TJA1051TK/3 [NXP]
High-speed CAN transceiver; 高速CAN收发器
| 型号： | TJA1051TK/3 |
| 厂家： | 
NXP |
| 描述： | High-speed CAN transceiver |
| 文件： | 总18页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TJA1051
High-speed CAN transceiver
Rev. 02 — 1 July 2009
Product data sheet
1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the
automotive industry, providing differential transmit and receive capability to (a
microcontroller with) a CAN protocol controller.
The TJA1051 is a up from the TJA1050 high-speed CAN transceiver. It offers improved
ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD) performance,
and also features:
• Ideal passive behavior to the CAN bus when the supply voltage is off
• Direct interfacing to microcontrollers with 3 V to 5 V supply voltages on TJA1051T/3
and TJA1051TK/3.
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features
2.1 General
I Fully ISO 11898-2 compliant
I Suitable for 12 V and 24 V systems
I Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
I VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
2.2 Low-power management
I Functional behavior predictable under all supply conditions
I Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
I High ElectroStatic Discharge (ESD) handling capability on the bus pins
I Bus pins protected against transients in automotive environments
I Transmit Data (TXD) dominant time-out function
I Undervoltage detection on pins VCC and VIO
I Thermally protected
TJA1051
NXP Semiconductors
High-speed CAN transceiver
3. Ordering information
Table 1.
Ordering information
Type number
Package
Name
SO8
Description
Version
TJA1051T
plastic small outline package; 8 leads; body width 3.9 mm
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
SOT96-1
TJA1051T/3[1]
TJA1051TK/3[1]
SO8
HVSON8
plastic thermal enhanced very thin small outline package; no leads; 8 SOT782-1
terminals; body 3 x 3 x 0.85 mm
[1] TJA1051T/3 and TJA1051TK/3 with VIO pin.
4. Block diagram
(1)
V
V
IO
CC
3
5
V
CC
TJA1051
TEMPERATURE
PROTECTION
(1)
7
6
V
IO
CANH
CANL
SLOPE
CONTROL
AND
1
8
TIME-OUT
DRIVER
TXD
MODE
CONTROL
S
4
RXD
DRIVER
2
015aaa036
GND
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC
.
Fig 1. Block diagram
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
2 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
5. Pinning information
5.1 Pinning
TJA1051T/3
TJA1051T
TJA1051TK/3
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
TXD
S
TXD
S
GND
CANH
CANL
n.c.
GND
CANH
CANL
V
CC
V
CC
RXD
RXD
V
IO
015aaa037
015aaa038
Fig 2. Pin configuration diagrams
5.2 Pin description
Table 2.
Pin description
Symbol Pin Description
TXD
GND
VCC
RXD
n.c.
1
2
3
4
5
5
transmit data input
ground supply
supply voltage
receive data output; reads out data from the bus lines
not connected; in TJA1051T version only
VIO
supply voltage for I/O level adapter; in TJA1051T/3 and TJA1051TK/3 versions
only
CANL
CANH
S
6
7
8
LOW-level CAN bus line
HIGH-level CAN bus line
Silent mode control input
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
3 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
6. Functional description
The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines
the functionality of the TJA1050 transceiver with improved EMC and ESD handling
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
The TJA1051 is available in two versions, distinguished only by the function of pin 5:
• The TJA1051T is 100 % backwards compatible with the TJA1050
• The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V
6.1 Operating modes
The TJA1051 supports two operating modes, Normal and Silent, which are selectable via
pin S. See Table 3 for a description of the operating modes under normal supply
conditions.
Table 3.
Mode
Operating modes
Inputs
Outputs
Pin S
Pin TXD
LOW
CAN driver
dominant
recessive
recessive
Pin RXD
active[1]
active[1]
active[1]
Normal
Silent
LOW
LOW
HIGH
X[2]
HIGH
[1] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[2] X = don't care
6.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slope of the output signals on the bus lines is
controlled and optimized in a way that guarantees the lowest possible ElectroMagnetic
Emission (EME).
6.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller from disrupting all network communications.
6.2 Fail-safe features
6.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
4 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
6.2.2 Internal biasing of TXD and S input pins
Pin TXD has an internal pull-up to VIO and pin S has an internal pull-down to GND. This
ensures a safe, defined state in case one or both of these pins are left floating.
6.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
6.2.4 Over-temperature protection
The output drivers are protected against over-temperature conditions. If the virtual
junction temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers
will be disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
6.3 VIO supply pin
Two versions of the TJA1051 are available, only differing in the function of a single pin. Pin
5 is either not connected or is a VIO supply pin.
Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller
supply voltage (see Figure 3). This will adjust the signal levels of pins TXD, RXD and S to
the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO
input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to
levels compatible with 5 V microcontrollers.
