TEA5581_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TEA5581

TEA5581T

PLL stereo decoder

June 1989

Product speciﬁcation

File under Integrated Circuits, IC01

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

GENERAL DESCRIPTION

The TEA5581 PLL stereo decoder is for car and medium-fi radios. It incorporates all the features provided by the

TEA5580 together with a source selector, muting circuit and output amplifiers with adjustable gain. It also features a

switch for radio or cassette function and a 228 kHz voltage-controlled oscillator (VCO) that is locked to the 19 kHz stereo

pilot tone by a phase-locked loop (PLL) system. Subcarrier frequencies of 19, 38, 57 and 114 kHz are regenerated via

I²L logic from the VCO output.

The PLL phase detector suppresses phase distortion due to the 57 kHz pilot tone from the German ‘Verkehrs Warnfunk’

(VWF) traffic warning system. Typical suppression of the 19 kHz stereo pilot tone is 40 dB. Adjacent channel interference

is prevented by the use of two demodulators, one driven by the 38 kHz decoding signal and the other at 114 kHz to

suppress the third harmonic of the multiplexed input signal.

The gain of the input amplifier can be adjusted by an external resistor and the circuit includes compensation for an IF

filter typical roll-off frequency of 50 kHz (2 dB down at 38 kHz).

The supply voltage range of the circuit is 7 V to 16 V.

Features

• Wide supply voltage range

• Automatic mono/stereo switching (pilot presence detector)

• Smooth stereo-to-mono change-over at weak signals (signal-dependent stereo channel separation)

• LED driver for stereo/mono indicator

• Suppresses:

third harmonics (114 kHz) of multiplexed signal to prevent interference from strong adjacent channels;

phase distortion due to the 57 kHz signal from VWF transmitters

• Pilot cancelling circuit to give added suppression of 19 kHz stereo pilot tone (up to 25 dB)

• IF filter roll-off compensation

• Source selector for radio or cassette input (typ. 90 dB)

• Mute circuit for 90 dB (typ.) muting of the output level

• Matrix and two output buffers with adjustable gain (max. 20 dB).

PACKAGE OUTLINES

TEA5581 : 16-lead DIL; plastic (SOT38); SOT38-1; 1996 August 16.

TEA5581T: 16-lead mini-pack; plastic (SO16L; SOT162A); SOT162-1; 1996 August 16.

June 1989

2

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER

Supply voltage range

CONDITIONS

SYMBOL

MIN.

MAX.

UNIT

V

_3-5, V_9-5

−

18

75

V

LED-driver current (peak value)

Total power dissipation

Storage temperature range

Operating ambient

−I_3M

P_tot

mA

see derating curve Fig.2

T_stg

−65

+150

°C

temperature range

T_amb

V_es

−30

+80

°C

Electrostatic handling*

+600

V

From junction to ambient in free air

SOT38

R_{th j-a}

75 K/W

95 K/W

SOT162

Fig.2 Power derating curve.

^*Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

June 1989

4

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

DC CHARACTERISTICS

Measured in the circuit of Fig.7; V = 8.5 V; T_amb= 25 °C; all DC voltages are with respect to pin 5; all currents are

positive into the IC.

PARAMETER

Supply voltage

CONDITIONS

R1 = 75 Ω

without LED driver

SYMBOL

V_S

MIN.

7.0

TYP.

8.5

MAX.

18

UNIT

V

Total current consumption

Power dissipation

Voltage

I_tot

−

15

20

mA

P_tot

125

−

mW

pin 15

V₁₅

−

2.1

3.6

−

V

pins 12 and 16

DC output current

pins 2 and 14

Output current

pin 3

V₁₂, V₁₆

3.2

4.0

−I₁₄, −I₂

225

320

450

µA

−I₃

−

20

mA

V

Switch “VCO-OFF”

voltage

V₇

2.2

−

Switch “VCO-OFF”

current

I₇

−

50

75

µA

June 1989

5

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

AC CHARACTERISTICS

Measured in the circuit of Fig.7; V_S= 8.5 V; T_amb= 25 °C; AC measurements have an input MUX-signal of 1 V

(peak-to-peak); V_pilot= 32 mV (9%); f_m= 1 kHz; oscillator adjusted to 228 kHz at V_i= 0 V; values are measured with an

external roll-off network of 50 kHz (2 dB down at 38 kHz) at the input (dashed components R_Sand C_Sin Fig.7); unless

otherwise speciﬁed

PARAMETER

Transimpedance

CONDITIONS

SYMBOL MIN.

V_O/I_I0.13 0.15

TYP.

MAX.

