
OCP  
start/stop oscillation  
LOGIC  
0.3 V  
shut-down  
reset  
start-up  
SD  
CT  
SGND  
2.33 V  
: 2  
5 µA  
RESET  
P
g
m
TIMER  
I
× 2  
ch  
OSCILLATOR  
2.5 V  
2.5 V  
3 V  
0.6 V  
BUFFER  
I
dch  
×16  
CSS  
VCO IRS  
VREF IFS  
CF  
014aaa680  
Fig 2. Block diagram  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
3 of 18  
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
6. Pinning information  
6.1 Pinning  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
P
VCO  
VREF  
SD  
3
CSS  
IRS  
4
CT  
CF  
5
OCP  
IFS  
TEA1611  
6
PGND  
n.c.  
RESET  
VAUX  
7
8
SH  
V
DD  
9
GH  
GL  
10  
VDD(FLOAT)  
SGND  
014aaa684  
Fig 3. Pin configuration  
6.2 Pin description  
Table 2.  
Symbol  
P
Pin description  
Pin  
1
Description  
error amplifier non-inverting input  
error amplifier output  
soft start capacitor input  
timer capacitor input  
overcurrent protection input  
power ground  
VCO  
CSS  
CT  
2
3
4
OCP  
PGND  
n.c.  
5
6
7
not connected[1]  
SH  
8
high side switch source connection  
high side switch gate connection  
floating supply high side driver  
signal ground  
GH  
9
VDD(FLOAT)  
SGND  
GL  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
low side switch gate connection  
supply voltage  
VDD  
VAUX  
RESET  
IFS  
auxiliary supply voltage  
latch reset input  
oscillator discharge current input  
oscillator capacitor  
CF  
IRS  
oscillator charge input current  
shut-down input  
SD  
VREF  
reference voltage  
[1] Provided as a high voltage spacer  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
4 of 18  
 
 
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
7. Functional description  
7.1 Start-up  
When the applied voltage at VDD reaches VDD(init) (see Figure 4), the low side power  
switch is turned on while the high side power switch remains in the non-conducting state.  
This start-up output state guarantees the initial charging of the bootstrap capacitor (Cboot  
)
used for the floating supply of the high side driver.  
During start-up, the voltage on the frequency capacitor pin (CF) is zero and defines the  
start-up state. The voltage at the soft start pin (CSS) is set to 2.5 V. The CSS pin voltage  
is copied to the VCO pin via a buffer and switching starts at about 80 % of the maximum  
frequency at the moment VDD reaches the start level.  
The start-up state is maintained until VDD reaches the start level (13.5 V), the oscillator is  
activated and the converter starts operating.  
V
V
V
DD  
0
DD(startup)  
DD(init)  
GH-SH  
0
GL  
0
t
014aaa036  
Fig 4. Start-up  
7.2 Oscillator  
The internal oscillator is a current-controlled sawtooth oscillator. The frequency of the  
sawtooth is determined by the external capacitor Cf and the currents flowing into the IFS  
and IRS pins.  
The minimum frequency and the non-overlap time are set by the capacitor Cf and the  
resistors Rf(min) and Rno. The maximum frequency is set by resistor R∆f (see Figure 7).  
The oscillator frequency is exactly twice the bridge frequency to achieve an accurate 50 %  
duty factor. An overview of the oscillator and driver signals is given in Figure 5.  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
5 of 18  
 
 
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
CF  
GH-SH  
0
GL  
0
non-overlap time (high to low)  
non-overlap time (low to high)  
t
014aaa685  
Fig 5. Oscillator and driver signals  
7.3 Non-overlap time resistor  
The non-overlap time resistor Rno is connected between the 3 V reference pin (VREF) and  
the IFS current input pin (see Figure 7). The voltage on the IFS pin is kept at a  
temperature-independent value of 0.6 V. The current that flows into the IFS pin is  
determined by the value of resistor’s Rno 2.4 V voltage drop divided by its value. The IFS  
input current equals 1/16 of the discharge current of capacitor Cf and determines the  
falling slope of the oscillator.  