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
5 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
7. Application design-in information
BAT
3 V
5 V
V
V
IO
CC
V
CANH
CANH
DD
S
Pyy
TJA1051T/3
TXD
RXD
MICRO-
CONTROLLER
TX0
RX0
TJA1051TK/3
CANL
CANL
GND
GND
015aaa039
Fig 3. Typical application of the TJA1051T/3 or TJA1051TK/3.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
Conditions
Min
Max
Unit
Vx
voltage on pin x
no time limit; DC value
on pins CANH and CANL
on any other pin
on pins CANH and CANL
IEC 61000-4-2
at pins CANH and CANL
HBM
−58
+58
+7
V
V
V
−0.3
[1]
[2]
[3]
[4]
Vtrt
transient voltage
−150 +100
VESD
electrostatic discharge voltage
−9
+9
kV
at pins CANH and CANL
at any other pin
MM
−8
−4
+8
+4
kV
kV
[5]
[6]
at any pin
−300 +300
V
CDM
at corner pins
−750 +750
−500 +500
V
at any pin
V
[7]
Tvj
virtual junction temperature
storage temperature
−40
−55
−40
+150
+150
+125
°C
°C
°C
Tstg
Tamb
ambient temperature
[1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,
3a and 3b.
[2] IEC 61000-4-2 (150 pF, 330 Ω).
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
6 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
[3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be verified by an external test house.
The result is equal to or better than ±8 kV (unaided).
[4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
[5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 µH, 10 Ω).
[6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (>1000 V).
[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 5.
Thermal characteristics
According to IEC 60747-1.
Symbol
Parameter
Conditions
Value
155
55
Unit
K/W
K/W
Rth(vj-a)
thermal resistance from virtual junction to ambient
SO8 package; in free air
HVSON8 package; in free air
10. Static characteristics
Table 6.
Static characteristics
Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply; pin VCC
VCC
ICC
supply voltage
4.5
0.1
-
5.5
2.5
V
supply current
Silent mode
1
mA
Normal mode
recessive; VTXD =VIO
dominant; VTXD = 0 V
2.5
20
5
10
70
4.5
mA
mA
V
50
-
Vuvd(VCC)
undervoltage detection
voltage on pin VCC
[1]
3.5
I/O level adapter supply; pin VIO
VIO
IIO
supply voltage on pin VIO
supply current on pin VIO
2.8
-
5.5
V
Normal and Silent modes
recessive; VTXD = VIO
dominant; VTXD = 0 V
10
50
1.3
80
350
-
250
500
2.7
µA
µA
V
Vuvd(VIO)
undervoltage detection
voltage on pin VIO
Mode control input; pin S
VIH
VIL
IIH
HIGH-level input voltage
0.7VIO
−0.3
1
-
VIO + 0.3 V
LOW-level input voltage
HIGH-level input current
LOW-level input current
-
0.3VIO
10
V
VS = VIO
VS = 0 V
4
0
µA
µA
IIL
−1
+1
CAN transmit data input; pin TXD
VIH
VIL
HIGH-level input voltage
LOW-level input voltage
0.7VIO
-
-
VIO + 0.3 V
0.3VIO
−0.3
V
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
7 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
Table 6.
Static characteristics …continued
Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol
Parameter
Conditions
Min
−5
Typ
0
Max
+5
Unit
µA
IIH
IIL
Ci
HIGH-level input current
LOW-level input current
input capacitance
VTXD = VIO
Normal mode; VTXD = 0 V
−260
-
−150
5
−30
10
µA
[3]
pF
CAN receive data output; pin RXD
IOH
IOL
HIGH-level output current
LOW-level output current
VRXD = VIO − 0.4 V; VIO = VCC
−8
−3
−1
mA
mA
VRXD = 0.4 V; bus dominant
2
5
12
Bus lines; pins CANH and CANL
VO(dom) dominant output voltage
VTXD = 0 V; t < tto(dom)TXD
pin CANH
2.75
0.5
3.5
1.5
0
4.5
V
pin CANL
2.25
+400
V
Vdom(TX)sym transmitter dominant voltage Vdom(TX)sym = VCC − VCANH − VCANL
−400
mV
symmetry
VO(dif)bus
bus differential output voltage VTXD = 0 V; t < tto(dom)TXD
1.5
-
3
V
RL = 45 Ω to 65 Ω
VTXD = VIO; recessive; no load
−50
-
+50
3
mV
V
VO(rec)
recessive output voltage
Normal and Silent modes;
TXD = VIO; no load
2
0.5VCC
V
Vth(RX)dif
Vhys(RX)dif
IO(dom)
differential receiver threshold Normal and Silent modes
voltage
Vcm(CAN)[4] = −30 V to +30 V
0.5
50
0.7
0.9
V
differential receiver hysteresis Normal and Silent modes
120
200
mV
voltage
Vcm(CAN) = −30 V to +30 V
dominant output current
VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
pin CANH; VCANH = 0 V
−100
40
−70
70
-
−40
100
+5
mA
mA
mA
pin CANL; VCANL = 5 V / 40 V
IO(rec)
IL
recessive output current
leakage current
Normal and Silent modes; VTXD = VIO
VCANH = VCANL = −27 V to +32 V
−5
VCC = VIO = 0 V;
−5
0
+5
µA
VCANH = VCANL = 5 V
Ri
input resistance
9
15
0
28
+1
52
20
kΩ
%
∆Ri
input resistance deviation
differential input resistance
between VCANH and VCANL
−1
19
-
Ri(dif)
Ci(cm)
30
-
kΩ
pF
[3]
[3]
common-mode input
capacitance
Ci(dif)
differential input capacitance
-
-
-
10
-
pF
°C
.