0.17

12

UNIT

V/µA

Input current (RMS value)

Overall gain

I_I(rms)

−

µA

mono; R3 = 47 kΩ

G_o(V_o/V_i)

9.0

10.0

11.0

dB

AF output voltage

(RMS value)

V

₁₂= V₁₆

0.95 1.14

1.33

500

V

AF output voltage

(RMS value)

V₂= V₁₄

−

mV

Total harmonic distortion

note 1;

V

_{O (rms)}= 1 V

THD

−

0.1

1.5

0.5

%

V

Output voltage

Output channel

unbalanced

THD = 1%

V₁₂= V₁₆

−

V₁₂= V₁₆

−

0.2

1.0

dB

Channel separation

IF roll-off

frequency = 50 kHz

L = 1; R = 0

α

26

−

40

76

82

−

dB

S/N ratio

bandwidth

20 Hz to 16 kHz

bandwidth IEC 79

(curve Din A)

see Fig.6

S/N

−

SDS control

Channel separation

Full stereo

V₄= 1.0 V

α

5

10

15

1.25

−

dB

V

channel separation

≥ 26 dB

V₄

−

1.2

Full mono

channel separation

≤ 1 dB

0.75 0.8

V

note 2; see Fig.5;

Stereo/mono switch

R4 = 180 kΩ

Switching to:

stereo

V_pilot

∆V_I

−

4

−

14

−

20

−

mV

mono

Hysteresis

4.5

−

June 1989

6

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

PARAMETER

CONDITIONS

note 3

SYMBOL MIN.

TYP.

MAX.

UNIT

Carrier and harmonic

suppression at the output

Pilot signal suppression

f = 19 kHz;

R4 = 180 kΩ; note 2;

see Figs 3 and 4

α₁₉

32

40

−

dB

Subcarrier suppression

f = 38 kHz

α₃₈

α₅₇

α₂₂₈

−

50

75

−

dB

f = 57 kHz

f = 228 kHz

Intermodulation suppression

f_m= 10 kHz

note 4

spurious signal

f_s= 1 kHz

α₂

−

50

80

70

−

dB

f_m= 13 kHz

spurious signal

f_s= 1 kHz

α₃

VWF tone suppression

f = 57 kHz

note 5

α₅₇

SCA tone rejection

f = 67 kHz

note 6

note 7

α₆₇

ACI rejection

f = 114 kHz

α₁₁₄

α₁₉₀

−

90

60

−

dB

f = 190 kHz

Ripple rejection

f = 100 Hz;

V_ripple= 100 mV;

mono

RR₁₀₀

−

50

−

dB

VCO

Oscillator frequency

adjustable with R5

Capture range

f_osc

228

kHz

deviation from

228 kHz centre

frequency;

V

_pilot= 32 mV

∆f/f

−

6

−

%

K^{− 1}

Temperature coefﬁcient

uncompensated

TC

−200× 100⁻⁶

June 1989

7

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

PARAMETER

CONDITIONS

SYMBOL MIN.

TYP.

MAX.

UNIT

Source selector

Suppression of

MPX signal

Switching level

voltage

V

₁₀≥ 2 V

α

80

90

−

dB

cassette to radio

V_IL

I_IL

−

0.8

25

V

current

10

µA

Output ampliﬁers

Gain

note 8; R₆/R7

G_v

Z_o

|Z_I|

α

−

20

500

−

dB

Ω

Output impedance

External load impedance

Suppression (mute)

DC offset

−

200

−

5

kΩ

dB

V₁₁= ≤ 0,8 V

84

90

−

voltage at

outputs during

mute switching

mute OFF-to-ON

mute ON-to-OFF

∆V₁₂, ∆V₁₆

−

1.0

2.0

−

mV

Muting circuit

Input voltage

mute ON

mute OFF

mute ON

mute OFF

V_IL

V_IH

I_IL

−

0.8

V_S

25

1

V

2.0

−

V

Input current

10

−

µA

I_IH

−

June 1989

8

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

Notes to the characteristics

1. Guaranteed for mono, mono + pilot and stereo.

2. Also adjustable.

3. Reference output voltage at 1 kHz (measured channel R, pin 16).

4. Intermodulation suppression (Beat-Frequency Components):

V_{o (signal)}(at 1 kHz)

α₂

=

; f = (2 × 10 kHz) – 19 kHz

--------------------------------------------------------------

s

V_{o (spurious)}(at 1 kHz)

V_{o (signal)}(at 1 kHz)

α₃=

; f = (3 × 13kHz) – 38kHz

--------------------------------------------------------------

s

V_{o (spurious)}(at 1 kHz)

measured with 91% mono signal; f_m= 10 or 13 kHz; 9% pilot signal.