The falling slope time is used to create a non-overlap time (tno) between two successive  
switching actions of the half-bridge switches:  
2.4V  
Rno  
IIFS  
=
-----------  
C f × ∆VCf  
tno  
=
--------------------------  
16 × IIFS  
7.4 Minimum frequency resistor  
The Rf(min) resistor is connected between the VREF pin (3 V reference voltage) and the  
IRS current input (kept at a temperature-independent voltage level of 0.6 V). The charge  
current of the capacitor Cf is twice the current flowing into the IRS pin.  
The Rf(min) resistor has a voltage drop of 2.4 V and its resistance defines the minimum  
charge current (rising slope) of the Cf capacitor if the control current is zero. The minimum  
frequency is defined by this minimum charge current (IIRS1) and the discharge current:  
2.4V  
Rf (min)  
IIRS1  
=
=
-----------------  
C f × ∆VCf  
tIRS1  
--------------------------  
2 × IIRS1  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
6 of 18  
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
1
f osc(min))  
=
------------------------  
tno × tIRS1  
f osc(min)  
f bridge(min)  
=
---------------------  
2
7.5 Maximum frequency resistor  
The output voltage is regulated by changing the frequency of the half-bridge converter.  
The maximum frequency is determined by the R∆f resistor which is connected between  
the error amplifier output VCO and the oscillator current input pin IRS. The current that  
flows through the R∆f resistor (IIRS2) is added to the current flowing through the Rf(min)  
resistor. As a result, the charge current ICF increases and the oscillation frequency  
increases. As the falling slope of the oscillator is constant, the relationship between the  
output frequency and the charge current is not a linear function (see Figure 6 and  
Figure 7):  
VVCO – 0.6  
IIRS2  
=
=
--------------------------  
R∆f  
C f × ∆VCf  
--------------------------------------------  
2 × (IIRS1 + IIRS2  
tIRS2  
)
The maximum output voltage of the error amplifier and the value of R∆f determine the  
maximum frequency:  
VVCO(max) – 0.6  
IIRS2(max)  
=
---------------------------------------  
R∆f  
C f × ∆VCf  
tIRS(min)  
=
---------------------------------------------------------  
2 × (IIRS2 + IIRS2(max)  
)
1
f osc(max)  
=
------------  
TOSC  
f osc(max)  
f bridge(max)  
=
---------------------  
2
TOSC = tIRS(min) + tno  
The frequency of the oscillator depends on the value of capacitor Cf, the peak-to-peak  
voltage swing VCF and the charge and discharge currents. The accuracy of the oscillator  
frequency decreases at higher frequencies due to delays in the circuit.  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
7 of 18  
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
f
osc  
f
osc(max)  
f
osc(start)  
f
osc(min)  
0
I
IRS  
014aaa038  
Fig 6. Frequency range  
7.6 Error amplifier  
The error amplifier is a transconductance amplifier. The output current at pin VCO is  
determined by the amplifier transconductance, the differential voltage between input pin P,  
and the internal 2.5 V reference voltage. The output current IVCO is fed to the IRS input of  
the current-controlled oscillator.  
The source capability of the error amplifier increases current in the IRS pin with a positive  
differential input voltage. Therefore the minimum current is determined by resistor Rf(min)  
and the minimum frequency setting is independent of the characteristics of the error  
amplifier.  
The error amplifier has a maximum output current of 0.5 mA for an output voltage of up to  
2.5 V. If the source current decreases, the oscillator frequency also decreases resulting in  
a higher regulated output voltage.  
During start-up, the output voltage of the amplifier is connected to the soft start (CSS) pin  
via a buffer. This will hold the VCO pin at a constant value of 2.5 V.  
7.7 Soft start  
The CSS pin voltage is copied to the VCO pin via a buffer. This buffer only has a source  
capability, i.e. it can only charge the VCO pin. This means that the error amplifier output  
can increase the VCO pin voltage above the CSS voltage level.  