Temperature protection
Tj(sd) shutdown junction
temperature
[3]
190
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC
[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use
correlated test conditions to cover the specified temperature and power supply voltage range.
[3] Not tested in production.
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
8 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
[4] Vcm(CAN) is the common mode voltage of CANH and CANL.
11. Dynamic characteristics
Table 7.
Dynamic characteristics
Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5
td(TXD-busdom) delay time from TXD to bus dominant Normal mode
-
65
90
60
65
-
-
ns
ns
ns
ns
ns
td(TXD-busrec) delay time from TXD to bus recessive Normal mode
-
-
td(busdom-RXD) delay time from bus dominant to RXD Normal and Silent modes
td(busrec-RXD) delay time from bus recessive to RXD Normal and Silent modes
-
-
-
-
tPD(TXD-RXD)
propagation delay from TXD to RXD
versions with pin 5 n.c.
Normal mode
40
220
versions with VIO pin
Normal mode
40
-
250
12
ns
tto(dom)TXD
TXD dominant time-out time
VTXD = 0 V; Normal mode
0.3
1
ms
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC
.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use
correlated test conditions to cover the specified temperature and power supply voltage range.
+5 V
47 µF
100 nF
(1)
V
V
CC
IO
TXD
CANH
TJA1051
R
L
100 pF
RXD
GND
CANL
S
15 pF
015aaa040
(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3), the VIO input is connected to pin VCC
.
Fig 4. Timing test circuit for CAN transceiver
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
9 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
HIGH
LOW
TXD
CANH
CANL
dominant
0.9 V
V
O(dif)(bus)
0.5 V
recessive
HIGH
0.7V
IO
RXD
0.3V
IO
LOW
t
t
d(TXD-busrec)
d(TXD-busdom)
t
t
d(busrec-RXD)
d(busdom-RXD)
t
t
PD(TXD-RXD)
PD(TXD-RXD)
015aaa025
Fig 5. CAN transceiver timing diagram
12. Test information
12.1 Quality information
This product has been qualified to the appropriate Automotive Electronics Council (AEC)
standard Q100 or Q101 and is suitable for use in automotive applications.
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
10 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 6. Package outline SOT96-1 (SO8)
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
11 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
SOT782-1
0
1
2 mm
scale
X
B
A
D
A
A
1
E
c
terminal 1
index area
detail X
C
e
1
terminal 1
index area
y
C
1
v
M
C
C
A B
y
b
e
w M
1
4
L
E
h
8
5
D
h
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
D
D
E
E
e
e
1
L
v
w
y
y
1
1
h
h
max.
0.05 0.35
0.00 0.25
3.1
2.9
2.55
2.25
3.1
2.9
1.75
1.45
0.5
0.3
mm
1
0.65 1.95
0.1
0.05 0.05
0.1
0.2
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
03-01-29
SOT782-1
- - -
MO-229
- - -
Fig 7. Package outline SOT782-1 (HVSON8)
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
12 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
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NXP Semiconductors
High-speed CAN transceiver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 8) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 8.
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
14 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 8. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
15 of 18
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NXP Semiconductors
High-speed CAN transceiver
15. Revision history
Table 10. Revision history
Document ID
TJA1051_2
Release date
Data sheet status
Change notice
Supersedes
20090701
Product data sheet
-
TJA1051_1
Modifications
• Revised parameter values in Table 4 (VESD
)
• Revised parameter values in Table 6 (VO for SPLIT pin)
TJA1051_1
20090309
Product data sheet
-
-
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
16 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TJA1051_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 1 July 2009
17 of 18
TJA1051
NXP Semiconductors
High-speed CAN transceiver
18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Low-power management . . . . . . . . . . . . . . . . . 1
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1
2.2
2.3
3
4
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
6.1
Functional description . . . . . . . . . . . . . . . . . . . 4
Operating modes . . . . . . . . . . . . . . . . . . . . . . . 4
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 4
TXD dominant time-out function . . . . . . . . . . . . 4
Internal biasing of TXD and S input pins . . . . . 5
Undervoltage detection on pins VCC and VIO . . 5
Over-temperature protection. . . . . . . . . . . . . . . 5
6.1.1
6.1.2
6.2
6.2.1
6.2.2
6.2.3
6.2.4
6.3
VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7
Application design-in information . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Test information. . . . . . . . . . . . . . . . . . . . . . . . 10
Quality information . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
8
9
10
11
12
12.1
13
14
Soldering of SMD packages . . . . . . . . . . . . . . 13
Introduction to soldering . . . . . . . . . . . . . . . . . 13
Wave and reflow soldering . . . . . . . . . . . . . . . 13
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 13
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
14.1
14.2
14.3
14.4
15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 July 2009
Document identifier: TJA1051_2
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