5. Traffic radio (VWF) tone suppression:

V_{o (signal)}(at 1 kHz)

α₅₇

=

-------------------------------------------------------------------------------------

V_{o (spurious)}(at 1 kHz ± 23 Hz)

measured with 91% stereo signal; f_m= 1 kHz; 9% pilot signal; 5% traffic subcarrier (f = 57 kHz; 60% AM modulated

with f_mod= 23 Hz).

6. SCA (Subsidiary Communication Authorization) tone rejection:

V_{o (signal)}(at 1 kHz)

α ₆₇

=

; f = (2 × 38 kHz) – 67 kHz

--------------------------------------------------------------

s

V_{o (spurious)}(at 9kHz)

measured with 81% mono signal; f_m= 1 kHz; 9% pilot signal; 10% SCA-subcarrier (f_s= 67 kHz, unmodulated).

7. ACI (Adjacent Channel Interference) rejection at:

V_{o (signal)}(at 1 kHz)

α₁₁₄

=

; f = (3 × 38 kHz) – 110 kHz

-------------------------------------------------------------

s

V_{o (spurious)}(at 4kHz)

V_{o (signal)}(at 1 kHz)

α₁₉₀

; f = (5 × 38 kHz) – 186 kHz

-------------------------------------------------------------

s

V_{o (spurious)}(at 4kHz)

measured with 90% mono signal; f_s= 1 kHz; 9% pilot signal; 1% spurious signal (f_s= 110 or 186 kHz, unmodulated).

8. Maximum permitted value of feedback resistor = 220 kΩ.

June 1989

9

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

Fig.3 Pilot suppression plotted against resistance (R4).

(1) 220 kΩ

(2) 180 kΩ

(3) 150 kΩ

Fig.4 Pilot suppression plotted against pilot input voltage level.

10

June 1989

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

(1) Switching from mono to stereo.

(2) Switching from stereo to mono.

Fig.5 Pilot sensitivity against resistance (R4).

Fig.6 Channel separation against V_SDS.

11

June 1989

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

APPLICATION INFORMATION

(1) 25% tolerance (all other resistors have a 5% tolerance).

(2) 1% tolerance (NPO).

Fig.7 Application diagram.

June 1989

12

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

D

M

E

A

2

A

1

L

c

e

w M

Z

b

1

(e )

1

b

16

9

M

H

pin 1 index

E

1

8

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

Z

A

2

(1)

1

w

UNIT

mm

b

c

D

E

e

L

M

H

1

E

max.

min.

max.

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

8.25

7.80

9.5

8.3

4.7

0.51

3.7

2.54

0.10

7.62

0.30

0.254

0.01

2.2

0.021

0.015

0.013

0.009

0.86

0.84

0.32

0.31

0.055

0.045

0.26

0.24

0.15

0.13

0.37

0.33

inches

0.19

0.020

0.15

0.087

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-10-02

95-01-19

SOT38-1

050G09

MO-001AE

June 1989

13

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

D

E

A

X

c

H

v

M

A

E

y

Z

16

9

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

8

detail X

e

w

M

b

p

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

max.

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

θ

1

2

3

p

E

p

Z

0.30

0.10

2.45

2.25

0.49

0.36

0.32

0.23

10.5

10.1

7.6

7.4

10.65

10.00

1.1

0.4

1.1

1.0

0.9

0.4

mm

2.65

1.27

0.050

1.4

0.25

0.01

0.25

0.1

0.25

0.01

8^o

0^o

0.012 0.096

0.004 0.089

0.019 0.013 0.41

0.014 0.009 0.40

0.30

0.29

0.419

0.394

0.043 0.043

0.016 0.039

0.035

0.016

inches 0.10

0.055

0.01 0.004

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-01-24

97-05-22

SOT162-1

075E03

MS-013AA

June 1989

14

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

Several techniques exist for reflowing; for example,

SOLDERING

Introduction

thermal conduction by heated belt. Dwell times vary

between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from

215 to 250 °C.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 minutes at

45 °C.

WAVE SOLDERING

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave) soldering

technique should be used.

DIP

SOLDERING BY DIPPING OR BY WAVE

• The longitudinal axis of the package footprint must be

parallel to the solder flow.

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

• The package footprint must incorporate solder thieves at

the downstream end.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

REPAIRING SOLDERED JOINTS

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

REPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

SO

REFLOW SOLDERING

Reflow soldering techniques are suitable for all SO

packages.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

June 1989

15

Philips Semiconductors

Product speciﬁcation

TEA5581

TEA5581T

PLL stereo decoder

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

June 1989

16


型号：	TEA5581
厂家：	NXP
描述：	PLL stereo decoder PLL立体声解码器解码器
文件：	总16页 (文件大小：134K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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