At start-up the soft start capacitor is charged to 2.5 V setting a start-up frequency of about  
80 % of the maximum frequency. After start-up the external soft start capacitor is  
discharged by Istart(soft). The VCO pin voltage will follow the CSS voltage (discharging  
takes place via R∆f) and the frequency sweeps down. The CSS capacitor will determine  
the frequency sweep rate. When the circuit comes into regulation, the error amplifier  
output will control the VCO pin voltage and the CSS voltage will sweep down further to  
zero volt.  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
8 of 18  
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
7.8 Overcurrent protection and timer  
The OCP input continuously compares the OCP pin voltage with VREF. When the OCP  
pin voltage is higher than VREF, the timer capacitor CT will be charged with Ich during the  
next full CF cycle. Else the timer capacitor will be discharged with Ileak  
.
In case the CT voltage exceeds Vtrip(H), the TEA1611T will switch over to shut-down  
mode. The timer capacitor will be discharged with Idch until the CT voltage reaches Vtrip(L)  
after which a soft start cycle is started.  
7.9 Shut-down  
The shut-down input (SD) has an accurate threshold level of 2.33 V. When the voltage on  
input SD reaches 2.33 V, the TEA1611T enters shut-down mode.  
During shut-down mode, pin VDD is clamped by an internal 12 V Zener diode with a 1 mA  
input current. This clamp prevents VDD rising above the rating of 14 V due to low supply  
current to the TEA1611T in shut-down mode.  
When the TEA1611T is in the shut-down mode, it can be activated again only by lowering  
V
DD below the VDD(rst) level (typically 5.3 V) or by making the reset input active. The  
shut-down latch is then reset and a new start-up cycle can begin.  
In shut-down mode the GL pin is HIGH and the GH pin is LOW. In this way the bootstrap  
capacitor remains charged, allowing a new, well defined cycle to start after a reset.  
7.10 OverTemperature Protection (OTP)  
The TEA1611T continuously monitors its temperature. When the temperature exceeds the  
Totp(act) level, the TEA1611T will switch to shut-down mode.  
7.11 Latch reset input  
The internal shut-down latch can be reset via the reset input. This input is active LOW.  
7.12 VAUX input  
When the IC is oscillating the start-up resistor is not able to deliver the supply current so  
that an auxiliary supply (for instance via an auxiliary winding or a dV/dt supply) is needed.  
The VAUX input facilitates a series regulator which regulates its output voltage  
(= VDD voltage) to VDD(reg)  
.
8. Limiting values  
Table 3.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Supply voltages  
Vdrv(hs) high-side driver voltage  
VDD  
Parameter  
Conditions  
Min  
Max  
Unit  
0
0
0
600  
14  
V
V
V
[1]  
[1]  
supply voltage  
VCC(AUX)  
auxiliary supply voltage  
20  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
9 of 18  
 
 
 
 
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
Table 3.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
Voltage on pins P, SD, RESET and OCP  
VI  
input voltage  
0
5
V
Currents  
IIFS  
current on pin IFS  
current on pin IRS  
current on pin VREF  
-
-
-
1/16  
1
mA  
mA  
mA  
IIRS  
IVREF  
−2  
Power and temperature  
Ptot  
total power dissipation  
Tamb < 70 °C  
-
0.8  
W
Tamb  
ambient temperature  
storage temperature  
operating  
−25  
−25  
+70  
+150  
°C  
°C  
Tstg  
Handling  
VESD  
[2]  
[3]  
electrostatic discharge  
voltage  
Human body  
model  
-
-
2000  
200  
V
V
Machine model  
[1] It is recommended that a buffer capacitor is placed as close as possible to the VDD pin (as indicated in  
Figure 7 and in the application note).  
[2] Human body model class 2: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.  
[3] Machine model class 2: equivalent to discharging a 200 pF capacitor through a 0.75 mH coil and 10 Ω  
resistor.  
9. Thermal characteristics  
Table 4.  
Thermal characteristics  
Parameter  
Symbol  
Conditions  
Typ  
Unit  
Rth(j-a)  
thermal resistance from junction in free air  
to ambient  
100  
K/W  
10. Characteristics  
Table 5.  
Characteristics  
All voltages are referred to the ground pins which must be connected externally; positive currents flow into the IC; VDD = 13 V  
and Tamb = 25 ˚C; tested using the circuit shown in Figure 7, unless otherwise specified.  
Symbol  
High voltage pins VDD(FLOAT), GH and SH  
Ileak leakage current  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VDD(F), VGH and  
-
-
30  
µA  
VSH = 600 V  
Supply pins VDD, VAUX  
VDD(init)  
initial supply voltage  
defined driver output;  
-
4
5
V
low side on; high side off  
VDD(startup) start-up supply voltage  
12.9  
9.0  
13.4  
9.4  
13.9  
9.8  
V
V
V
VDD(stop)  
VDD(hys)  
stop supply voltage  
hysteresis of supply voltage  
3.8  
4.0  
4.2  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
10 of 18  
 
 
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
Table 5.  
Characteristics …continued  
All voltages are referred to the ground pins which must be connected externally; positive currents flow into the IC; VDD = 13 V  
and Tamb = 25 ˚C; tested using the circuit shown in Figure 7, unless otherwise specified.  
Symbol  
VDD(reg)  
VDD  
Parameter  
Conditions  
Min  
Typ  
12.6  
12  
Max  
Unit  
V
regulation supply voltage  
supply voltage  
VAUX = 17 V  
-
-
-
-
current capability series  
regulator;  
V
VCC(AUX) = 17 V;  
IDD = 50 mA  
clamp voltage in  
shut-down state; low  
side on; high side off;  
11.0  
4.5  
12.0  
5.3  
13.0  
6.0  
V
V
IDD = 1 mA  
Vrst  
IDD  
reset voltage  
[1]  
supply current  
start-up  
210  
260  
2.4  
310  
-
µA  
mA  
µA  
operating  
shut-down  
-
-
220  
270  
Reference voltage on pin VREF  
Vref  
Iref  
Zo  
reference voltage  
reference current  
output impedance  
temperature coefficient  
Iref = 0 mA  
source only  
Iref = −1 mA  
2.9  
3.0  
-
3.1  
V
−2.0  
-
-
-
mA  
Ω
-
-
5.0  
−0.3  
TC  
Iref = 0 mA;  
mV/K  
Tj = 25 °C to 150 °C  
Current controlled oscillator pins IRS, IFS, CF  
Ich(CF)min  
Ich(CF)max  
VIRS  
minimum charge current on  
pin CF  
IIRS = 15 µA; VCF = 2 V  
28  
30  
32  
µA  
µA  
maximum charge current on  
pin CF  
IIRS = 200 µA; VCF = 2 V  
340  
380  
420  
voltage on pin IRS  
IIRS = 200 µA  
590  
47  
620  
50  
650  
53  
mV  
Idch(CF)min minimum discharge current on  
pin CF  
IIFS = 50/16 µA;  
µA  
VCF = 2 V  
Idch(CF)max maximum discharge current on  
pin CF  
IIFS = 1/16 µA; VCF = 2 V  
0.89  
0.94  
0.99  
mA  
VIFS  
voltage on pin IFS  
IIFS = 1/16 mA  
Cf = 100 pF;  
570  
156  
600  
167  
630  
178  
mV  
fbridge(min) minimum bridge frequency  
kHz  
IIFS = 0.5/16 mA;  
IIRS = 50 µA;  
f OSC  
fbridge  
=
------------  
2
[2]  
fbridge(max) maximum bridge frequency  
Cf = 100 pF;  
IFS = 1/16 mA;  
395  
440  
485  
kHz  
I
IIRS = 200 µA;  
f OSC  
fbridge  
=
------------  
2
Vtrip(L)  
Vtrip(H)  
LOW-level trip voltage  
HIGH-level trip voltage  
pin CF; DC level  
pin CF; DC level  
-
-
1.27  
2.97  
-
-
V
V
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
11 of 18  
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
Table 5.  
Characteristics …continued  
All voltages are referred to the ground pins which must be connected externally; positive currents flow into the IC; VDD = 13 V  
and Tamb = 25 ˚C; tested using the circuit shown in Figure 7, unless otherwise specified.  
Symbol  
VCF(p-p)  
tno  
Parameter  
Conditions  
DC level  
Min  
1.6  
Typ  
1.7  
Max  
1.8  
Unit  
V
peak-to-peak voltage on pin CF  
non-overlap time  
Cf = 100 pF;  
0.58  
0.63  
0.68  
µs  
IIFS = 0.5/16 mA;  
IIRS = 50 µA  
Idch(osc)/IIFS oscillator discharge current to  
current on pin IFS ratio  
IIFS = 0.5/16 mA;  
14.4  
16  
17.6  
Output drivers  
Isource(GH) source current on pin GH  
high side;  
-
-
300  
480  
-
-
mA  
mA  
VDD(F) = 11.2 V;  
VSH = 0 V; VGH = 0 V  
Isink(GH)  
sink current on pin GH  
high side;  
VDD(F) = 11.2 V;  
VSH = 0 V; VGH = 11.2 V  
Isource(GL)  
Isink(GL)  
VOH  
source current on pin GL  
sink current on pin GL  
HIGH-level output voltage  
low side; VGL = 0 V  
low side; VGL = 13 V  
pin GH; high side;  
-
-
-
300  
580  
10.9  
-
-
-
mA  
mA  
V
VDD(F) = 11.2 V;  
VSH = 0 V; IGH = 10 mA  
pin GL; low side;  
IGL = 10 mA  
-
-
12.6  
0.17  
-
-
V
V
VOL  
LOW-level output voltage  
pin GL; high side;  
VDD(F) = 11.2 V;  
VSH = 0 V; IGH = 10 mA  
pin GL; low side;  
IGL = 10 mA  
-
0.18  
1.6  
-
V
V
VFd(bs)  
bootstrap diode forward voltage  
IO = 5 mA  
1.3  
1.9  
Shut-down input pin SD  
II  
input current  
VSD = 2.33 V  
-
-
0.5  
µA  
Vth(SD)  
threshold voltage on pin SD  
2.26  
2.33  
2.40  
V
Error amplifier pins P, VCO  
II(cm)  
common-mode input current  
VI(CM) = 1 V  
VI(CM) = 1 V;  
-
−0.1  
−0.5  
2.5  
+2  
µA  
V
VI(cm)  
VI(offset)  
common-mode input voltage  
offset input voltage  
-
-
−2  
0
mV  
IVCO = −10 mA  
gm  
transconductance  
open-loop gain  
VI(CM) = 1 V; source only  
-
-
330  
70  
-
-
µA/mV  
Gol  
RL = 10 kΩ to GND;  
dB  
V
I(CM) = 1 V  
RL = 10 kΩ to GND;  
I(CM) = 1 V  
GB  
gain bandwidth product  
-
5
-
MHz  
V
V
VVCO(max) maximum VCO voltage  
operating;  
3.2  
3.6  
4.0  
RL = 10 kΩ to GND  
IVCO(max)  
VO  
maximum VCO current  
output voltage  
operating; VVCO = 1 V  
−0.4  
−0.5  
−0.6  
mA  
V
during start-up;  
2.5  
2.7  
2.9  
IVCO = 0.3 mA  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
12 of 18  
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
Table 5.  
Characteristics …continued  
All voltages are referred to the ground pins which must be connected externally; positive currents flow into the IC; VDD = 13 V  
and Tamb = 25 ˚C; tested using the circuit shown in Figure 7, unless otherwise specified.  
Symbol  
Reset pin  
Vrst  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
reset voltage  
2.15  
2.4  
0.65  
-
2.65  
V
Vrst(hys)  
II(rst)  
hysteresis of reset voltage  
reset input current  
-
-
-
V
1
µA  
CSS pin  
Istart(soft)  
CT pin  
Ich  
soft start current  
12  
15  
18  
µA  
charge current  
discharge current  
leakage current  
21  
8
27  
33  
12  
1
µA  
µA  
µA  
µA  
Idch  
10  
Ileak  
0.1  
2.4  
0.3  
2.7  
Ich/Idch  
charge current to discharge  
current ratio  
3.0  
Vtrip(H)  
Vtrip(L)  
OCP pin  
Vref  
HIGH-level trip voltage  
LOW-level trip voltage  
2.7  
0.6  
3
3.3  
0.8  
V
V
0.7  
reference voltage  
280  
120  
305  
135  
330  
150  
mV  
OTP  
Totp(act)  
activation overtemperature  
protection temperature  
°C  
[1] The supply current IDD increases with an increasing bridge frequency to drive the capacitive load of two MOSFETs. Typical MOSFETs  
for the TEA1611T application are 8N50 (NXP type PHX80N50E, QG(tot) = 55 nC typ.) and these will increase the supply current at  
150 kHz according to the following formula:  
∆IDD = 2 × QG(tot) × f bridge = 2 × 55nC × 150kHz = 16.5mA  
low side on; high side off; Cf = 100 pF; IIFS = 0.5 mA; IIRS = 50 µA; low side off; high side off; VDD = 9 V  
[2] The frequency of the oscillator depends on the value of capacitor Cf, the peak-to-peak voltage swing VCF and the charge/discharge  
currents ICF(ch) and ICF(dis)  
.
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
13 of 18  
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
11. Application information  
bridge voltage supply (high side)  
output voltage  
+
−
C
VDD  
V
DD  
13  
14  
18 V  
VAUX  
10 VDD(FLOAT)  
L
p
12.6 V  
9 GH  
8 SH  
LEVEL  
SHIFTER  
HIGH SIDE  
DRIVER  
TEA1611  
L
r(ext)  
C
boot  
on/off  
12  
GL  
LOW SIDE  
DRIVER  
C
p
C
r
6 PGND  
11  
SUPPLY  
SGND  
LOGIC  
5
OCP  
SD  
0.3 V  
15  
1
latch reset RESET  
regulator  
19  
overvoltage protection  
2.33 V  
feedback  
g
m
P
: 2  
(1)  
2.5 V  
2.7 V  
OSCILLATOR  
(2)  
TIMER  
3 V  
start-up  
600 mV  
600 mV  
17  
20  
18  
16  
3
2
VCO  
CSS  
IRS  
V
IFS  
CF  
REF  
C
f
C
T
R
∆f  
R
f(min)  
R
no  
C
SS  
014aaa683  
(1) Construction 1: Regulation feedback connected to pin 1.  
(2) Construction 2: Regulation feedback connected to pin 19 with resistor.  
Fig 7. Application diagram  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
14 of 18  
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
12. Package outline  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
mm  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
2.65  
0.1  
0.25  
0.01  
1.27  
0.05  
1.4  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT163-1  
075E04  
MS-013  
Fig 8. Package outline SOT163-1 (SO20)  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
15 of 18  
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
13. Revision history  
Table 6.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
TEA1611T_1  
20090907  
Product data sheet  
-
-
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
16 of 18  
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
14. Legal information  
14.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
14.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
14.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
14.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
15. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
TEA1611T_1  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 01 — 7 September 2009  
17 of 18  
 
 
 
 
 
 
TEA1611T  
NXP Semiconductors  
Zero voltage switching resonant converter controller  
16. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
7
Functional description . . . . . . . . . . . . . . . . . . . 5  
Start-up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Non-overlap time resistor . . . . . . . . . . . . . . . . . 6  
Minimum frequency resistor . . . . . . . . . . . . . . . 6  
Maximum frequency resistor. . . . . . . . . . . . . . . 7  
Error amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Soft start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Overcurrent protection and timer . . . . . . . . . . . 9  
Shut-down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
OverTemperature Protection (OTP) . . . . . . . . . 9  
Latch reset input . . . . . . . . . . . . . . . . . . . . . . . . 9  
VAUX input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
7.1  
7.2  
7.3  
7.4  
7.5  
7.6  
7.7  
7.8  
7.9  
7.10  
7.11  
7.12  
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Thermal characteristics. . . . . . . . . . . . . . . . . . 10  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 10  
Application information. . . . . . . . . . . . . . . . . . 14  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16  
9
10  
11  
12  
13  
14  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
14.1  
14.2  
14.3  
14.4  
15  
16  
Contact information. . . . . . . . . . . . . . . . . . . . . 17  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 7 September 2009  
Document identifier: TEA1611T_1  
 

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